CN205972251U - Baffle is used to silicon chip packing - Google Patents

Abstract

The utility model discloses a baffle is used to silicon chip packing belongs to silicon chip packing auxiliary device technical field, for solving the present baffle is used to silicon chip packing problem design that the silicon chip took out from the foam box of not being convenient for. The utility model provides a baffle is used to silicon chip packing includes ontology partition, ontology partition's edge is equipped with the opening, it is more convenient that the opening is used for making the silicon chip to take, the open -ended width is at 1cm to between the 3cm, the open -ended degree of depth is at 1cm to between the 3cm. The utility model discloses a kind of baffle is used to silicon chip packing had not only had the buffering and had taken out with the fixed action but also in making things convenient for silicon chip follow foam box.

Description

A kind of silicon chip packaging dividing plate

Technical field

This utility model is related to silicon chip package auxiliary device technical field and in particular to a kind of silicon chip packaging dividing plate.

Background technology

At present, crystal-silicon solar cell in photovoltaic industry still in occupation of leading position, and needed for the preparation of crystal silicon battery Raw material silicon wafer thickness be only 200 μm about, easily occur broken in transportation and damage.Therefore, in transport raw silicon Need to be packed using foam box during piece, need to place hollow clapboard simultaneously between silicon chip.External force can not only be buffered by hollow clapboard Impact to silicon chip, and silicon chip can also play position fixation in foam box.

Existing dividing plate is in the same size with silicon chip, and raw material silicon chip is fixed on after foam box for it can protect silicon chip in transport During be not damaged by, but when taking silicon chip, because median septum is tightly fixing by silicon chip, silicon chip inconvenient from foam box Take out, workman is often because the reason such as overexert leads to silicon chip broken during taking.

Therefore, need a kind of new hollow clapboard badly and can solve the problem that above-mentioned silicon chip breakable problem when taking.

Utility model content

The purpose of this utility model is to propose one kind not only to have had buffering and fixation but also can facilitate silicon chip from foam box The silicon chip packaging dividing plate taking out.

For reaching this purpose, this utility model employs the following technical solutions：

A kind of silicon chip packaging dividing plate, including clapboard body, the edge of described clapboard body is provided with opening, described opening More convenient for making silicon chip take；

, between 1cm to 3cm, the depth of described opening is between 1cm to 3cm for the width of described opening.

As a preferred version of the present utility model, open respectively at the upper edge of described clapboard body and lower edge It is provided with described opening.

As a preferred version of the present utility model, relative two side of described clapboard body all opens up State opening.

As a preferred version of the present utility model, described opening is located at the vertical centrage of described clapboard body side On.

As a preferred version of the present utility model, the section of described opening is in the shape of the letter V.

As a preferred version of the present utility model, the section of described opening is arc or semicircle.

As a preferred version of the present utility model, the width of described opening is 1.5cm, and the depth of described opening is 1.5cm.

As a preferred version of the present utility model, described clapboard body is the square structure of hollow.

The beneficial effects of the utility model are：

Silicon chip packaging dividing plate of the present utility model offers opening in the edge of clapboard body, during use, by dividing plate It is positioned over equipped with the foam box of silicon chip, so that dividing plate had not only had buffering and fixation but also can make silicon chip by opening More easily take out from foam box.

Brief description

Fig. 1 is the front view of the silicon chip packaging dividing plate that this utility model preferred embodiment provides；

Fig. 2 is the silicon chip packaging dividing plate top view that this utility model preferred embodiment provides；

Fig. 3 is one of state diagram when the dividing plate that this utility model preferred embodiment provides uses in foam box；

Fig. 4 is two of the state diagram when dividing plate that this utility model preferred embodiment provides uses in foam box.

In figure is labeled as：

1st, opening；2nd, clapboard body；3rd, silicon chip；4th, foam box.

Specific embodiment

Further illustrate the technical solution of the utility model below in conjunction with the accompanying drawings and by specific embodiment.

Preferred embodiment：

This preferred embodiment discloses a kind of silicon chip packaging dividing plate.As depicted in figs. 1 and 2, silicon chip packaging dividing plate includes Clapboard body 2, clapboard body 2 is the square structure of hollow, and the edge of clapboard body 2 is provided with opening 1, and opening 1 is used for making silicon Piece is taken more convenient.

In the present embodiment, as shown in figure 1, offering opening 1 respectively at the upper edge of clapboard body 2 and lower edge, Opening 1 may be located on side it is also possible to be located on top surface or bottom surface.It is preferably in relative two side of clapboard body 2 On all offer opening 1, and opening 1 is respectively in the upper and lower of side, and is located on the vertical centrage of this side.

Take more easily purpose to realize silicon chip, so that the section of opening 1 is in the shape of the letter V, but, the section shape of opening 1 Shape is not limited to V-shaped or arc, semicircle or other shapes, be capable of silicon chip and take convenient purpose be Can.

, between 1cm to 3cm, the depth of opening 1 is between 1cm to 3cm for the width of opening 1.Preferably, the width of opening 1 Spend for 1.5cm, the depth of opening 1 is 1.5cm it is also possible to enter the setting of line width and depth according to actually used demand.

When actually used, as shown in Figure 3 and Figure 4, multiple silicon chips 3 are put in foam box 4, multiple silicon chips 3 are divided into three parts, Place 2-4 piece dividing plate between adjacent two parts to be fixed and buffer, preferably place 2 dividing plates and separate, so every part silicon chip 3 all may be used Fast and easily to be taken out by opening 1, can effectively prevent silicon chip 3 from overexerting when taking out simultaneously and lead to fragment.

In order to preferably explain to the present embodiment, now it is illustrated below：

Using the hollow clapboard that the present embodiment provides, silicon chip is packed, 400 silicon chips 3 are divided into four parts, adjacent two 3 new hollow clapboards are placed between part.The A/F of hollow clapboard is 1.5cm, and depth is 1.5cm.Using this packaging Mode, silicon chip has no breakage in transportation, opens that to take silicon chip when box is taken convenient simultaneously.

Finally in addition it is also necessary to explanation, herein, term " inclusion ", "comprising" or its any other variant are intended to Cover comprising of nonexcludability, so that including a series of process of key elements, method, article or equipment not only include those Key element, but also include other key elements being not expressly set out, or also include for this process, method, article or set Standby intrinsic key element.In the absence of more restrictions, the key element that limited by sentence "including a ..." it is not excluded that Also there is other identical element in process, method, article or the equipment including described key element.

Above in association with accompanying drawing, embodiment of the present utility model is described, but this utility model is not limited to The specific embodiment stated, those skilled in the art is in the scope feelings protected without departing from this utility model objective and claim Under condition, also can get a lot of forms, these are all within protection domain of the present utility model.

Claims (8)

1. it is characterised in that including clapboard body (2), the edge of described clapboard body (2) sets a kind of silicon chip packaging dividing plate There is opening (1), described opening (1) is used for making silicon chip take more convenient；

, between 1cm to 3cm, the depth of described opening (1) is between 1cm to 3cm for the width of described opening (1).

2. a kind of silicon chip packaging dividing plate according to claim 1 is it is characterised in that the upside of described clapboard body (2) Described opening (1) is offered respectively at edge and lower edge.

3. a kind of silicon chip packaging dividing plate according to claim 2 it is characterised in that described clapboard body (2) relative Two sides on all offer described opening (1).

4. a kind of silicon chip packaging dividing plate according to claim 3 it is characterised in that described opening (1) be located at described every On the vertical centrage of plate body (2) side.

5. a kind of silicon chip packaging dividing plate according to claim 4 is it is characterised in that the section of described opening (1) is in V word Shape.

6. a kind of silicon chip packaging dividing plate according to claim 4 is it is characterised in that the section of described opening (1) is arc Shape or semicircle.

7. a kind of silicon chip packaging dividing plate according to any one of claim 1-6 is it is characterised in that described opening (1) Width is 1.5cm, and the depth of described opening (1) is 1.5cm.

8. a kind of silicon chip packaging dividing plate according to any one of claim 1-6 is it is characterised in that described clapboard body (2) for the square structure of hollow.