CN205961089U - Physics encapsulation of miniaturation atomic clock - Google Patents
Physics encapsulation of miniaturation atomic clock Download PDFInfo
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- CN205961089U CN205961089U CN201620793252.9U CN201620793252U CN205961089U CN 205961089 U CN205961089 U CN 205961089U CN 201620793252 U CN201620793252 U CN 201620793252U CN 205961089 U CN205961089 U CN 205961089U
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Abstract
The utility model relates to a physics encapsulation of miniaturation atomic clock, include: photoelectric detector and circuit board, temperature sensitive resistance, photoelectric detector circuit board pin, MEMS alkali metal vapour bubble, 14 wave plates, field effect transistor, laser instrument and circuit board, C axle field coil support and magnetic screen shell, physics encapsulation main part support and bolt -lock, physics encapsulation main part support is used for being in the same place photoelectric detector and circuit board, temperature sensitive resistance, photoelectric detector circuit board pin, MEMS alkali metal vapour bubble, 14 wave plates, field effect transistor with laser instrument and circuit board assembly, physics encapsulation main part support both sides set up a plurality of keyholes, and the bolt -lock is provided with the bolt with the same quantity of a plurality of keyholes, and the bolt passes the keyhole and fixes the position of photoelectric detector and circuit board and laser instrument and circuit board. The utility model discloses the degree of difficulty that the low miniaturation atomic clock physics encapsulation of degradable realized, through the discrete device in the fixed physics encapsulation main part support, the mechanical fastness of reinforcing total.
Description
Technical field
This utility model is related to a kind of physical package technology of miniaturization atomic clock, more particularly to a kind of miniaturization atom
The physical package of clock.
Background technology
Atomic clock is the equipment that can provide correct time or frequency at present in the world, but volume is big, power consumption is high, price
Costliness limits its range.And atomic clock is miniaturized and because of it, there is small volume, low in energy consumption and relatively low
Price, is more and more favored.
Miniaturization atomic clock includes radio-frequency module, servo control loop and three parts of physical package, wherein physical package
It is most crucial, the most difficult part.
Utility model content
The purpose of this utility model is the problem difficult for miniaturization atomic clock physical package in prior art, provides one
Plant the physical package of miniaturization atomic clock, reduce the difficulty that miniaturization atomic clock physical package is realized, reduce physical package work(
Consumption, enhances the mechanical firmness of whole encapsulating structure.
For achieving the above object, this utility model provides a kind of physical package of miniaturization atomic clock, including：Light electrical resistivity survey
Survey device and its circuit board, thermo-sensitive resistor, photo-detector circuit plate pad pin, MEMS vapour of an alkali metal bubble, quarter wave plate, field
Effect pipe, laser instrument and its circuit board, C axle field coil support and magnetic shield shell；Also include：Physical package main body rack and
Bolt-lock；Physical package main body rack is used for photodetector and its circuit board, thermo-sensitive resistor, photo-detector circuit plate pad
Pin, MEMS vapour of an alkali metal bubble, quarter wave plate, field effect transistor and laser instrument and its circuit board group are fitted together；Physical package master
Body support frame both sides are provided with multiple keyholes, and bolt-lock is provided with the bolt with multiple keyhole equal numbers, and bolt passes through multiple keyholes by light
The position of electric explorer and its circuit board and laser instrument and its circuit board is fixed.
This utility model adopts the physical package main body rack of machining, reduces miniaturization atomic clock physical package real
Existing difficulty；All discrete devices in physical package main body rack are fixed together by the bolt-lock of physical package, enhance whole
The mechanical firmness of individual structure.
Brief description
A kind of physical package of miniaturization atomic clock and its showing of primary clustering that Fig. 1 provides for this utility model embodiment
It is intended to；
Fig. 2 a is the structural representation of laser instrument and its circuit board in the primary clustering of physical package shown in Fig. 1；
Fig. 2 b is the structural representation of laser instrument and its circuit board in the primary clustering of physical package shown in Fig. 1；
Fig. 3 is the structural representation of MEMS vapour of an alkali metal bubble in the primary clustering of physical package shown in Fig. 1；
Fig. 4 is the structural representation of field effect transistor in the primary clustering of physical package shown in Fig. 1；
Fig. 5 is the structural representation of photodetector and its circuit board in the primary clustering of physical package shown in Fig. 1；
Fig. 6 is the structure elevational schematic view of physical package main body rack in the primary clustering of physical package shown in Fig. 1；
Fig. 7 is the structure schematic top plan view of physical package main body rack in the primary clustering of physical package shown in Fig. 1；
Fig. 8 is the structure chart of bolt-lock in the primary clustering of physical package shown in Fig. 1；
Fig. 9 is the structure chart of C axle field coil support in the primary clustering of physical package shown in Fig. 1；
Figure 10 is the structural representation of magnetic shield shell in the primary clustering of physical package shown in Fig. 1.
Wherein：
Miniaturization atomic clock physical package 100, photodetector and its circuit board 101, thermo-sensitive resistor 102, photodetection
Device board pads pin 103, MEMS vapour of an alkali metal bubble 104, quarter wave plate 105, field effect transistor 106, laser instrument and its circuit
Plate 107, physical package main body rack 108, bolt-lock 109, C axle field coil support 110, magnetic shield shell 111, photodetector
Circuit board space 201, photodetector space 202, MEMS vapour of an alkali metal steeps space 203, quarter wave plate space 204, and laser leads to
Hole 205, keyhole 206-213, field effect transistor space 214-215, laser instrument, thermo-sensitive resistor and be close to laser instrument circuit board sky
Between 216, photo-detector circuit plate pad pin bores 217-218, away from the space 219 of the circuit board of laser instrument, bolt 301-
304, bolt stationary plane 305, field coil anti-drop structure 401-402, field coil position 403, field coil rack space
404, glass 501, silicon 502, glass 503, silicon hole 504, alkali metal 505, field effect transistor hot zone 601, fin 602, field is imitated
Should pipe pin 603-605, magnetic shield shell body 701, magnetic shield shell fix foot 702-705, magnetic shield outer casing space 706, light
Electric explorer circuit board 801, photo-detector circuit plate pin bores 802-803, photodetector pad 804-805, light electrical resistivity survey
Survey device 806, laser circuit board pad pin bores 901-902, support fixation be close to laser instrument circuit board connecting pins 903-904,
913-914, field effect transistor pin bores 905-907,915-917, laser instrument pad 908-909, thermo-sensitive resistor pad 910-911,
Thermo-sensitive resistor pad pin 918-919, laser instrument pad pin 920-921, away from the circuit board 922 of laser instrument, are close to laser
The circuit board 923 of device, laser instrument 924.
Specific embodiment
Below by drawings and Examples, the technical solution of the utility model is described in further detail.
A kind of physical package of miniaturization atomic clock and its showing of primary clustering that Fig. 1 provides for this utility model embodiment
It is intended to.As shown in figure 1, physical package mainly includes photodetector and its circuit board 101, thermo-sensitive resistor 102, photodetector
Board pads pin 103, MEMS vapour of an alkali metal bubble 104, quarter wave plate 105, field effect transistor 106, laser instrument and its circuit board
107th, physical package main body rack 108, bolt-lock 109, C axle field coil support 110 and magnetic shield shell 111.
Physical package main body rack 108 is used for photodetector and its circuit board 101, thermo-sensitive resistor 102, photodetection
Device board pads pin 103, MEMS vapour of an alkali metal bubble 104, quarter wave plate 105, field effect transistor 106 and laser instrument and its electricity
Road plate 107 fits together；Physical package main body rack 108 both sides are provided with multiple keyhole 206-213, and bolt-lock 109 is provided with
With the bolt 301-304 of multiple keyhole 206-213 equal numbers, bolt 301-304 passes through multiple keyhole 206-213 by photodetector
And its position of circuit board 101 and laser instrument and its circuit board 107 is fixed.Preferably, physical package main body rack 108 can
Made using the polytetrafluoroethylmaterial material with low thermal conductivity, internal conduction of heat can be reduced, reduce physical package power consumption.
Fig. 2 a and Fig. 2 b is respectively the structural representation of laser instrument and its circuit board in the primary clustering of physical package shown in Fig. 1
Figure.As shown in Figure 2 a and 2 b, laser instrument and its circuit board 107 include thermo-sensitive resistor 102, laser circuit board pad pin bores
901-902, support fixation be close to laser circuit board pin 903-904,913-914, field effect transistor pin bores 905-907,
915-917, laser instrument pad 908-909, sharp thermo-sensitive resistor pad 910-911, thermo-sensitive resistor pad pin 918-919, light device
Pad pin 920-921, the circuit board 922 away from laser instrument, the circuit board 923 being close to laser instrument and laser instrument 924.
Laser instrument 924 is welded in the one side of the circuit board 923 being close to laser instrument by laser instrument pad 908-909；Temperature
Quick resistance 102 is welded in the one side of the circuit board 923 being close to laser instrument by thermo-sensitive resistor pad 910-911；Support and fix
It is close to laser circuit board pin 903-904,913-914 to be installed on the another side of circuit board 923 being close to laser instrument；Swash
Light device pad pin 920-921 and thermo-sensitive resistor pad pin 918-919 is welded on the another of the circuit board 923 being close to laser instrument
Simultaneously go up；Laser circuit board pad pin bores 901-902 and field effect transistor pin bores 905-907,915-917 are located at and are close to swash
On the circuit board 923 of light device；Fixation is supported to be close to laser circuit board pin away from being welded with the circuit board 922 of laser instrument
903-904、913-914.
Fig. 3 is the structural representation of MEMS vapour of an alkali metal bubble in the primary clustering of physical package shown in Fig. 1.As Fig. 3 institute
Show, MEMS vapour of an alkali metal bubble 104 includes upper strata glass 501, lower floor's glass 503, silicon 502, silicon hole 504 and alkali metal 505；Silicon
502 two sides is fitted tightly with upper strata glass 501 and lower floor's glass 503 respectively, to close the silicon hole 504 being located at silicon 502 center；
Silicon hole 504 is used for placing alkali metal 505, and filling buffer gas；Alkali metal 505 is used for providing frequency discrimination atom.
Fig. 4 is the structural representation of field effect transistor in the primary clustering of physical package shown in Fig. 1.As shown in figure 4, field effect
Pipe 106 includes hot zone 601, fin 602 and pin 603-605；Hot zone 601 is used for field effect transistor and works；Fin 602
For field effect transistor radiating；Pin 603-605 is used for drawing three electrodes of field effect transistor.
Fig. 5 is the structural representation of photodetector and its circuit board in the primary clustering of physical package shown in Fig. 1.As figure
Shown in 5, photodetector and its circuit board 101 include photo-detector circuit plate 801, photo-detector circuit plate pin bores
802-803, photodetector pad 804-805 and photodetector 806；Photodetector 806 passes through photodetector pad
804-805 is welded on photo-detector circuit plate 801；Photo-detector circuit plate pin bores 802-803 are used for welding photoelectricity
Detector circuit plate pad pin 103；Photodetector 806 is used for detecting and the laser intensity after alkali metal effect.
Fig. 6 is the structure elevational schematic view of physical package main body rack in the primary clustering of physical package shown in Fig. 1, Fig. 7
The structure schematic top plan view of physical package main body rack in the primary clustering of physical package shown in Fig. 1.As shown in Figure 6 and Figure 7,
Physical package main body rack 108 mainly includes photo-detector circuit board space 201, photodetector space 202, MEMS alkali gold
Belong to steam bubble space 203, quarter wave plate space 204, laser via 205, keyhole 206-213, field effect transistor space 214-215, swash
Light device, thermo-sensitive resistor and be close to laser circuit board space 216, photo-detector circuit pad pin bores 217-218 and away from
Laser circuit board space 219.
Photo-detector circuit board space 201 is used for placing photo-detector circuit plate 801；Photodetector space 202
For placing photodetector 806；MEMS vapour of an alkali metal bubble space 203 is used for placing MEMS vapour of an alkali metal bubble 104；1/4
Wave plate space 204 is used for placing quarter wave plate 105；Laser via 205 is used for allowing laser to pass through；Keyhole 206-213 is used for placing bolt
301-304；It is laser instrument 924 that field effect transistor space 214-215 is used for and MEMS vapour of an alkali metal bubble 104 provides suitable work
Temperature；Laser instrument, thermo-sensitive resistor and be close to laser circuit board space 216 be used for placing laser instrument 924, thermo-sensitive resistor 102 and
It is close to the circuit board 923 of laser instrument；Photo-detector circuit pad pin bores 217-218 are used for drawing through photodetector pad
Foot；It is used for being located away from the circuit board 922 of laser instrument away from laser circuit board space 219.
Fig. 8 is the structure chart of bolt-lock in the primary clustering of physical package shown in Fig. 1.As shown in figure 8, bolt-lock 109 mainly wraps
Include bolt-lock stationary plane 305 and bolt 301-304, the quantity of bolt-lock 109 is 2.
Fig. 9 is the structure chart of C axle field coil support in the primary clustering of physical package shown in Fig. 1.As shown in figure 9, C axle
Field coil support 110 include field coil anti-drop structure 401-402, field coil position 403 and field coil prop up built on stilts
Between 404；Field coil anti-drop structure 401-402 comes off for limiting coil；Field coil position 403 is used for wound around coil；
Field coil rack space 404 is used for placing photodetector and its circuit board 101, thermo-sensitive resistor 102, photo-detector circuit
Plate pad pin 103, MEMS vapour of an alkali metal bubble 104, quarter wave plate 105, field effect transistor 106, laser instrument and its circuit board 107,
Physical package main body rack 108 and bolt-lock 109.
Figure 10 is the structural representation of magnetic shield shell in the primary clustering of physical package shown in Fig. 1.As shown in Figure 10, magnetic
Shielding shell 111 mainly includes magnetic shield shell body 701, the fixing foot 702-705 of magnetic shield shell and magnetic shield outer casing space
706；The fixing foot 702-705 of magnetic shield shell is used for fixing magnetic shield shell body 701；Magnetic shield outer casing space 706 is used for placing
Photodetector and its circuit board 101, thermo-sensitive resistor 102, photo-detector circuit plate pad pin 103, MEMS alkali metal steam
Steam bubble 104, quarter wave plate 105, field effect transistor 106, laser instrument and its circuit board 107, physical package main body rack 108, bolt-lock
109 and C axle field coil supports 110.Magnetic shield shell 111 is made using permalloy material.
With reference to Fig. 1-Figure 10 the concrete assembling process of the physical package that this utility model embodiment provides is carried out as
Lower elaboration.
1st step, in the one side of circuit board 923 being close to laser instrument, by laser instrument pad 908-909 welding laser
924, thermo-sensitive resistor 102 is welded by thermo-sensitive resistor pad 910-911；On the another side of circuit board 923 being close to laser instrument,
Install and support fixation to be close to circuit board connecting pins 903-904,913-914 of laser instrument, welding laser pad pin 920-921 and
Thermo-sensitive resistor pad pin 918-919.
2nd step, on photo-detector circuit plate 801, welds photodetector by photodetector pad 804-805
806.
3rd step, installs quarter wave plate 105, in laser instrument, thermo-sensitive resistor and its be close to laser in quarter wave plate space 204
Laser instrument 924 and the circuit board 923 being close to laser instrument are installed in device circuit board space 216, are close to laser instrument electricity supporting fixation
Circuit board 922 away from laser instrument is welded on road plate pin 903-904,913-914.
4th step, steeps in MEMS vapour of an alkali metal and places MEMS vapour of an alkali metal bubble 104 in space 203.
5th step, installs field effect transistor 106 in scene effect tube space 214-215, MEMS alkali metal is close to by fin 602
Steam bubble 104, field effect transistor pin 603-605 passes through field effect transistor pin bores 905-907,915-917.
6th step, installs bolt-lock 109 Dao keyhole 206-213 in.
7th step, installs photo-detector circuit plate pad pin 103 in photodetector pad pin bores 802-803,
Photo-detector circuit plate pad pin 103 is initially passed through photo-detector circuit plate pad pin bores 217-218, is then passed through swashing
It is welded and fixed after light device board pads pin bores 901-902.
8th step, in field coil position 403 wound around coil of C axle field coil support 110, props up built on stilts in field coil
Between 404 place and complete physical package main body rack 108 and the bolt-lock 109 of above-mentioned 7th step.
9th step, places the C axle magnetic field completing above-mentioned 8th step in the magnetic shield outer casing space 706 of magnetic shield shell 111
Coil brace 110.
This utility model embodiment adopts the physical package main body rack of machining, reduces miniaturization atomic clock physics
The difficulty that encapsulation is realized.All discrete devices in physical package main body rack can be fixed on one by the bolt-lock of physical package
Rise, to strengthen the mechanical firmness of total.
Above specific embodiment, has been carried out to the purpose of this utility model, technical scheme and beneficial effect further
Describe in detail, be should be understood that and these are only specific embodiment of the present utility model, be not used to limit this practicality
New protection domain, all of the present utility model spirit and principle within, any modification, equivalent substitution and improvement done etc.,
Should be included within protection domain of the present utility model.
Claims (10)
1. a kind of physical package of miniaturization atomic clock, including：Photodetector and its circuit board (101), thermo-sensitive resistor
(102), photo-detector circuit plate pad pin (103), MEMS vapour of an alkali metal bubble (104), quarter wave plate (105), field effect
Pipe (106), laser instrument and its circuit board (107), C axle field coil support (110) and magnetic shield shell (111)；Its feature exists
In also including：Physical package main body rack (108) and bolt-lock (109)；
Physical package main body rack (108) is used for photodetector and its circuit board (101), thermo-sensitive resistor (102), light electrical resistivity survey
Survey device board pads pin (103), MEMS vapour of an alkali metal bubble (104), quarter wave plate (105), field effect transistor (106) and swash
Light device and its circuit board (107) fit together；
Physical package main body rack (108) both sides are provided with multiple keyholes (206-213), and bolt-lock (109) is provided with and multiple bolts
The bolt (301-304) of hole (206-213) equal number, bolt (301-304) passes through multiple keyholes (206-213) by photodetector
And its position of circuit board (101) and laser instrument and its circuit board (107) is fixed.
2. physical package according to claim 1 is it is characterised in that physical package main body rack (108) adopts polytetrafluoro
Vinyl material is made.
3. physical package according to claim 1 is it is characterised in that photodetector and its circuit board (101) include light
Electric explorer circuit board (801), photo-detector circuit plate pin bores (802-803), photodetector pad (804-805) and
Photodetector (806)；
Photodetector (806) is welded on photo-detector circuit plate (801) by photodetector pad (804-805)；
Photo-detector circuit plate pin bores (802-803) is used for welding photo-detector circuit plate pad pin (103)；
Photodetector (806) is used for detecting and the laser intensity after alkali metal effect.
4. physical package according to claim 1 is it is characterised in that MEMS vapour of an alkali metal bubble (104) includes upper strata glass
Glass (501), lower floor's glass (503), silicon (502), silicon hole (504) and alkali metal (505)；
The two sides of silicon (502) is fitted tightly with upper strata glass (501) and lower floor's glass (503) respectively, is located at silicon (502) to close
The silicon hole (504) at center；
Silicon hole (504) is used for placing alkali metal (505), and filling buffer gas；
Alkali metal (505) is used for providing frequency discrimination atom.
5. physical package according to claim 1 is it is characterised in that field effect transistor (106) includes hot zone (601), dissipates
Backing (602) and pin (603-605)；
Hot zone (601) is used for field effect transistor and works；
Fin (602) is used for field effect transistor and radiates；
Pin (603-605) is used for drawing three electrodes of field effect transistor.
6. physical package according to claim 1 is it is characterised in that laser instrument and its circuit board (107) include temperature sensitive electricity
Resistance (102), laser circuit board pad pin bores (901-902), support fixation be close to laser circuit board pin (903-904,
913-914), field effect transistor pin bores (905-907,915-917), laser instrument pad (908-909), thermo-sensitive resistor pad
(910-911), thermo-sensitive resistor pad pin (918-919), laser instrument pad pin (920-921), the circuit away from laser instrument
Plate (922), the circuit board (923) being close to laser instrument and laser instrument (924)；
Laser instrument (924) is welded in the one side of circuit board (923) being close to laser instrument by laser instrument pad (908-909)；
Thermo-sensitive resistor (102) is welded on the one side of the circuit board (923) being close to laser instrument by thermo-sensitive resistor pad (910-911)
On；
Support fixation to be close to laser circuit board pin (903-904,913-914) and be installed in the circuit board being close to laser instrument
(923) on another side；
Laser instrument pad pin (920-921) and thermo-sensitive resistor pad pin (918-919) are welded on the electricity being close to laser instrument
On the another side of road plate (923)；
Laser circuit board pad pin bores (901-902) and field effect transistor pin bores (905-907,915-917) are located at and are close to
On the circuit board (923) of laser instrument；
Support fixation is welded with the circuit board (922) away from laser instrument and is close to laser circuit board pin (903-904,913-
914).
7. physical package according to claim 1 is it is characterised in that physical package main body rack (108) mainly includes light
Electric explorer circuit board space (201), photodetector space (202), MEMS vapour of an alkali metal bubble space (203), quarter wave plate
Space (204), laser via (205), keyhole (206-213), field effect transistor space (214-215), laser instrument, thermo-sensitive resistor and
It is close to laser circuit board space (216), photo-detector circuit pad pin bores (217-218) and away from laser circuit board
Space (219)；
Photo-detector circuit board space (201) is used for placing photo-detector circuit plate (801)；
Photodetector space (202) is used for placing photodetector (806)；
MEMS vapour of an alkali metal bubble space (203) is used for placing MEMS vapour of an alkali metal bubble (104)；
Quarter wave plate space (204) is used for placing quarter wave plate (105)；
Laser via (205) is used for allowing laser to pass through；
Keyhole (206-213) is used for placing bolt (301-304)；
It is laser instrument (924) that field effect transistor space (214-215) is used for and MEMS vapour of an alkali metal bubble (104) provides suitable work
Make temperature；
Laser instrument, thermo-sensitive resistor and be close to laser circuit board space (216) and be used for placing laser instrument (924), thermo-sensitive resistor
And be close to the circuit board (923) of laser instrument (102)；
Photo-detector circuit pad pin bores (217-218) is used for through photodetector pad pin；
It is used for being located away from the circuit board (922) of laser instrument away from laser circuit board space (219).
8. physical package according to claim 1 is it is characterised in that C axle field coil support (110) includes field coil
Anti-drop structure (401-402), field coil position (403) and field coil rack space (404)；
Field coil anti-drop structure (401-402) comes off for limiting coil；Field coil position (403) is used for being wound around line
Circle；
Field coil rack space (404) is used for placing photodetector and its circuit board (101), thermo-sensitive resistor (102), photoelectricity
Detector circuit plate pad pin (103), MEMS vapour of an alkali metal steep (104), quarter wave plate (105), field effect transistor (106), swash
Light device and its circuit board (107), physical package main body rack (108) and bolt-lock (109).
9. physical package according to claim 1 is it is characterised in that magnetic shield shell (111) is mainly included outside magnetic shield
The fixing foot (702-705) of housing (701), magnetic shield shell and magnetic shield outer casing space (706)；
The fixing foot (702-705) of magnetic shield shell is used for fixing magnetic shield shell body (701)；
Magnetic shield outer casing space (706) is used for placing photodetector and its circuit board (101), thermo-sensitive resistor (102), light electrical resistivity survey
Survey device board pads pin (103), MEMS vapour of an alkali metal bubble (104), quarter wave plate (105), field effect transistor (106), laser
Device and its circuit board (107), physical package main body rack (108), bolt-lock (109) and C axle field coil support (110).
10. physical package according to claim 1 is it is characterised in that magnetic shield shell (111) adopts permalloy material
Make.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620793252.9U CN205961089U (en) | 2016-07-26 | 2016-07-26 | Physics encapsulation of miniaturation atomic clock |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620793252.9U CN205961089U (en) | 2016-07-26 | 2016-07-26 | Physics encapsulation of miniaturation atomic clock |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205961089U true CN205961089U (en) | 2017-02-15 |
Family
ID=57972368
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620793252.9U Expired - Fee Related CN205961089U (en) | 2016-07-26 | 2016-07-26 | Physics encapsulation of miniaturation atomic clock |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205961089U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108628152A (en) * | 2018-05-31 | 2018-10-09 | 中北大学 | The chip atomic clock microsystem of nanometer Y waveguide |
| CN108793059A (en) * | 2017-04-28 | 2018-11-13 | 泰莱达因科学与成像公司 | Physical package for compact atomic device |
| CN113147041A (en) * | 2020-12-14 | 2021-07-23 | 兰州空间技术物理研究所 | 3D printing manufacturing method of miniaturized atomic clock supporting structure |
-
2016
- 2016-07-26 CN CN201620793252.9U patent/CN205961089U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108793059A (en) * | 2017-04-28 | 2018-11-13 | 泰莱达因科学与成像公司 | Physical package for compact atomic device |
| CN108793059B (en) * | 2017-04-28 | 2021-02-02 | 泰莱达因科学与成像公司 | Physical packaging for compact atomic devices |
| CN108628152A (en) * | 2018-05-31 | 2018-10-09 | 中北大学 | The chip atomic clock microsystem of nanometer Y waveguide |
| CN113147041A (en) * | 2020-12-14 | 2021-07-23 | 兰州空间技术物理研究所 | 3D printing manufacturing method of miniaturized atomic clock supporting structure |
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