CN205942527U - Heat dissipation bracket for computer - Google Patents
Heat dissipation bracket for computer Download PDFInfo
- Publication number
- CN205942527U CN205942527U CN201620653251.4U CN201620653251U CN205942527U CN 205942527 U CN205942527 U CN 205942527U CN 201620653251 U CN201620653251 U CN 201620653251U CN 205942527 U CN205942527 U CN 205942527U
- Authority
- CN
- China
- Prior art keywords
- mainboard
- connecting plate
- computer
- heat dissipation
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model provides a heat dissipation bracket for computer, its lower extension board and last extension board that includes the pin joint to and set up at the pillar between extension board and the last extension board down, wherein, last extension board includes: with the bottom plate of extension board pin joint down, the bottom plate includes a mainboard and sets up the grid backup pad at mainboard rear side edge that main plate thickness is greater than the thickness of grid backup pad, with the connecting plate that mainboard and heating panel were pegged graft, the width of mainboard is the integral multiple of the width of connecting plate, and the length of bottom plate is the integral multiple of the length of connecting plate with the poor of the length of mainboard, heating panel with pegging graft with mainboard and connecting plate is provided with radiator fan, and the size of heating panel equals with the size of connecting plate. The utility model discloses well heating panel and connecting plate can be pegged graft at will, can different and carry out the change of adaptability, the effectual radiating effect that improves the heat dissipation support along with the computer generates heat the position of part.
Description
Technical field
The utility model belongs to computer peripheral device field.More specifically, the utility model is related to a kind of computer heat radiation
Support.
Background technology
At present in the live and work of people, computer is indispensable, and the greatest problem caused by Long-Time Service is just
It is radiating, slowly, impact uses the bad speed of service not only resulting in computer of radiating, and in addition long-term hot operation also can affect
The service life of hardware.But in existing cooling stand, it is frequently in center and there is a thermal component, and computer
CPU position is but in other positions, and it is poor that the misfitting of position causes radiating effect.
Utility model content
A purpose of the present utility model is to solve at least the above, and provides the advantage that at least will be described later.
The utility model provides a kind of heat dissipation bracket for computer, and it includes the lower carrier plate of pivot joint and upper supporting plate, and is arranged on
Pillar between described lower carrier plate and described upper supporting plate, wherein, described upper supporting plate includes：
With the base plate of described lower carrier plate pivot joint, described base plate includes a mainboard and be arranged on the side of described mainboard posterior edges
Trellis gripper shoe, the thickness of described mainboard is more than the thickness of described grid-like gripper shoe；
With the connecting plate of described mainboard and heat sink grafting, the width of described mainboard is the integer of the width of described connecting plate
Times, the difference of the length of the length of described base plate and described mainboard is the integral multiple of the length of described connecting plate；
And the described heat sink with described mainboard and described connecting plate grafting, described heat sink is provided with radiator fan,
The size of described heat sink is equal sized with described connecting plate.
Preferably, in described heat dissipation bracket for computer, the both sides of the edge position of the upper surface of described grid-like gripper shoe
Offer one for card set the draw-in groove of described heat sink.
Preferably, in described heat dissipation bracket for computer, the upper surface of described grid-like gripper shoe has some anti-skidding
Grain.
Preferably, in described heat dissipation bracket for computer, described pillar is two, and each described pillar includes many phases
Mutually sheathed sub- pillar.
Preferably, in described heat dissipation bracket for computer, each described sub- pillar offers the relative company of least one set
Connect hole, connecting rod passes through described connection through hole to fix described sub- pillar.
Preferably, in described heat dissipation bracket for computer, described heat sink and described connecting plate offer some radiatings
Through hole.
Preferably, in described heat dissipation bracket for computer, described connecting plate is additionally provided with multiple radiating fins.
The utility model provides a kind of heat dissipation bracket for computer, and it includes the lower carrier plate of pivot joint and upper supporting plate, and is arranged on
Pillar between described lower carrier plate and described upper supporting plate, wherein, described upper supporting plate includes：With the base plate of described lower carrier plate pivot joint,
Described base plate includes a mainboard and is arranged on the grid-like gripper shoe of described mainboard posterior edges, and the thickness of described mainboard is more than institute
State the thickness of grid-like gripper shoe；With the connecting plate of described mainboard and heat sink grafting, the width of described mainboard is described connection
The difference of the length of the integral multiple of the width of plate, the length of described base plate and described mainboard is the integer of the length of described connecting plate
Times；And the described heat sink with described mainboard and described connecting plate grafting, described heat sink is provided with radiator fan, described scattered
The size of hot plate is equal sized with described connecting plate.In the utility model heat sink and connecting plate can arbitrarily grafting, Neng Gousui
The position difference of computer heat generating components and carry out adaptive change, effectively raise the radiating effect of cooling stand.
Part is embodied by further advantage of the present utility model, target and feature by description below, and part also will be passed through
Research of the present utility model and practice are understood by the person skilled in the art.
Brief description
The structural representation of the heat dissipation bracket for computer that Fig. 1 provides for the utility model.
Specific embodiment
Below in conjunction with the accompanying drawings the utility model is described in further detail, to make those skilled in the art with reference to explanation
Book word can be implemented according to this.
It should be appreciated that used herein such as " have ", "comprising" and " inclusion " term do not allot one or many
The presence of individual other element or a combination thereof or interpolation.
As shown in figure 1, the utility model provides the utility model to provide a kind of heat dissipation bracket for computer, it is included under pivot joint
Support plate 1 and upper supporting plate, and it is arranged on the pillar 3 between described lower carrier plate 1 and described upper supporting plate, wherein, described upper supporting plate bag
Include：
With the base plate of described lower carrier plate 1 pivot joint, described base plate includes a mainboard 201 and is arranged on rear side of described mainboard 201
The grid-like gripper shoe 202 at edge, the thickness of described mainboard 201 is more than the thickness of described grid-like gripper shoe 202；
With the connecting plate 4 of described mainboard 201 and heat sink 5 grafting, the width of described mainboard 201 is described connecting plate 4
The difference of the length of the integral multiple of width, the length of described base plate and described mainboard 201 is the integer of the length of described connecting plate 4
Times；
And the described heat sink 5 with described mainboard 201 and described connecting plate 4 grafting, described heat sink 5 is provided with radiating
Fan, the size of described heat sink 5 is equal sized with described connecting plate 4.
In described heat dissipation bracket for computer, the both sides of the edge position of the upper surface of described grid-like gripper shoe 202 offers
One is used for the draw-in groove that card sets described heat sink 5.
In described heat dissipation bracket for computer, the upper surface of described grid-like gripper shoe 202 has some antiskid particles.
In described heat dissipation bracket for computer, described pillar 3 be two, and each described pillar 3 include many mutually sheathed
Sub- pillar.
In described heat dissipation bracket for computer, each described sub- pillar offers the relative connection through hole of least one set, even
Extension bar passes through described connection through hole to fix described sub- pillar.
In described heat dissipation bracket for computer, described heat sink 5 and described connecting plate 4 offer some thermal vias.
In described heat dissipation bracket for computer, described connecting plate 4 is additionally provided with multiple radiating fins.
Although embodiment of the present utility model is disclosed as above, it is not restricted in specification and embodiment
Listed utilization, it can be applied to various suitable fields of the present utility model completely, for those skilled in the art,
It is easily achieved other modification, therefore under the universal being limited without departing substantially from claim and equivalency range, this reality
It is not limited to specific details with new and shown here as the legend with description.
Claims (7)
1. heat dissipation bracket for computer is it is characterised in that include the lower carrier plate of pivot joint and upper supporting plate, and be arranged on described lower carrier plate and
Pillar between described upper supporting plate, wherein, described upper supporting plate includes：
With the base plate of described lower carrier plate pivot joint, described base plate includes a mainboard and be arranged on the grid-like of described mainboard posterior edges
Gripper shoe, the thickness of described mainboard is more than the thickness of described grid-like gripper shoe；
With the connecting plate of described mainboard and heat sink grafting, the width of described mainboard is the integral multiple of the width of described connecting plate,
The difference of the length of the length of described base plate and described mainboard is the integral multiple of the length of described connecting plate；
And the described heat sink with described mainboard and described connecting plate grafting, described heat sink is provided with radiator fan, described
The size of heat sink is equal sized with described connecting plate.
2. heat dissipation bracket for computer as claimed in claim 1 is it is characterised in that the both sides of the upper surface of described grid-like gripper shoe
Marginal position offer one for card set the draw-in groove of described heat sink.
If 3. heat dissipation bracket for computer as claimed in claim 1 is it is characterised in that the upper surface of described grid-like gripper shoe has
Dry antiskid particles.
4. heat dissipation bracket for computer as claimed in claim 1 is it is characterised in that described pillar is two, and each described pillar
Including many mutually sheathed sub- pillars.
5. heat dissipation bracket for computer as claimed in claim 4 is it is characterised in that offer least one set on each described sub- pillar
Relative connection through hole, connecting rod passes through described connection through hole to fix described sub- pillar.
6. heat dissipation bracket for computer as claimed in claim 1 is it is characterised in that offer on described heat sink and described connecting plate
Some thermal vias.
7. heat dissipation bracket for computer as claimed in claim 1 is it is characterised in that be additionally provided with multiple radiating fins on described connecting plate
Piece.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620653251.4U CN205942527U (en) | 2016-06-27 | 2016-06-27 | Heat dissipation bracket for computer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620653251.4U CN205942527U (en) | 2016-06-27 | 2016-06-27 | Heat dissipation bracket for computer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205942527U true CN205942527U (en) | 2017-02-08 |
Family
ID=57930792
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620653251.4U Expired - Fee Related CN205942527U (en) | 2016-06-27 | 2016-06-27 | Heat dissipation bracket for computer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205942527U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106704777A (en) * | 2017-03-03 | 2017-05-24 | 安徽豪威商用显示科技有限公司 | Gradient-adjustable stable bracket |
-
2016
- 2016-06-27 CN CN201620653251.4U patent/CN205942527U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106704777A (en) * | 2017-03-03 | 2017-05-24 | 安徽豪威商用显示科技有限公司 | Gradient-adjustable stable bracket |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170208 Termination date: 20180627 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |