CN205942481U - Special computer protection device of wide temperature environment - Google Patents
Special computer protection device of wide temperature environment Download PDFInfo
- Publication number
- CN205942481U CN205942481U CN201620864721.1U CN201620864721U CN205942481U CN 205942481 U CN205942481 U CN 205942481U CN 201620864721 U CN201620864721 U CN 201620864721U CN 205942481 U CN205942481 U CN 205942481U
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- cpu module
- chilling plate
- protection device
- semiconductor chilling
- temperature environment
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Abstract
The utility model discloses a special computer protection device of wide temperature environment, including the CPU module, the input of CPU module is connected with temperature and humidity acquisition module, the input/output end of CPU module is connected with LCD, the outer cladding of LCD has the insulating glass layer, LCD's display screen with be filled with the inert gas layer between the insulating glass layer, the output of CPU module is connected with heating device and refrigerating plant respectively through first switch and second switch. The utility model discloses can not only control liquid crystal display's operating temperature, be convenient for improve its thermal insulation performance and energy -conserving effect, still adjust the protection device of CPU and whole computer through heating device and refrigerating plant for the product can stably be worked.
Description
Technical field
This utility model is related to microcomputer protecting device field, more particularly, to wide temperature environment dedicated microcomputer protection device.
Background technology
More and more extensive with protection device use environment, conventional microcomputer protecting device is generally operational in -10 DEG C～+55
DEG C, its weather working environment of some occasions, due to temperature control device imperfection, leads to device to work under extremely low temperature or superhigh temperature, very
To being possible to beyond device operating temperature scope, make the product can not reliable and stable work.
Common LCD liquid crystal display screen works under the low temperature environment of pole, because liquid crystal characteristic easily produces smear, Hua Ping, instead
Answer the phenomenon such as blunt, under hyperthermal environments, more have the possibility burning out；Although adopting technical grade temperature device during components selection,
Be be operated in close to limiting temperature when, due to the effect of temperature drift, also more or less properties of product are produced some impact.These are all
It is uncontrollable, device operating ambient temperature can only be controlled in a good range.And for unit temp extremely low or
During superelevation, then the temperature of uncontrollable LCDs, lead to LCDs cannot use.
Content of the invention
Technical problem to be solved in the utility model is to provide wide temperature environment dedicated microcomputer protection device, and it can not only
Control the operating temperature of LCDs, be easy to improve its heat-insulating property and energy-saving effect, also by heater and refrigeration dress
Put adjustment work temperature so that product being capable of steady operation.
For solving above technical problem, this utility model embodiment provides wide temperature environment dedicated microcomputer protection device, including
CPU module, the input of described CPU module is connected with humiture collection module, and the input/output terminal of described CPU module is connected with
Liquid crystal display；
Heat insulation glass layer, the display screen of described liquid crystal display and described insulation are coated with described liquid crystal display outer wall
It is filled with layer of inert between glassy layer；
The outfan of described CPU module is connected to heater and refrigeration dress by first switch and second switch
Put.
Further, described heater is far infrared heater or the first semiconductor chilling plate, described first switch
It is connected with the hot face of described far infrared heater or described first semiconductor chilling plate.
Further, described refrigerating plant is the second semiconductor chilling plate, described second switch and described second quasiconductor
The huyashi-chuuka (cold chinese-style noodles) of cooling piece connects.
Further, the input of described CPU module has been also respectively connected with power input, has opened into module and AC sampling
Device, the outfan of described CPU module is connected with outputs module.
Further, also include a pcb board, described CPU module, humiture collection module, liquid crystal display, far infrared add
The huyashi-chuuka (cold chinese-style noodles) of the hot face of thermal or the first semiconductor chilling plate and the second semiconductor chilling plate may be contained within described pcb board, institute
State far infrared heater or the hot face of the first semiconductor chilling plate is also disposed on described pcb board.
Further, described pcb board is in a seal casinghousing, the huyashi-chuuka (cold chinese-style noodles) of described first semiconductor chilling plate and the second half
The hot face of conductor cooling piece is outside described housing.
Further, the hot face of described first semiconductor chilling plate and the hot face of the second semiconductor chilling plate are respectively equipped with
First heat abstractor and the second heat abstractor.
The beneficial effects of the utility model are as follows：
1st, this utility model pass through in LCDs outer cladding insulating so that the display screen of liquid crystal display with
Described heat insulation glass layer forms double glazing, is full of layer of inert, indifferent gas between display screen and heat insulation glass layer simultaneously
, for air, density is big, and heat conductivity is little for body phase, therefore can slow down the thermal convection current of centre, reduces the heat conductivity of gas, thus
Reduce the heat transfer coefficient in outside, contribute to improving the heat-insulating property of double glazing and energy-saving effect.Filling inert gas into hollow glass
Concentration is higher, and the effect improving energy-conservation is better.
2nd, this utility model passes through to increase heater and refrigerating plant, it is possible to achieve the regulation and control of internal temperature, by temperature
Humidity collection module, can measure temperature and humidity；When temperature is not in the range of requiring, refrigeration is controlled by CPU module
Device or heater are so as to reach the temperature range of requirement.This utility model temperature-controllable, easy to use.
Brief description
Fig. 1 is the circuit theory diagrams of the wide temperature environment dedicated microcomputer protection device that this utility model provides；
Fig. 2 is the structural representation of the liquid crystal display that this utility model provides；
In figure：
1st, CPU module；2nd, humiture collection module；3rd, liquid crystal display；4th, heat insulation glass layer；5th, first switch；6th,
Two switches；7th, heater；8th, refrigerating plant；9th, power input；10th, open into module；11st, ac sampling device；12nd, output
Module.
Specific embodiment
Below in conjunction with the accompanying drawing in this utility model embodiment, the technical scheme in this utility model embodiment is carried out
Clearly and completely describe.
Referring to shown in Fig. 1-2, being the wide temperature environment dedicated microcomputer protection device that this utility model provides, including CPU module
1, the input of described CPU module 1 is connected with humiture collection module 2, and the input/output terminal of described CPU module 1 is connected with liquid
Crystal display；
Heat insulation glass layer 4 is coated with described liquid crystal display 3 outer wall, the display screen of described liquid crystal display 3 with described
It is filled with layer of inert between heat insulation glass layer 4；
The outfan of described CPU module 1 passes through first switch 5 and second switch 6 is connected to heater 7 and refrigeration
Device 8.
Specifically, above-mentioned heating fills 7 is far infrared heater or the first semiconductor chilling plate, described first switch 5 with
The hot face of described far infrared heater or described first semiconductor chilling plate connects.By far infrared heater, Ke Yishi
Existing Infrared Heating, and pass through the first semiconductor chilling plate and can realize semiconductor heating, user is selected according to demand.
Further, described refrigerating plant 8 is the second semiconductor chilling plate, and described second switch 6 is led with described the second half
The huyashi-chuuka (cold chinese-style noodles) of body cooling piece connects.By the second semiconductor chilling plate, realize the refrigeration of quasiconductor.
Semiconductor refrigeration material is an emerging active material, just has for cooling down a certain object or right in its application
The introduction that certain special object is radiated, and this situation occurs in electronics industry in a large number.
Further, the input of described CPU module 1 has been also respectively connected with power input 9, has opened into module 10 and hand over
Stream sampling apparatuses 11, the outfan of described CPU module 1 is connected with outputs module 12.Power supply confession is carried out by power input 9
Give, open into module 10 and output the input and output that module 12 realizes CPU module, by ac sampling device 11 it is ensured that exchange is adopted
In sample measurement, collection is accurate, reliable.
Further, also include a pcb board, described CPU module 1, humiture collection module 2, liquid crystal display 3, far red
The huyashi-chuuka (cold chinese-style noodles) of the hot face of external heating device or the first semiconductor chilling plate and the second semiconductor chilling plate may be contained within described pcb board
On, the hot face of described far infrared heater or the first semiconductor chilling plate is also disposed on described pcb board.By by above-mentioned mould
Block welding is to pcb board so as to form circuit board, convenient use, it is convenient to carry.Using front, pcb board carried out with water-proofing treatment, prevents
Condensation figure layer, to carrying out encapsulation process around pcb board.
Further, described pcb board is in a seal casinghousing, the huyashi-chuuka (cold chinese-style noodles) and second of described first semiconductor chilling plate
The hot face of semiconductor chilling plate is outside described housing.Because the effect here of the first semiconductor chilling plate is heating, so
Should be by its huyashi-chuuka (cold chinese-style noodles) outside housing, it is to avoid impact plays its effect；Likewise, the effect of the second semiconductor chilling plate is refrigeration,
Should be by its hot face outside housing.
Further, the hot face of described first semiconductor chilling plate and the hot face of the second semiconductor chilling plate are respectively equipped with
One heat abstractor and the second heat abstractor.Because, in the use of semiconductor chilling plate, hot face has big calorimetric and sheds, if too late
Shi Jinhang radiates, and can affect its use, therefore need to increase by the first heat abstractor and the second heat abstractor carries out radiating treatment.
During using this utility model, it is preferred that emphasis is heat-insulation and heat-preservation to liquid crystal display and to internal temperature automatic temperature-control
Control, be also required to process its humidity resistance of enhancing to PCB spraying three-proofing coating simultaneously.
In use, the LCDs that responsible interactive interface shown and operates, the design uses SPI serial side
Formula and CPU module complete data interaction；In structure, liquid crystal display pass through once good heat insulation glass so as to formed double-layer inflatable
Double glazing mode, LCDs part is isolated from the outside.The heat insulation glass of outer layer is responsible for heat-insulation and heat-preservation, and internal layer is liquid crystal
The screen of display screen.
Inflation double glazing refers to that two panels or divided glass, so that effective support is evenly spaced and periphery adhering and sealing, make glass
Interlayer is formed with the glass in dry noble gases space.Between LCDs of the present utility model and heat insulation glass and
Noble gases just form above-mentioned inflation double glazing, and, for air, density is big, and heat conductivity is little for noble gases,
Therefore the thermal convection current in intermediate layer can be slowed down, reducing the heat conductivity of gas, thus reducing the heat transfer coefficient of double glazing, contributing to improving
The heat-insulating property of double glazing and energy-saving effect.Filling inert gas into hollow glass concentration is higher, and the effect improving energy-conservation is better.
Internal temp. controls by humiture acquisition system, and heating system and refrigeration system are constituted.Humiture acquisition system is adopted
With Temperature Humidity Sensor, real-time monitoring is carried out to internal medium, gathered data is uploaded directly into CPU module makes itself and setting value
Contrast judges；Heating system adopts low-power consumption Far-infrared Heating or the first semiconductor chilling plate；Refrigeration system adopts
Two semiconductor refrigerating modes, are radiated by casing.When temperature exceeds 0 DEG C～40 DEG C of the temperature value that CPU module sets, start in
Portion's heating or cooling system, can control unit temp in good range of operation.Operation logic is as follows：
(1) when detection temperature T<When 0 DEG C, start far infrared heating system, after being heated to+1 DEG C, stop heating；
When detection temperature T>When 40 DEG C, start semiconductor refrigeration system, freeze to after+39 DEG C and stop refrigeration.
The above is preferred implementation of the present utility model it is noted that ordinary skill for the art
For personnel, on the premise of without departing from this utility model principle, some improvements and modifications can also be made, these improve and moisten
Decorations are also considered as protection domain of the present utility model.
Claims (7)
1. it is characterised in that including CPU module, the input of described CPU module connects wide temperature environment dedicated microcomputer protection device
There is humiture collection module, the input/output terminal of described CPU module is connected with liquid crystal display；
Heat insulation glass layer, the display screen of described liquid crystal display and described heat insulation glass are coated with described liquid crystal display outer wall
It is filled with layer of inert between layer；
The outfan of described CPU module is connected to heater and refrigerating plant by first switch and second switch.
2. wide temperature environment dedicated microcomputer protection device as claimed in claim 1 is it is characterised in that described heater is far red
External heating device or the first semiconductor chilling plate, described first switch and described far infrared heater or described first quasiconductor
The hot face of cooling piece connects.
3. wide temperature environment dedicated microcomputer protection device as claimed in claim 2 is it is characterised in that described refrigerating plant is second
Semiconductor chilling plate, described second switch is connected with the huyashi-chuuka (cold chinese-style noodles) of described second semiconductor chilling plate.
4. as arbitrary in claim 3 described wide temperature environment dedicated microcomputer protection device is it is characterised in that described CPU module
Input has been also respectively connected with power input, has opened into module and ac sampling device, and the outfan of described CPU module is connected with
Output module.
5. wide temperature environment dedicated microcomputer protection device as claimed in claim 4 is it is characterised in that also including a pcb board, described
CPU module, the huyashi-chuuka (cold chinese-style noodles) of humiture collection module, liquid crystal display and the second semiconductor chilling plate may be contained within described pcb board,
The hot face of described far infrared heater or the first semiconductor chilling plate is also disposed on described pcb board.
6. wide temperature environment dedicated microcomputer protection device as claimed in claim 5 is it is characterised in that described pcb board is close located at one
In capsule body, the huyashi-chuuka (cold chinese-style noodles) of described first semiconductor chilling plate and the hot face of the second semiconductor chilling plate outside described housing, institute
State LCDs located at described surface of shell.
7. wide temperature environment dedicated microcomputer protection device as claimed in claim 6 is it is characterised in that described first semiconductor refrigerating
The hot face of the hot face of piece and the second semiconductor chilling plate is respectively equipped with the first heat abstractor and the second heat abstractor.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620808660 | 2016-07-28 | ||
| CN2016208086607 | 2016-07-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205942481U true CN205942481U (en) | 2017-02-08 |
Family
ID=57923512
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620864721.1U Active CN205942481U (en) | 2016-07-28 | 2016-08-10 | Special computer protection device of wide temperature environment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205942481U (en) |
-
2016
- 2016-08-10 CN CN201620864721.1U patent/CN205942481U/en active Active
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| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |