CN205930916U - Welded structure of backplate and apron under car pillar - Google Patents
Welded structure of backplate and apron under car pillar Download PDFInfo
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- CN205930916U CN205930916U CN201620949127.2U CN201620949127U CN205930916U CN 205930916 U CN205930916 U CN 205930916U CN 201620949127 U CN201620949127 U CN 201620949127U CN 205930916 U CN205930916 U CN 205930916U
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- backplate
- joint
- cover plate
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- pillar
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Abstract
The utility model relates to an ultrasonic bonding technical field, concretely relates to welded structure of backplate and apron under car pillar. This welded structure includes: at least one joint recess that forms along the at least partial edge part of lapping the back, a plurality of along the spherical solder joint of part that the joint recess was arranged, under the pillar backplate surface with joint recess matched with joint is protruding. The utility model discloses a joint recess, the spherical solder joint of part, joint arch are mutually supported among the welded structure, make protruding correspondence of joint recess and joint coincide and carry out ultrasonic spot welding, and welding strength is good, and difficult pine takes off, and the backplate is difficult for the breaking occur circumstances with the apron under the in use back prop, has strengthened its service function and life, has reduced the disability rate, practices thrift manufacturing cost.
Description
Technical field
This utility model be related to ultrasonic welding technique field and in particular under a kind of automobile pillar backplate and cover plate weldering
Access node structure.
Background technology
Ultrasonic bonding is, by supersonic generator, 50/60 hertz of electric current is converted into 15,20,30 or 40 KHz electricity
Energy.The high-frequency electrical energy changed is again converted to the mechanical movement into equal frequencies by transducer, and subsequent mechanical movement is led to
Cross a set of amplitude rod devices that can change amplitude and be delivered to soldering tip.The vibrational energy receiving is delivered to be welded moulding by soldering tip
The junction surface of material workpiece, in this region, vibrational energy is converted into heat energy by friction mode, by plastic molting, prior art
Under middle back prop, backplate assembly is the part that typical case completes by ultrasonic welding process, but the shape of pad directly influences
Assembling intensity between part, subject matter is technical requirements that are easy to fall off, can not reaching pull-out force.
The weldering of backplate and cover plate under a kind of new automobile pillar, in consideration of it, overcoming above defect of the prior art, is provided
Access node is configured to this area technical problem urgently to be resolved hurrily.
Content of the invention
The purpose of this utility model is the drawbacks described above for prior art, provides backplate and lid under a kind of automobile pillar
The welding structure of plate.
The purpose of this utility model can be realized by following technical measures：
The welding structure of backplate and cover plate under a kind of automobile pillar, described cover plate is in tetragon, under described cover plate and pillar
The relative one side of backplate is the back side, and this welding structure includes：
At least one engagement groove being formed along at least part of edge part at the cover plate back side；
Multiple Part-spherical solder joints along the arrangement of described engagement groove；And
It is formed at the bump bonding that under pillar, shield face is matched with described engagement groove.
Preferably, described engagement groove continuously extends along the edge part on the cover plate back side wherein three sides.
Preferably, the quantity of described solder joint is four.
Preferably, the basal diameter of described Part-spherical solder joint is 7mm, and the height of described Part-spherical solder joint is 3mm.
In welding structure of the present utility model, engagement groove, Part-spherical solder joint, bump bonding cooperate, and make joint recessed
Groove is corresponding with bump bonding to be overlapped and carries out ultrasonic spot welding, and weld strength is good, is difficult to get loose, in use backplate under back prop
It is not susceptible to crack conditions with cover plate, enhance it and use function and service life, decrease scrappage, save production cost.
Brief description
Fig. 1 is backplate and panel cooperation figure under autocar strut.
Fig. 2 is guard board structure schematic diagram under autocar strut.
Fig. 3 is back side of panel structural representation.
Fig. 4 is welding spot structure schematic diagram in welding structure of the present utility model.
Specific embodiment
In order that the purpose of this utility model, technical scheme and advantage become more apparent, below in conjunction with the accompanying drawings and specifically
Embodiment is described in further detail to this utility model.It should be appreciated that specific embodiment described herein is only in order to solve
Release this utility model, be not used to limit this utility model.
Hereinafter, refer to the attached drawing to be more fully understood many aspects of the present utility model.Part in accompanying drawing may not
It is drawn to scale.Alternatively, it is preferred that emphasis is clearly demonstrate part of the present utility model.Additionally, in the accompanying drawings some regard
In figure, identical reference indicates corresponding part.
" exemplary " or " illustrative " expression are as example, example or explanation as used herein, the word.Herein retouch
State any embodiment for " exemplary " or " illustrative " to be not necessarily to be construed as with respect to other embodiment being preferred or having
Profit.All embodiments described below are illustrative embodiments, provide these illustrative embodiments be in order that
Those skilled in the art make and using embodiment of the disclosure and expection be not intended to limit the scope of the present disclosure, the disclosure
Scope is defined by the claims.In other embodiments, describe in detail known to feature and method so as not to obscure this
Utility model.For purpose described herein, term " on ", D score, "left", "right", "front", "rear", " vertical ", " level " and
Its derivative words will be relevant with the utility model that such as Fig. 1 orients.And, have no intent to be subject to technical field above, background technology,
Any theoretical restriction expressed or imply being given in content of the invention or detailed description below.It should also be clear that it is shown in the drawings
It is the utility model design limiting in the following claims with the concrete device described in discussion below book and process
Simple examples embodiment.Therefore, the concrete size related to presently disclosed embodiment and other physical features should be by
It is interpreted as restricted, unless claims are separately clearly stated.
Refer to shown in Fig. 1 to Fig. 4, under back prop, backplate 100 and panel 200 carry out ultrasonic bonding, cover plate 200 is in four
Side shape, described cover plate 200 one side relative with backplate under pillar 100 is back side 200a.
This utility model embodiment provides the welding structure of backplate 100 and panel 200 under above-mentioned back prop, including：Engage
Groove 10, Part-spherical solder joint 20 and bump bonding 30.Wherein, engagement groove 10 is along at least portion of cover plate 200 back side 200a
Edge part is divided to be formed, a vat or multiple discontinuous sulculus that engagement groove 10 can be continuously formed, one
In individual preferred implementation, the quantity of engagement groove 10 is one, and it is along the edge on cover plate 200 back side 200a wherein three sides
Portion continuously extends, shown in Figure 3.
Wherein, bump bonding 30 is formed at backplate 100 surface under pillar, and it is matched with described engagement groove 10.Engage
Raised 30 position, shape and quantity are all corresponding with engagement groove 10.
Wherein, some spherical solders 20 arrange along engagement groove 10, and the solder joint 20 of Part-spherical has good
Welding effect, the quantity of solder joint 20 and arrangement mode determine according to the actual requirements for those of ordinary skill in the art.Excellent at one
Select in embodiment, the quantity of solder joint 20 is four, as shown in figure 3, four angle settings respectively close to tetragon cover plate 200.
In a preferred embodiment, the basal diameter of Part-spherical solder joint 20 is 7mm, and the height of Part-spherical solder joint 20 is 3mm.
In the welding structure of the present embodiment, engagement groove, Part-spherical solder joint, bump bonding cooperate, and make engagement groove
Corresponding with bump bonding overlap and carry out ultrasonic spot welding, weld strength is good, is difficult to get loose, in use under back prop backplate with
Cover plate is not susceptible to crack conditions, enhances it and uses function and service life, decrease scrappage, saves production cost.
The foregoing is only preferred embodiment of the present utility model, not in order to limit this utility model, all this
Any modification, equivalent and improvement made within the spirit of utility model and principle etc., should be included in this utility model
Protection domain within.
Claims (4)
1. under a kind of automobile pillar backplate and cover plate welding structure, described cover plate is in tetragon, protects under described cover plate and pillar
The relative one side of plate is the back side it is characterised in that this welding structure includes：
At least one engagement groove being formed along at least part of edge part at the cover plate back side；
Multiple Part-spherical solder joints along the arrangement of described engagement groove；And
It is formed at the bump bonding that under pillar, shield face is matched with described engagement groove.
2. under automobile pillar according to claim 1 the welding structure of backplate and cover plate it is characterised in that described joint is recessed
Groove continuously extends along the edge part on the cover plate back side wherein three sides.
3. under automobile pillar according to claim 2 the welding structure of backplate and cover plate it is characterised in that described solder joint
Quantity is four.
4. under automobile pillar according to claim 1 the welding structure of backplate and cover plate it is characterised in that described part ball
The basal diameter of shape solder joint is 7mm, and the height of described Part-spherical solder joint is 3mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620949127.2U CN205930916U (en) | 2016-08-26 | 2016-08-26 | Welded structure of backplate and apron under car pillar |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620949127.2U CN205930916U (en) | 2016-08-26 | 2016-08-26 | Welded structure of backplate and apron under car pillar |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205930916U true CN205930916U (en) | 2017-02-08 |
Family
ID=57954002
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620949127.2U Active CN205930916U (en) | 2016-08-26 | 2016-08-26 | Welded structure of backplate and apron under car pillar |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205930916U (en) |
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2016
- 2016-08-26 CN CN201620949127.2U patent/CN205930916U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CB03 | Change of inventor or designer information | ||
| CB03 | Change of inventor or designer information |
Inventor after: Lu Xuegang Inventor after: Chen Yunfeng Inventor before: Lu Xuegang |