CN205921826U - Circuit board with bury inductance component - Google Patents
Circuit board with bury inductance component Download PDFInfo
- Publication number
- CN205921826U CN205921826U CN201620894175.6U CN201620894175U CN205921826U CN 205921826 U CN205921826 U CN 205921826U CN 201620894175 U CN201620894175 U CN 201620894175U CN 205921826 U CN205921826 U CN 205921826U
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- China
- Prior art keywords
- hole
- inductance component
- magnetic core
- wiring board
- embedment
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Abstract
The utility model provides a circuit board with bury inductance component, include the PCB board and bury the magnetic core of PCB inboard, the PCB board is equipped with first through -hole and second through -hole, first through -hole with all be equipped with the copper layer on the pore wall of second through -hole, copper layer in the first through -hole is connected with the copper layer electricity to in should the second through -hole of first through -hole and is wound the line in order to form the magnetic core, and then formation the inductance component. Compared with the prior art, the utility model discloses a broken various difficult problems of magnetic core when lamination and drilling have been overcome to the circuit board to the preparation of inductance component circuit board is buried in the realization, reduce the size of power class circuit board by a wide margin, realized miniaturization, densification and the multi -functionalization of product, still improved power supply product's production efficiency and stability and the reliability that power supply product transferred signal, filter effect simultaneously, in addition, shown the electric conductive property who has promoted around the circuit of magnetic core, effectively promoted the anti -corrosion performance of circuit board.
Description
Technical field
This utility model is related to the manufacturing technology of printed substrate, more particularly, to a kind of circuit with embedment inductance component
Plate.
Background technology
Hydrid integrated circuit is stepping into system level chip, microsensor, microactrator and peripheral foil passive element
Integrate the stage carrying out system encapsulation (sop).Sop technology employs the scheme of uniqueness to system, can reduce volume huge
Big wiring board is together with the size of many elements.Component number is accounted in passive device (electric capacity, inductance, resistance etc.) assist side
70% to 90%, account for 70% to the 80% of substrate area.If the buried technology of pcb passive device is widely used, product chi
The very little amplitude reducing is expected to reduce tens times.
Nowadays in wiring board design, inductance is widely applied, and the passive filter circuit of formation acts primarily as adjusts signal, filtering
Effect.The inductance of power supply type wiring board is usually to be looped around, by the very thick enamel-covered wire of line footpath, the circular magnetic scribbling shades of colour
On core.The inductance element of power pack takies power supply plate surface more than 40% area, is unfavorable for product design miniaturization, highly dense
Change, power pack inductance is required for greatly mounting up by hand, and work efficiency is low, there is the bad equivalent risk of weld pads.Then
In pcb, embedment magnetic core technique is arisen at the historic moment.
Therefore, it is necessary to provide a kind of new wiring board with embedment inductance component to solve the above problems.
Utility model content
The purpose of this utility model is to provide a kind of wiring board with embedment inductance component, which reduces power supply class
The size of pcb plate, realizes miniaturization and highly denseization of power supply class pcb plate, improves production efficiency and the power supply of power supply product
Product adjusts signal, the stability of filter action and reliability, effectively improves the resistance to corrosion of wiring board simultaneously.
This utility model provides a kind of wiring board with embedment inductance component, including pcb plate and the described pcb plate of embedment
Toroidal cores that are interior and having looping pit, what described pcb plate was provided with that the looping pit of corresponding described magnetic core formed multiple first leads to
Corresponding with described first through hole multiple second through holes that the periphery of hole and corresponding described magnetic core is formed, described second through hole cincture
Described magnetic core uniform array setting, the hole wall of described first through hole and described second through hole is equipped with layers of copper, and described first leads to
The layers of copper of in the hole, with to the layers of copper in described second through hole of first through hole should being electrically connected to form magnetic core coiling, and then is formed
Described inductance component.
Preferably, described first through hole uniform array is arranged in described looping pit.
Preferably, described first through hole and the aperture of described second through hole are 0.45mm, and the thickness of described layers of copper is not little
In 75 μm.
Preferably, described annular in the hole potting resin.
Preferably, the hole wall of described first through hole to the distance of described magnetic core all not less than 0.1778mm.
Preferably, described layers of copper is formed on the hole wall that described first through hole is with described second through hole by pulse plating.
Preferably, the quantity of described first through hole is equal with the quantity of described second through hole.
Preferably, the quantity of described first through hole is 14.
Preferably, described layers of copper surface is also coated with nickel dam.
Compared with correlation technique, this utility model has the wiring board of embedment inductance component, by magnetic core is imbedded pcb plate
Interior, and constitute the circuit around magnetic core in pcb plate internal drilling copper plate, overcome that in lamination and boring magnetic core crushes is various
A difficult problem, thus realize burying the making of inductance component wiring board；It significantly reduces power supply by embedment inductance component in pcb plate
The size of class wiring board is it is achieved that the miniaturization of product, and encapsulates integration realization densification and multifunction by system,
Also improve the production efficiency of power supply product simultaneously and power supply product adjusts signal, the stability of filter action and reliability, in addition,
By nickel coating again in layers of copper, not only it has been obviously improved the electric conductivity of the circuit around magnetic core, and has effectively improved line
The corrosion resistance of road plate.
Brief description
Fig. 1 has the structural representation of the wiring board of embedment inductance component for this utility model；
Fig. 2 has the top view of the wiring board of embedment inductance component for this utility model；
Fig. 3 has the structural representation of wiring board nickel coating in layers of copper of embedment inductance component for this utility model.
Specific embodiment
Technical scheme in this utility model embodiment will be clearly and completely described it is clear that described below
Embodiment is only a part of embodiment of the present utility model, rather than whole embodiments.Based on the enforcement in this utility model
Example, all other embodiment that those of ordinary skill in the art are obtained under the premise of not making creative work, broadly fall into
The scope of this utility model protection.
Refer to Fig. 1, Fig. 1 is the structural representation of the wiring board with embedment inductance component of the present utility model.Described
The wiring board 1 with embedment inductance component includes in pcb plate 10 and the described pcb plate of embedment 10 and has the annulus of looping pit 110
Shape magnetic core 11.Described magnetic core 11 internal diameter size is: 3.58-3.72mm, and outside dimension is: 11.52-11.76mm, and thickness is:
3.42-3.46mm, in order to prevent described magnetic core 11 damaged when imbedding described pcb plate 10, when carrying out pressing plate, maximum pressure is not
More than 300psi.
Please refer to Fig. 2, Fig. 2 has the top view of the wiring board of embedment inductance component for this utility model.Described ring
Potting resin in shape hole 110, described pcb plate 10 is provided with multiple first through holes that the looping pit 110 of corresponding described magnetic core 11 is formed
100 and corresponding with described first through hole 100 multiple second through holes 101 of being formed of periphery of corresponding described magnetic core 11, described the
The quantity of one through hole 100 is equal with the quantity of described second through hole 101.The quantity of described first through hole 100 is 14.
Layers of copper 12 is equipped with the hole wall of described first through hole 100 and described second through hole 101, described layers of copper 12 passes through arteries and veins
Punching plating is formed in described first through hole 100 and the hole wall of described second through hole 101.Layers of copper in described first through hole 100
12, with to the layers of copper 12 in described second through hole 101 of first through hole 100 should being electrically connected to form magnetic core coiling, and then form
Described inductance component.
Described first through hole 100 uniform array is arranged in described looping pit 110, and described second through hole 101 is around described
Magnetic core 11 uniform array is arranged.Described first through hole 100 is 0.45mm with the aperture of described second through hole 101.The institute being formed
State inductance component and will reach predetermined inductance value, the thickness of described layers of copper 12 is not less than 75 μm.
In order to prevent from damaging described magnetic core 11 when boring described first through hole 100, described first leads to, and 100 hole wall is to institute
The distance stating magnetic core 11 is not less than 0.1778mm.
Refer to Fig. 3, Fig. 3 has the structure of wiring board nickel coating in layers of copper of embedment inductance component for this utility model
Schematic diagram.In order to improve the electric conductivity of the circuit around described magnetic core 11, and the corrosion resistance improving wiring board 1
Can, also it is coated with nickel dam 13 on described layers of copper 12 surface.
Compared with correlation technique, this utility model has the wiring board 1 of embedment inductance component, by imbedding magnetic core 11
In pcb plate 10, and constitute the circuit around magnetic core 11 in pcb plate 10 internal drilling copper plate 12, overcome in lamination and boring
The various difficult problems that magnetic core 11 crushes, thus realize burying the making of inductance component wiring board 1；It passes through to imbed electricity in pcb plate 10
Inductor component significantly reduces the size of power supply class wiring board 1 it is achieved that the miniaturization of product, and encapsulates integration realization by system
Densification and multifunction, also improve the production efficiency of power supply product simultaneously and power supply product adjusts signal, filter action
Stability and reliability, in addition, by nickel coating 13 again in layers of copper 12, being not only obviously improved the circuit around magnetic core 11
Electric conductivity, and effectively improve the corrosion resistance of wiring board 1.
The foregoing is only embodiment of the present utility model, not thereby limit the scope of the claims of the present utility model, every
The equivalent structure made using this utility model description and accompanying drawing content or equivalent flow conversion, or be directly or indirectly used in
Other related technical fields, are all included in the same manner in scope of patent protection of the present utility model.
Claims (9)
1. a kind of wiring board with embedment inductance component is it is characterised in that including pcb plate and imbedding in described pcb plate and have
There are the toroidal cores of looping pit, described pcb plate is provided with multiple first through holes that the looping pit of corresponding described magnetic core formed and right
Answer corresponding with described first through hole multiple second through holes that the periphery of described magnetic core is formed, described second through hole is around described magnetic
Core uniform array is arranged, and the hole wall of described first through hole and described second through hole is equipped with layers of copper, in described first through hole
Layers of copper, with to the layers of copper in described second through hole of first through hole should being electrically connected to form magnetic core coiling, and then forms described electricity
Inductor component.
2. the wiring board with embedment inductance component according to claim 1 is it is characterised in that described first through hole is uniform
Array is arranged in described looping pit.
3. the wiring board with embedment inductance component according to claim 1 is it is characterised in that described first through hole and institute
The aperture stating the second through hole is 0.45mm, and the thickness of described layers of copper is not less than 75 μm.
4. the wiring board with embedment inductance component according to claim 1 is it is characterised in that described annular in the hole is filled
Resin.
5. the wiring board with embedment inductance component according to claim 1 is it is characterised in that the hole of described first through hole
The distance of wall to described magnetic core is not less than 0.1778mm.
6. the wiring board with embedment inductance component according to claim 1 is it is characterised in that described layers of copper passes through pulse
Plating is formed in described first through hole and the hole wall of described second through hole.
7. the wiring board with embedment inductance component according to claim 1 is it is characterised in that the number of described first through hole
Amount is equal with the quantity of described second through hole.
8. the wiring board with embedment inductance component according to claim 7 is it is characterised in that the number of described first through hole
Measure as 14.
9. the wiring board with embedment inductance component according to claim 1 is it is characterised in that described layers of copper surface is also plated
There is nickel dam.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620894175.6U CN205921826U (en) | 2016-08-16 | 2016-08-16 | Circuit board with bury inductance component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620894175.6U CN205921826U (en) | 2016-08-16 | 2016-08-16 | Circuit board with bury inductance component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205921826U true CN205921826U (en) | 2017-02-01 |
Family
ID=57871638
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620894175.6U Active CN205921826U (en) | 2016-08-16 | 2016-08-16 | Circuit board with bury inductance component |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205921826U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107548243A (en) * | 2017-08-22 | 2018-01-05 | 新华三技术有限公司 | A kind of printed circuit board (PCB) preparation technology and printed circuit board (PCB) |
-
2016
- 2016-08-16 CN CN201620894175.6U patent/CN205921826U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107548243A (en) * | 2017-08-22 | 2018-01-05 | 新华三技术有限公司 | A kind of printed circuit board (PCB) preparation technology and printed circuit board (PCB) |
| CN107548243B (en) * | 2017-08-22 | 2020-01-03 | 新华三技术有限公司 | Printed circuit board preparation process and printed circuit board |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |