CN205881897U - System level packaging chip and contain equipment of this chip - Google Patents

Abstract

The utility model relates to a microelectronics field discloses a system level packaging chip and has contained the equipment of this system level packaging chip, and this system level packaging chip contains: the radio frequency front end module, adc and digital analog converter, microcontroller processing unit, the system bus unit, and wifi BBMACPHY unit, with microcontroller processing unit via the system bus unit links to each other for one or many persons below carrying out in the operation: to come from microcontroller processing unit's signal via after digital analog converter carries out digital analog conversion, through the radio frequency front end module is sent away, and receive by the radio frequency front end module receive and by adc carries out the signal after the analog -to -digital conversion to with this signal transmission extremely microcontroller processing unit. Through above -mentioned technical scheme, can provide high -speed operate, throughput height, simplified the design of hardware.

Description

System in package chip and comprise the equipment of this chip

Technical field

This utility model relates to microelectronic, in particular it relates to a kind of system in package chip and comprise this system The equipment of level encapsulation chip.

Background technology

Internet of Things (Internet of Things) is the important component part of generation information technology, and Internet of Things is exactly thing The Internet that thing is connected.It utilizes the communication technology such as localized network or the Internet sensor, controller, machine, personnel and thing It is linked togather Deng by the way of new, forms people and be connected with thing with thing, thing, it is achieved information-based, remote management and control and intellectuality Network.It is a kind of Ubiquitous Network set up on the internet.The important foundation of technology of Internet of things and core are still interconnections Net, by various wired and wireless network and the Internet converged, passes real-time and accurately by the information of object.At Internet of Things On the information of sensor timing acquiring need to be transmitted by network, owing to its quantity is the hugest, define magnanimity information, In transmitting procedure, in order to ensure correctness and the promptness of data, it is necessary to adapt to various heterogeneous network and agreement.

Along with the Internet of Things continuous demand to chips such as high integration, super-small and super low-power consumptions, and chip and The continuous progress of mechanics of communication, networked devices needs more functional chip is encapsulated in system in package (SiP) the inside, Estimate that the Internet of Things intelligent domestic of 80% and wearable device will use SiP module in the time of following 5 to 10 years, because of Smaller for SiP, there is more preferable resistance to mechanical and chemical attack ability, it is possible to notable shorten product development and put on market In the cycle, less radio-frequency performance is more stable, the more high plurality of advantages of reliability.

Fig. 1 is the block chart of existing a kind of SiP module that can be applicable to Internet of Things.This SiP module comprises BB/MAC/ PHY processing unit 100, RF front-end module 102, wave filter 110, wave filter 112, agitator 106, agitator 108, Yi Jicun Storage 104.BB/MAC/PHY processing unit 100 is for transmitting or receiving and process signal.Radio-frequency module 102 is connected to BB/ MAC/PHY processing unit 100, for processing the agreement of radiofrequency signal and radio frequency transmission.BB/MAC/PHY processing unit 100 comprises Transmission/reception the mode being connected to RF front-end module 102 selects port, makes BB/MAC/PHY processing unit 100 can determine one Processing mode.Memory connects 104 and is connected to BB/MAC/PHY processing unit 100, and wherein this memory can be non-volatile (non- Volatile) memory.RF front-end module 102 comprises first antenna port and the second antenna port, to be connected to first day Line and the second antenna.Therefore, BB/MAC/PHY processing unit 100 comprises the antenna diversity selection end being connected to radio-frequency front-end 102 Mouthful, make the BB/MAC/PHY processing unit 100 can be to select an antenna diversity mode.BB/MAC/PHY processing unit 100 also comprises Bluetooth port, to be connected to bluetooth module.BB/MAC/PHY processing unit 100 inclusion region bus port is to be connected to a region Bus.In the prior art, universal input/output device (GPIO), combined testing action group adapter (JTAG Connector), first value configuration, field bus, compact flash memory and secure digital input and output/universal serial convergence periphery Interface (SDIO/GSPI) is respectively connecting to the corresponding connectivity port of BB/MAC/PHY processing unit 100, sets in advance performing it Fixed function.

But, along with Internet of Things is to the chip continuous demand in its various aspects of performance, the SiP module shown in Fig. 1 is with more More it is difficult to meet the demand of Internet of Things.This area need a kind of can be at aspect of performance more than the SiP module shown in Fig. 1.

Utility model content

The purpose of this utility model is to provide a kind of system in package chip and comprises setting of this system in package chip Standby, it can show and existing SiP module better performance.

To achieve these goals, this utility model provides a kind of system in package chip for household electrical appliance, and this is Irrespective of size encapsulation chip comprises: RF front-end module；Analog-digital converter and digital to analog converter；Microcontroller processing unit；System is total Line unit；And Wifi BB/MAC/PHY unit, with described microcontroller processing unit via described system bus unit phase Even, for perform in following operation one or more: by the signal from described microcontroller processing unit via described number After weighted-voltage D/A converter carries out digital-to-analogue conversion, sent by described RF front-end module；And receive by described radio-frequency front-end Module receives and is carried out the signal after analog digital conversion by described analog-digital converter, and transmits the signal to described microcontroller Device processing unit.

Wherein, this system in package chip also comprises: coupling and wave filter, is connected to described RF front-end module with described Between the antenna of system in package chip exterior.

Wherein, this system in package chip also comprises safety chip unit, for described microcontroller processing unit institute The signal of output is encrypted.

Wherein, this system in package chip also comprises peripheral interface, is connected to described system bus unit.

Wherein, described peripheral interface comprise following one or more: universal asynchronous receiving-transmitting transmitter UART interface；Outside serial If interface SPI；Universal input/output GPIO interface；And twin wire universal serial bus I2C interface.

Wherein, this system in package chip also comprises: BT BB/MAC/PHY processing unit, and being used for will be from described micro-control After the signal of device processing unit processed carries out digital-to-analogue conversion via described digital to analog converter, sent by described RF front-end module Go out；And/or receive by RF front-end module reception and carried out the signal after analog digital conversion by described analog-digital converter, and Transmit the signal to described microcontroller processing unit.

Wherein, this system in package chip also comprise following one or more: temperature sensor, for by Temperature Quantity change For the signal of telecommunication, and send to by described microcontroller processing unit via described system bus unit；And humidity sensor, use In humidity amount being converted to the signal of telecommunication, and send to by described microcontroller processing unit via described system bus unit.

Wherein, this system in package chip also comprises: infrared ray sensor, is used for producing whether reaction exists human body or dynamic The signal of telecommunication that thing is movable, and send to by described microcontroller processing unit via described system bus unit.

Wherein, this system in package chip also comprises: the first agitator, for producing the first frequency of oscillation, for described Other modules in system in package chip use at normal manipulation mode；And second agitator, for producing the second vibration Frequency, uses at electricity-saving operation mode for other modules in described system in package chip.

Wherein, this system in package chip also comprise following one or more: flash memory access memorizer, with described microcontroller Device processing unit and described system bus unit are connected；And random access memory, with described microcontroller processing unit and Described system bus unit is connected.

Wherein, this system in package chip also comprises Power Management Unit, in described system in package chip Electricity consumption module for power supply.

Correspondingly, this utility model also provides for a kind of equipment comprising said system level encapsulation chip, and this equipment can include Below one or more: wearable device, household electrical appliance and Intelligent illumination device.

By technique scheme, WiFi BB/MAC/PHY processing unit can pass through system bus port and microcontroller Device processing unit connects, it is thus possible to provide high speed operation to run.It addition, system bus unit is data throughout height, unit Data processing amount in time is significantly larger than the data processing amount of SDIO/SPI.Additionally, system bus unit simplifies hardware Design, it is simple to use Modular Structure Design method, as long as the design of bus-oriented chip makes MCU plug-in unit according to the rules, deposits Reservoir plug-in unit and I/O plug-in unit etc., they are connected into bus just can work, without the detailed operation considering bus.

Other features and advantages of the utility model will be described in detail in detailed description of the invention part subsequently.

Accompanying drawing explanation

Accompanying drawing is used to offer and is further appreciated by of the present utility model, and constitutes a part for description, with following Detailed description of the invention be used for explaining this utility model together, but be not intended that restriction of the present utility model.In the accompanying drawings:

Fig. 1 is the block chart of existing a kind of SiP module that can be applicable to Internet of Things；

The block chart of the SiP module that Fig. 2 provides for this utility model one embodiment；

The block chart of the SiP module that Fig. 3 provides for another embodiment of this utility model；

The fabrication processing figure of the SiP module that Fig. 4 provides for this utility model one embodiment；And

Fig. 5 for another embodiment of this utility model provide the fabrication processing figure of SiP module.

Description of reference numerals

100 BB/MAC/RF processing unit 102 radio-frequency front-ends

104 memory 106 first agitators

108 second agitator 110 wave filter

112 wave filter 200 MCU

201 system bus unit 202 FLASH

203 RAM 204 WiFi BB/MAC/PHY unit

205 BT BB/MAC/PHY unit 206 analog-digital converters

207 digital to analog converter 208 RF front-end modules

209 coupling and wave filter 210 peripheral interfaces

211 Temperature Humidity Sensor 212 Power Management Unit

213 first agitator 214 second agitators

215 infrared sensor 216 safety chip unit

Detailed description of the invention

Below in conjunction with accompanying drawing, detailed description of the invention of the present utility model is described in detail.It should be appreciated that herein Described detailed description of the invention is merely to illustrate and explains this utility model, is not limited to this utility model.

The block chart of the SiP module that Fig. 2 provides for this utility model one embodiment.As in figure 2 it is shown, this utility model one is real The SiP module that executing example provides comprises: RF front-end module 208；Analog-digital converter 206 and digital to analog converter 207；At microcontroller Reason unit 200；System bus unit 201；And Wireless Fidelity (WiFi) base band/medium plan/radio frequency (Base Band/Media Access Control/Radio Frequency；BB/MAC/PHY) at unit 204, with described microcontroller Reason unit (Mirco Controller Unit；MCU) 200 are connected via described system bus unit 201, be used for performing below One or more in operation: the signal from described microcontroller processing unit 200 is entered via described digital to analog converter 207 After row digital-to-analogue conversion, sent by described RF front-end module 208；And receive by described RF front-end module 208 Receive and carried out the signal after analog digital conversion by described analog-digital converter 206, and transmitting the signal to described microcontroller Processing unit 200.

In the present embodiment, MAC 200 can use ARMCortex-M4 processor, and this processor cores is at Cortex- Growing up on the basis of M3 kernel, its performance improves 20% than Cortex-M3.Floating-point, DSP, parallel computation are newly increased Deng.Effective and wieldy control and the Digital Signals market of signal processing function mixing in order to satisfied needs.It is high The signal processing function of effect combines with the low-power consumption of Cortex-M processor family, low cost and wieldy advantage. Cortex-M4 provides unrivaled function, controls 32 integrated with leading Digital Signal Processing to meet need Will the market of very high energy efficiency rank.Cortex-M4 processor uses single clock cycle multiply-accumulate (MAC) list of an extension Unit, single-instruction multiple-data (SIMD) instruction optimized, saturation arithmetic instruction and an optional single-precision floating point unit (FPU). These functions are based on the innovative technology of performance ARMCortex-M series processors feature, including risc processor kernel, high Performance 32 bit CPU, there is deterministic computing, low latency 3 stage pipeline, up to 1.25DMIPS/MHz；Thumb-2 instruction set, The optimal mixing of 16/32 bit instruction, less than 8 equipment 3 times code size, performance is had no adverse effect, it is provided that optimal Code density；Low-power consumption mode, integrated sleep state support, multi-power domain, software based on framework control；In nested vector Disconnected controller (NVIC), low latency, low jitter interrupt response, need not assemble programming, the interruption service example write with pure C language Journey, can complete outstanding interrupt processing；Instrument and RTOS support, widely third party's instrument support, Cortex microcontroller soft Part interface standard (CMSIS), to greatest extent increase software achievement are reused；CoreSight debugging and tracking, JTAG or 2 pin strings Line debugging (SWD) connects, supports multiprocessor, supports real-time tracking.Additionally, this processor additionally provide one optional in Deposit protected location (MPU), it is provided that the debugging/tracking function of low cost and integrated resting state, to increase motility.Embedded Developer will quickly be designed and released the end product attracted people's attention, and possesses most functions and minimum power consumption and chi Very little.

In the present embodiment, WiFi BB/MAC/PHY processing unit 204 can be 2.4/5GHz frequency modulation, Baseband processor (baseband processor), multimedia agreement medium plan (multi-media protocol media access Control) or central authorities process (central processing) unit.WiFi BB/MAC/PHY processing unit 204 has height Usefulness, power saving and be applicable to the characteristic such as intelligent domestic and Internet of Things application device, and wherein this intelligent domestic and Internet of Things Net application device can be dehumidifier, air-conditioning, depurator, air cooler, fan, warmer, refrigerator, rotary drum washing machine, rolling Cylinder washing machine, electric heater, electric cooking pot, electric cooker, mobile phone, mobile phone, personal digital assistant (PDA), voice-over-net transmission (VoIP), MP3/MP4 player.The transmitter of WiFi BB/MAC/PHY processing unit 204 combines homophase and quadrature baseband letter Number, and convert the signal into the frequency to be sent.The receptor of WiFi BB/MAC/PHY processing unit 204 uses double frequency that changes to tie Structure and be not required to the plug-in intermediate-frequency filter of chip.Frequency synthesizer is supported by frequency defined in 802.11 specifications.WiFi BB/ MAC/PHY processing unit 204 orthogonal frequency domain to be supported multiplexing (Orthogonal Frequency Division Multiplexing；OFDM), and medium plan also support IEEE 802.11 wireless medium access control agreement and 802.11i confidentiality (security).

WiFi BB/MAC/PHY processing unit 204 can comprise a system bus port so that this WiFi BB/MAC/PHY Processing unit can be connected with microcontroller processing unit 200 by system bus port, it is thus possible to provides high speed operation fortune OK.System bus is only by the assistance of storage buffer, and not by any bridger (bridge) and/or the assistance of I/O interface, counts According to, address and control signal along advanced high-performance system bus (Advanced High Speed Buses；AHB) line connects To microcontroller processing unit.Compared with the processing speed of system bus, the processing speed of bridger and/or I/O interface is usual Relatively low.One advantage of system bus is high data throughput (Throughput), and the data processing amount in the unit interval is the highest Data processing amount in SDIO/SPI.System bus simplifies the design of hardware.It is easy to use Modular Structure Design method, face As long as designing to the chip of bus and making MCU plug-in unit, memory card and I/O plug-in unit etc. according to the rules, they are connected into always Line just can work, without the detailed operation considering bus.System bus simplifies system structure simultaneously.Whole system structure is clear Clear.Line is few, and base plate line can printing.System bus makes system expansibility good.One is that scale expands, and scale only expands Only need to insert some plug-in units with type more.Two is that function expands, and function expansion needs only to insert according to bus standard design is new Part, plug-in unit inserts the position of machine does not often have strict restriction.System bus is connectable to microcontroller storage bus, or directly Receive microcontroller processing unit in succession.System bus makes system update performance good.Because MCU, memorizer, I/O interface etc. All be suspended in bus by bus regulation, as long as thus bus design is appropriate, can at any time along with processor chip and Other design new plug-in unit about the progress of chip, and new plug-in unit is inserted on base plate and is updated system, other plug-in units and the end Plate line typically need not change.

RF front-end module 208 is connected to WiFi BB/MAC/PHY processing unit 204, to connect by analog-digital converter 206 The collection of letters number.WiFi BB/MAC/PHY processing unit 204 is connected to RF front-end module 208 by digital to analog converter 207, to send out The number of delivering letters.WiFi BB/MAC/PHY processing unit 204 comprise transmission/reception mode select port, delivery port, receiving port, And power control terminal mouth.This transmission/reception mode selects port respectively by digital to analog converter 207/ analog-digital converter 206 even It is connected to the transmission/receiving port of radio-frequency front-end 208, makes WiFi BB/MAC/PHY processing unit 204 can control radio-frequency front-end mould Block 208, with the signal in processing in transmission or receiving.

Coupling and wave filter 209 can separately exist in the SiP module of this embodiment, also can be included in RF front-end module In 208.Antenna, by coupling and wave filter 209, is connected to the connectivity port of RF front-end module 208, and it provides a road Footpath, to transmit/to receive signal to antenna.Therefore, the signal of WiFi BB/MAC/PHY processing unit 204 is via digital to analog converter 207, RF front-end module 208, coupling and wave filter 209 and antenna are launched.Equally, WiFi BB/MAC/PHY processes single Unit 204 also can receive signal via antenna, coupling and wave filter 209, RF front-end module 208 and analog-digital converter 206.

The block chart of the SiP module that Fig. 3 provides for another embodiment of this utility model.Below in conjunction with Fig. 3 to this another real Execute example to be described further.It should be noted that this embodiment illustrated in fig. 3 comprises number of modules or unit, these modules or Unit can form individually or in any combination be comprised in SiP module.For being discussed in detail in above-mentioned embodiment illustrated in fig. 2 Module or unit, repeat no more in this.

In this embodiment, SiP module also can comprise: bluetooth (BT) BB/MAC/PHY processing unit 205, for will be from After the signal of described MCU 200 carries out digital-to-analogue conversion via described digital to analog converter 207, by described RF front-end module 208 send；And/or reception is received by RF front-end module 208 and is carried out analog digital conversion by described analog-digital converter 206 Signal afterwards, and transmit the signal to described MCU 200.

In the present embodiment, this BTBB/MAC/PHY processing unit 204 can be 2.4/5GHz frequency modulation, Baseband processor (baseband processor), multimedia agreement medium plan (multi-media protocol media access Control) or central authorities process (central processing) unit.This BTBB/MAC/PHY processing unit 204 has low merit Consumption, low cost, high benefit and be applicable to mouse, earphone, printer, wireless microphone, keyboard, personal digital assistant (PDA), smart mobile phone, mobile phone, panel computer and multimedia player.BTBB/MAC/PHY processing unit 204 compatibility is also Support bluetooth 4.0+BLE agreement, bluetooth 4.1 agreement, bluetooth 4.2 agreement completely.

RF front-end module 208 is connected to BT BB/MAC/PHY processing unit 205 by analog-digital converter 206, to receive Signal.BT BB/MAC/PHY processing unit 205 is connected to RF front-end module 208, to send letter by digital to analog converter 207 Number.BT BB/MAC/PHY processing unit 205 comprises transmission/reception mode and selects port, delivery port, receiving port, Yi Ji electricity Source controls port.This transmission/reception mode selects port to be connected to penetrate by digital to analog converter 207/ analog-digital converter 206 respectively Frequently transmission/the receiving port of front-end module 208, makes BT BB/MAC/PHY processing unit 205 can control RF front-end module 208, with the signal in processing in transmission or receiving.

As it is shown on figure 3, in this embodiment, SiP module also can comprise safety chip unit 216, for described MCU 200 signals exported are encrypted.

This safety chip is a to be applied to the low-power consumption of USBKEY, low cost, high security, multi-functional code core Sheet.This chip has a key management on sheet (include password generate, store, renewal etc.), RSA, ECC (SM2) coprocessor in sheet, Realize digital signature and authentication, SM1, SM4, DES (TDES) hardware algorithm core in sheet, SM3, SHA hardware algorithm core in sheet, Support the various communication interfaces such as USB, SPI, UART.Safety chip is by system bus and MCU 200, WiFi BT BB/MAC/ PHY processing unit and BT BB/MAC/PHY processing unit link together.Data by safety chip carry out safety encrypt after again Send.Receiving terminal also has corresponding decryption method to decipher, it is ensured that the safety of data transmission.

As it is shown on figure 3, in this embodiment, SiP module also can comprise peripheral interface, is connected to described system bus list Unit.This peripheral interface comprise following one or more: universal asynchronous receiving-transmitting transmitter UART interface；Serial peripheral equipment interface SPI；Logical Use input/output GPIO interface；And twin wire universal serial bus I2C interface.Certainly, this utility model is not limited to this, also may be used It is arranged as required to other interfaces.Thereby, all kinds of peripheral hardware can be facilitated to access SiP module.

As it is shown on figure 3, in this embodiment, SiP module also can comprise following one or more: temperature sensor, be used for Temperature Quantity is converted to the signal of telecommunication, and sends to by described microcontroller processing unit via described system bus unit；And Humidity sensor, for humidity amount is converted to the signal of telecommunication, and sends to by described microcontroller via described system bus unit Device processing unit.This temperature sensor and humidity sensor are shown generally as Temperature Humidity Sensor 211 in figure 3.

Specifically, Temperature Humidity Sensor 211 refers to Temperature Quantity and humidity amount are converted into easy measured process The equipment of the signal of telecommunication or device, Temperature Humidity Sensor is usually measures Temperature Quantity and relative humidity amount.In relative humidity i.e. gas Steam vapour amount (water vapor pressure) contained by (usually in air) and saturated steam amount (saturated steam under its air same case Pressure) percentage ratio.

Humidity sensor can be capacitance type humidity sensor, this capacitance type humidity sensor by polymer, finger electrodes and Silicon substrate is constituted, and have employed distribution of electrodes and the coating technique of uniqueness so that induction apparatus not only will not aoxidize, moreover it is possible to quickly receives water Molecule.Temperature sensor can be made up of the PNP transistor being in diode mode, and during variations in temperature, output voltage will become Change.

Generally speaking, the energy consumption of Temperature Humidity Sensor is 80 μ W (at 12,3V, under the conditions of 1 measurement/second)；RH works Scope is 0-100%RH；Calibrate completely, linearisation, and the numeral output of temperature-compensating；Wide power voltage scope, from 2.4 to 5.5V；I2C interface communication speed is up to 1MHz and carries 2 optional addresses of user；Typical accuracy reaches 2%RH and 0.3 DEG C；Start Speed is fast and the time of measurement is short；Long-term work is reliable and stable, temperature year drift value < 0.03 degree/year；Humidity year drift value < 0.25%RH/year is long-lasting and concordance is good；Temperature and moisture sensors integration, it is simple to produce, saves PCB surface and amasss and produce Product miniaturization.

As it is shown on figure 3, in this embodiment, SiP module also can comprise: infrared ray sensor 215, is used for producing reaction and is The no signal of telecommunication that there is human body or animal activity, and send to being processed by described microcontroller single via described system bus unit Unit.

This infrared ray sensor can be Thermoelectric Infrared Sensor, and this Thermoelectric Infrared Sensor includes optical system System, detecting element and change-over circuit.Pyroelectric infrared sensor is thermally sensitive sensor.It is by ceramic oxide or pressure Transistor element forms, and makes electrode on two surfaces of element, when in the range of Sensor monitoring, temperature has the change of Δ T, and heat Release electrical effect and can produce electric charge Δ Q on two electrodes, produce a faint voltage Δ V the most between electrodes.Due to it Output impedance high, have a field effect transistor to carry out impedance transformation in the sensor.Electric charge Δ Q produced by pyroelectric effect Can be combined by the ion in air and disappear, i.e. when ambient temperature-stable is constant, Δ T=0, then sensor is without output.When Human body enters detection zone, because human body temperature and ambient temperature have difference, produces Δ T, then has Δ T to export；If human body enters detection Behind district motionless, then temperature is not changed in, and sensor does not the most output.So this sensor for human detection or the work of animal Dynamic sensing.

Pyroelectric infrared sensor sensitivity up to 3.6mVpp and there is splendid signal to noise ratio；Height during variations in temperature is steady Qualitative；It is suitable for the reflow soldering of 240 DEG C of peak values；The ken reaches ± 50 °；Wide supply voltage scope reaches 2 to 15V；To outside The high noise immunity of noise (vibration, RFI etc.).

As it is shown on figure 3, in this embodiment, SiP module also can comprise following one or more: flash memory access memorizer (flash) 202, it is connected with described MCU 200 and described system bus unit 201；And random access memory (RAM) 203, With described MCU 200 and described system bus unit 201.Described MCU 200 can to this flash memory access memorizer 202 and/or with Machine access memorizer 203 is written and read operation.

As it is shown on figure 3, in this embodiment, SiP module also can comprise: the first agitator 213, for producing the first vibration Frequency, uses at normal manipulation mode for other modules in described system in package chip；And second agitator 214, For producing the second frequency of oscillation, use at electricity-saving operation mode for other modules in described system in package chip.

Such as, the first agitator 213 can produce the first frequency of oscillation, and this first frequency of oscillation is sent to WiFi BB/ MAC/PHY unit 204, BT BB/MAC/PHY unit 205, infrared sensor 215, Temperature Humidity Sensor 211 etc. make for it With.In the present embodiment, the first frequency of oscillation is about 40MHz.Second agitator 214 can produce the second frequency of oscillation, is about 32KHz, this second frequency of oscillation also can be transferred into WiFi BB/MAC/PHY unit 204, BT BB/MAC/PHY unit 205, Infrared sensor 215, Temperature Humidity Sensor 211 etc. use for it.WiFi BB/MAC/PHY unit 204, BT BB/MAC/ PHY unit 205, infrared sensor 215, Temperature Humidity Sensor 211 etc. work in 40MHz when general operation mode, in power saving Then work in 32kHz during mode.

As it is shown on figure 3, in this embodiment, SiP module also can comprise: Power Management Unit 212, for described system Electricity consumption module for power supply in level encapsulation chip, such as WiFi BB/MAC/PHY unit 204, BT BB/MAC/PHY unit 205, red Outer sensor 215, Temperature Humidity Sensor the 211, first agitator 213 and the second agitator 214 etc..

In the present embodiment, WiFi BB/MAC/PHY processing unit 204 can be intelligent domestic and Internet of Things application One chip, MCU 200 can be intelligent domestic and the one chip of Internet of Things application, and Temperature Humidity Sensor 211 can be intelligence Intelligent household and the one chip of Internet of Things application, infrared sensor unit 215 can be intelligent domestic and the list of Internet of Things application One chip, such as complementary metal oxide layer semiconductor (Complementary Metal Oxide Semiconductor； CMOS) chip.

Fig. 4 is the fabrication processing figure of the SiP module of this utility model one embodiment.As shown in Figure 4, this utility model One embodiment also provides for a kind of method preparing said system level encapsulation chip, and the method includes: PCB substrate is carried out tin cream print Brush, is placed in tin cream print on the pad of pcb board；The pcb board that print is equipped with tin cream carries out chip attachment, and this chip is band pin Packaged chip；The pcb board being pasted with chip is carried out Reflow Soldering, so that chip is fixed on described pcb board；To fixing The pcb board having described chip carries out nude film welding and epoxy cure, so that nude film is fixed on described pcb board, this is naked Sheet is un-encapsulated and without pin, and fixes through epoxy resin, and the ability of the antidetonation of SiP can be made to be better than general printing Circuit board；And the pcb board being fixed with described chip and nude film is carried out go between welding, injection mo(u)lding, injection mo(u)lding after-hardening And coating electro-magnetic screen layer, thus produce described system in package chip.

Produce, therefore owing to having stress in injection molding process during injection ring epoxy resins (Molding Compound) Chip packaged in above-mentioned SiP module and nude film must have certain resistance to compression and thermostability.Multiple bare chip or mould can be taked Block carries out arrangement and assembles, can use the 3D encapsulation technology of stacking to increase the quantity of wafer or module, thus in vertical direction Add the number of plies that can place wafer, further enhance the Function Integration Mechanism ability of sip technique.And interior bonds technology can be single Pure line bonding (Wire Bonding), it is possible to use chip bonding (Flip Chip), it is possible to the two is used with.

Therefore multiple wafer package self-organizing system in single packaging body can be had height by the SiP prepared in this way Conformability and miniaturization characteristic, be suitably applied the electronic product of the characteristics such as little, multi-functional, the low-power consumption of volume, the most wearable Equipment (such as, intelligent watch, bracelet, glasses, shoes etc.), household electrical appliance (such as, dehumidifier, air-conditioning, depurator, air cooler, Fan, warmer, refrigerator, rotary drum washing machine, roller washing machine, electric heater, electric cooking pot, electric cooker etc.) and intelligent lighting Equipment.And, make into the most independent potted element to integrate with sip technique, just can reduce encapsulation volume to save sky Between, and shorten interelement connection line and make resistance reduce, promote electrical effect, finally present miniature package and replace sheet The advantage of circuit board, the most still can maintain wafer original function out of the ordinary.Additionally, because SIP is that interlock circuit is complete with packaging body Cladding, therefore can increase resist chemical and resistance to stress (Anti-stress) ability of circuit board, and can improve product entirety can By property, life of product also can be promoted.

Fig. 5 is the fabrication processing figure of the SiP module of another embodiment of this utility model.Below in conjunction with Fig. 5, this is described The fabrication processing of the SiP module of utility model.First, PCB substrate is preheated；Then, PCB substrate is carried out tin cream Printing, is placed in tin cream print on the pad of pcb board；Afterwards, pcb board print being equipped with tin cream carries out chip attachment so that chip On contact be wired on the pin of pcb board, these pins are set up even further through the wire on pcb board and other devices Connecing, the operation of this chip attachment can use Fuji chip mounter to complete；Afterwards, the pcb board being pasted with chip carries out Reflow Soldering, in order to core Sheet can be soldered in PCB substrate；Afterwards, the scaling powder of residual when removing Reflow Soldering；Afterwards, PCB substrate baking is again carried out Dry；Afterwards, nude film welding and epoxy cure are carried out；Afterwards, the epoxy resin of residual is removed by plasma cleaning；It After, carrying out lead-in wire welding, this lead-in wire welding operation can use K&S wire bonder to carry out；Afterwards, plasma cleaning is carried out；Afterwards, enter Row injection mo(u)lding, this injection mo(u)lding operation can use the forming machines such as TOWA；After moulding, injection hardening is carried out；Afterwards, Chip is carried out laser marking, and mark completes laggard line integrated circuit test (ICT), chip cutting, drying, electro-magnetic screen layer painting Covering, this chip cutting can use the cutting machines such as DFD, and the coating of this electro-magnetic screen layer can use the coating machines such as LINCOTEC to carry out；It After, carry out system level testing and Defect Scanning to be confirmed whether to have wafer damage, carry out afterwards drying, last tape package.It After, finished product OQC OQC, and transport away after finished product OQC is qualified.

After above-mentioned part steps, need to carry out visual inspection (FVI) or automated optical inspection (AOI), and inspection qualified it After carry out to next step just now.Above step flow process of the present utility model is the technological process of innovation, to ensureing Wireless Fidelity The performance of system in package product has important effect.Product is made to have compact, multi-functional, the characteristic of low-power consumption.

Form Factor of the present utility model, its area is less than or much smaller than 150 square millimeters, and height is less than or is much smaller than 2.0 millimeters, this highly comprises weld pad or soldered ball (soldering pads or balls) and isolation cover structure or shapes material The thickness of (shield structure or molding material).This utility model also uses and is generally of six or four layers (layer) the thin printed circuit board (PCB) of stromatolithic structure (stack-up structure), or the most multilayer laminated structure is as base Plate (substrate), such as when using LTCC (Low Temperature Cofired Ceramic；LTCC) During as substrate, use 12 or the printed circuit board (PCB) of ten layer laminate structure.Surface then part (Surface Mount Devices；SMDs), flip package part (Flip Chip Packaged Device) or other there is wafer-level package The part of (Chip Scaled Package) was embedded in the upper strata copper film (top-side copper) of substrate in the past, and these Part also can be embedded in lower floor's copper film (bottom-side copper) or internal layer copper film (inner-side according to design copper)。

The SiP of the band Wi-Fi function prepared by above-mentioned processing technology of the present utility model and congenerous are with type Wi-Fi The comparison of the index of correlation of module, either receiving sensitivity, or size, resistance to mechanical and chemical attack, waterproof and antidetonation, this The advantage of the Wi-Fi SIP of utility model is the most obvious, shown in table specific as follows:

Preferred implementation of the present utility model is described in detail above in association with accompanying drawing, but, this utility model does not limit Detail in above-mentioned embodiment, in technology concept of the present utility model, can be to skill of the present utility model Art scheme carries out multiple simple variant, and these simple variant belong to protection domain of the present utility model.

It is further to note that each the concrete technical characteristic described in above-mentioned detailed description of the invention, at not lance In the case of shield, can be combined by any suitable means.In order to avoid unnecessary repetition, this utility model is to respectively Plant possible compound mode to illustrate the most separately.

Additionally, combination in any can also be carried out, as long as it is not disobeyed between various different embodiment of the present utility model Carrying on the back thought of the present utility model, it should be considered as content disclosed in the utility model equally.

Claims (13)

1. a system in package chip, it is characterised in that this system in package chip comprises:

RF front-end module；

Analog-digital converter and digital to analog converter；

Microcontroller processing unit；

System bus unit；And

Wifi BB/MAC/PHY unit, is connected via described system bus unit with described microcontroller processing unit, is used for holding One or more in operation below row:

After carrying out digital-to-analogue conversion from the signal of described microcontroller processing unit via described digital to analog converter, by institute State RF front-end module to send；And

Receive and received and carried out by described analog-digital converter the signal after analog digital conversion by described RF front-end module, and will This signal sends to described microcontroller processing unit.

System in package chip the most according to claim 1, it is characterised in that this system in package chip also comprises:

Coupling and wave filter, be connected between the antenna of described RF front-end module and described system in package chip exterior.

System in package chip the most according to claim 1, it is characterised in that this system in package chip also comprises safety Chip unit, is encrypted for the signal being exported described microcontroller processing unit.

System in package chip the most according to claim 1, it is characterised in that this system in package chip also comprises periphery Interface, is connected to described system bus unit.

System in package chip the most according to claim 4, it is characterised in that described peripheral interface comprise following one or Many persons:

Universal asynchronous receiving-transmitting transmitter UART interface；

Serial peripheral equipment interface SPI；

Universal input/output GPIO interface；And

Twin wire universal serial bus I2C interface.

System in package chip the most according to claim 1, it is characterised in that this system in package chip also comprises:

BT BB/MAC/PHY processing unit, for turning from the signal of described microcontroller processing unit via described digital-to-analogue After parallel operation carries out digital-to-analogue conversion, sent by described RF front-end module；And/or reception is connect by RF front-end module Receive and carried out the signal after analog digital conversion by described analog-digital converter, and transmitting the signal to the process of described microcontroller Unit.

System in package chip the most according to claim 1, it is characterised in that this system in package chip also comprises following One or more:

Temperature sensor, for Temperature Quantity is converted to the signal of telecommunication, and sends to by described micro-via described system bus unit Controller processing unit；And

Humidity sensor, for humidity amount is converted to the signal of telecommunication, and sends to by described micro-via described system bus unit Controller processing unit.

System in package chip the most according to claim 1, it is characterised in that this system in package chip also comprises:

Whether infrared ray sensor, exist the signal of telecommunication of human body or animal activity for producing reaction, and total via described system Line unit sends to by described microcontroller processing unit.

System in package chip the most according to claim 1, it is characterised in that this system in package chip also comprises:

First agitator, for producing the first frequency of oscillation, for other modules in described system in package chip normally Operator scheme uses；And

Second agitator, for producing the second frequency of oscillation, for other modules in described system in package chip in power saving Operator scheme uses.

System in package chip the most according to claim 1, it is characterised in that this system in package chip also comprise with Lower one or many persons:

Flash memory access memorizer, is connected with described microcontroller processing unit and described system bus unit；And

Random access memory, is connected with described microcontroller processing unit and described system bus unit.

11. system in package chips according to claim 1, it is characterised in that this system in package chip also comprises:

Power Management Unit, for the electricity consumption module for power supply in described system in package chip.

12. 1 kinds of equipment comprised according to the system in package chip described in claim any one of claim 1-11.

13. equipment according to claim 12, it is characterised in that this equipment include following one or more: wearable set Standby, household electrical appliance and Intelligent illumination device.