CN205881878U - Online test silicon chip thickness reduction quantity's device - Google Patents
Online test silicon chip thickness reduction quantity's device Download PDFInfo
- Publication number
- CN205881878U CN205881878U CN201620881377.7U CN201620881377U CN205881878U CN 205881878 U CN205881878 U CN 205881878U CN 201620881377 U CN201620881377 U CN 201620881377U CN 205881878 U CN205881878 U CN 205881878U
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- CN
- China
- Prior art keywords
- silicon chip
- electronic scale
- photoelectric sensor
- elevating mechanism
- conveyer belt
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Testing Of Individual Semiconductor Devices (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model discloses an online test silicon chip thickness reduction quantity's device, including control terminal, conveying portion and conveyer belt, be equipped with material loading district, the inside cell body district of board and unloading district on the conveyer belt in proper order, lie in in the material loading district and be equipped with a first electronic scale and a photoelectric sensing ware that lies in on the elevating system between two conveyer belts, a photoelectric sensing ware lies in one side that first electronic scale is close to the inside cell body district of board, and when the silicon chip distinguished when the material loading just blocked a photoelectric sensing ware, the steady support of silicon chip was on first electronic scale, lieing in in the unloading district and being equipped with second electronic scale and the 2nd photoelectric sensing ware that lies in on the 2nd elevating system between two conveyer belts, the 2nd photoelectric sensing ware lies in one side that the inside cell body district of board was kept away from to the second electronic scale, and when the silicon chip distinguished when the unloading just blocked the 2nd photoelectric sensing ware, the steady support of silicon chip was on the second electronic scale. The utility model discloses can online test silicon chip thickness reduction quantity, save artifically, improve product quality.
Description
Technical field
This utility model relates to the device of a kind of on-line testing wafer thinning amount, belongs to technical field of solar batteries.
Background technology
The surface structuration processing procedure of solar battery sheet is a vital step in solar battery sheet production technology, right
The making of further battery sheet has a great impact, and carrying out surface wool manufacturing is the most frequently used surface structuration side of solaode
Method.
In prior art, solaode is when carrying out surface wool manufacturing, it is common that weigh by measuring the Reducing thickness of silicon chip
The quality of amount making herbs into wool effect, produces now the front weight that the way on line is manual measurement silicon chip, after making herbs into wool, measures same silicon chip
Rear heavy, front heavy and rear heavy difference is the Reducing thickness of silicon chip.
But, there are the following problems for above-mentioned way: first, it is impossible to monitors production technology in real time, it is impossible to ensures work
The stability of skill；Second, people and silicon chip can come in contact, and cause silicon chip surface to pollute, waste raw material；3rd, artificially calculate appearance
The unfavorable condition such as mistake in computation and data falsification easily occurs；4th, use the method for manual measurement to make cost of labor higher.
Therefore, the device of a kind of on-line testing wafer thinning amount is developed, it is possible to monitor and calculate the Reducing thickness of silicon chip in real time,
To save operation with artificial, it is clear that have positive realistic meaning.
Summary of the invention
Goal of the invention of the present utility model is to provide the device of a kind of on-line testing wafer thinning amount.
To achieve the above object of the invention, the technical solution adopted in the utility model is: a kind of on-line testing wafer thinning amount
Device, including controlling terminal, transport unit and two the parallel conveyer belts being located in transport unit, by transmitting on described conveyer belt
Direction is sequentially provided with feeding area, the internal cell body district of board and discharging area,
Described feeding area is provided with between two conveyer belts the first electronic scale and the first photoelectric sensor, described first
Being provided with the first elevating mechanism below electronic scale, described first photoelectric sensor is positioned at the first electronic scale near the internal cell body district of board
Side, and make: when the silicon chip of feeding area just blocks the first photoelectric sensor, silicon chip is supported in the first electronics smoothly
On scale；
Described discharging area is provided with between two conveyer belts the second electronic scale and the second photoelectric sensor, described second
Being provided with the second elevating mechanism below electronic scale, described second photoelectric sensor is positioned at the second electronic scale away from cell body district, board inside
Side, and make: when the silicon chip of discharging area just blocks the second photoelectric sensor, silicon chip is supported in the second electronics smoothly
On scale；
Described transport unit, the first electronic scale, the first photoelectric sensor, the first elevating mechanism, the second electronic scale, the second photoelectricity
Induction apparatus and the second elevating mechanism are all connected to control terminal and by controlling terminal centralized Control.
Preferably, described control terminal is computer.
Further, described first elevating mechanism and the second elevating mechanism are cylinder.
Further, described first elevating mechanism and the second elevating mechanism are hydraulic mandril.
Further, described first photoelectric sensor is positioned at the plane at two conveyer belt places and is perpendicular to conveyer belt
The half that horizontal range is silicon chip length on first straight line, between center and first straight line of the silicon chip of described feeding area.?
In actual application, it is contemplated that the sensitivity of the first photoelectric sensor, between center and first straight line of the silicon chip of described feeding area
Horizontal range may be slightly changed, be usually slightly less than the half of silicon chip length.
Preferably, described first photoelectric sensor is to the half that distance is silicon chip length at the center of the silicon chip of feeding area.
Further, described second photoelectric sensor is positioned at the plane at two conveyer belt places and is perpendicular to conveyer belt
The half that horizontal range is silicon chip length on second straight line, between center and second straight line of the silicon chip of described discharging area.?
In actual application, it is contemplated that the sensitivity of the second photoelectric sensor, between center and second straight line of the silicon chip of described discharging area
Horizontal range may be slightly changed, be usually slightly less than the half of silicon chip length.
Preferably, described second photoelectric sensor is to the half that distance is silicon chip length at the center of the silicon chip of discharging area.
Preferably, the precision of described first electronic scale and the second electronic scale is not less than 0.01g.
Owing to technique scheme is used, this utility model compared with prior art has the advantage that
1. the utility model discloses the device of a kind of on-line testing wafer thinning amount, drive silicon chip successively by conveyer belt
Through feeding area, the internal cell body district of board and discharging area, recorded before and after making by the first electronic scale and the second electronic scale respectively
The weight of silicon chip also transmits data to control terminal and calculates the Reducing thickness of silicon chip, it is achieved on-line testing wafer thinning amount
Function, it is to avoid mistake in computation that artificial calculating brings and be the situation looking for data；
2. this utility model uses automatic on-line water operation, saves manpower, has saved cost, avoids artificial simultaneously
The pollution that product is caused by contact, improves the quality of product；
3. this utility model is convenient to operation, it is simple to promote.
Accompanying drawing explanation
Fig. 1 is this utility model structural representation in embodiment one.
Fig. 2 is expanded application schematic diagram of the present utility model in embodiment one.
Wherein: 1, conveyer belt；2, feeding area；3, the internal cell body district of board；4, discharging area；5, the first electronic scale；6, first
Photoelectric sensor；7, silicon chip；8, the second electronic scale；9, the second photoelectric sensor.
Detailed description of the invention
Below in conjunction with the accompanying drawings and this utility model is further described by embodiment:
Embodiment one:
Seeing shown in Fig. 1 ~ 2, the device of a kind of on-line testing wafer thinning amount, including controlling terminal, transport unit and being located at
Two parallel conveyer belts 1 in transport unit, described conveyer belt is sequentially provided with feeding area 2, board interior groove by direction of transfer
Body district 3 and discharging area 4,
Described feeding area is provided with between two conveyer belts the first electronic scale 5 and the first photoelectric sensor 6, described
Being provided with the first elevating mechanism below one electronic scale, described first photoelectric sensor is positioned at the first electronic scale near the internal cell body of board
The side in district, and make: when the silicon chip 7 of feeding area just blocks the first photoelectric sensor, silicon chip is supported in first smoothly
On electronic scale；
Described discharging area is provided with between two conveyer belts the second electronic scale 8 and the second photoelectric sensor 9, described
Being provided with the second elevating mechanism below two electronic scales, described second photoelectric sensor is positioned at the second electronic scale away from board inside cell body
The side in district, and make: when the silicon chip of discharging area just blocks the second photoelectric sensor, silicon chip is supported in the second electricity smoothly
On sub-scale；
Described transport unit, the first electronic scale, the first photoelectric sensor, the first elevating mechanism, the second electronic scale, the second photoelectricity
Induction apparatus and the second elevating mechanism are all connected to control terminal and by controlling terminal centralized Control.
In the present embodiment, described control terminal is computer.
It is noted that described first elevating mechanism and the second elevating mechanism can be cylinder, hydraulic mandril or its
It is capable of the mechanical part of electronic scale lifting.
It is pointed out that in order to the weight of silicon chip, described first optoelectronic induction before and after accurately measure processing procedure
Device is positioned at the plane at two conveyer belt places and is perpendicular on the first straight line of conveyer belt, the center of the silicon chip of described feeding area
And the half that the horizontal range between the first straight line is silicon chip length；Described second photoelectric sensor is positioned at two conveyer belt places
Plane in and be perpendicular on the second straight line of conveyer belt, the level between center and second straight line of the silicon chip of described discharging area
Distance is the half of silicon chip length, and when the first electronic scale and the second electronic scale so can not only be prevented raised, silicon chip drops,
Also ensure that the surface of the first electronic scale and the second electronic scale completely attaches to silicon chip, it is ensured that the accuracy of measurement.
As preferably, the distance of the first photoelectric sensor described in the utility model to the center of the silicon chip of feeding area is silicon
The half of leaf length；Described second photoelectric sensor is to the half that distance is silicon chip length at the center of the silicon chip of discharging area, i.e.
First photoelectric sensor and the second photoelectric sensor are positioned at the position, middle of two conveyer belts.
The first electronic scale and the precision of the second electronic scale that this utility model is used are not less than 0.01g, and levelness is adjustable,
And synchronous calibration can be carried out by computer.
Operation principle of the present utility model is: silicon chip enters feeding area by automatic charging and forwarded by conveyer belt,
Now, first, second photoelectric sensor is in opening, when silicon chip is transferred into and just blocks the first photoelectric sensor,
Silicon chip is positioned at the surface of the first electronic scale, controls terminal control transport unit and suspends the transmission of conveyer belt, and controls first simultaneously
Elevating mechanism lifts the first electronic scale and completely disengages from conveyer belt to silicon chip, after the first electronic scale records Si wafer quality M, controls eventually
End control the first elevating mechanism falls to silicon chip and returns on conveyer belt, the first electronic scale playback, and the first photoelectric sensor is closed, and
Control transport unit unlatching conveyer belt to continue to forward；Silicon chip carry out in being sent to the internal cell body district of board corresponding processing procedure (as
Making herbs into wool), processing procedure terminates rear silicon chip and is transferred into discharging area；When silicon chip is transferred into and just blocks the second photoelectric sensor, silicon
Sheet is positioned at the surface of the second electronic scale, controls terminal control transport unit and suspends the transmission of conveyer belt, and controls the second elevator
Structure lifts the second electronic scale and completely disengages from conveyer belt to silicon chip, after the second electronic scale records Si wafer quality m, controls terminal control
Second elevating mechanism falls to silicon chip and returns on conveyer belt, the second electronic scale playback, and the second photoelectric sensor is closed, and controlled to pass
Send portion to open conveyer belt to continue to forward；First electronic scale and the second electronic scale are respectively by weight M of silicon chip before and after processing procedure and m
Send to the Reducing thickness calculating silicon chip in computer and be, and show over the display.
Shown in Figure 2, this utility model can expand to, according to actually used needs, the streamline group that multiple tracks is arranged side by side,
The Reducing thickness of silicon chip on every one streamline can be directly read, additionally, computer can also preserve many groups on computer display
Measurement data, is available for calling at any time, by the stability of software analysis correspondence streamline board processing procedure, and provides evaluation, moreover it is possible to
It is arranged as required to into fixed time test or quantitative test is reminded.
Claims (9)
1. the device of an on-line testing wafer thinning amount, it is characterised in that: include controlling terminal, transport unit and being located at transport unit
On two parallel conveyer belts, on described conveyer belt by direction of transfer be sequentially provided with feeding area, the internal cell body district of board and under
Material district,
Described feeding area is provided with between two conveyer belts the first electronic scale and the first photoelectric sensor, described first electronics
Being provided with the first elevating mechanism below scale, described first photoelectric sensor is positioned at the first electronic scale near the one of the internal cell body district of board
Side, and make: when the silicon chip of feeding area just blocks the first photoelectric sensor, silicon chip is supported in the first electronic scale smoothly
On；
Described discharging area is provided with between two conveyer belts the second electronic scale and the second photoelectric sensor, described second electronics
Being provided with the second elevating mechanism below scale, described second photoelectric sensor is positioned at the second electronic scale away from the one of cell body district, board inside
Side, and make: when the silicon chip of discharging area just blocks the second photoelectric sensor, silicon chip is supported in the second electronic scale smoothly
On；Described transport unit, the first electronic scale, the first photoelectric sensor, the first elevating mechanism, the second electronic scale, the second optoelectronic induction
Device and the second elevating mechanism are all connected to control terminal and by controlling terminal centralized Control.
The device of on-line testing wafer thinning amount the most according to claim 1, it is characterised in that: described control terminal is meter
Calculation machine.
The device of on-line testing wafer thinning amount the most according to claim 1, it is characterised in that: described first elevating mechanism
It is cylinder with the second elevating mechanism.
The device of on-line testing wafer thinning amount the most according to claim 1, it is characterised in that: described first elevating mechanism
It is hydraulic mandril with the second elevating mechanism.
The device of on-line testing wafer thinning amount the most according to claim 1, it is characterised in that: described first optoelectronic induction
Device is positioned at the plane at two conveyer belt places and is perpendicular on the first straight line of conveyer belt, the center of the silicon chip of described feeding area
And the half that the horizontal range between the first straight line is silicon chip length.
The device of on-line testing wafer thinning amount the most according to claim 5, it is characterised in that: described first optoelectronic induction
Device is to the half that distance is silicon chip length at the center of the silicon chip of feeding area.
7. according to the device of the on-line testing wafer thinning amount described in claim 1 ~ 6 any one, it is characterised in that: described
Two photoelectric sensors are positioned at the plane at two conveyer belt places and are perpendicular on the second straight line of conveyer belt, described discharging area
The half that horizontal range is silicon chip length between center and second straight line of silicon chip.
The device of on-line testing wafer thinning amount the most according to claim 7, it is characterised in that: described second optoelectronic induction
Device is to the half that distance is silicon chip length at the center of the silicon chip of discharging area.
The device of on-line testing wafer thinning amount the most according to claim 1, it is characterised in that: described first electronic scale and
The precision of the second electronic scale is not less than 0.01g.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620881377.7U CN205881878U (en) | 2016-08-15 | 2016-08-15 | Online test silicon chip thickness reduction quantity's device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620881377.7U CN205881878U (en) | 2016-08-15 | 2016-08-15 | Online test silicon chip thickness reduction quantity's device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205881878U true CN205881878U (en) | 2017-01-11 |
Family
ID=57703641
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620881377.7U Expired - Fee Related CN205881878U (en) | 2016-08-15 | 2016-08-15 | Online test silicon chip thickness reduction quantity's device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205881878U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109742017A (en) * | 2019-01-25 | 2019-05-10 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Wafer reduction process |
-
2016
- 2016-08-15 CN CN201620881377.7U patent/CN205881878U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109742017A (en) * | 2019-01-25 | 2019-05-10 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Wafer reduction process |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170111 Termination date: 20170815 |