CN205847714U - A kind of electrostatic prevention structure of ultra-thin wiring board - Google Patents

A kind of electrostatic prevention structure of ultra-thin wiring board Download PDF

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Publication number
CN205847714U
CN205847714U CN201620543734.9U CN201620543734U CN205847714U CN 205847714 U CN205847714 U CN 205847714U CN 201620543734 U CN201620543734 U CN 201620543734U CN 205847714 U CN205847714 U CN 205847714U
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CN
China
Prior art keywords
electrostatic
wiring board
absorption
board
plate
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Active
Application number
CN201620543734.9U
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Chinese (zh)
Inventor
岳长来
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SHENZHEN SHI ZHENG JI ELECTRONICS CO Ltd
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SHENZHEN SHI ZHENG JI ELECTRONICS CO Ltd
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Priority to CN201620543734.9U priority Critical patent/CN205847714U/en
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Publication of CN205847714U publication Critical patent/CN205847714U/en
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Abstract

This utility model relates to the electrostatic prevention structure of a kind of ultra-thin wiring board, it includes wiring board body and absorbs static board, the extension of this absorption static board is connected to this wiring board body end, it is connected between this wiring board body with this absorption static board and has broken plate, specifically producing when, this absorption static board is connected to this wiring board body end by this broken plate and carries out early stage production, carrying out early stage production when, electrostatic on wiring board is by this absorption static board adsorption to electrostatic, its electrostatic mainly focuses on this absorption static board, cutting off this broken plate afterwards makes this absorption static board separate from this wiring board body, this moment, this absorption static board carries most electrostatic on circuit board and separates to reach to remove the effect of most electrostatic on wiring board from this wiring board body.

Description

A kind of electrostatic prevention structure of ultra-thin wiring board
Technical field
This utility model relates to a kind of electrostatic prevention structure, particularly relates to a kind of application electrostatic prevention structure in the circuit board.
Background technology
Electrostatic is that (electric charge of flowing is the formation of electricity to a kind of the most immobilising electric charge of the electric charge remained static Stream).When accumulation is the formation of electrostatic on certain object or during surface, and electric charge is divided into positive charge and negative charge two kinds, That is electrostatic phenomenon is also classified into two kinds i.e. positive electrostatic and negative electrostatic.It is the formation of when positive charge is gathered on certain object Positive electrostatic, is the formation of negative electrostatic when negative charge is gathered on certain object.
The generation of electrostatic is inevitable, but electrostatic its harm during board production is huge, with The development wiring board more accurate, that thickness is thinner at present science and technology has become as a kind of development trend, and it is to production and processing link Requirement be the highest, if half-finished circuit board is to gather to have electrostatic will necessarily have a strong impact on product concrete production when Quality, but there is presently no out structure and the method being now able to electrostatic on the wiring board of efficient place to go, and this is for tradition The major defect of technology.
Utility model content
Technical solution adopted in the utility model is: the electrostatic prevention structure of a kind of ultra-thin wiring board, it includes wiring board Body and absorb static board, this absorption static board extend be connected to this wiring board body end, this wiring board body with should Absorb to connect between static board and have broken plate.
Specifically producing when, this absorption static board is connected to before this wiring board body end carries out by this broken plate Phase produce, carry out early stage produce when, the electrostatic on wiring board by this absorption static board adsorption to electrostatic, its Electrostatic mainly focuses on this absorption static board, before wiring board needs printed surface ink, by manually or automatically Change equipment cuts off this broken plate makes this absorption static board separate from this wiring board body, and this moment, this absorption static board is taken Separate to reach to remove the work of most electrostatic on wiring board from this wiring board body with electrostatic most on circuit board With, this wiring board body then individually enters in follow-up procedure of processing, and overall structure of the present utility model is simple, removes quiet Electricity is satisfactory for result.
This absorption static board includes that plate body and some absorption electrostatic bodies, these absorption electrostatic bodies some are arranged in this plate On body, this absorption electrostatic body have can the structure of adsorption electrostatic in a large number, thus by this absorption electrostatic body absorbing circuit plate Main electrostatic, each this absorption electrostatic body includes arc plate, and the two ends of this arc plate are connected with this plate body respectively, this arc plate Having upper surface and lower surface, this upper surface of this arc plate and this lower surface are respectively arranged with some tooth ribs, and each should Tooth rib all includes two inclined walls and pinnacle, and two these inclined walls are connected to the both sides on this pinnacle, by these teeth some The structure design of rib enables electrostatic main on this absorption electrostatic body absorbing circuit plate, being embodied as when, this absorption Electrostatic body entirety is made up of insulant, such as, and the material that the adsorption electrostatic ability such as plastics is strong.
Being embodied as when, this absorption static board front end is provided with draw-in groove, corresponding with this draw-in groove at this broken plate End is provided with dop, and this dop active card is connected in this draw-in groove, by the activity between this absorption static board and this broken plate Snap fit, makes this absorption static board be capable of the purpose that repetitive cycling uses, after this absorption static board is separated, Electrostatic thereon can be removed to utilize the modes such as washing, then repeat to be again connected on this broken plate of other circuit boards To reach the purpose of recycling.
The beneficial effects of the utility model are: this utility model is specifically producing when, and this absorption static board is by being somebody's turn to do Broken plate is connected to this wiring board body end and carries out early stage production, carrying out early stage production when, and the electrostatic on wiring board By this absorption static board adsorption to electrostatic, its electrostatic mainly focuses on this absorption static board, when wiring board needs Before printed surface ink, cut off this broken plate by manual or automated equipment and make this absorption static board from this wiring board Separating on body, this moment, this absorption static board carries most electrostatic on circuit board and separates from this wiring board body Getting off to reach the effect of most electrostatic on wiring board of removing, this wiring board body then individually enters follow-up procedure of processing In, overall structure of the present utility model is simple, removes electrostatic efficiency preferable.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model.
Fig. 2 is the structural representation that this utility model dop active card is connected in draw-in groove.
Detailed description of the invention
As Fig. 1 is to shown in 2, and the electrostatic prevention structure of a kind of ultra-thin wiring board, it includes wiring board body 10 and absorbs quiet Electroplax 20, the extension of this absorption static board 20 is connected to this wiring board body 10 end.
It is connected between this wiring board body 10 with this absorption static board 20 and has broken plate 30.
Specifically producing when, this absorption static board 20 is connected to this wiring board body 10 end by this broken plate 30 Carrying out early stage production, carrying out early stage production when, the electrostatic on wiring board is by this absorption static board 20 suction to electrostatic Attached effect, its electrostatic mainly focuses on this absorption static board 20, before wiring board needs printed surface ink, by people Work or automation equipment cut off this broken plate 30 makes this absorption static board 20 separate from this wiring board body 10, this Carving, this absorption static board 20 carries most electrostatic on circuit board and separates to reach to remove from this wiring board body 10 The effect of most electrostatic on wiring board, this wiring board body 10 then individually enters in follow-up procedure of processing, and this practicality is new The overall structure of type is simple, removes electrostatic efficiency preferable.
This absorption static board 20 includes that plate body 21 and some absorption electrostatic bodies 22, these absorption electrostatic bodies 22 some arrangement set Put on this plate body 21.
This absorption electrostatic body 22 have can the structure of adsorption electrostatic in a large number, thus adsorb electricity by this absorption electrostatic body 22 Electrostatic main on the plate of road.
Each this absorption electrostatic body 22 includes arc plate 41, and the two ends of this arc plate 41 are connected with this plate body 21 respectively, This arc plate 41 has upper surface and lower surface, and this upper surface of this arc plate 41 and this lower surface are respectively arranged with some tooth ribs 42。
Each this tooth rib 42 includes two inclined walls 43 and pinnacle 44.
Two these inclined walls 43 are connected to the both sides on this pinnacle 44, are designed by the structure of these tooth ribs 42 some and make this Absorb the electrostatic that electrostatic body 22 can be main on absorbing circuit plate.
Being embodied as when, this absorption electrostatic body 22 entirety is made up of insulant, such as, and the adsorption electrostatic such as plastics The material that ability is strong.
Being embodied as when, this absorption static board 20 front end is provided with draw-in groove 51, corresponding at this with this draw-in groove 51 Broken plate 30 end is provided with dop 52, and this dop 52 active card is connected in this draw-in groove 51.
By the movable snap fit between this absorption static board 20 and this broken plate 30, make this absorption static board 20 can Realize the purpose that repetitive cycling uses.
After this absorption static board 20 is separated, it is possible to use the modes such as washing remove electrostatic thereon, then weigh Again connected to again on this broken plate 30 of other circuit boards to reach the purpose of recycling.

Claims (3)

1. the electrostatic prevention structure of a ultra-thin wiring board, it is characterised in that: include wiring board body and absorb static board, this suction Receiving static board extension and be connected to this wiring board body end, being connected between this wiring board body with this absorption static board has fracture Plate, this absorption static board includes that plate body and some absorption electrostatic bodies, these absorption electrostatic bodies some are arranged on this plate body,
Each this absorption electrostatic body includes arc plate, and the two ends of this arc plate are connected with this plate body respectively, on this arc plate has Surface and lower surface, this upper surface of this arc plate and this lower surface be respectively arranged with some tooth ribs, each this tooth rib Including two inclined walls and pinnacle, two these inclined walls are connected to the both sides on this pinnacle.
The electrostatic prevention structure of a kind of ultra-thin wiring board the most as claimed in claim 1, it is characterised in that: this absorption electrostatic body is overall It is made up of insulant.
The electrostatic prevention structure of a kind of ultra-thin wiring board the most as claimed in claim 1, it is characterised in that: this absorption static board front end Being provided with draw-in groove, corresponding with this draw-in groove this broken plate end is provided with dop, this dop active card is connected in this draw-in groove.
CN201620543734.9U 2016-06-07 2016-06-07 A kind of electrostatic prevention structure of ultra-thin wiring board Active CN205847714U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201620543734.9U CN205847714U (en) 2016-06-07 2016-06-07 A kind of electrostatic prevention structure of ultra-thin wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201620543734.9U CN205847714U (en) 2016-06-07 2016-06-07 A kind of electrostatic prevention structure of ultra-thin wiring board

Publications (1)

Publication Number Publication Date
CN205847714U true CN205847714U (en) 2016-12-28

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201620543734.9U Active CN205847714U (en) 2016-06-07 2016-06-07 A kind of electrostatic prevention structure of ultra-thin wiring board

Country Status (1)

Country Link
CN (1) CN205847714U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109890136A (en) * 2019-02-20 2019-06-14 苏州市吴通智能电子有限公司 A kind of pcb board splicing construction applied to SMT attachment line
CN109890136B (en) * 2019-02-20 2024-06-04 苏州市吴通智能电子有限公司 Be applied to PCB board mosaic structure of SMT assembly line

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109890136A (en) * 2019-02-20 2019-06-14 苏州市吴通智能电子有限公司 A kind of pcb board splicing construction applied to SMT attachment line
CN109890136B (en) * 2019-02-20 2024-06-04 苏州市吴通智能电子有限公司 Be applied to PCB board mosaic structure of SMT assembly line

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