CN205812497U

CN205812497U - A kind of pottery dual platen

Info

Publication number: CN205812497U
Application number: CN201620610410.2U
Authority: CN
Inventors: 孙建科
Original assignee: Shenzhen Jing Yuan Micro Technology Co Ltd
Current assignee: Shenzhen Jing Yuan Micro Technology Co Ltd
Priority date: 2016-06-20
Filing date: 2016-06-20
Publication date: 2016-12-14
Anticipated expiration: 2026-06-20

Abstract

This utility model relates to circuit substrate technical field, especially a kind of pottery dual platen.It includes ceramic wafer, the upper end of ceramic wafer is disposed with the first cushion and the first conductive layer, the lower end of ceramic wafer is disposed with the second cushion and the second conductive layer, first conductive layer, first cushion, ceramic wafer, second cushion and the second conductive layer offer the conductive through hole being interconnected successively, first conductive layer and the second conductive layer are positioned at inner face and are equipped with FPC plate, FPC plate includes the first electrode tip holder, second electrode tip holder and input termination, first electrode tip holder is arranged between the first conductive layer and the second conductive layer along " X " axle, second electrode tip holder is arranged between the first conductive layer and the second conductive layer along " Y " axle, first electrode tip holder and the mutual split of the second electrode tip holder.This utility model is good by compressive property, and simple in construction has the strongest practicality.

Description

A kind of pottery dual platen

Technical field

This utility model relates to circuit substrate technical field, especially a kind of pottery dual platen.

Background technology

It is known that pottery is to pass through mixing, the molding of pulverizing with natural clay and various natural minerals for primary raw material Various goods with the material that calcining prepares.And pottery is made self to have 1. mechanical strengths high；2. wearability, corrosion resistance Good；3. Heat stability is good；4. abundant raw material, price is low；5. product environmental protection, pollution-free；The advantages such as 6, insulation, heat conductivity are strong, general All over being favored by user.And in circuit substrate, pottery is extensively paid attention to the advantage insulated, heat conduction is strong.

At present, traditional ceramic substrate generally has the disadvantage in that entirety is frangible, double-sided wiring is loaded down with trivial details.

Utility model content

For above-mentioned the deficiencies in the prior art, the purpose of this utility model is to provide a kind of pressure, wiring letter Single ceramic dual platen.

To achieve these goals, this utility model adopts the following technical scheme that

A kind of pottery dual platen, it includes that ceramic wafer, the upper end of described ceramic wafer are disposed with the first cushion and the One conductive layer, the lower end of described ceramic wafer is disposed with the second cushion and the second conductive layer, described first conductive layer, first Cushion, ceramic wafer, the second cushion and the second conductive layer offer the conductive through hole being interconnected, described first conduction successively Layer and the second conductive layer are positioned at inner face and are equipped with FPC plate, and described FPC plate includes the first electrode tip holder, the second electrode tip holder and input Termination, described first electrode tip holder is arranged between the first conductive layer and the second conductive layer along " X " axle, described second electrode tip holder edge " Y " axle is arranged between the first conductive layer and the second conductive layer, described first electrode tip holder and the mutual split of the second electrode tip holder.

Preferably, it is provided with horizontal cavity inside described first cushion and the second cushion.

Preferably, the outlet up and down of described conductive through hole is all in horn-like.

Owing to have employed such scheme, this utility model carries out connecting up and FPC by the first conductive layer and the second conductive layer The laying of plate, utilizes conductive through hole to realize the double-side conduction of circuit；Meanwhile, the first cushion and the second cushion is utilized to press Power buffers, the effective minimizing external pressurization damage to ceramic wafer；Further, it is placed within the first cushion and the second cushion Horizontal cavity strengthens contractility, effectively strengthens the protection to ceramic wafer, its simple in construction, has the strongest practicality.

Accompanying drawing explanation

Fig. 1 is the structural principle schematic diagram of this utility model embodiment；

Fig. 2 is the structural representation of the FPC plate of this utility model embodiment；

Fig. 3 is the structural representation of the first electrode tip holder of the FPC plate of this utility model embodiment.

Detailed description of the invention

Below in conjunction with accompanying drawing, embodiment of the present utility model is described in detail, but this utility model can be by right Require that the multitude of different ways limiting and covering is implemented.

As shown in Figure 1 to Figure 3, a kind of pottery dual platen that the present embodiment provides, it includes ceramic wafer 3, ceramic wafer 3 upper End is disposed with the first cushion 2 and the first conductive layer 1, and the lower end of ceramic wafer 3 is disposed with the second cushion 4 and second Conductive layer 5, first conductive layer the 1, first cushion 2, ceramic wafer the 3, second cushion 4 and the second conductive layer 5 offer phase successively Intercommunicated conductive through hole 6, the first conductive layer 1 and the second conductive layer 5 be positioned at inner face and be equipped with FPC plate 8, and FPC plate 8 includes One electrode tip holder the 10, second electrode tip holder 11 and input termination, the first electrode tip holder 10 is arranged in the first conductive layer 1 and second along " X " axle Between conductive layer 5, the second electrode tip holder 11 is arranged between the first conductive layer 1 and the second conductive layer 5 along " Y " axle, the first electrode tip holder 10 and the second mutual split of electrode tip holder 11.

Further, the first cushion 2 and the second cushion 4 inside are provided with horizontal cavity 7.

Further, the outlet up and down of conductive through hole 6 is all in horn-like.

The present embodiment is carried out the laying of wiring and FPC plate 8 by the first conductive layer 1 and the second conductive layer 5, utilizes conductive through hole 6 double-side conductions realizing circuit, the first electrode tip holder 10 and the second electrode tip holder 11 arranged along " X " axle and " Y " axle are mutually perpendicular to also Mutually split forms a rectangular surfaces, therefore can turn on according to actual needs a certain example in rectangular surfaces and or a certain perpendicular, utilize The most flexible；Meanwhile, utilizing the first cushion 2 and the second cushion 4 to carry out pressure buffer, the external pressurization of effective minimizing is to pottery The damage of porcelain plate 3；Further, it is placed in the horizontal cavity within the first cushion 2 and the second cushion 4 and strengthens contractility, effectively Strengthen protection to ceramic wafer 3.

The outlet up and down of the conductive through hole 6 of the present embodiment is all in horn-like, therefore substantially reduces wiring difficulty, makes circuit Conduct convenient.

These are only preferred embodiment of the present utility model, not thereby limit the scope of the claims of the present utility model, every Utilize equivalent structure or equivalence flow process conversion that this utility model description and accompanying drawing content made, or be directly or indirectly used in Other relevant technical fields, are the most in like manner included in scope of patent protection of the present utility model.

Claims

1. a ceramic dual platen, it is characterised in that: it includes that ceramic wafer, the upper end of described ceramic wafer are disposed with first and delay Rushing layer and the first conductive layer, the lower end of described ceramic wafer is disposed with the second cushion and the second conductive layer, and described first leads Electric layer, the first cushion, ceramic wafer, the second cushion and the second conductive layer offer the conductive through hole being interconnected, institute successively Stating the first conductive layer and the second conductive layer is positioned at inner face and is equipped with FPC plate, described FPC plate includes the first electrode tip holder, the second electricity Electrode seat and input termination, described first electrode tip holder is arranged between the first conductive layer and the second conductive layer along " X " axle, and described second Electrode tip holder is arranged between the first conductive layer and the second conductive layer along " Y " axle, and described first electrode tip holder and the second electrode tip holder are mutual Split.

2. a kind of pottery dual platen as claimed in claim 1, it is characterised in that: in described first cushion and the second cushion Portion is provided with horizontal cavity.

3. a kind of pottery dual platen as claimed in claim 2, it is characterised in that: the outlet up and down of described conductive through hole is all in loudspeaker Shape.