CN205812486U - A kind of stiffening plate of flexible PCB - Google Patents
A kind of stiffening plate of flexible PCB Download PDFInfo
- Publication number
- CN205812486U CN205812486U CN201620666193.9U CN201620666193U CN205812486U CN 205812486 U CN205812486 U CN 205812486U CN 201620666193 U CN201620666193 U CN 201620666193U CN 205812486 U CN205812486 U CN 205812486U
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- CN
- China
- Prior art keywords
- flexible pcb
- epoxy glass
- glass cloth
- polyimide layer
- stiffening plate
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The utility model discloses the stiffening plate of a kind of flexible PCB, including: polyimide layer and epoxy glass cloth, polyimide layer applies on epoxy glass cloth, and epoxy glass cloth laminating flexible PCB is arranged；The thickness summation of described polyimide layer and epoxy glass cloth is 0.225mm.By the way, this utility model can ensure that product thickness, abrasion resistance, impact strength and water absorbing properties improve the bending property of product, tensile strength performance and percentage elongation while constant.
Description
Technical field
This utility model relates to flexible PCB reinforcement field, particularly relates to the stiffening plate of a kind of flexible PCB.
Background technology
Polyimides is one of optimal high-molecular organic material of combination property, high temperature resistant reaches 400 ° of more than C, life-time service
300 ° of C of-200 ° of C of temperature range, without sharp melting point, high insulating property, have been widely used at Aeronautics and Astronautics, microelectronics, receive
The fields such as rice, liquid crystal, separation film, laser.Polyimides can divide by thickness specification have multiple, including 0.075mm, 0.1mm,
0.125mm, 0.15mm, 0.175mm, 0.2mm, 0.225mm ... many kinds of different thickness of 0.475mm.At present, flexible PCB
Stiffening plate uses the polyimides of 0.225cm, and this polyimides is thicker, and polyimides is the thickest, its bending property, draws
Stretch strength character and percentage elongation be the poorest, thus the product problem brought to be plate roll Qu Buping, harmomegathus coefficient big, impact
The planarization of plank, has a strong impact on the efficiency that subsequent production makes, and its Costco Wholesale is higher.
Utility model content
This utility model is mainly solving the technical problems that provide the stiffening plate of a kind of flexible PCB, it is possible to ensureing product
Improve while product thickness, abrasion resistance, impact strength and water absorbing properties are constant the bending property of product, tensile strength performance with
And percentage elongation, it is to avoid there are the problems such as plate roll Qu Buping, harmomegathus coefficient are big, plank is the most smooth in product, improves subsequent production
The efficiency made, and its Costco Wholesale is relatively low.
For solving above-mentioned technical problem, the technical scheme that this utility model uses is: provide a kind of flexible PCB
Stiffening plate, including: polyimide layer and epoxy glass cloth, polyimide layer applies on epoxy glass cloth, expoxy glass
Layer of cloth laminating flexible PCB is arranged；The thickness summation of described polyimide layer and epoxy glass cloth is 0.225mm.
Preferably, the thickness of described polyimide layer is 0.075mm, and the thickness of described epoxy glass cloth is 0.15mm.
Preferably, pure glue-line it is provided with between described epoxy glass cloth and flexible PCB.
The beneficial effects of the utility model are: this utility model can ensure product thickness, abrasion resistance, impact strength with
And water absorbing properties constant while improve the bending property of product, tensile strength performance and percentage elongation.
Accompanying drawing explanation
Fig. 1 is the frame structure schematic diagram of stiffening plate one preferred embodiment of a kind of flexible PCB of this utility model.
Detailed description of the invention
Below in conjunction with the accompanying drawings preferred embodiment of the present utility model is described in detail, so that advantage of the present utility model
Can be easier to be readily appreciated by one skilled in the art with feature, thus protection domain of the present utility model is made apparent clearly
Define.
Referring to Fig. 1, this utility model embodiment includes:
A kind of stiffening plate of flexible PCB, including: polyimide layer and epoxy glass cloth, polyimide layer applies at ring
In oxygen glass fabric layer, epoxy glass cloth laminating flexible PCB is arranged；Described polyimide layer and the thickness of epoxy glass cloth
Degree summation is 0.225mm.The thickness of described polyimide layer is 0.075mm, and the thickness of described epoxy glass cloth is 0.15mm.
Pure glue-line it is provided with between described epoxy glass cloth and flexible PCB.
This utility model can ensure that product thickness, abrasion resistance, impact strength and water absorbing properties carry while constant
The bending property of high product, tensile strength performance and percentage elongation, it is to avoid product occur plate roll Qu Buping, harmomegathus coefficient big,
The problems such as plank is the most smooth, improve the efficiency that subsequent production makes, and its Costco Wholesale are relatively low.
The foregoing is only embodiment of the present utility model, not thereby limit the scope of the claims of the present utility model, every
Utilize equivalent structure or equivalence flow process conversion that this utility model description and accompanying drawing content made, or be directly or indirectly used in
Other relevant technical fields, are the most in like manner included in scope of patent protection of the present utility model.
Claims (3)
1. the stiffening plate of a flexible PCB, it is characterised in that including: polyimide layer and epoxy glass cloth, polyamides is sub-
Amine layer is applied on epoxy glass cloth, and epoxy glass cloth laminating flexible PCB is arranged；Described polyimide layer and epoxy glass
The thickness summation of glass layer of cloth is 0.225mm.
The stiffening plate of a kind of flexible PCB the most according to claim 1, it is characterised in that: the thickness of described polyimide layer
Degree is 0.075mm, and the thickness of described epoxy glass cloth is 0.15mm.
The stiffening plate of a kind of flexible PCB the most according to claim 1, it is characterised in that: described epoxy glass cloth and
Pure glue-line it is provided with between flexible PCB.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620666193.9U CN205812486U (en) | 2016-06-29 | 2016-06-29 | A kind of stiffening plate of flexible PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620666193.9U CN205812486U (en) | 2016-06-29 | 2016-06-29 | A kind of stiffening plate of flexible PCB |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205812486U true CN205812486U (en) | 2016-12-14 |
Family
ID=57511877
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620666193.9U Active CN205812486U (en) | 2016-06-29 | 2016-06-29 | A kind of stiffening plate of flexible PCB |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205812486U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107333384A (en) * | 2017-06-26 | 2017-11-07 | 韩胜池 | The circuit board module and its installation method of a kind of liquid level detection device |
-
2016
- 2016-06-29 CN CN201620666193.9U patent/CN205812486U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107333384A (en) * | 2017-06-26 | 2017-11-07 | 韩胜池 | The circuit board module and its installation method of a kind of liquid level detection device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: 215000 Jiangsu Suzhou Xiangcheng District Huangqiao Street Mu Xiang Village Suzhou City Huayang electronic Limited by Share Ltd Patentee after: SUZHOU HUAYANG ELECTRONICS Co.,Ltd. Address before: 215132 Muxiang Village, Huangqiao Street, Xiangcheng District, Suzhou City, Jiangsu Province Patentee before: SUZHOU SMARTRON TECHNOLOGY Corp.,Ltd. |
|
| CP03 | Change of name, title or address |