CN205793614U - A kind of multilayer circuit board with blind buried via hole - Google Patents
A kind of multilayer circuit board with blind buried via hole Download PDFInfo
- Publication number
- CN205793614U CN205793614U CN201620505491.XU CN201620505491U CN205793614U CN 205793614 U CN205793614 U CN 205793614U CN 201620505491 U CN201620505491 U CN 201620505491U CN 205793614 U CN205793614 U CN 205793614U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- intermediate layer
- via hole
- buried via
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Structure Of Printed Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
nullThis utility model relates to a kind of multilayer circuit board with blind buried via hole，Belong to multilayer circuit board field，Including circuit board body，Circuit board body is provided with some fixing holes，Circuit board body is sequentially provided with bus plane from top to bottom、External circuit layer、Intermediate layer、Bottom and ground plane，Intermediate layer is made up of the insulation board of some band printed circuit board wirings，Between bus plane and external circuit layer、All connected by blind hole between bottom with ground plane，Between external circuit layer and intermediate layer、Between intermediate layer and bottom、All connected by buried via hole between the built-in electrical insulation plate of intermediate layer，By arranging special bus plane and ground plane，In high-frequency circuit designs，It is better than the form design with bus that power supply designs as a layer，So loop always can be walked along the path that impedance is minimum，In addition，Power panel must provide a signal circuit for the signal of generations all on PCB and acceptance，So can minimize signal circuit，Thus reduce noise.
Description
Technical field
This utility model relates to a kind of multilayer circuit board with blind buried via hole, belongs to multilayer circuit board field.
Background technology
In various electronic equipments, such as computer, television set, telephone set, mobile phone and various control equipment instruments etc., the most all
Using printed circuit board (PCB) as retaining element and the substrate of connection circuit, printed circuit board (PCB) generally arranges component hole with solid on plate body
Determine hole and connect the printed circuit lines of various component hole, during use, corresponding various electronic components being inserted solid welding at printed circuit
In the component hole of plate, form corresponding control circuit, then by fixing hole thereon for use in printed circuit board and corresponding casing for electric appliances
Fixing, form various electronic equipment, some electronic equipment complex circuit, a layer circuit board is difficult to be distributed required printing electricity
Route, generally requires multilayer circuit board and carries out overall configuration, but the printed circuit lines between each layer is generally all carried out at periphery
Corresponding connection, causes overall printing circuit layout complicated, electronic component distribution confusion, and usage safety performance is poor, and circuit
Plate usually by some fairly simple fixing devices, sometimes because location comparison is crowded, causes circuit board in use
Producing substantial amounts of heat, these heats can not distribute in time, and the electronic device smaller for some thermostabilitys can cause one
Fixed damage, the most directly can be burned, and staff is caused certain judgement accordingly, it would be desirable to improve further.
Summary of the invention
The technical problems to be solved in the utility model overcomes existing defect, it is provided that a kind of multilayer circuit board with blind buried via hole, logical
Crossing and arrange special bus plane and ground plane, in high-frequency circuit designs, power supply designs general than the shape with bus as a layer
Formula design to be got well, and such loop always can be walked, additionally, power panel must be for generations all on PCB along the path that impedance is minimum
There is provided a signal circuit with the signal accepted, so can minimize signal circuit, thus reduce noise, can effectively solve
Problem in background technology.
In order to solve above-mentioned technical problem, this utility model provides following technical scheme:
A kind of multilayer circuit board with blind buried via hole, including circuit board body, described circuit board body is provided with some fixing holes, described electricity
Road plate body is sequentially provided with bus plane, external circuit floor, intermediate layer, bottom and ground plane from top to bottom, if described intermediate layer by
The insulation board composition of dry band printed circuit board wiring, between described bus plane and external circuit layer, all passes through between bottom and ground plane
Blind hole connects, between described external circuit layer and intermediate layer, between intermediate layer and bottom, the most logical between the built-in electrical insulation plate of intermediate layer
Cross buried via hole to connect, be also equipped with base bottom described circuit board body, bottom described base intracavity, be provided with some support columns, described
The hinged dust cap of hinge chain is passed through in base side, and it is protruding that described dust cap inwall is provided with some sponges.
Furthermore, being additionally provided with fan bottom described base intracavity, described fan is electrically connected with bus plane by wire.
Furthermore, described dust cap side is provided with handle, and described handle outer wall is additionally provided with slip-resistant texture.
Furthermore, described blind hole is equipped with opening.
Furthermore, the number of described support column is at least provided with four.
This utility model beneficial effect: by arranging special bus plane and ground plane, high-frequency circuit design in, power supply with
The form design of layer is typically good than the form design with bus, and such loop always can be walked along the path that impedance is minimum, additionally,
Bus plane also for generations all on PCB and acceptance signal provide a signal circuit, so can minimize signal circuit, from
And reduce noise, it is simultaneously provided with dust cap, is possible not only to dust-proof, moreover it is possible to pushing down circuit board by sponge projection prevents it from shaking,
Can be dispelled the heat by fan, simple in construction, reasonable in design, practical.
Accompanying drawing explanation
Accompanying drawing is used for providing being further appreciated by of the present utility model, and constitutes a part for description, with this utility model
Embodiment be used for together explaining this utility model, be not intended that restriction of the present utility model.
Fig. 1 is a kind of multilayer circuit board body sectional view with blind buried via hole of this utility model.
Fig. 2 is a kind of multilayer circuit board overall structure figure with blind buried via hole of this utility model.
Fig. 3 is a kind of multilayer circuit board base intracavity structure chart with blind buried via hole of this utility model.
Label in figure: 1, circuit board body；2, fixing hole；3, bus plane；4, external circuit layer；5, intermediate layer；6、
Bottom；7, ground plane；8, blind hole；9, buried via hole；10, base；11, support column；12, dust cap；13, sponge is protruding；
14, fan；15, handle.
Detailed description of the invention
Below in conjunction with accompanying drawing, preferred embodiment of the present utility model is illustrated, it will be appreciated that preferred reality described herein
Execute example be merely to illustrate and explain this utility model, be not used to limit this utility model.
As shown in Figure 1-Figure 3, a kind of multilayer circuit board with blind buried via hole, including circuit board body 1, described circuit board body 1
It is provided with some fixing holes 2, can carry out circuit board body 1 installing by fixing hole 2 and fix, described circuit board body 1
It is sequentially provided with bus plane 3, external circuit layer 4, intermediate layer 5, bottom 6 and ground plane 7 from top to bottom, facilitates between different layers
Hole connect, described intermediate layer 5 is made up of the insulation board of some band printed circuit board wirings, needs to increase absolutely according to circuit design
The number of listrium, between described bus plane 3 and external circuit layer 4, is all connected by blind hole 8 between bottom 6 and ground plane 7,
And described blind hole 8 is equipped with opening, convenient circuit line is drawn and the footnote of connecting electronic component, described external circuit layer 4
With between intermediate layer 5, between intermediate layer 5 and bottom 6, be all connected by buried via hole 9 between the built-in electrical insulation plate of intermediate layer 5, logical
Cross buried via hole 9 and can ensure that the electrical connection of internal layer, be also equipped with base 10 bottom described circuit board body 1, pass through base
Circuit board can be fixed by 10, and described base 10 intracavity bottom is additionally provided with fan 14, can be to circuit board by fan 14
Dispelling the heat, described fan 14 is electrically connected with bus plane 3 by wire, provides power supply can to fan 14, described dust-proof
Cover 12 sides and be provided with handle 15, by handle 15 is convenient, dust cap 12 is operated, described handle 15 outer wall is additionally provided with anti-skidding
Texture, is possible to prevent hands sliding, and described base 10 intracavity bottom is provided with some support columns 11, and the number of described support column 11 is extremely
Being provided with four less, can be supported circuit board body, the hinged dust cap of hinge chain 12 is passed through in described base 10 side, by anti-
Dirt lid 12 can be dust-proof, and described dust cap 12 inwall is provided with some sponge projections 13, can prevent circuit board by sponge projection 13
Vibrations.
This utility model is in use, by arranging special bus plane 3 and ground plane 7, in high-frequency circuit designs, electric
It is better than the form design with bus that source is designed as a layer, and such loop always can be walked along the path that impedance is minimum,
Additionally, bus plane also for generations all on PCB and acceptance signal provide a signal circuit, so can minimize signal and return
Road, thus reduce noise, it is simultaneously provided with dust cap, is possible not only to dust-proof, moreover it is possible to push down circuit board by sponge projection 13 and prevent
Its vibrations, can be dispelled the heat by fan 14, and simple in construction is reasonable in design, practical.
Being more than this utility model preferably embodiment, this utility model those skilled in the art can also be to above-mentioned reality
The mode of executing changes and revises, and therefore, this utility model is not limited to above-mentioned detailed description of the invention, every this area skill
Any conspicuously improved, replacement or modification that art personnel are made on the basis of this utility model belong to of the present utility model
Protection domain.
Claims (5)
- null1. the multilayer circuit board with blind buried via hole，Including circuit board body (1)，It is characterized in that，Described circuit board body (1) is provided with some fixing holes (2)，Described circuit board body (1) is sequentially provided with bus plane (3) from top to bottom、External circuit layer (4)、Intermediate layer (5)、Bottom (6) and ground plane (7)，Described intermediate layer (5) is made up of the insulation board of some band printed circuit board wirings，Between described bus plane (3) and external circuit layer (4)、All connected by blind hole (8) between bottom (6) with ground plane (7)，Between described external circuit layer (4) and intermediate layer (5)、Between intermediate layer (5) and bottom (6)、All connected by buried via hole (9) between intermediate layer (5) built-in electrical insulation plate，Described circuit board body (1) bottom is also equipped with base (10)，Described base (10) intracavity bottom is provided with some support columns (11)，The hinged dust cap of hinge chain (12) is passed through in described base (10) side，It is protruding (13) that described dust cap (12) inwall is provided with some sponges.
- A kind of multilayer circuit board with blind buried via hole, it is characterized in that: described base (10) intracavity bottom is additionally provided with fan (14), described fan (14) is electrically connected with bus plane (3) by wire.
- A kind of multilayer circuit board with blind buried via hole, it is characterised in that: described dust cap (12) side is provided with handle (15), and described handle (15) outer wall is additionally provided with slip-resistant texture.
- A kind of multilayer circuit board with blind buried via hole, it is characterised in that: described blind hole (8) is equipped with opening.
- A kind of multilayer circuit board with blind buried via hole, it is characterised in that: the number of described support column (11) is at least provided with four.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620505491.XU CN205793614U (en) | 2016-05-27 | 2016-05-27 | A kind of multilayer circuit board with blind buried via hole |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620505491.XU CN205793614U (en) | 2016-05-27 | 2016-05-27 | A kind of multilayer circuit board with blind buried via hole |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205793614U true CN205793614U (en) | 2016-12-07 |
Family
ID=59978698
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620505491.XU Expired - Fee Related CN205793614U (en) | 2016-05-27 | 2016-05-27 | A kind of multilayer circuit board with blind buried via hole |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205793614U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106914073A (en) * | 2017-03-01 | 2017-07-04 | 郑州航空工业管理学院 | A kind of dust guard for mathematical data processor |
-
2016
- 2016-05-27 CN CN201620505491.XU patent/CN205793614U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106914073A (en) * | 2017-03-01 | 2017-07-04 | 郑州航空工业管理学院 | A kind of dust guard for mathematical data processor |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN206235797U (en) | Flash lamp component and terminal device | |
| WO2007025440A1 (en) | A chassis | |
| CN205793614U (en) | A kind of multilayer circuit board with blind buried via hole | |
| US8779298B2 (en) | Electronic circuit | |
| JP5370935B2 (en) | Power converter and filter switch | |
| US8125794B2 (en) | Multilayer printed wiring board and electronic device using the same | |
| CN102999113A (en) | Server | |
| CN206341235U (en) | New network interchanger | |
| JP2014003613A (en) | Portable terminal | |
| Lun | Designing for board level electromagnetic compatibility | |
| CN208657188U (en) | A kind of packaged type shielding box | |
| CN204696011U (en) | A kind of electromagnetic armouring structure for keyboard | |
| Gu et al. | Capacitive touch hardware design guide | |
| CN106559956A (en) | The circuit board of power supply unit, including the electronic installation and inductance device of circuit board | |
| CN207820303U (en) | A kind of diamagnetic interference circuit board | |
| US8149560B2 (en) | Electrostatic discharge apparatus for touch key | |
| JP2001144387A (en) | Shielded wiring on printed wiring board | |
| CN206004718U (en) | A kind of mounting structure of light sensor, light level device assembly and electronic equipment | |
| Chen et al. | Improve electromagnetic interference of electronic products with Taguchi parametric design | |
| JPH0864984A (en) | Low emi structure | |
| CN211213231U (en) | Keyboard board and ultrasonic diagnostic equipment | |
| CN203590051U (en) | Compact switching power supply | |
| CN201709023U (en) | Blind and buried hole multilayer printed circuit board | |
| CN208079489U (en) | The PCB circuit board layout structure of LLC Resonant Chargers | |
| KR101461280B1 (en) | Mobile Apparatus Having Vertical and Horizontal Substrate Structures |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20161207 Termination date: 20200527 |