CN205793134U - Mike - Google Patents
Mike Download PDFInfo
- Publication number
- CN205793134U CN205793134U CN201620503712.XU CN201620503712U CN205793134U CN 205793134 U CN205793134 U CN 205793134U CN 201620503712 U CN201620503712 U CN 201620503712U CN 205793134 U CN205793134 U CN 205793134U
- Authority
- CN
- China
- Prior art keywords
- wiring board
- mike
- mems chip
- damping screen
- shell
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Micromachines (AREA)
Abstract
This utility model provides a kind of mike; it includes wiring board and connects the shell forming host cavity with wiring board lid; this wiring board and shell form protection structure; the first acoustic aperture turned on described host cavity is offered on described shell; this mike also includes the control circuit chip being placed in described protection structure and is provided with the mems chip in back of the body chamber; described mems chip is placed on described wiring board; offering the second acoustic aperture that the back of the body chamber with described mems chip turns on described wiring board, described wiring board is provided with the damping screen covering described second acoustic aperture.Mike of the present utility model has the function that directivity is recorded.
Description
[technical field]
This utility model relates to a kind of mike, particularly relates to a kind of microphone of microelectromechanicsystem system.
[background technology]
Along with the development of wireless telecommunications, Global Mobile Phone Users gets more and more, and user is to mobile phone
Require the most not only to be satisfied with call, and want to provide high-quality communication effect, move the most at present
The development of dynamic multimedia technology, the speech quality of mobile phone becomes more important, and the mike of mobile phone is made
For the voice pick device of mobile phone, its design quality directly affects speech quality.
And applying more and better performances mike at present is microphone of microelectromechanicsystem system
(Micro-Electro-Mechanical-System Microphone is called for short MEMS), with this utility model
Relevant mike includes wiring board, the upper cover covering wiring board, the control that is respectively placed on wiring board
Circuit and the transducer being provided with back of the body chamber, wherein, above cover and be provided only with an acoustic aperture, can not reach singly to point to record
The function of sound.
Therefore, it is necessary to provide a kind of novel mike.
[utility model content]
The purpose of this utility model is that providing a kind of has single mike pointing to sound-recording function.
The technical solution of the utility model is as follows: a kind of mike, it include wiring board and with described circuit
Plate lid connects the shell forming host cavity, this wiring board and shell and forms protection structure, and described shell is offered
Having the first acoustic aperture turned on described host cavity, this mike also includes being placed in described protection structure
Control circuit chip and the mems chip being provided with back of the body chamber, described mems chip is placed in described wiring board
On, it is characterised in that: offer on described wiring board with described mems chip the back of the body chamber conducting second
Acoustic aperture, described wiring board is provided with the damping screen covering described second acoustic aperture.
Preferably, during described damping screen is embedded in described wiring board.
Preferably, described wiring board includes first line plate and the second wiring board, the described resistance that stacking arranges
Buddhist nun's net is placed between first line plate and the second wiring board.
Preferably, described wiring board include near described mems chip inner surface and with described interior table
The outer surface that face is relative, described damping screen is sticked at the inner surface of described wiring board.
Preferably, described wiring board include near described mems chip inner surface and with described interior table
The outer surface that face is relative, described damping screen is sticked at the outer surface of described wiring board.
Preferably, described damping screen is pasted fixing by bonding agent with the outer surface of described wiring board.
Preferably, described bonding agent is double faced adhesive tape.
Preferably, described double faced adhesive tape is hollow annular structure, and described double faced adhesive tape is located at described damping screen
Periphery.
Preferably, described shell is metal shell.
Preferably, described mems chip is electrically connected by binding gold thread with control circuit chip, described control
Circuit chip processed is electrically connected by gold thread with described wiring board.
The beneficial effects of the utility model are: owing to protection structure is provided with two acoustic aperture being separated from each other,
And attaching damping screen wherein in an acoustic aperture, this mike can realize singly pointing to the function of recording, record
Automatic fitration background noise when of sound, has the function of up de-noising;Owing to damping screen has high temperature resistant
Characteristic, this mike can directly cross Reflow Soldering, it is possible to use surface mount process.
[accompanying drawing explanation]
Fig. 1 is the sectional view of this utility model mike first embodiment.
Fig. 2 is the sectional view of this utility model mike the second embodiment.
[detailed description of the invention]
The utility model is described in further detail with embodiment below in conjunction with the accompanying drawings.
As shown in Figure 1, for the mike 10 of first embodiment of the present utility model, this mike 10 wraps
Include wiring board 12 and connect the shell 11 forming host cavity 19, described shell 11 with described wiring board 12 lid
For metal shell, magnetic shield and the effect of anti-electromagnetism interference can be played.Described wiring board 12 and shell
11 constitute protection structure 111, described shell 11 offer and the first sound of described host cavity 19 conducting
Hole 110, this mike also includes the control circuit chip 13 being placed in described protection structure 111 and sets
There is the mems chip 14 in back of the body chamber 140, described wiring board 12 offers and described mems chip 14
Second acoustic aperture 120 of conducting.
Described mems chip 14 be provided with near described second acoustic aperture 120 first surface 1411 and with
The second surface 1412 that described first surface 1411 is relative, described first acoustic aperture 110 and the described rising tone
Hole 120 is different, when sound wave is respectively by described first acoustic aperture to the distance of described mems chip 14
110 and during described second acoustic aperture 120, described first surface 1411 He of described mems chip 14
It is poor that described second surface 1412 forms acoustic pressure, reaches the function of directivity recording.
Described wiring board 12 is provided with the damping screen 16 covering described second acoustic aperture 120, described damping screen
16 are embedded in described wiring board 12.Concrete, described wiring board 12 includes first that stacking is arranged
Wiring board 1201 and the second wiring board 1202, described damping screen 16 is placed in described first line plate 1201
And between described second wiring board 1202.Embedding manner can be to be buried underground by laminating technology, it is also possible to
Bury underground by other means.Described damping screen 16 is that the material with resistant to elevated temperatures characteristic is made so that
Reflow Soldering can directly be crossed by this mike, it is possible to use surface mount process.
The acoustic resistance size of described damping screen 16 can regulate, thus reaches different directivity performances.
Wherein, described control circuit chip 13 and described mems chip 14 electrically connect, at the present embodiment
In, described control circuit chip 13 and described mems chip 14 are to realize electricity by binding gold thread 18
Connect.
Described control circuit chip 13 and described wiring board 12 electrically connect, and in the present embodiment, control electricity
Road chip 13 is placed on wiring board 12, and described control circuit chip 13 and described wiring board 12 are logical
Cross gold thread 17 and realize electrical connection.In other embodiments, it is also possible to take other mode to realize electricity
Connect, be attached say by the circuit being embedded in circuit board;It addition, control circuit chip also may be used
To be placed on shell.
In the present embodiment, described control circuit chip 13 and described mems chip 14 are Split type structures,
The two can certainly be integrated in one.
As shown in Figure 2, for the mike 20 of the second embodiment of the present utility model, this mike 20 wraps
Include wiring board 22 and connect the shell 21 forming host cavity 29, described shell 21 with described wiring board 22 lid
For metal shell, described wiring board 22 and shell 21 constitute protection structure 222, described shell 21 are opened
Being provided with and the first acoustic aperture 210 of described host cavity 29 conducting, this mike also includes being placed in described protection
Control circuit chip 23 in structure 222 and the mems chip 24 being provided with back of the body chamber 240, described circuit
Offer on plate 22 and the second acoustic aperture 220 of described mems chip 24 conducting.
Described mems chip 24 be provided with near described second acoustic aperture 220 first surface 2411 and with
The second surface 2412 that described first surface 2411 is relative, described first acoustic aperture 210 and the described rising tone
Hole 220 is different, when sound wave is respectively by described first acoustic aperture to the distance of described mems chip 24
210 and during described second acoustic aperture 220, described first surface 2411 He of described mems chip 24
It is poor that described second surface 2412 forms acoustic pressure, reaches the function of directivity recording.
Described wiring board 22 include near described mems chip 14 upper surface 2211 and with described on
The lower surface 2212 that surface 2211 is relative.
Described wiring board 22 is provided with the damping screen 26 covering described second acoustic aperture 220, described damping screen
26 are sticked on the described lower surface 2212 of described wiring board 22, in other embodiments, and described damping
Net can also be arranged on the described upper surface of described wiring board.
Damping screen 26 and shell 21 can be to be pasted by bonding agent to fix, in the present embodiment, viscous
Connecing agent is resistant to elevated temperatures double faced adhesive tape 25.In other embodiments, it is also possible to fix by other means.
Described damping screen 26 is that the material with resistant to elevated temperatures characteristic is made so that this mike can direct mistake
Reflow Soldering, it is possible to use surface mount process.
In the present embodiment, described high temperature resistant double faced adhesive tape 25 is hollow annular structure, is sticked in described resistance
The periphery of Buddhist nun's net 26.
The acoustic resistance size of described damping screen 26 can regulate, thus reaches different directivity performances.
Wherein, described control circuit chip 23 and described mems chip 24 electrically connect, at the present embodiment
In, described control circuit chip 23 and described mems chip 24 are to realize electricity by binding gold thread 28
Connect.
Described control circuit chip 23 and described wiring board 22 electrically connect, and in the present embodiment, control electricity
Road chip 23 is placed on wiring board 22, and described control circuit chip 23 and described wiring board 22 are logical
Cross gold thread 27 and realize electrical connection.In other embodiments, it is also possible to take other mode to realize electricity
Connect, be attached say by the circuit being embedded in circuit board;It addition, control circuit chip also may be used
To be placed on shell.
In the present embodiment, described control circuit chip 23 and described mems chip 24 are Split type structures,
The two can certainly be integrated in one.
Above-described is only two kinds of embodiments of the present utility model, at this it is noted that for ability
For the those of ordinary skill in territory, on the premise of creating design without departing from this utility model, it is also possible to do
Go out to improve, but these belong to protection domain of the present utility model.
Claims (10)
1. a mike, it include wiring board and with described wiring board lid connect formed host cavity shell,
This wiring board and shell form protection structure, and described shell offers the turned on described host cavity
One acoustic aperture, this mike also includes the control circuit chip being placed in described protection structure and is provided with back of the body chamber
Mems chip, described mems chip is placed on described wiring board, it is characterised in that: described circuit
Offering the second acoustic aperture that the back of the body chamber with described mems chip turns on plate, described wiring board is provided with
Cover the damping screen of described second acoustic aperture.
Mike the most according to claim 1, it is characterised in that: described damping screen is embedded in described
In wiring board.
Mike the most according to claim 2, it is characterised in that: described wiring board includes that stacking sets
The first line plate put and the second wiring board, described damping screen is placed in first line plate and the second wiring board
Between.
Mike the most according to claim 1, it is characterised in that: described wiring board includes close
The inner surface of described mems chip and the outer surface relative with described inner surface, described damping screen is sticked
Inner surface at described wiring board.
Mike the most according to claim 1, it is characterised in that: described wiring board includes close
The inner surface of described mems chip and the outer surface relative with described inner surface, described damping screen is sticked
Outer surface at described wiring board.
Mike the most according to claim 5, it is characterised in that: described damping screen is by bonding
Agent is pasted fixing with the outer surface of described wiring board.
Mike the most according to claim 6, it is characterised in that: described bonding agent is double faced adhesive tape.
Mike the most according to claim 7, it is characterised in that: described double faced adhesive tape is hollow ring
Shape structure, and described double faced adhesive tape is located at the periphery of described damping screen.
Mike the most according to claim 1, it is characterised in that: described shell is metal shell.
Mike the most according to claim 1, it is characterised in that: described mems chip and control
Circuit chip processed is electrically connected by binding gold thread, and described control circuit chip and described wiring board are by gold
Line electrically connects.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201620503712.XU CN205793134U (en) | 2016-05-26 | 2016-05-26 | Mike |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201620503712.XU CN205793134U (en) | 2016-05-26 | 2016-05-26 | Mike |
Publications (1)
Publication Number | Publication Date |
---|---|
CN205793134U true CN205793134U (en) | 2016-12-07 |
Family
ID=59979414
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201620503712.XU Active CN205793134U (en) | 2016-05-26 | 2016-05-26 | Mike |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN205793134U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110475193A (en) * | 2019-09-05 | 2019-11-19 | 朝阳聚声泰(信丰)科技有限公司 | It is a kind of to be singly directed toward MEMS microphone and its production method |
CN117544888A (en) * | 2024-01-09 | 2024-02-09 | 瑞声光电科技(常州)有限公司 | Electromagnetic microphone |
-
2016
- 2016-05-26 CN CN201620503712.XU patent/CN205793134U/en active Active
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110475193A (en) * | 2019-09-05 | 2019-11-19 | 朝阳聚声泰(信丰)科技有限公司 | It is a kind of to be singly directed toward MEMS microphone and its production method |
CN117544888A (en) * | 2024-01-09 | 2024-02-09 | 瑞声光电科技(常州)有限公司 | Electromagnetic microphone |
CN117544888B (en) * | 2024-01-09 | 2024-04-09 | 瑞声光电科技(常州)有限公司 | Electromagnetic microphone |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US10735855B2 (en) | Waterproof headphone structure | |
CN201114761Y (en) | Dustproof silicon microphone | |
CN104244130B (en) | A kind of earphone | |
CN101677423A (en) | Micro electromechanical system (MEMS) microphone | |
US10448165B2 (en) | Audio transducer with electrostatic discharge protection | |
CN205793134U (en) | Mike | |
TW201126660A (en) | MEMS microphone packages and fabrication methods thereof | |
JP2017212713A (en) | speaker | |
CN202587367U (en) | Micromotor system microphone | |
CN107659880A (en) | A kind of loudspeaker with shock-absorbing function | |
CN206524941U (en) | Loudspeaker enclosure | |
CN206077681U (en) | Mike | |
CN206596212U (en) | A kind of electronic equipment terminal | |
CN201403200Y (en) | Silicon capacitance microphone | |
CN205793135U (en) | Mike | |
CN206061117U (en) | A kind of Microspeaker | |
CN103139676A (en) | Microphone assembly having ear set function and method of manufacturing the same | |
CN207219039U (en) | Mems microphone | |
CN206272837U (en) | Loudspeaker and earphone | |
CN206302555U (en) | The vibration component and sound-producing device of sound-producing device | |
CN206533533U (en) | Microphone device | |
CN206602615U (en) | Line control machine and earphone | |
CN205793173U (en) | A kind of earphone wiring pad and a kind of earphone | |
KR200387446Y1 (en) | A case with speaker | |
CN108366334A (en) | Loudspeaker enclosure and preparation method thereof |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant |