CN205790028U - A kind of silicon chip drying improved mat - Google Patents
A kind of silicon chip drying improved mat Download PDFInfo
- Publication number
- CN205790028U CN205790028U CN201620462827.9U CN201620462827U CN205790028U CN 205790028 U CN205790028 U CN 205790028U CN 201620462827 U CN201620462827 U CN 201620462827U CN 205790028 U CN205790028 U CN 205790028U
- Authority
- CN
- China
- Prior art keywords
- film magazine
- silicon chip
- sheet
- face
- antiskid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Cleaning Or Drying Semiconductors (AREA)
Abstract
A kind of silicon chip drying improved mat, including one can be inserted into silicon chip film magazine H face accompany sheet, accompany and on sheet, be symmetrically arranged with two antiskid bars, the end of two antiskid bars is provided with two film magazine card wheels, and between two film magazine card wheels, there is gap, so that after accompanying sheet in the slot inserting silicon chip film magazine H face, silicon chip film magazine U face snaps onto in this gap.This utility model can be inserted into accompanying sheet and arranging two antiskid bars on sheet accompanying of silicon chip film magazine H face by setting, and two film magazine card wheels blocking silicon chip film magazine U face it are respectively provided with in the end of antiskid bar, thus constitute a stable supporting construction, during declining, antiskid bar just can effectively stop skidding off of silicon chip, sheet, antiskid bar and film magazine card wheel is accompanied to be polypropylene material and process, there is good heat-resisting, corrosion resistance, can meet by the heating chemical liquid bath in cleaning process.
Description
Technical field
This utility model relates to silicon circle polished and cleaned field, a kind of silicon chip drying improved mat.
Background technology
Wafer Cleaning is the pith in silicon circle manufacturing industry, is to ensure that the important means of silicon chip surface cleanliness factor, and drying is one of most widely used drying mode of Wafer Cleaning.Drying is to be placed in drier by silicon chip, utilizes the centrifugal force that high speed rotating produces, and removes silicon chip surface moisture, it is ensured that the degree of drying of silicon chip surface.
The most general drier just used is divided into vertical and horizontal.The vertical list box that mostly is dries, the parallel ground of rotary shaft.After film magazine is put into, built-in film magazine clip there are two steel pipes silicon chip is fixed, in rotary course, it is therefore prevented that silicon chip landing.Horizontal drying is for dry in groups, and rotary shaft is perpendicular to the ground.Before drying, cylinder promotes sheet box container can bottom to rise, and after film magazine puts in place, cylinder controls actuating device can bottom and declines, and declines the laggard row that puts in place and rotates.
Current horizontal drying can meet the dry requirement in most of Wafer Cleaning.But when carrying out 6 cun of two-sided throwings and producing, during can declines, because 6 cun of two-sided throwing back sides are minute surface, under moisture state, frictional force is less, and during the decline of film magazine bottom, the stress of silicon chip easily causes silicon chip to skid off film magazine, causes fragment and scuffing in ensuing rotary course.
Utility model content
For solving existing silicon wafer drying machine problem of the easy landing of silicon chip when drying 6 cun of twin polishing silicon chips, this utility model provides a kind of silicon chip drying improved mat, the silicon chip in film magazine can be fixed during film magazine glides, prevent silicon chip from skidding off along with decline process.
The technical scheme that this utility model is used by the above-mentioned technical problem of solution is: a kind of silicon chip drying improved mat, including one can be inserted into silicon chip film magazine H face accompany sheet, accompany and on sheet, be symmetrically arranged with two antiskid bars, the end of two antiskid bars is provided with two film magazine card wheels, and between two film magazine card wheels, there is gap, so that after accompanying sheet in the slot inserting silicon chip film magazine H face, silicon chip film magazine U face snaps onto in this gap.
On described every antiskid bar, in two film magazine card wheels, at least one is flexibly connected with antiskid bar, to adjust the size in gap between two film magazine card wheels.
It is described that to accompany sheet to have arc-shaped away from one end of two antiskid bars protruding, so that inserting in the slot in silicon chip film magazine H face, position between described two antiskid bars has the depressed part to arc-shaped projection side depression, and the position distribution between antiskid bar and arc-shaped projection has some through-hole, in order to the silicon chip in film magazine is carried out by cleanout fluid through through-hole.
Beneficial effect: this utility model can be inserted into accompanying sheet and arranging two antiskid bars on sheet accompanying of silicon chip film magazine H face by setting, and be respectively provided with in the end of antiskid bar two block silicon chip film magazine U face film magazine card wheel, sheet is accompanied to put into PFA film magazine H face the first groove the most in use, film magazine card wheel blocks PFA film magazine U face, thus constitute a stable supporting construction, during declining, antiskid bar just can effectively stop skidding off of silicon chip；Accompany sheet, antiskid bar and film magazine card wheel to be polypropylene material and process, there is good heat-resisting, corrosion resistance, can meet by the heating chemical liquid bath in cleaning process；This utility model has that processing technique is simple, install the advantages such as easy to operate, security performance is good, and when can avoid drying, the skidding off of silicon chip during film magazine upset decline, decreases economic loss, make production to be smoothed out.
Accompanying drawing explanation
Fig. 1 is this utility model plan structure schematic diagram；
Fig. 2 is that this utility model faces structural representation；
Fig. 3 is this utility model side-looking structural representation；
Fig. 4 is the structural representation after this utility model snaps in film magazine H face；
Fig. 5 is the structural representation after this utility model snaps in film magazine U face；
Fig. 6 is the plan structure schematic diagram after this utility model puts into film magazine；
Reference: 1, accompany sheet, 101, arc-shaped protruding, 102, depressed part, 103, through-hole, 2, antiskid bar, 3, film magazine card wheel, 4, gap, 5, silicon chip film magazine H face, 6, silicon chip film magazine U face.
Detailed description of the invention
As shown in the figure, a kind of silicon chip drying improved mat, including one can be inserted into silicon chip film magazine H face 5 accompany sheet 1, accompany and on sheet 1, be symmetrically arranged with two antiskid bars 2, the end of two antiskid bars 2 is provided with two film magazine card wheels 3, and have gap 4 between two film magazine card wheels 3, so that after accompanying sheet 1 in the slot inserting silicon chip film magazine H face 5, silicon chip film magazine U face 6 snaps onto in this gap 4.
It is more than basic embodiment of the present utility model, can further be improved, limit and optimize on the basis of above:
As, on described every antiskid bar 2, in two film magazine card wheels 3, at least one is flexibly connected with antiskid bar 2, to adjust the size in gap 4 between two film magazine card wheels 3；
And for example, described sheet 1 is accompanied to have arc-shaped projection 101 away from one end of two antiskid bars 2, so that inserting in the slot in silicon chip film magazine H face 5, position between described two antiskid bars 2 has the depressed part 102 to the protruding 101 side depressions of arc-shaped, and the position distribution between antiskid bar 2 and arc-shaped projection 101 has some through-hole 103, in order to the silicon chip in film magazine is carried out by cleanout fluid through through-hole 103.
This utility model in use, before i.e. loading Wafer Cleaning in film magazine, will accompany sheet 1 to insert in first groove in silicon chip film magazine H face 5, as it is shown in figure 5, silicon chip film magazine U face 6 is blocked in the gap 4 that now film magazine card is taken turns between 3.Being directly entered cleaning equipment normal wash, in time entering the drying stage, as shown in Figure 6, accompany sheet 1, antiskid bar 2, film magazine card wheel 3, define a stable supporting construction, silicon chip is blocked by antiskid bar 2, just can effectively prevent skidding off of silicon chip.In order to preferably embed film magazine draw-in groove, the semi-circular design (i.e. arc-shaped projection 101) accompanying sheet 1 section lower to be similar silicon chip of improved mat, in order to reduce the impact accompanying sheet 1 to cleaning, hollow out (some through-hole 103 are i.e. set) on sheet 1 accompanying, consequently facilitating the cleaning that cleanout fluid is to silicon chip.
Claims (3)
1. a silicon chip drying improved mat, it is characterized in that: include one can be inserted into silicon chip film magazine H face (5) accompany sheet (1), accompany and on sheet (1), be symmetrically arranged with two antiskid bars (2), the end of two antiskid bars (2) is provided with two film magazine cards wheel (3), and between two film magazine cards wheel (3), there is gap (4), so that after accompanying sheet (1) in the slot inserting silicon chip film magazine H face (5), silicon chip film magazine U face (6) snaps onto in this gap (4).
A kind of silicon chip drying improved mat the most according to claim 1, it is characterized in that: in upper two film magazine cards wheel (3) of described every antiskid bar (2), at least one is flexibly connected with antiskid bar (2), to adjust the size in gap (4) between two film magazine cards wheel (3).
A kind of silicon chip drying improved mat the most according to claim 1, it is characterized in that: described in accompany sheet (1) to have arc-shaped away from one end of two antiskid bars (2) protruding (101), so that inserting in the slot of silicon chip film magazine H face (5), position between described two antiskid bars (2) has the depressed part (102) to arc-shaped protruding (101) side depression, and the position distribution between antiskid bar (2) and arc-shaped protruding (101) has some through-hole (103), so that the silicon chip in film magazine is carried out by cleanout fluid through through-hole (103).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620462827.9U CN205790028U (en) | 2016-05-20 | 2016-05-20 | A kind of silicon chip drying improved mat |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620462827.9U CN205790028U (en) | 2016-05-20 | 2016-05-20 | A kind of silicon chip drying improved mat |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205790028U true CN205790028U (en) | 2016-12-07 |
Family
ID=58116723
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620462827.9U Expired - Fee Related CN205790028U (en) | 2016-05-20 | 2016-05-20 | A kind of silicon chip drying improved mat |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205790028U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108917298A (en) * | 2018-08-29 | 2018-11-30 | 欧阳小泉 | A kind of silicon wafer drying machine shutdown shaft Self-resetting mechanism |
-
2016
- 2016-05-20 CN CN201620462827.9U patent/CN205790028U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108917298A (en) * | 2018-08-29 | 2018-11-30 | 欧阳小泉 | A kind of silicon wafer drying machine shutdown shaft Self-resetting mechanism |
| CN108917298B (en) * | 2018-08-29 | 2023-10-31 | 泉芯半导体科技(无锡)有限公司 | Self-resetting mechanism for shutdown rotating shaft of silicon wafer spin dryer |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20161207 Termination date: 20180520 |