CN205767955U - Novel substrate solution bonding apparatus - Google Patents
Novel substrate solution bonding apparatus Download PDFInfo
- Publication number
- CN205767955U CN205767955U CN201620505844.6U CN201620505844U CN205767955U CN 205767955 U CN205767955 U CN 205767955U CN 201620505844 U CN201620505844 U CN 201620505844U CN 205767955 U CN205767955 U CN 205767955U
- Authority
- CN
- China
- Prior art keywords
- bonding apparatus
- substrate solution
- fixed
- solution bonding
- heating disk
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Manufacturing Optical Record Carriers (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Abstract
This utility model relates to nanometer technique field, particularly relates to Novel substrate solution bonding apparatus.This Novel substrate solution bonding apparatus, including base plate, front limit stop block, rear positive stop, guide rail, carriage, upper dish location dish, cylinder, upper heating disk and column.Be bonded together two pieces of substrates can be separated by the Novel substrate solution bonding apparatus involved by this utility model, and spring and multiple vacuum sucking holes make the two pieces of substrate absorption up and down being bonded together more stable, and substrate itself will not be caused damage.Additionally, this Novel substrate solution bonding apparatus reasonable in design, the separation to substrate is safe and efficient, is suitable for promoting the use of.
Description
Technical field
This utility model relates to nanometer technique field, particularly relates to Novel substrate solution bonding apparatus.
Background technology
In nanometer technique field, the use of substrate is the most common.Between two pieces of substrates, the material such as majority epoxy resin is bonded together, and owing to substrate self is the thinnest, during the two pieces of substrates being bonded together are carried out Xie Jian separation, is easily caused substrate broken or produce scar, thus causes damage to substrate.
In order to solve above-mentioned technical problem, this utility model devises Novel substrate solution bonding apparatus, be bonded together two pieces of substrates can be separated by this Novel substrate solution bonding apparatus, spring and multiple vacuum sucking holes make the two pieces of substrate absorption up and down being bonded together more stable, and substrate itself will not be caused damage.Additionally, this Novel substrate solution bonding apparatus reasonable in design, the separation to substrate is safe and efficient, is suitable for promoting the use of.
Utility model content
nullIn order to overcome defect present in background technology，This utility model solves its technical problem the technical scheme is that Novel substrate solution bonding apparatus，Including base plate、Front limit stop block、Rear positive stop、Guide rail、Carriage、Upper dish location dish、Cylinder、Upper heating disk and column，Described front limit stop block and rear positive stop are fixed on base plate，Described guide rail is fixed on the base plate between front limit stop block and rear positive stop，Described carriage can be at slide on rails，Described cylinder is fixed on carriage，It is fixed with down on described cylinder and adds hot plate，Described column is fixed on base plate，The top of described column is provided with crossbeam，It is fixed with upper dish location dish by fixing screw on described crossbeam，Linked together by trip bolt between described upper dish location dish and upper heating disk，Trip bolt between described upper dish location dish and upper heating disk is provided with spring，Add hot plate under described and upper heating disk is provided with vacuum adapter and multiple vacuum sucking holes.
Novel substrate solution bonding apparatus involved by this utility model, be bonded together two pieces of substrates can be separated by this Novel substrate solution bonding apparatus, spring and multiple vacuum sucking holes make the two pieces of substrate absorption up and down being bonded together more stable, and substrate itself will not be caused damage.Additionally, this Novel substrate solution bonding apparatus reasonable in design, the separation to substrate is safe and efficient, is suitable for promoting the use of.
Accompanying drawing explanation
With embodiment, this utility model is further illustrated below in conjunction with the accompanying drawings.
Fig. 1 is the structural representation one of this utility model Novel substrate solution bonding apparatus；
Fig. 2 is the structural representation two of this utility model Novel substrate solution bonding apparatus；
Wherein: 1, base plate；2, front limit stop block；3, rear positive stop；4, guide rail；5, carriage；6, upper dish location dish；7, cylinder；8, upper heating disk；9, hot plate is added under；10, column；11, crossbeam；12, vacuum adapter；13, vacuum sucking holes；14, fixing screw；15, trip bolt；16, spring.
Detailed description of the invention
Presently in connection with accompanying drawing, this utility model is described in further detail.Accompanying drawing is the schematic diagram simplified, and basic structure of the present utility model is described the most in a schematic way, and therefore it only shows the composition relevant with this utility model.
nullSpecific embodiment，Refer to Fig. 1 and Fig. 2，Novel substrate solution bonding apparatus，Including base plate 1、Front limit stop block 2、Rear positive stop 3、Guide rail 4、Carriage 5、Upper dish location dish 6、Cylinder 7、Upper heating disk 8 and column 10，Described front limit stop block 2 and rear positive stop 3 are fixed on base plate 1，Described guide rail 4 is fixed on the base plate 1 between front limit stop block 2 and rear positive stop 3，Described carriage 5 can slide on guide rail 4，Described cylinder 7 is fixed on carriage 5，It is fixed with down on described cylinder 7 and adds hot plate 9，Described column 10 is fixed on base plate 1，The top of described column 10 is provided with crossbeam 11，It is fixed with upper dish location dish 6 by fixing screw 14 on described crossbeam 11，Linked together by trip bolt 15 between described upper dish location dish 6 and upper heating disk 8，Trip bolt 15 between described upper dish location dish 6 and upper heating disk 8 is provided with spring 16，Add hot plate 9 under described and upper heating disk 8 is provided with vacuum adapter 12 and multiple vacuum sucking holes 13.
nullNovel substrate solution bonding apparatus involved by this utility model，This Novel substrate solution bonding apparatus is in use，First the two pieces of substrates up and down being bonded together are placed on down and add in hot plate 9，And by under add vacuum adapter 12 evacuation in hot plate 9，By vacuum sucking holes 13 the lower piece of substrate being bonded together it is fixed on down and adds in hot plate 9，Then slip carriage 5 makes down to add hot plate 9 and is directed at upper heating disk 8，Hot plate 9 is added under cylinder 7 jack-up，The substrate being bonded together is fixed on down and adds between hot plate 9 and upper heating disk 8，And by vacuum adapter 12 evacuation on upper heating disk 8，By vacuum sucking holes 13, the upper piece substrate being bonded together is fixed on upper heating disk 8，Add down hot plate 9 and upper heating disk 8 heats，The agent of pasting between upper and lower two pieces of substrates is made to melt，The most upper and lower two pieces of complete separating of substrate.In a word, be bonded together two pieces of substrates can be separated by this Novel substrate solution bonding apparatus, and spring 16 and multiple vacuum sucking holes 13 make the two pieces of substrate absorption up and down being bonded together more stable, and substrate itself will not be caused damage.Additionally, this Novel substrate solution bonding apparatus reasonable in design, the separation to substrate is safe and efficient, is suitable for promoting the use of.
Obviously, above-described embodiment is only for clearly demonstrating example, and not restriction to embodiment.For those of ordinary skill in the field, can also make other changes in different forms on the basis of the above description.Here without also cannot all of embodiment be given exhaustive.And the obvious change thus extended out or variation still in the protection domain of the invention among.
Claims (1)
- null1. Novel substrate solution bonding apparatus，Including base plate (1)、Front limit stop block (2)、Rear positive stop (3)、Guide rail (4)、Carriage (5)、Upper dish location dish (6)、Cylinder (7)、Upper heating disk (8) and column (10)，It is characterized in that: described front limit stop block (2) and rear positive stop (3) are fixed on base plate (1)，Described guide rail (4) is fixed on the base plate (1) between front limit stop block (2) and rear positive stop (3)，Described carriage (5) can be in the upper slip of guide rail (4)，Described cylinder (7) is fixed on carriage (5)，It is fixed with down on described cylinder (7) and adds hot plate (9)，Described column (10) is fixed on base plate (1)，The top of described column (10) is provided with crossbeam (11)，It is fixed with upper dish location dish (6) by fixing screw (14) on described crossbeam (11)，Linked together by trip bolt (15) between described upper dish location dish (6) and upper heating disk (8)，Trip bolt (15) between described upper dish location dish (6) and upper heating disk (8) is provided with spring (16)，Add hot plate (9) under described and upper heating disk (8) is provided with vacuum adapter (12) and multiple vacuum sucking holes (13).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620505844.6U CN205767955U (en) | 2016-05-30 | 2016-05-30 | Novel substrate solution bonding apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620505844.6U CN205767955U (en) | 2016-05-30 | 2016-05-30 | Novel substrate solution bonding apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205767955U true CN205767955U (en) | 2016-12-07 |
Family
ID=59979117
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620505844.6U Active CN205767955U (en) | 2016-05-30 | 2016-05-30 | Novel substrate solution bonding apparatus |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205767955U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108346597A (en) * | 2017-12-28 | 2018-07-31 | 大族激光科技产业集团股份有限公司 | A kind of vacuum heating system, chip stripping off device and method |
| CN110040684A (en) * | 2019-05-14 | 2019-07-23 | 苏州美图半导体技术有限公司 | Automatic solution bonder |
-
2016
- 2016-05-30 CN CN201620505844.6U patent/CN205767955U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108346597A (en) * | 2017-12-28 | 2018-07-31 | 大族激光科技产业集团股份有限公司 | A kind of vacuum heating system, chip stripping off device and method |
| CN110040684A (en) * | 2019-05-14 | 2019-07-23 | 苏州美图半导体技术有限公司 | Automatic solution bonder |
| CN110040684B (en) * | 2019-05-14 | 2024-04-09 | 苏州美图半导体技术有限公司 | Automatic bond-releasing machine |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN205767955U (en) | Novel substrate solution bonding apparatus | |
| CN204251550U (en) | A kind of optics double sticky tape | |
| CN205380975U (en) | Novel bonded is separated to substrate device | |
| CN106566441A (en) | Waterborne binder for tile | |
| CN103834960B (en) | The removal methods of metal surface rubber bodies | |
| CN106281152A (en) | Recyclable carton location glue | |
| WO2016051269A3 (en) | Laminate production method | |
| CN203462946U (en) | Anti-crack wooden door | |
| CN205630587U (en) | Material platform is received to PCB board | |
| CN105252656B (en) | Movable sticking bar support | |
| CN103042752A (en) | Electronic device with fit structure and manufacturing method | |
| CN103740302A (en) | Waterproof adhesive | |
| RU2015101126A (en) | CURRENT CARBONIZED LAYERED PRODUCT | |
| CN202592560U (en) | Solar silicon rod component | |
| CN202332939U (en) | Novel silicon chip crystal supply tooling bar | |
| CN201456505U (en) | Hard polyvinyl chloride (PVC) foam board reinforced composite plate | |
| CN204081361U (en) | For the paster apparatus that wall surface paster manufactures | |
| CN205062540U (en) | Novel can clear up tailoring table of cloth relic | |
| CN206016112U (en) | Artistic flitch moulding wall construction | |
| CN205044230U (en) | Plastic and integrative injection moulding board of metal nanometer | |
| CN206162446U (en) | Novel touch -sensitive screen and full laminated structure of display module assembly | |
| CN103074014A (en) | Wood adhesion agent | |
| CN105217945A (en) | A kind of novel glass cutting mechanism | |
| CN104354124A (en) | Lower cavity positioning and clamping mechanism of vacuum laminating machine | |
| CN202276579U (en) | Electronic device with bonding structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |