CN205764316U - A kind of solder reflow device - Google Patents
A kind of solder reflow device Download PDFInfo
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- CN205764316U CN205764316U CN201620480614.9U CN201620480614U CN205764316U CN 205764316 U CN205764316 U CN 205764316U CN 201620480614 U CN201620480614 U CN 201620480614U CN 205764316 U CN205764316 U CN 205764316U
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Abstract
This utility model embodiment discloses a kind of solder reflow device, including the first body of heater, the second body of heater, the 3rd body of heater and transmission system, first furnace interior forms the first warm area, second furnace interior forms the second warm area, 3rd furnace interior forms three-temperature-zone, transmission system the first warm area, between the second warm area and three-temperature-zone transmit treat weldment；First body of heater and the second body of heater are the most setting up and down, have window between the first body of heater and the second body of heater, treat weldment in order to transmit between the first body of heater and the second body of heater；Second body of heater and the 3rd body of heater are horizontally disposed, have window between the second body of heater and the 3rd body of heater, treat weldment in order to transmit between the second body of heater and the 3rd body of heater.By combining vertically placement and horizontal positioned between each warm area in this utility model solder reflow device, make full use of the solid space putting district, decrease floor space.
Description
Technical field
This utility model relates to solder reflow techniques field, particularly relates to a kind of solder reflow device.
Background technology
The development of face package technique SMT whole technology is gradually improved, going out of multiple surface mount elements and Mount Device
Existing, reflow soldering process technology and equipment as a mounting technology part are developed the most accordingly.In order to
Realizing good welding result, different treats that weldment or welding material need to experience and it in welding process
The heating and cooling process of coupling, now treats weldment temperature in solder reflow device distribution curve one in time
As be referred to as preferable Reflow Soldering curve.
The main flow equipment that hot air type solder reflow device welds as SMT, has homogeneous heating, temperature stabilization
Feature, by the laminar motion transferring heat energy of hot blast, utilize heater and fan, make furnace air not
Disconnected intensification also circulates, and treats that weldment is heated by hot gases in stove, thus realizes welding.Hot air type
Solder reflow device is made up of multiple warm areas, generally comprises preheating zone, heat preservation zone, recirculating zone and cooling zone,
Treat that weldment sequentially passes through each warm area, it is achieved the heating and cooling in welding process, treat that the temperature of weldment is in time
Distribution forms finite reflux weldering temperature curve, and this curve can be by the temperature measuring equipment in solder reflow device
Detection obtains.The welding result that weldment treated by finite reflux weldering temperature curve is most important, such as, if in advance
Excessive or recirculating zone the peak temperature of the slope of curve of hot-zone is too high, and pcb board can be caused to deform warped, chip
Internal damage etc.；If the peak temperature of recirculating zone is too low, the time is too short, rosin joint can be caused.
In order to improve the Temperature Distribution of heater, to realize preferable reflow soldering curve temperature, existing
Solder reflow device is updated, and increases warm area number in the horizontal direction, has had up to ten several temperature
The solder reflow device of the about 8m length in district, makes it to control further accurately the temperature at each position in solder reflow device
Degree distribution, the preferable regulation of temperature curve of being more convenient for.
But, in existing solder reflow device, each warm area arranges the most in the horizontal direction, causes floor space
Excessive.
Utility model content
This utility model embodiment provides a kind of solder reflow device, is used for solving existing solder reflow device and accounts for
The problem that ground area is excessive.
For reaching above-mentioned purpose, the one side of this utility model embodiment provides a kind of solder reflow device,
Including: the first body of heater, the second body of heater, the 3rd body of heater and transmission system, the first furnace interior forms the
One warm area, the second furnace interior forms the second warm area, and the 3rd furnace interior forms three-temperature-zone, transmission system
Unite at the first warm area, transmit between the second warm area and three-temperature-zone and treat weldment；First body of heater and the second body of heater
The most setting up and down, have window between the first body of heater and the second body of heater, in order at the first body of heater
With second transmit between body of heater and treat weldment；Second body of heater and the 3rd body of heater are horizontally disposed, the second stove
Have window between body and the 3rd body of heater, treat weldment in order to transmit between the second body of heater and the 3rd body of heater.
In conjunction with first aspect, in the first possible implementation of first aspect, solder reflow device is also
Including the 4th body of heater, the 4th furnace interior forms four-temperature region；4th body of heater and the 3rd body of heater are along vertically side
To setting up and down, between the 4th body of heater and the 3rd body of heater, have window, in order at the 4th body of heater and the 3rd stove
Transmit between body and treat weldment.
In conjunction with first aspect, in the implementation that the second of first aspect is possible, solder reflow device is also
Including the 4th body of heater, the 4th furnace interior forms four-temperature region；4th body of heater and the 3rd body of heater are along level side
To setting, between the 4th body of heater and the 3rd body of heater, have window, in order to the 4th body of heater and the 3rd body of heater it
Between transmit treat weldment.
In conjunction with the first possible implementation of first aspect, in the third possible reality of first aspect
In existing mode, the 3rd body of heater includes the 3rd heating assembly and the 3rd fan assembly, the 3rd heating assembly and the
Three fan assemblies are arranged at the sidewall of the 3rd body of heater；4th body of heater includes the 4th heating assembly and four fan device
Assembly, the 4th heating assembly and four fan device assembly are arranged at the sidewall of the 4th body of heater.
In conjunction with the implementation that the second of first aspect is possible, in the 4th kind of possible reality of first aspect
In existing mode, the 3rd body of heater includes the 3rd heating assembly and the 3rd fan assembly, the 3rd heating assembly and the
Three fan assemblies are arranged at upper wall and/or the lower wall of the 3rd body of heater；4th body of heater include the 4th heating assembly and
Four fan device assembly, the 4th heating assembly and four fan device assembly be arranged at the 4th body of heater upper wall and/or under
Wall.
In conjunction with the third possible implementation of first aspect, in the 5th kind of possible reality of first aspect
In existing mode, solder reflow device also includes that the 5th body of heater, the 5th furnace interior form the 5th warm area；5th
Body of heater and the 4th body of heater are horizontally disposed so that the 5th warm area and four-temperature region connect in the horizontal direction；
5th body of heater includes the 5th heating assembly and the 5th fan assembly, the 5th heating assembly and the 5th fan assembly
It is arranged at upper wall and/or the lower wall of the 5th body of heater.
In conjunction with the third possible implementation of first aspect, in the 6th kind of possible reality of first aspect
In existing mode, the first warm area and four-temperature region do not connect.
In conjunction with first aspect, the first possible implementation of first aspect, the second of first aspect
Possible implementation, the third possible implementation of first aspect, the 4th kind of first aspect can
The implementation of energy, the 5th kind of possible implementation of first aspect, the 6th kind of possibility of first aspect
Implementation among any one, in the 7th kind of possible implementation of first aspect, the first stove
Body includes that the first heating assembly and the first fan assembly, the first heating assembly and the first fan assembly are arranged at
The sidewall of the first body of heater；Second body of heater includes the second heating assembly and the second fan assembly, the second heating group
Part and the second fan assembly are arranged at the sidewall of the second body of heater.
In conjunction with first aspect, the first possible implementation of first aspect, the second of first aspect
Possible implementation, the third possible implementation of first aspect, the 4th kind of first aspect can
The implementation of energy, the 5th kind of possible implementation of first aspect, the 6th kind of possibility of first aspect
Implementation, first aspect the 7th kind of possible implementation among any one, in first aspect
The 8th kind of possible implementation in, transmission system includes retractor device and horizontal guide rail, retractor device
Vertically carrying out stretching motion, retractor device includes the first end and the second end；The first of retractor device
End is provided with load bearing unit, and load bearing unit treats weldment for carrying；Second end of retractor device is led with level
Rail connects so that retractor device moves in the horizontal direction.
In conjunction with first aspect, the first possible implementation of first aspect, the second of first aspect
Possible implementation, the third possible implementation of first aspect, the 4th kind of first aspect can
The implementation of energy, the 5th kind of possible implementation of first aspect, the 6th kind of possibility of first aspect
Implementation, the 7th kind of possible implementation of first aspect, the 8th kind of first aspect possible
Among implementation any one, in the 9th kind of possible implementation of first aspect, the first body of heater,
It is detachable connection between second body of heater and the 3rd body of heater.
As can be seen from the above technical solutions, this utility model embodiment has the advantage that
This utility model by by the most setting up and down to the first body of heater and the second body of heater, the second body of heater
Horizontally disposed with the 3rd body of heater, and have window between adjacent body of heater, treat weldment in order to transmit, make
Obtain between each warm area by combining vertically placement and horizontal positioned, make full use of the solid space putting district,
Decrease floor space.
Accompanying drawing explanation
Fig. 1 is a structural representation of this utility model embodiment solder reflow device；
Fig. 2 is this utility model embodiment solder reflow device structural representation about hot-air system；
Fig. 3 is this utility model embodiment solder reflow device structural representation about transmission system；
Fig. 4 is a structural representation of this utility model many warm areas of embodiment solder reflow device；
Fig. 5 is a structural representation after this utility model embodiment solder reflow device adds dividing plate.
Detailed description of the invention
This utility model embodiment provides a kind of solder reflow device, is used for reducing solder reflow device and takes up an area face
Long-pending excessive problem.
In order to make those skilled in the art be better understood from this utility model scheme, below in conjunction with this reality
With the accompanying drawing in new embodiment, the technical scheme in this utility model embodiment is purged, completely
Description, it is clear that described embodiment be only this utility model a part embodiment rather than
Whole embodiments.Based on the embodiment in this utility model, those of ordinary skill in the art are not doing
Go out the every other embodiment obtained under creative work premise, all should belong to this utility model protection
Scope.
Term " first " in specification and claims of the present utility model and above-mentioned accompanying drawing, "
Two ", the (if present) such as " the 3rd ", " the 4th ", " the 5th " is similar right for distinguishing
As, without being used for describing specific order or precedence.Should be appreciated that the data of so use are suitable
Can exchange in the case of when, in order to the embodiments described herein can be with except here illustrating or describing
Order beyond content is implemented.Additionally, term " includes " and " having " and their any deformation,
Be intended to cover non-exclusive comprising, such as, contain series of steps or the process of unit, method,
System, product or equipment are not necessarily limited to those steps or the unit clearly listed, but can include not having
That clearly list or for intrinsic other steps of these processes, method, product or equipment or unit.
This utility model embodiment provides a kind of solder reflow device, refer to Fig. 1, for the knot of solder reflow device
Structure schematic diagram.Solder reflow device includes first body of heater the 11, second body of heater the 12, the 3rd body of heater 13 and transmission
System, the first body of heater 11 is internally formed the first warm area 111, and the second body of heater 12 is internally formed the second warm area 121,
3rd body of heater 13 is internally formed three-temperature-zone 131.Transmission system is in the first warm area, the second warm area and the 3rd temperature
Transmit between district and treat weldment, during weldment is treated in transmission system transmission, treat that the movement locus of weldment can
Think track 14, transmit starting point and may be provided in the first body of heater 11, transmit terminal and may be provided in the 3rd body of heater 13.
First body of heater 11 is the most setting up and down with the second body of heater 12, with the first body of heater in the present embodiment
11 be arranged on above the second body of heater 12 as a example by illustrate.The bottom of the first body of heater 11 and the second body of heater 12
Top has window 15 accordingly so that the first warm area 111 connects at vertical direction with the second warm area 121.
The size of window should at least enable to treat that weldment passes through from this window, so, treats that weldment is by the first stove
When body 11 sends out, the second body of heater 12 can be directly entered via window.
Second body of heater 12 is horizontally disposed with the 3rd body of heater 13, the second body of heater 12 and the 3rd body of heater 13 it
Between have window 16, in order between the second body of heater 12 and the 3rd body of heater 13 transmit treat weldment.
It is understood that the first body of heater 11 and the 3rd body of heater 13 need to be additionally provided with window 18 and window respectively
19, treat the window of weldment in order to receive as solder reflow device and to send.
Hot air type solder reflow device typically uses multiple heating assembly and fan assembly to realize temperature in body of heater
The control of degree, i.e. forms each warm area.In this utility model solder reflow device, heating assembly and blower fan
The facilities of assembly may refer to Fig. 2.
Heating furnace body includes heating assembly and fan assembly, wherein heating assembly and fan assembly composition hot blast
System 20.First body of heater includes the first heating assembly and the first fan assembly, the first heating assembly and first
Fan assembly is arranged at the sidewall of the first body of heater；Second body of heater includes the second heating assembly and the second blower fan group
Part, the second heating assembly and the second fan assembly are arranged at the sidewall of the second body of heater.The sidewall of body of heater refers to,
The furnace wall that furnace interior is on the side, the side of body of heater refers to other faces in addition to body of heater top and bottom.
3rd body of heater includes the 3rd heating assembly and the 3rd fan assembly, refers to Fig. 2, the 3rd heating assembly and the
Three fan assemblies can be arranged at upper wall and the/lower wall of the 3rd body of heater.Or, the 3rd heating assembly and the 3rd
The hot-air system of fan assembly composition, it is also possible to be arranged at the sidewall of the 3rd body of heater.By being arranged at each stove
The heating assembly in internal portion and fan assembly, reflow soldering device interior forms multiple warm area.The temperature of warm area
Degree control can realize by increasing temperature measurement system and heating control system etc..
Transmission system in this utility model embodiment reflow soldering equipment can include retractor device 31 and water
Level gauge 32, refers to Fig. 3.Retractor device 31 vertically carries out stretching motion, and retractor device 31 wraps
Include the first end and the second end.First end of retractor device is provided with load bearing unit 311, and load bearing unit is used for holding
Load treats weldment.Treat that weldment is as a example by pcb board, it is assumed that on pcb board, have LED chip by solder connection.Stretch
Second end of compression apparatus 31 is connected with horizontal guide rail 32 so that retractor device 31 moves in the horizontal direction.As
This, transmission system is capable of pcb board biography between each warm area by retractor device 31 and horizontal guide rail 32
Send.In actual applications, transmission system can also be realized pcb board between each warm area by other devices
Transmit, do not limit.
Solder reflow device in this utility model embodiment can also include the 4th body of heater, the 4th furnace interior
Form four-temperature region.4th body of heater and the 3rd body of heater can be the most setting up and down, the 4th body of heater with
Have window between 3rd body of heater, treat weldment in order to transmit between the 4th body of heater and the 3rd body of heater.3rd
Body of heater includes the 3rd heating assembly and the 3rd fan assembly, and the 3rd heating assembly and the 3rd fan assembly are permissible
It is arranged at the sidewall of the 3rd body of heater；4th body of heater includes the 4th heating assembly and four fan device assembly, the 4th
Heating assembly and four fan device assembly can be arranged at the sidewall of the 4th body of heater.
4th body of heater and the 3rd body of heater can also be horizontally disposed, between the 4th body of heater and the 3rd body of heater
Have window, treat weldment in order to transmit between the 4th body of heater and the 3rd body of heater.Four-temperature region can conduct
Last warm area of solder reflow device, it is to be understood that the 4th body of heater needs to have window, to send
Go out to treat weldment.3rd body of heater includes the 3rd heating assembly and the 3rd fan assembly, the 3rd heating assembly and the
Three fan assemblies can be arranged at upper wall and/or the lower wall of the 3rd body of heater；4th body of heater includes the 4th heating group
Part and four fan device assembly, the 4th heating assembly and four fan device assembly can be arranged at the upper of the 4th body of heater
Wall and/or lower wall.
In actual applications, warm area number is typically much deeper than 4, therefore, and another enforcement of this utility model
Example is divided into 5 Ge Zi districts, heat preservation zone to be divided into 4 Ge Zi districts, recirculating zone to be divided into 3 Ge Zi districts, cooling zone with preheating zone
As a example by being divided into 3 Ge Zi districts, illustrate, refer to the structural representation of the solder reflow device shown in Fig. 4.
Wherein, the 1st sub-district 401 is preheating zone to the 5th sub-district 405, and sub-district of the 6th sub-district 406 to the 9th 409 is insulation
District, sub-district of the 10th sub-district 410 to the 12nd 412 is trivial for backflow, and the 13rd sub-district 413 to the 15th sub-district 415 is
Cooling zone.
In actual applications, between the 1st sub-district 408 of sub-district the 401 and the 8th, the 2nd sub-district 407 of sub-district the 402 and the 7th
Between, between the 3rd sub-district 406 of sub-district the 403 and the 6th all can by increase dividing plate 51 stop between sub-district
Level connection, now, the first retractor device 52 and the second flexible dress can be respectively provided with in dividing plate 51 both sides
Put 53 and treat the transmission of weldment to realize transmission system, as shown in Figure 5.
Each body of heater in this utility model solder reflow device can be as independent module, and passing through between each body of heater can
It is detachably connected with, it is possible to the convenient number adjusting warm area and the shape of solder reflow device, facilitates Reflow Soldering to set
Standby movement, and can adapt to different equipment arrangement places.
In actual use, this solder reflow device can also include other structures, is such as used for supporting each stove
The support of body, such as detecting the temperature measurement system etc. of each warm area temperature, is not particularly limited herein.
In several embodiments provided herein, it should be understood that disclosed system, device and
Method, can realize by another way.Such as, device embodiment described above is only shown
Meaning property, such as, the division of described unit, be only a kind of logic function and divide, actual can when realizing
There to be other dividing mode, the most multiple unit or assembly can in conjunction with or be desirably integrated into another
System, or some features can ignore, or do not perform.Another point, shown or discussed each other
Coupling direct-coupling or communication connection can be the INDIRECT COUPLING by some interfaces, device or unit
Or communication connection, can be electrical, machinery or other form.
The described unit illustrated as separating component can be or may not be physically separate, makees
The parts shown for unit can be or may not be physical location, i.e. may be located at a place,
Or can also be distributed on multiple NE.Can select according to the actual needs part therein or
The whole unit of person realizes the purpose of the present embodiment scheme.
The above, above example is only in order to illustrate the technical solution of the utility model, rather than limits it
System；Although this utility model being described in detail with reference to previous embodiment, the common skill of this area
Art personnel it is understood that the technical scheme described in foregoing embodiments still can be modified by it,
Or wherein portion of techniques feature is carried out equivalent；And these amendments or replacement, do not make corresponding
The essence of technical scheme departs from the spirit and scope of this utility model each embodiment technical scheme.
Claims (10)
1. a solder reflow device, it is characterised in that including:
First body of heater, the second body of heater, the 3rd body of heater and transmission system, described first furnace interior is formed
First warm area, described second furnace interior forms the second warm area, and described 3rd furnace interior forms the 3rd temperature
District, described transmission system is in described first warm area, transmission between described second warm area and described three-temperature-zone
Treat weldment；
Described first body of heater is the most setting up and down with described second body of heater, described first body of heater and institute
State and have window between the second body of heater, in order to transmit institute between described first body of heater and described second body of heater
State and treat weldment；
Described second body of heater is horizontally disposed with described 3rd body of heater, described second body of heater and described the
Have window between three bodies of heater, treat described in transmitting between described second body of heater and described 3rd body of heater
Weldment.
Solder reflow device the most according to claim 1, it is characterised in that described solder reflow device is also
Including the 4th body of heater, described 4th furnace interior forms four-temperature region；
Described 4th body of heater is the most setting up and down with described 3rd body of heater, described 4th body of heater and institute
State and have window between the 3rd body of heater, in order to transmit institute between described 4th body of heater and described 3rd body of heater
State and treat weldment.
Solder reflow device the most according to claim 1, it is characterised in that described solder reflow device is also
Including the 4th body of heater, described 4th furnace interior forms four-temperature region；
Described 4th body of heater is horizontally disposed with described 3rd body of heater, described 4th body of heater and described the
Have window between three bodies of heater, treat described in transmitting between described 4th body of heater and described 3rd body of heater
Weldment.
Solder reflow device the most according to claim 2, it is characterised in that described 3rd body of heater includes
3rd heating assembly and the 3rd fan assembly, described 3rd heating assembly and described 3rd fan assembly are arranged
Sidewall in described 3rd body of heater；
Described 4th body of heater includes the 4th heating assembly and four fan device assembly, described 4th heating assembly and
Described four fan device assembly is arranged at the sidewall of described 4th body of heater.
Solder reflow device the most according to claim 3, it is characterised in that described 3rd body of heater includes
3rd heating assembly and the 3rd fan assembly, described 3rd heating assembly and described 3rd fan assembly are arranged
Upper wall and/or lower wall in described 3rd body of heater；
Described 4th body of heater includes the 4th heating assembly and four fan device assembly, described 4th heating assembly and
Described four fan device assembly is arranged at upper wall and/or the lower wall of described 4th body of heater.
Solder reflow device the most according to claim 4, it is characterised in that described solder reflow device is also
Including the 5th body of heater, described 5th furnace interior forms the 5th warm area；
Described 5th body of heater is horizontally disposed with described 4th body of heater so that described 5th warm area and institute
State four-temperature region to connect in the horizontal direction；
Described 5th body of heater includes the 5th heating assembly and the 5th fan assembly, described 5th heating assembly and
Described 5th fan assembly is arranged at upper wall and/or the lower wall of described 5th body of heater.
Solder reflow device the most according to claim 4, it is characterised in that described first warm area and institute
State four-temperature region not connect.
Solder reflow device the most according to any one of claim 1 to 7, it is characterised in that described
One body of heater includes the first heating assembly and the first fan assembly, described first heating assembly and described first wind
Thermomechanical components is arranged at the sidewall of described first body of heater；
Described second body of heater includes the second heating assembly and the second fan assembly, described second heating assembly and
Described second fan assembly is arranged at the sidewall of described second body of heater.
Solder reflow device the most according to any one of claim 1 to 7, it is characterised in that described biography
Communication system includes retractor device and horizontal guide rail, and described retractor device vertically carries out stretching motion,
Described retractor device includes the first end and the second end；
First end of described retractor device is provided with load bearing unit, described load bearing unit be used for carrying described in treat
Weldment；
Second end of described retractor device is connected with described horizontal guide rail so that described retractor device is along level
Move in direction.
Solder reflow device the most according to any one of claim 1 to 7, it is characterised in that institute
State and be connected for detachable between the first body of heater, described second body of heater and described 3rd body of heater.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620480614.9U CN205764316U (en) | 2016-05-24 | 2016-05-24 | A kind of solder reflow device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620480614.9U CN205764316U (en) | 2016-05-24 | 2016-05-24 | A kind of solder reflow device |
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| CN205764316U true CN205764316U (en) | 2016-12-07 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105772885A (en) * | 2016-05-24 | 2016-07-20 | 深圳市劲拓自动化设备股份有限公司 | Reflow soldering device |
-
2016
- 2016-05-24 CN CN201620480614.9U patent/CN205764316U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105772885A (en) * | 2016-05-24 | 2016-07-20 | 深圳市劲拓自动化设备股份有限公司 | Reflow soldering device |
| WO2017201814A1 (en) * | 2016-05-24 | 2017-11-30 | 深圳市劲拓自动化设备股份有限公司 | Reflow soldering apparatus |
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