CN205755064U - Component carrier - Google Patents
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- CN205755064U CN205755064U CN201520771338.7U CN201520771338U CN205755064U CN 205755064 U CN205755064 U CN 205755064U CN 201520771338 U CN201520771338 U CN 201520771338U CN 205755064 U CN205755064 U CN 205755064U
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Abstract
This utility model describes a kind of component carrier (600), and it includes that (a) has the electric insulation layer structure (120,420) of inner chamber body (130,430)；B () embeds the electronic component (350) in cavity (130,430), wherein, electronic component (350) includes at least one top side terminal (354) and at least one the bottom side terminal (352) for providing signal concatenation ability at the top major surface and bottom major surface of electronic component (350)；C () is electrically connected at least one via (664) of at least one top side terminal (354)；D electronic component (350) is attached to the adhesive layer (232) of electric insulation layer structure (120,420) by (), wherein, electronic component (350) is positioned at cavity (130,430)；And (e) is electrically connected at least one further via (362) of at least one bottom side terminal (352).
Description
Technical field
This utility model relates in general to the technical field of the component carrier that can install electronic component thereon to form electronic assemblies.Especially, this utility model relates to a kind of component carrier comprising electronic component, in electronic component embedded components carrier.Further, this utility model relates to a kind of method for manufacturing this component carrier.
Background technology
Setting up on it has the component carrier of the electronic assemblies comprising several electronic component to be widely used in multiple electronic consumer devices, the most such as (a) calculates device, such as desktop computer, notebook computer, mobile phone, panel computer etc., (b) wireless data communication device, such as mobile phone, telephone set, router, near field communication means etc., and (c) non-wireless means, such as watch-dog, television set etc..This is enumerated is incomplete and has the quantity of the electronic installation setting up electronic assemblies on component carrier and type constantly becomes many.
In order to increase the integration density of electronic assemblies, having been developed that component carrier, this component carrier is except providing machinery to support for electronic component and providing some Electricity Functionals also by the active or passive electronic component of embedding in addition to electrical connection.
US 8,745,860 B2 discloses a kind of method for manufacturing the component carrier being formed as printed substrate.Disclosed method comprises the following steps: that (a) forms the first resin insulating barrier on the supporting plate, b () forms the second resin insulating barrier on the first resin insulating barrier, c () forms opening portion in the second resin insulating barrier, the electronic component with electric terminals is installed in opening portion, d electronic component is contained in the opening portion of the second resin insulating barrier by (), make the electrode surface of the electronic component offside to the first resin insulating barrier, e () forms interlayer resin insulating barrier on the first surface and electronic component of the second resin insulating barrier, and (f) forms the via (via) that conductor arrives the electric terminals of electronic component in interlayer resin insulating barrier.In an embodiment of the printed substrate produced, in order to disperse the heat produced during operation is adhered on a printed-wiring board or is present in the radiator outside printed substrate by electronic component, dissipating vias adapter is formed at below electronic component.
Utility model content
In view of the simple telescopiny relevant with the high flexibility about electrical contact embedded electronic components, it is understood that there may be to the needs providing the component carrier with embedded electronic components.
These needs can be met by the theme according to independent claims.Subclaims describe advantageous embodiment of the present utility model.
According to first aspect of the present utility model, it is provided that a kind of component carrier, comprising: (a) has the electric insulation layer structure of inner chamber body；B () is embedded in the electronic component in cavity, wherein, electronic component includes at least one top side terminal and at least one bottom side terminal for providing signal concatenation ability at the top major surface of electronic component with relative bottom major surface；C () is electrically connected at least one via of this at least one top side terminal；D electronic component is attached to the adhesive layer of electric insulation layer structure by (), wherein, electronic component is within the cavity；And (e) is electrically connected at least one further via of this at least one bottom side terminal.Electronic component can be arranged the most asymmetrically about the centronucleus central layer in electric insulation layer structure.
Described component carrier can be respectively from the theory of two not two different directions electrical contacts of homonymy based on embedded electronic components.Specifically, at least one first electrical connection is set up and is formed at the metal level above electronic component in the upside of embedded electronic components and preferably arrival.Correspondingly, at least one second electrical connection is set up and is formed at another metal level below electronic component in the downside of embedded element and preferably arrival.Described electric layer can be formed respectively on the top of the bottom of whole component carrier.Further, each metal level can be separated with each first type surface of electronic component by least one insulating barrier, and at least one insulating barrier described is considered as a part for described electric insulation layer structure.When design element carrier, electronic component is i.e. set especially completely about centronucleus central layer outside centronucleus central layer in electric insulation layer structure (especially layer stack (stack)) the most asymmetrically and simplifies the electronic component motility fixing and providing high level in cavity.Further, the transmission of the signal of telecommunication between the outside of component carrier and the electronic component of the inside that is embedded in component carrier can have low-loss and high signal transmission quality.Such as, such framework makes the plate manufactured the most easily be equipped with cavity (especially having one or more from the following contact made), and then electronic component such as can be simply plugged into cavity by pressing and be connected to become possibility there.
By never with side contacts embedded electronic components, the electrical connection of embedded electronic components can be obviously improved.At least including in the case of more than one electric terminals on the one of its first type surface at electronic component, according to the electronic circuitry implemented in embedded electronic components, being formed at all terminals at each first type surface need not all be used for electrically connecting embedded electronic components.
In the document, term " first type surface " especially can represent that presents maximum area in those two surfaces of embedded electronic components.In the content of the document, these first type surfaces are also represented by the top of each lower surface of embedded electronic components.
In the context of the document, term " component carrier " especially can represent and can accommodate on it by one or more electronic components and/or wherein be used for providing any kind of supporting construction of mechanical support and electrical connection.Component carrier can be such as PCB or can be generally any kind of flexibility, the semiflexible or substrate of rigidity.
Terminal can be any electric conductivity structures of the internal circuit that can electrically connect embedded electronic components and the external circuit being arranged at component carrier inside or component carrier.In a preferred embodiment, terminal is realized by so-called spherical contact.In these spherical contacts or any kind of electric terminals can be located at adhesive layer or laterally surrounded by adhesive layer.
According to embodiment of the present utility model, electric insulation layer material includes the multiple electric insulation layers being arranged on top each other or is made up of the multiple electric insulation layers being arranged on top each other.
At least one but preferably all electric insulation layer processed by known storehouse shaping and produce, wherein, the so-called prepreg bed of material is about orientation the most in a planar manner and then by applying pressure and/or heat treatment attachment firmly with each other.In this way, the stable layer structure including several electric insulation layer or being made up of several electric insulation layers can be formed.
According to further embodiment of the present utility model, at least two electric insulation layer of electric insulation layer structure the whole height of the storehouse formed is equal to or more than the height of embedded electronic components.
In this context, the height of the storehouse of definition is given along the respective spatial spread being oriented perpendicularly to be respectively perpendicular at least two electric insulation layer in the direction of the plane extension of the electric insulation layer of the first type surface of embedded electronic components by embedded electronic components.In the description of more mathematics, described short transverse is parallel to the normal vector of the respective layer plane of described first type surface.
In in this respect, it is noted that the electronic component being embedded in component carrier generally accommodates in the groove in the so-called core layer being formed at each component carrier.This core layer usually forms the intimate rigid layer of the mechanical trunk of component carrier.According to embodiment described here, when embedding electronic component, there is not the restriction provided by the thickness of this core layer.According to concrete application, each electric insulation layer right quantity and suitable thickness of described storehouse of the groove being formed with the appropriate size for accommodating embedded electronic components can be close in freely selecting to form it.This takes into account about bulk and especially with respect to the high flexibility that and can suppose to be placed on the height of the electronic component in the cavity of electric insulation layer structure.
Say in descriptive manner, it is positioned at compared with the known embedded processing of the groove being formed in core layer with wherein embedded electronic components, technology described in the document is very different, because the manufacturer that its (a) allows described component carrier uses the thicker element embedded, b () guarantees more preferable processing characteristics, because element is integrated in the suitable storehouse of electric insulation layer, and (c) allows client to use any layer stack structure in the case of substantially not limiting.Especially, by selecting suitable material and/or size for respective electric insulation layer, when manufacturing or when assembling described component carrier, it will less pay close attention to about such as may unwanted static discharge (ESD) event of infringement electronic component when in the groove being placed in the storehouse being formed at respective electric insulation layer.
According to further embodiment of the present utility model, embedded electronic components along the short transverse of component carrier between the lower surface and the upper surface of storehouse of storehouse.
Specifically, according to said embodiment, compared with the upper surface of storehouse, the top major surface of embedded electronic components is positioned at relatively low height coordinate.Correspondingly, compared with the lower surface of storehouse, the bottom major surface of embedded electronic components is positioned at higher height coordinate.
According to further embodiment of the present utility model, at least two electric insulation layer of storehouse is concave type layer, and each concave type layer has the groove of the part forming cavity.This can provide following advantage: when by using the known technology being mechanically connected the different prepreg bed of material to manufacture described component carrier, will automatically form cavity.Only need by making each prepreg bed of material be in alignment with each other before applying pressure and/or the thermal mechanical connection prepreg bed of material.
According to further embodiment of the present utility model, in addition at least two concave type layer of storehouse, electric insulation layer structure includes at least one cover layer.This cover layer is also electric insulation layer.Further, this cover layer is arranged on above storehouse.
Saying in descriptive manner, the top major surface of embedded electronic components is covered by described electric insulation cover layer.This may result in well and reliably protect embedded electronic components especially from environmental effect.This especially can aid in and even reliably operates embedded electronic components under coarse environmental condition.
According to further embodiment of the present utility model, in addition at least two concave type layer of storehouse, electric insulation layer structure includes at least one Primary layer, and this Primary layer is also electric insulation layer and the lower section being arranged on storehouse.
Saying in descriptive manner, the bottom major surface of embedded electronic components is covered and at least without directly contacting core layer towards bottom by described electric insulation Primary layer, and whole electric insulation layer structure is formed at above core layer.Further, this can help to the smooth receiving of embedded electronic components.
According to further embodiment of the present utility model, adhesive layer is at least partially situated between the upper surface of Primary layer and the bottom major surface of electronic component.This can provide following advantage: embedded electronic components can be mechanically secured to cavity in a straightforward manner and make electrical contact with in cavity.Therefore, the manufacturing process of described component carrier allows to effective and cheap mode manufacture described component carrier by fairly simple.
According to further embodiment of the present utility model, adhesive layer includes electric conduction material or is made up of electric conduction material.This can be provided that following advantage: provides the good electrical of electronic component.When high-frequency signal is assumed to be transmitted by each electric terminals, this may be especially advantageous.
According to further embodiment of the present utility model, at least one electric insulation layer includes at least one in the group comprising resin especially bismaleimide-triazine resin, cyanate, glass especially glass fibre, preimpregnation material, polyimides, liquid crystal polymer, epoxy radicals laminated film (Build-Up Film), FR4 material, pottery and metal-oxide.This can provide following advantage: in order to realize described component carrier, may utilize the known material for manufacturing printed circuit board (PCB) and process technology.
In this respect, it is noted that any other electric insulation layer that term " electric insulation layer " can be comprised with concave type layer mentioned above, cover layer, Primary layer and/or described component carrier.
According to further embodiment of the present utility model, between the electric insulation layer that at least two is adjacent, it is formed with electrically-conductive layer.
At least one middle electrically-conductive layer is set following advantage can be provided: not only in the surface of whole component carrier but also further circuit can be set up in component carrier (inside).In this article, electrically-conductive layer can be especially for the structurized conducting shell patterned the most spatially.
According to further embodiment of the present utility model, at least one electrically-conductive layer described includes at least one in the group comprising copper, al and ni.This can provide following advantage: in order to realize described component carrier, may utilize the known technology for especially processing metal material in the field manufacturing printed circuit board.Although generally preferably copper, but other materials is also possible.
According to further embodiment of the present utility model, component carrier is configured to plate.This compact and the most smooth design that can help to include having any electronic installation of the described component carrier of embedded electronic components.Therefore, component carrier still can provide the bigger or broader substrate for being installed on it by (non-embedded) electronic component.Additionally, particularly as the naked mould (naked die) of the preferred embodiment for embedded electronic components, can be conveniently embedded in thin plate owing to its thickness is little.
According to further embodiment of the present utility model, component carrier is configured in the group comprising printed circuit board (PCB) and substrate.
In the context of the document, term " printed circuit board (PCB) " (PCB) especially can display plate shape component carrier, this plate element carrier is by such as having several electrically-conductive layer structures of several electric insulation layer structure and formed by applying pressure (if desired with the supply of heat energy) lamination.As the preferred material for PCB technology, electrically-conductive layer structure is made of copper, but, electric insulation layer structure can include resin and/or glass fibre, so-called preimpregnation material or FR4 material.Various electrically-conductive layer structures can be by being formed such as by punching or the through hole of machine drilling across-layer pressing plate and by being connected to each other in a desired manner as the via of through hole connection with electric conduction material (especially copper) filling through hole thus formation.In addition at least one embedded electronic components above-mentioned, printed circuit board (PCB) is typically configured as a surface or two apparent surfaces for one or more (non-embedded) electronic component is contained in plate shape printed circuit board (PCB).These electronic components can be by being welded to connect to each first type surface.
In the context of the document, term " substrate " especially can represent have generally with the little component carrier of the electronic component same size being installed on it.This little component carrier generally represents intermediate carrier.
According to further embodiment of the present utility model, embedded electronic components is selected from comprising active electron component, passive electronic components, electronic chip, storage device, filter, integrated circuit, Signal Processing Element, power management components, optic electric interface element, electric pressure converter, cipher component, transmitter and/or the group of receptor, electromechanical transducer, sensor, actuator, Micro Electro-Mechanical Systems, microprocessor, capacitor, resistor, inductance, battery, switch, video camera, antenna and logic chip.However, it is possible to other electronic components are especially produced and are launched electromagnetic radiation and/or those elements of the electromagnetic radiation sensitivity from environmental dissemination to electronic component are embedded in component carrier.Such as, magnetics can be used as electronic component.This magnetics can be permanent magnet component (such as ferromagnetic component, anti-ferromagnetism element or ferrimagnetism element, such as FERRITE CORE) can be maybe paramagnetic elements.
According to further aspect of the present utility model, it is provided that a kind of method manufacturing component carrier.The method provided includes that (a) provides the electric insulation layer structure with the internal cavity being formed in electric insulation layer structure；B () inserts adhesive layer in the bottom of cavity；C electronic component is arranged on adhesive layer and electronic component is embedded in cavity by (), wherein electronic component includes at least one the top side terminal being formed at the top major surface of electronic component and is formed at least one the bottom side terminal at the bottom major surface of electronic component；D () is formed and is connected to provide at least one via of at least one top side terminal of the electronic component with the signal concatenation ability by least one top side terminal；And (e) is formed and is connected to provide at least one further via of at least one bottom side terminal of the electronic component with the signal concatenation ability by least one bottom side terminal.Electronic component can be arranged the most asymmetrically about the centronucleus central layer in electric insulation layer structure.
Further, described method theory based on the electrical connection that can obviously improve embedded electronic components when embedded electronic components is from two difference (relatively) side electrical contacts.
According to embodiment of the present utility model, electric insulation layer structure includes the multiple electric insulation layers being arranged on top each other or is made up of the multiple electric insulation layers being arranged on top each other.The method farther includes to extend electric insulation layer structure by formation cover layer on multiple electric insulation layers and on embedded electronic components, and at least one via wherein said is formed in cover layer.Especially, at least one via described can penetrate cover layer.
Particularly by covering embedded electronic components, the mechanical protection of electronic component can be realized in a simple and effective way.To last, this may provide powerful help for the stable operating condition of embedded electronic components.
Adhesive layer is also possible that anisotropic conductive film (ACF).ACF is the bonding interconnection system for setting up the form membrane electrically and mechanically connected.Alternatively, ACF can be used for being referred to as the cream form of anisotropic conductive cream (ACP).
It should be noted that the embodiment of the present utility model with reference to different subject descriptions.Especially, describe some embodiments with reference to device type claim, and reference method type claims describes other embodiments.But, those skilled in the art will draw unless otherwise notice from above-mentioned and following explanation, otherwise in addition to belonging to any combination of feature of a type of theme, also it is seen as the most disclosed herein about any combination between feature and the feature of Method type claim of especially device type claim between the feature of different themes.
The aspect being defined above and further aspect of the present utility model become obvious from the embodiment example being described below and illustrate with reference to embodiment example.It is more fully described this utility model below in reference to embodiment example, but this utility model is not limited to this.
Accompanying drawing explanation
Fig. 1-5 explanation forms the serial of methods step of the component carrier according to preferred embodiment of the present utility model.
Fig. 6 illustrates the sectional view of the component carrier with the embodiment of the present utility model manufactured according to Fig. 1 to Fig. 5.
Fig. 7 illustrates the sectional view of another component carrier of another exemplary embodiment of the present utility model.
List of reference signs:
100 semi-finished product
105 core layers
110 bottom sequences
112 electric insulation layers
120 electric insulation layer structures
122 storehouses
122a-c (concave type) electric insulation layer
124 Primary layer/electric insulation layer
130 grooves
192 first metal interconnection structures
194 second metal interconnection structures
196 metal layer part
232 adhesive layers
350 electronic components
352 bottom side terminals
354 top side terminals
362 further metallized vias (for bottom side terminal)
410 (extension) bottom sequence
416 bottoms
420 (extension) electric insulation layer structure
426 cover layers/electric insulation layer
430 cavitys
518 via openings
528 via openings
563 via openings
600 component carriers
664 metallized vias (for top side terminal)
670 metal top layers
692 the first metal interconnection structures extended
694 the second metal interconnection structures extended
Detailed description of the invention
Explanation in accompanying drawing is diagram.It should be noted that in different figures, similar elements or feature have identical reference number or have only first digit and be different from the reference number of corresponding reference number.In order to avoid unnecessary repetition, the explanation of part illustrates below element or feature the most again that have been described above about previous embodiment.
Additionally, as it can be seen, the space correlation term of such as " front " and " afterwards ", "up" and "down", " left " and " right " etc. is for describing the relation of element and another element.Therefore, space correlation term is in use applicable to be different from the direction in the direction described in accompanying drawing.It is apparent that all these space correlation terms refer to be not necessarily restrictive, because can be assumed that the direction taking to be different from those directions shown in the drawings in use according to the equipment of embodiment of the present utility model only for the purposes of describing direction shown in the drawings.
Fig. 1 illustrates the semi-finished product 100 being used as to manufacture the starting point of component carrier according to exemplary embodiment described herein.Owing to skilled artisan would know how to manufacture the proper method of shown semi-finished product 100, the structure of semi-finished product 100 will only be described below.
Semi-finished product 100 include providing relative stiffness or the core layer 105 of powerful trunk for the frame for movement of semi-finished product 100.Bottom sequence 110 is formed below in core layer 105, includes four electric insulation layers 112 according to embodiment bottom sequence 110 described herein.Being respectively formed with thin metal layer between two adjacent layers 112, thin metal layer cannot see that due to the ratio of explanation.It is formed above electric insulation layer structure 120 in core layer 105.According to embodiment described herein, electric insulation layer structure 120 includes four electric insulation layers altogether, and these four electric insulation layers include that (a) is formed at electric insulation Primary layer above core layer 105 124 and (b) is formed at the storehouse 122 of total of three electric insulation layer 122a, 122b and 122c above Primary layer 124.
As it will be noted from fig. 1 that the groove part that each includes in three electric insulation layers 122a, 122b and 122c makes these layer of 122a, 122b, 122c in this article be also indicated as the electric insulation layer of concave type.Electric insulation layer 122a, 122b, 122c of three concave types arranges the most in aligned manner and groove 130 is formed in storehouse 122.
Should be mentioned that, according to all electric insulation layers of embodiment described herein 112,124,122a, 122b, 122c be firmly attached to each other and be attached to core layer 105 also by known printed circuit board manufacturing process, wherein, at least electric insulation layer 112,124,122a, 122b, 122c be made up of the so-called prepreg bed of material, the prepreg bed of material is pressed against each other in process for making.
As seen further from Fig. 1, the semi-finished product 100 of described embodiment farther include metal interconnection structure, and this metal interconnection structure extends vertically, and be i.e. perpendicular to layer plane and the short transverse along semi-finished product 100 extends through whole semi-finished product 100.Formed with several sheet metals (pad) in known manner and include the first metal interconnection structure 192, metal layer part 196 and the metal interconnection structure of the second metal interconnection structure 194, wherein, two sheet metals being assigned to adjacent metal connect with metallized via respectively.
Fig. 2 illustrates next step the result manufacturing the component carrier according to embodiment of the present utility model.As it will be seen that adhesive layer 232 has been formed on the Primary layer 124 of the bottom of groove 130.
Fig. 3 illustrates the result of further manufacturing step.Therefore, first, forming metallic vias attachment means, it extends up to the upper surface of Primary layer 124 from the upper surface of core layer 105.According to embodiment described herein, via attachment means includes two metallized vias being referred to herein as further metallized via 362.These further metallized vias 362, electricity via connection is utilized to be formed at (a) and be formed between the metal level do not drawn between core layer 105 and Primary layer 122 and the bottom of (b) groove 130.
Secondly, electronic component 350 is put in groove 130 in the way of by two bottom side terminals 352 of electronic component 350, metallized via 362 further with two aligns spatially respectively.As can be seen from Figure 3, two bottom side terminals 352 ball (unused reference number name) is formed below.These balls at least penetrate adhesive layer 232 and make to be formed between a further metallized via 362 and a bottom side terminal 352 respectively conductivity connection.
As can be seen from Figure 3, electronic component 350 farther includes two top side terminals 354.
Fig. 4 illustrates the result of the next step manufacturing component carrier.Electric insulation cover layer 426 is formed at (and also above the first metal interconnection structure 192) above the electric insulation layer 122c of concave type.Therefore, groove is covered such that it represents cavity 430 now.Due to symmetry reason, electric insulation layer 112 below bottom 416 is formed below, bottom 416 is still formed of an electrically insulating material.
Should be mentioned that, cover layer 426 upwardly extend the electric insulation layer structure 120 shown in Fig. 1-3 make from now on its be named as extend electric insulation layer structure 420.Correspondingly, bottom 416 downwardly extend the most in fig. 1-3 shown in bottom sequence 110 make from now on its be named as extend bottom sequence 410.
Manufacturing process according to known printed circuit board (PCB) and being also made up of the corresponding ready prepreg bed of material according to embodiments described herein, cover layer 426 and bottom 416, the electric insulation layer 122c of prepreg bed of material extruding concave type and following electric insulation layer 112.
In next manufacturing step, Fig. 5 illustrates its result, and via openings is formed in cover layer 426.Specifically, via openings 528 makes the second metal interconnection structure 194 expose and two via openings 563 make to be formed at two top side terminals 354 on the upside of electronic component 350 and expose.Correspondingly, in order to make the first metal interconnection structure 19 expose, via openings 518 is formed in bottom 416.
Fig. 6 illustrates the result of the next step for manufacturing component carrier 600.In this manufacturing step, the via openings 528 and 563 shown in Fig. 5 is metallized so that the second metal interconnection structure 194 shown in Fig. 5 extends through whole cover layer 426 now.Therefore, corresponding extended structure is named as the second metal interconnection structure 694 extended.Additionally, and to embodiment of the present utility model described herein more importantly, the via openings 563 shown in Fig. 5 is metallized so that being formed for the metallized via 664 of two top terminals 354.In order to allow further external circuit to make electrical contact with the second metal interconnection structure 694 and the top side terminal 354 of extension, on cover layer 426, form structurized metal top layer 617.Should be mentioned that, the spatial framework of structurized layer not shown in FIG. 6 is of course depend upon the spatial design of further circuit.
Therefore, the metallization of the via openings 518 shown in Fig. 5 causes the metallized via to the first metal interconnection structure 192 shown in bottom direction extension bitmap 5.Therefore, the first metal interconnection structure 692 extended is formed.Certainly, in order to allow the bottom side of component carrier to be also connected with the further circuit outside component carrier 600, the metal level do not drawn also can be formed in the bottom side of component carrier 600.
As learnt from Fig. 6, electronic component 350 is arranged the most asymmetrically about the centronucleus central layer 105 in electric insulation layer structure (seeing reference number 410,420).More specifically, in shown complete embodiment above centronucleus central layer 105, electronic component 350 is fully located at the outside of centronucleus central layer 105.Further, the electric contact on two first type surfaces of electronic component 350 is fully located at above centronucleus central layer 105.Therefore, in electronic component 350 is embedded into lamination (seeing reference number 420) rather than in centronucleus central layer 105.This simplify and electronic component 350 is positioned at the idea in cavity 430 and provides the motility of high level for component carrier designer.In addition, the shortest signal path from embedded electronic components 350 transmitting telecommunication number and transmitting telecommunication number to embedded electronic components 350 can be kept (i.e., leave or enter from component carrier 600 component carrier 600) because embedded electronic components 350 can be located at the position on the surface being relatively close to component carrier 600.
Fig. 7 illustrates the sectional view of another component carrier 600 according to another exemplary embodiment of the present utility model.Fig. 7 illustrates that the framework of exemplary embodiment of the present utility model is the most flexibly.Shown component carrier 600 and multiple electronic component 350, a part for multiple electronic components 350 is embedded into the top of core layer 105, in another part of multiple electronic components 350 is embedded into the lower section of core layer 105, and also another part is positioned partially at core layer 105.
Furthermore disclosed following content:
Aspect 1: a kind of method for manufacturing component carrier 600, the method includes
The electric insulation layer structure 120,420 with the internal cavity 130,430 being formed in electric insulation layer structure is provided；
Adhesive layer 232 is inserted in the bottom of cavity 130,430；
Electronic component 350 is arranged on adhesive layer 232 electronic component 350 is embedded in cavity 130,430, wherein, electronic component 350 includes at least one the top side terminal 354 being formed at the top major surface of electronic component 350 and is formed at least one the bottom side terminal 352 at the bottom major surface of electronic component 350；
Formed and be connected to provide at least one via 664 of at least one top side terminal 354 of the electronic component 350 with the signal concatenation ability by least one top side terminal 352；And
Formed and be connected to provide at least one further via 362 of at least one bottom side terminal 352 of the electronic component 350 with the signal concatenation ability by least one bottom side terminal 352；
About the centronucleus central layer 105 in electric insulation layer structure 120,420, electronic component 350 is set the most asymmetrically.
Aspect 2: method as described in 1 in terms of, wherein
Electric insulation layer structure 120 includes multiple electric insulation layers 124,122a, 122b, 122c of being arranged on above each other or is formed by being arranged on multiple electric insulation layers 124 of top, 122a, 122b, 122c each other,
The method farther includes
Extending electric insulation layer structure 120 by forming cover layer 426 on multiple electric insulation layers 124,122a, 122b, 122c and on embedded electronic components 350, at least one of which via 664 is formed in cover layer 426.
It should be noted that term " includes " being not precluded from other elements or step, and the use of article " " is not precluded from multiple.And the described element relevant from different embodiments can be in conjunction with.The reference marker being also to be noted that in claim should not be construed as the scope limiting claim.
Claims (15)
1. a component carrier, it is characterised in that described component carrier includes
Electric insulation layer structure, described electric insulation layer structure has inner chamber body；
Electronic component, described electronic component embeds in described cavity, and wherein, described electronic component includes at least one top side terminal and at least one the bottom side terminal providing signal concatenation ability for place on the top major surface and bottom major surface of described electronic component；
At least one via, at least one via described is electrically connected at least one top side terminal；
Adhesive layer, described electronic component is attached to described electric insulation layer structure by described adhesive layer, and wherein, described electronic component is positioned at described cavity；And
At least one further via, at least one further via described is electrically connected at least one bottom side terminal described；
Wherein, described electronic component is arranged the most asymmetrically about the centronucleus central layer in described electric insulation layer structure.
2. component carrier as claimed in claim 1, it is characterised in that
Described electric insulation layer structure includes the multiple electric insulation layers being arranged on top each other or is made up of the multiple electric insulation layers being arranged on top each other.
3. component carrier as claimed in claim 2, it is characterised in that
The whole height of the storehouse formed by least two electric insulation layer of described electric insulation layer structure is equal to or more than the height of described electronic component.
4. component carrier as claimed in claim 3, it is characterised in that
Described electronic component along the short transverse of described component carrier between the lower surface and the upper surface of described storehouse of described storehouse.
5. component carrier as claimed in claim 3, it is characterised in that
At least two electric insulation layer of described storehouse is concave type layer, and each the female formula layer has the groove of the part forming described cavity.
6. component carrier as claimed in claim 5, it is characterised in that
In addition at least two concave type layer of described storehouse, described electric insulation layer structure includes that at least one cover layer, described cover layer are electric insulation layer equally and are arranged on above described storehouse.
7. component carrier as claimed in claim 5, it is characterised in that
In addition at least two concave type layer of described storehouse, described electric insulation layer structure includes at least one Primary layer, described Primary layer also electric insulation layer and being arranged on below described storehouse.
8. component carrier as claimed in claim 7, it is characterised in that
Described adhesive layer is at least partially situated between the upper surface of described Primary layer and the bottom major surface of described electronic component.
9. component carrier as claimed in claim 1, it is characterised in that
Described adhesive layer includes electric conduction material or is made up of electric conduction material.
10. component carrier as claimed in claim 2, it is characterised in that
It is formed with electrically-conductive layer between the electric insulation layer that at least two is adjacent.
11. component carriers as claimed in claim 10, it is characterised in that
At least one electrically-conductive layer described includes at least one in the group comprising copper, al and ni.
12. component carriers as claimed in claim 1, it is characterised in that
Described component carrier is configured to plate.
13. component carriers as claimed in claim 1, it is characterised in that
Described component carrier is configured to contain one in the group of printed circuit board (PCB) and substrate.
14. component carriers as claimed in claim 1, it is characterised in that
Described electronic component is selected from comprising active electron component, passive electronic components, electronic chip, storage device, filter, integrated circuit, Signal Processing Element, power management components, optic electric interface element, electric pressure converter, cipher component, transmitter and/or the group of receptor, electromechanical transducer, sensor, actuator, microelectromechanical systems, microprocessor, capacitor, resistor, inductance, battery, switch, video camera, antenna, magnetics and logic chip.
15. component carriers as claimed in claim 1, it is characterised in that described adhesive layer includes at least one in the group comprising anisotropic conductive film (ACF) and anisotropic conductive cream (ACP).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520771338.7U CN205755064U (en) | 2015-09-30 | 2015-09-30 | Component carrier |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520771338.7U CN205755064U (en) | 2015-09-30 | 2015-09-30 | Component carrier |
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| Publication Number | Publication Date |
|---|---|
| CN205755064U true CN205755064U (en) | 2016-11-30 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520771338.7U Active CN205755064U (en) | 2015-09-30 | 2015-09-30 | Component carrier |
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| Country | Link |
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| CN (1) | CN205755064U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113131291A (en) * | 2021-03-11 | 2021-07-16 | 东莞市晟合科技有限公司 | Connecting wire carrying electronic component and manufacturing method thereof |
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2015
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113131291A (en) * | 2021-03-11 | 2021-07-16 | 东莞市晟合科技有限公司 | Connecting wire carrying electronic component and manufacturing method thereof |
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