CN205752225U - 一种结构简单的二极管 - Google Patents

一种结构简单的二极管 Download PDF

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Publication number
CN205752225U
CN205752225U CN201520970647.7U CN201520970647U CN205752225U CN 205752225 U CN205752225 U CN 205752225U CN 201520970647 U CN201520970647 U CN 201520970647U CN 205752225 U CN205752225 U CN 205752225U
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CN
China
Prior art keywords
led chip
reflector
resin enclosure
connecting line
metal connecting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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CN201520970647.7U
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English (en)
Inventor
夏振宇
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Individual
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Individual
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Priority to CN201520970647.7U priority Critical patent/CN205752225U/zh
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Publication of CN205752225U publication Critical patent/CN205752225U/zh
Expired - Fee Related legal-status Critical Current
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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

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  • Led Device Packages (AREA)

Abstract

本实用新型公开了一种结构简单的二极管,包括树脂外壳(1)、阴极引线(2)和阳极引线(3),所述阳极引线(3)上设有金属连线(4),所述阴极引线(2)上设有反光板(5),所述反光板(5)上设有LED芯片(6),所述LED芯片(6)上设有荧光体层(7),所述金属连线(4)与LED芯片(6)相适配。本实用新型结构设计合理,生产成本体,使用效果好,符合生产生活的需要。

Description

一种结构简单的二极管
技术领域
本实用新型涉及机械领域,具体涉及一种结构简单的二极管。
背景技术
二极管一种用于将交流电转变为直流电的半导体器件。现有的二极管结构设计不合理,不适于工业化大生产。
发明内容
本实用新型的目的克服现有技术的问题提供一种结构简单的二极管。
本实用新型的一种结构简单的二极管,包括树脂外壳、阴极引线和阳极引线,所述阴极引线和阳极引线的一端设于树脂外壳内,所述阳极引线设于树脂外壳内的一端上设有金属连线,所述阴极引线设于树脂外壳内的一端上设有反光板,所述反光板上设有LED芯片,所述LED芯片上设有荧光体层,所述金属连线与LED芯片相适配,所述反光板上设有端子,所述金属连线、反光板、LED芯片和荧光体层都设于树脂外壳内,所述树脂外壳一端设有弧形凸起。
本实用新型与现有技术相比,具有以下优点。
本实用新型结构设计合理,生产成本体,使用效果好,符合生产生活的需要。
附图说明
图1为本实用新型结构简单的二极管的结构示意图。
图中:1-树脂外壳,2-阴极引线,3-阳极引线,4-金属连线,5-反光板,6-LED芯片,7-荧光体层。
具体实施方式
下面结合附图和实施例对本实用新型做进一步的解释说明。
如图1所示,一种结构简单的二极管,包括树脂外壳1、阴极引线2和阳极引线3,阴极引线2和阳极引线3的一端设于树脂外壳1内,阳极引线3设于树脂外壳1内的一端上设有金属连线4,阴极引线2设于树脂外壳1内的一端上设有反光板5,反光板5上设有LED芯片6,LED芯片6上设有荧光体层7,金属连线4与LED芯片6相适配,所述反光板5上设有端子,金属连线4、反光板5、LED芯片6和荧光体层7都设于树脂外壳1内,所述树脂外壳一端设有弧形凸起。
上述内容为本实用新型的示例及说明,但不意味着本实用新型可取得的优点受此限制,凡是本实用新型实践过程中可能对结构的简单变换、和/或一些实施方式中实现的优点的其中一个或多个均在本申请的保护范围内。

Claims (1)

1.一种结构简单的二极管,其特征在于:包括树脂外壳(1)、阴极引线(2)和阳极引线(3),所述阴极引线(2)和阳极引线(3)的一端设于树脂外壳(1)内,所述阳极引线(3)设于树脂外壳(1)内的一端上设有金属连线(4),所述阴极引线(2)设于树脂外壳(1)内的一端上设有反光板(5),所述反光板(5)上设有LED芯片(6),所述LED芯片(6)上设有荧光体层(7),所述金属连线(4)与LED芯片(6)相适配,所述反光板(5)上设有端子,所述金属连线(4)、反光板(5)、LED芯片(6)和荧光体层(7)都设于树脂外壳(1)内,所述树脂外壳一端设有弧形凸起。
CN201520970647.7U 2015-11-30 2015-11-30 一种结构简单的二极管 Expired - Fee Related CN205752225U (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201520970647.7U CN205752225U (zh) 2015-11-30 2015-11-30 一种结构简单的二极管

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201520970647.7U CN205752225U (zh) 2015-11-30 2015-11-30 一种结构简单的二极管

Publications (1)

Publication Number Publication Date
CN205752225U true CN205752225U (zh) 2016-11-30

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Country Status (1)

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CN (1) CN205752225U (zh)

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C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20161130

Termination date: 20181130

CF01 Termination of patent right due to non-payment of annual fee