CN205752151U - Heat radiation fixture block for metal-oxide-semiconductor - Google Patents
Heat radiation fixture block for metal-oxide-semiconductor Download PDFInfo
- Publication number
- CN205752151U CN205752151U CN201620415932.7U CN201620415932U CN205752151U CN 205752151 U CN205752151 U CN 205752151U CN 201620415932 U CN201620415932 U CN 201620415932U CN 205752151 U CN205752151 U CN 205752151U
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- Prior art keywords
- radiator body
- heat radiator
- semiconductor
- oxide
- metal
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Abstract
A kind of heat radiation fixture block for metal-oxide-semiconductor；Including vehicle frame, heat radiator body, radiating block flank and metal-oxide-semiconductor；Described heat radiator body is relatively fixed on described vehicle frame；The cross section of described heat radiator body is the T-shaped structure being made up of transverse part and vertical part, and the two ends of described heat radiator body transverse part are arranged with opening；The bottom of described each opening is designed with circular receiving chamber；Described radiating block flank is two, and the upper end of described radiating block flank laterally extends a fixed part；The lower end of described radiating block flank is provided with arc clamping part；Grafting rotatable engagement between circular receiving chamber on the fixed part of described radiating block flank upper end and described heat radiator body；The arc clamping part of described radiating block flank bottom is resisted against on described metal-oxide-semiconductor.This utility model simple in construction, easy to operate, it is not required to go individually to clamp multiple metal-oxide-semiconductor and heat radiator body with multiple parts, in heat radiator body while assembling is fixing, metal-oxide-semiconductor can be clamped, reduce operating procedure.
Description
Technical field
This utility model belongs to electronic device docking technical field, relates to a kind of heat radiation fixture block for metal-oxide-semiconductor.
Background technology
Owing to electric bicycle has environmental protection and energy saving, the features such as price is suitable, noiseless, convenient, therefore obtain and be increasingly widely applied.Conventional electric bicycle drives brshless DC motor by controller, and the heat dissipation design of the most whole controller has extremely important effect for electric bicycle performance and reliability.At present, the transistor such as metal-oxide-semiconductor is first welded on pcb board, and owing to pcb board size is relatively big, metal-oxide-semiconductor size is smaller, and metal-oxide-semiconductor is again in pcb board centre position, causes fixing for metal-oxide-semiconductor the most extremely difficult.
And how to solve the problems referred to above, it is the content that those skilled in the art are to be studied.
Summary of the invention
For overcoming above-mentioned deficiency of the prior art, this utility model purpose is to provide a kind of heat radiation fixture block for metal-oxide-semiconductor.
For achieving the above object and other relevant purposes, this utility model provides a kind of heat radiation fixture block for metal-oxide-semiconductor；Including vehicle frame, heat radiator body, radiating block flank and metal-oxide-semiconductor；Described heat radiator body is relatively fixed on described vehicle frame；The cross section of described heat radiator body is the T-shaped structure being made up of transverse part and vertical part, and the two ends of described heat radiator body transverse part are arranged with opening；The bottom of described each opening is designed with circular receiving chamber；Described radiating block flank is two, is symmetricly set on the both sides of described heat radiator body；The upper end of described radiating block flank laterally extends a fixed part；The shape of described fixed part and described opening and the circular form fit accommodating chamber；The lower end of described radiating block flank is provided with arc clamping part；Grafting rotatable engagement between circular receiving chamber on the fixed part of described radiating block flank upper end and described heat radiator body；The accommodating position of metal-oxide-semiconductor is constituted between vertical part and the bottom of described radiating block flank of described heat radiator body；The arc clamping part of described radiating block flank bottom is resisted against on described metal-oxide-semiconductor.
In technique scheme, related content is explained as follows:
1, in such scheme, the width of described heat radiator body vertical part and described metal-oxide-semiconductor are at a distance of the pitch match arranged.
2, in such scheme, the middle part of described heat radiator body is provided with counterbore, and described vehicle frame is provided with pin, is connected fixing between described heat radiator body with described vehicle frame in pin is plugged in described counterbore.
Owing to technique scheme is used, this utility model compared with prior art has the advantage, that
1, this utility model uses radiating block flank and heat radiator body cooperation to be fixed by metal-oxide-semiconductor, heat radiator body is before being assembled on vehicle frame, metal-oxide-semiconductor is placed on the lower section of radiating block flank, while heat radiator body is assembled on vehicle frame, the top of the radiating block flank of both sides is interfered with vehicle frame such that it is able to simultaneously clamp on the metal-oxide-semiconductor that two rows are set up in parallel；It is locked at vehicle frame because of heat radiator body again, also heat can be delivered on vehicle frame simultaneously, can dispel the heat to metal-oxide-semiconductor more preferably faster.
2, this utility model simple in construction, easy to operate, it is not required to go individually to clamp multiple metal-oxide-semiconductor and heat radiator body with multiple parts, in heat radiator body while assembling is fixing, metal-oxide-semiconductor can be clamped, reduce operating procedure.
Accompanying drawing explanation
Fig. 1 is this utility model structural representation one；
Fig. 2 is this utility model structural representation two.
Detailed description of the invention
By particular specific embodiment, embodiment of the present utility model being described below, those skilled in the art can be understood other advantages of the present utility model and effect easily by the content disclosed by this specification.
Refer to Fig. 1 and Fig. 2.Notice, structure depicted in this specification institute accompanying drawings, ratio, size etc., the most only in order to coordinate the content disclosed in description, understand for those skilled in the art and read, it is not limited to the enforceable qualifications of this utility model, therefore do not have technical essential meaning, the modification of any structure, the change of proportionate relationship or the adjustment of size, under not affecting effect that this utility model can be generated by and the purpose that can reach, all should still fall in the range of the technology contents disclosed in this utility model obtains and can contain.Simultaneously, in this specification cited as " on ", D score, "left", "right", the term of " middle " and " " etc., it is merely convenient to understanding of narration, and it is not used to limit the enforceable scope of this utility model, being altered or modified of its relativeness, changing under technology contents without essence, when being also considered as the enforceable category of this utility model.
As depicted in figs. 1 and 2, the heat radiation fixture block for metal-oxide-semiconductor is planted；Including vehicle frame 1, heat radiator body 2, radiating block flank 3 and metal-oxide-semiconductor 4；Described heat radiator body 2 is relatively fixed on described vehicle frame 1；The cross section of described heat radiator body 2 is the T-shaped structure being made up of transverse part 21 and vertical part 22, and the two ends of described heat radiator body 2 transverse part 21 are arranged with opening 211；The bottom of described each opening 211 is designed with circular receiving chamber 212；Described radiating block flank 3 is two, is symmetricly set on the both sides of described heat radiator body 2；The upper end of described radiating block flank 3 laterally extends a fixed part 31；The shape of described fixed part 31 and described opening 211 and the circular form fit accommodating chamber 212；The lower end of described radiating block flank 3 is provided with arc clamping part 32；Grafting rotatable engagement between circular receiving chamber 212 on the fixed part 31 of described radiating block flank 3 upper end and described heat radiator body 2；The accommodating position of metal-oxide-semiconductor 4 is constituted between vertical part 22 and the bottom of described radiating block flank 3 of described heat radiator body 2；The arc clamping part 32 of described radiating block flank 3 bottom is resisted against on described metal-oxide-semiconductor 4.
The width of described heat radiator body 2 vertical part 22 and described metal-oxide-semiconductor 4 are at a distance of the pitch match arranged.
The middle part of described heat radiator body 2 is provided with counterbore 23, and described vehicle frame 1 is provided with pin 5, is connected fixing between described heat radiator body 2 with described vehicle frame 1 in pin 5 is plugged in described counterbore 23.
This utility model uses radiating block flank and heat radiator body to coordinate and is fixed by metal-oxide-semiconductor, heat radiator body is before being assembled on vehicle frame, metal-oxide-semiconductor is placed on the lower section of radiating block flank, while heat radiator body is assembled on vehicle frame, the top of the radiating block flank of both sides is interfered with vehicle frame such that it is able to simultaneously clamp on the metal-oxide-semiconductor that two rows are set up in parallel；It is locked at vehicle frame because of heat radiator body again, also heat can be delivered on vehicle frame simultaneously, can dispel the heat to metal-oxide-semiconductor more preferably faster.
This utility model simple in construction, easy to operate, it is not required to go individually to clamp multiple metal-oxide-semiconductor and heat radiator body with multiple parts, in heat radiator body while assembling is fixing, metal-oxide-semiconductor can be clamped, reduce operating procedure.
Above-described embodiment only illustrative principle of the present utility model and effect thereof, not for limiting this utility model.Above-described embodiment all can be modified under spirit and the scope of the present utility model or change by any person skilled in the art.Therefore, art has all equivalence modification or changes that usually intellectual is completed under without departing from the spirit disclosed in this utility model and technological thought such as, must be contained by claim of the present utility model.
Claims (3)
1. the heat radiation fixture block for metal-oxide-semiconductor；It is characterized in that: include vehicle frame, heat radiator body, radiating block flank and metal-oxide-semiconductor；Described heat radiator body is relatively fixed on described vehicle frame；The cross section of described heat radiator body is the T-shaped structure being made up of transverse part and vertical part, and the two ends of described heat radiator body transverse part are arranged with opening；The bottom of described each opening is designed with circular receiving chamber；Described radiating block flank is two, is symmetricly set on the both sides of described heat radiator body；The upper end of described radiating block flank laterally extends a fixed part；The shape of described fixed part and described opening and the circular form fit accommodating chamber；The lower end of described radiating block flank is provided with arc clamping part；Grafting rotatable engagement between circular receiving chamber on the fixed part of described radiating block flank upper end and described heat radiator body；The accommodating position of metal-oxide-semiconductor is constituted between vertical part and the bottom of described radiating block flank of described heat radiator body；The arc clamping part of described radiating block flank bottom is resisted against on described metal-oxide-semiconductor.
Heat radiation fixture block for metal-oxide-semiconductor the most according to claim 1, it is characterised in that: the width of described heat radiator body vertical part and described metal-oxide-semiconductor are at a distance of the pitch match arranged.
Heat radiation fixture block for metal-oxide-semiconductor the most according to claim 1, it is characterised in that: the middle part of described heat radiator body is provided with counterbore, and described vehicle frame is provided with pin, is connected fixing between described heat radiator body with described vehicle frame in pin is plugged in described counterbore.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620415932.7U CN205752151U (en) | 2016-05-10 | 2016-05-10 | Heat radiation fixture block for metal-oxide-semiconductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620415932.7U CN205752151U (en) | 2016-05-10 | 2016-05-10 | Heat radiation fixture block for metal-oxide-semiconductor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205752151U true CN205752151U (en) | 2016-11-30 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620415932.7U Expired - Fee Related CN205752151U (en) | 2016-05-10 | 2016-05-10 | Heat radiation fixture block for metal-oxide-semiconductor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205752151U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111916412A (en) * | 2020-08-06 | 2020-11-10 | 互升科技(深圳)有限公司 | MOS (Metal oxide semiconductor) tube and preparation method thereof |
-
2016
- 2016-05-10 CN CN201620415932.7U patent/CN205752151U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111916412A (en) * | 2020-08-06 | 2020-11-10 | 互升科技(深圳)有限公司 | MOS (Metal oxide semiconductor) tube and preparation method thereof |
| CN111916412B (en) * | 2020-08-06 | 2022-07-12 | 互升科技(深圳)有限公司 | MOS (Metal oxide semiconductor) tube and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20161130 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |