CN205691725U - 一种集成门极可关断晶闸管测试台 - Google Patents
一种集成门极可关断晶闸管测试台 Download PDFInfo
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- CN205691725U CN205691725U CN201620554408.8U CN201620554408U CN205691725U CN 205691725 U CN205691725 U CN 205691725U CN 201620554408 U CN201620554408 U CN 201620554408U CN 205691725 U CN205691725 U CN 205691725U
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 31
- 229910052802 copper Inorganic materials 0.000 claims description 31
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- 238000009413 insulation Methods 0.000 claims description 16
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- 229910052751 metal Inorganic materials 0.000 claims description 9
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107219382A (zh) * | 2017-07-14 | 2017-09-29 | 常州博瑞电力自动化设备有限公司 | 换流阀单晶闸管级测试阀组 |
CN107743033A (zh) * | 2017-09-20 | 2018-02-27 | 全球能源互联网研究院 | 一种igbt压装结构 |
CN113701809A (zh) * | 2021-08-20 | 2021-11-26 | 株洲华梁电气有限公司 | 一种igct压接测试试验装置 |
CN114726356A (zh) * | 2022-05-17 | 2022-07-08 | 清华大学 | 一种可关断晶闸管驱动电路及控制方法 |
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Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107219382A (zh) * | 2017-07-14 | 2017-09-29 | 常州博瑞电力自动化设备有限公司 | 换流阀单晶闸管级测试阀组 |
CN107743033A (zh) * | 2017-09-20 | 2018-02-27 | 全球能源互联网研究院 | 一种igbt压装结构 |
CN107743033B (zh) * | 2017-09-20 | 2023-12-19 | 全球能源互联网研究院 | 一种igbt压装结构 |
CN113701809A (zh) * | 2021-08-20 | 2021-11-26 | 株洲华梁电气有限公司 | 一种igct压接测试试验装置 |
CN113701809B (zh) * | 2021-08-20 | 2024-04-09 | 株洲华梁电气有限公司 | 一种igct压接测试试验装置 |
CN114726356A (zh) * | 2022-05-17 | 2022-07-08 | 清华大学 | 一种可关断晶闸管驱动电路及控制方法 |
CN114726356B (zh) * | 2022-05-17 | 2022-09-09 | 清华大学 | 一种可关断晶闸管驱动电路及控制方法 |
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Address after: 214135 China Jiangsu Sensor Network International Innovation Park 200, Linghu Avenue, Wuxi new district. Patentee after: WUXI UNIGROUP MICROELECTRONICS CO.,LTD. Country or region after: China Address before: 214135 China Jiangsu Sensor Network International Innovation Park 200, Linghu Avenue, Wuxi new district. Patentee before: WUXI TONGFANG MICROELECTRONICS Co.,Ltd. Country or region before: China |
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Effective date of registration: 20240702 Address after: 100000 106A, Floor 1, B-1, Zhongguancun Dongsheng Science Park, 66 Xixiaokou Road, Haidian District, Northern Territory, Beijing Patentee after: ZIGUANG TONGXIN MICROELECTRONICS CO.,LTD. Country or region after: China Address before: 214135 China Jiangsu Sensor Network International Innovation Park 200, Linghu Avenue, Wuxi new district. Patentee before: WUXI UNIGROUP MICROELECTRONICS CO.,LTD. Country or region before: China |
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