CN205691719U - A kind of semiconductor components and devices insulated test device - Google Patents
A kind of semiconductor components and devices insulated test device Download PDFInfo
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- CN205691719U CN205691719U CN201620538298.6U CN201620538298U CN205691719U CN 205691719 U CN205691719 U CN 205691719U CN 201620538298 U CN201620538298 U CN 201620538298U CN 205691719 U CN205691719 U CN 205691719U
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- semiconductor components
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- test
- pawl
- contact assembly
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Abstract
The open a kind of semiconductor components and devices insulated test device of this utility model, wherein, including one for the pin contact assembly placing semiconductor components and devices and the test pawl contact assembly for described semiconductor components and devices being carried out Insulation test being connected with described pin contact assembly；Described test pawl contact assembly includes a test pawl, for the drive mechanism driving described test pawl to move up and down and the plastic cement block support being fixed together by metal stator and described test pawl.A kind of semiconductor components and devices insulated test device using this utility model to provide, not only increases the stability of semiconductor components and devices Insulation test item, and improves testing efficiency, reduces testing cost, effectively prevent the probability of artificial electric shock simultaneously.
Description
Technical field
This utility model relates to semiconductor components and devices field tests, particularly relates to a kind of semiconductor components and devices Insulation test dress
Put.
Background technology
In recent years, along with the semiconductor components and devices components and parts market competition is more and more fierce, product stability also can be increasingly
High.As parameter testing operation, in addition to testing some conventional parameters, client is it is also proposed that some special test items, and wherein insulate item
It is exactly one of them.According to existing way, hand fit's graphic instrument carried out test insulation before this, went with board test absolutely the most again
Edge.But there is inefficiency, test instability in manual testing, and needs plus kilovoltage, as slightly at test insulation item
Micro-deal with improperly, easily cause the problems such as artificial electric shock accidents.
Therefore, prior art has yet to be improved and developed.
Utility model content
In view of above-mentioned the deficiencies in the prior art, the purpose of this utility model is to provide a kind of semiconductor components and devices insulation to survey
Electricity testing device, it is intended to solve existing semiconductor components and devices Insulation test and use manual testing, it exists, and testing efficiency is low, test
Unstable properties and be susceptible to the problems such as artificial electric shock accidents.
The technical solution of the utility model is as follows:
A kind of semiconductor components and devices insulated test device, wherein, connects for placing the pin of semiconductor components and devices including one
Touch assembly and the test pawl for described semiconductor components and devices being carried out Insulation test being connected with described pin contact assembly
Contact assembly；Described test pawl contact assembly includes a test pawl, for the drive mechanism driving described test pawl to move up and down
And the plastic cement block support being fixed together by metal stator and described test pawl.
It is preferred that described semiconductor components and devices insulated test device, wherein, described pin contact assembly includes one and institute
State pin that semiconductor components and devices connects, be positioned at below described pin for the collets of pin described in support and be positioned at described
The metallic plate of semiconductor components and devices below semiconductor components and devices and described in the support, described metallic plate one end is with power cathode even
Connect.
It is preferred that described semiconductor components and devices insulated test device, wherein, also set up above described semiconductor components and devices
Having a pressure apparatus, described pressure apparatus to include one first cylinder and push rod, in test process, the first cylinder moves downward, and pushes away
Dynamic push rod is downward, makes described semiconductor components and devices be in close contact with metallic plate.
It is preferred that described semiconductor components and devices insulated test device, wherein, described test pawl one end is with positive source even
Connect.
It is preferred that described semiconductor components and devices insulated test device, wherein, described drive mechanism includes one second gas
Cylinder, it is positioned at the carrying fixed support above described second cylinder and the insulating ceramics circle that is connected with described carrying fixed support,
Described test pawl is positioned at described insulating ceramics circle.
It is preferred that described semiconductor components and devices insulated test device, wherein, described plastic cement block support is fixed on quasiconductor
On the installing plate of component testing screening installation.
Beneficial effect: a kind of semiconductor components and devices insulated test device using this utility model to provide, not only increases
The stability of semiconductor components and devices Insulation test item, and improve testing efficiency, reduce testing cost, it is prevented effectively from simultaneously
The probability of artificial electric shock.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of this utility model a kind of semiconductor components and devices insulated test device preferred embodiment.
Detailed description of the invention
This utility model provides a kind of semiconductor components and devices insulated test device, for making the purpose of this utility model, technology
Scheme and effect are clearer, clear and definite, further describe this utility model below.Should be appreciated that described herein
Specific embodiment, only in order to explain this utility model, is not used to limit this utility model.
As it is shown in figure 1, semiconductor components and devices insulated test device of the present utility model, wherein, including one for placing half
The pin contact assembly A of conductor components and parts 10 and being used for described semiconductor element device of being connected with described pin contact assembly A
Part 10 carries out the test pawl contact assembly B of Insulation test.
A kind of semiconductor components and devices insulated test device using this utility model to provide, can not only improve semiconductor element device
The stability of part Insulation test item, and improve testing efficiency, reduce testing cost, effectively prevent artificial electric shock simultaneously
Probability.
Specifically, as it is shown in figure 1, in this utility model, described pin contact assembly A include one with described semiconductor element
Pin 20 that device 10 connects, it is positioned at below described pin 20 for the collets 30 of pin described in support 20 and is positioned at described
The metallic plate 40 of semiconductor components and devices 10, described metallic plate 40 one end and electricity below semiconductor components and devices 10 and described in the support
Source negative pole connects.
Further, described semiconductor components and devices 10 is arranged above a pressure apparatus 50, and described pressure apparatus includes one
First cylinder 51 and push rod 52.Specifically, when described semiconductor components and devices 10 is in test mode, the first cylinder 51 is transported downwards
Dynamic, promote push rod 52 downwards described semiconductor components and devices 10 top to be applied pressure, make bottom described semiconductor components and devices 10 with
Metallic plate 40 is in close contact.
Further, as it is shown in figure 1, in this utility model, described test pawl contact assembly B includes a test pawl 60, uses
It is fixed on described test pawl 60 in the drive mechanism driving described test pawl 60 to move up and down and by metal stator 70
Plastic cement block support 80 together, described test pawl 60 one end is connected with positive source.
Further, described drive mechanism includes one second cylinder 91, is positioned at the carrying above described second cylinder 91 admittedly
Fixed rack 92 and the insulating ceramics circle 93 being connected with described carrying fixed support 92, described test pawl 60 is positioned at described insulation pottery
In porcelain circle 93.
Specifically, described second cylinder 91 drives insulating ceramics circle 93 to move up and down by carrying fixed support 92, due to
Described test pawl 60 is positioned at described insulating ceramics circle 93, and then described insulating ceramics circle 93 drives and moves down on described test pawl 60
Dynamic, make described test pawl 60 contact with described pin 20 or separate.It is preferred that described test pawl 60 and the basis of described pin 20
Mode is face contact.
Further, in this utility model, described plastic cement block support 80 is fixed on semiconductor components and devices testing, sorting equipment
Installing plate 90 on.
In sum, a kind of semiconductor components and devices insulated test device using this utility model to provide, not only increase
The stability of semiconductor components and devices Insulation test item, and improve testing efficiency, reduce testing cost, it is prevented effectively from simultaneously
The probability of artificial electric shock.
It should be appreciated that application of the present utility model is not limited to above-mentioned citing, those of ordinary skill in the art are come
Saying, can be improved according to the above description or convert, all these modifications and variations all should belong to the appended power of this utility model
The protection domain that profit requires.
Claims (6)
1. a semiconductor components and devices insulated test device, it is characterised in that include for placing drawing of semiconductor components and devices
Foot contact assembly and the survey for described semiconductor components and devices being carried out Insulation test being connected with described pin contact assembly
Examination pawl contact assembly；Described test pawl contact assembly includes a test pawl, for the driving driving described test pawl to move up and down
Mechanism and the plastic cement block support being fixed together by metal stator and described test pawl.
Semiconductor components and devices insulated test device the most according to claim 1, it is characterised in that described pin contact assembly
The pin that is connected with described semiconductor components and devices including one, be positioned at below described pin for pin described in support collets with
And be positioned at below described semiconductor components and devices and for the metallic plate of semiconductor components and devices described in support, described metallic plate one end with
Power cathode connects.
Semiconductor components and devices insulated test device the most according to claim 2, it is characterised in that described semiconductor components and devices
Being arranged above a pressure apparatus, described pressure apparatus includes one first cylinder and push rod, in test process, the first cylinder to
Lower motion, promotes push rod downward, makes described semiconductor components and devices be in close contact with metallic plate.
Semiconductor components and devices insulated test device the most according to claim 1, it is characterised in that described test pawl one end with
Positive source connects.
Semiconductor components and devices insulated test device the most according to claim 4, it is characterised in that described drive mechanism includes
One second cylinder, it is positioned at the carrying fixed support above described second cylinder and the insulation that is connected with described carrying fixed support
Porcelain ring, described test pawl is positioned at described insulating ceramics circle.
Semiconductor components and devices insulated test device the most according to claim 4, it is characterised in that described plastic cement block support is solid
It is scheduled on the installing plate of semiconductor components and devices testing, sorting equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620538298.6U CN205691719U (en) | 2016-06-06 | 2016-06-06 | A kind of semiconductor components and devices insulated test device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620538298.6U CN205691719U (en) | 2016-06-06 | 2016-06-06 | A kind of semiconductor components and devices insulated test device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205691719U true CN205691719U (en) | 2016-11-16 |
Family
ID=57260905
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620538298.6U Active CN205691719U (en) | 2016-06-06 | 2016-06-06 | A kind of semiconductor components and devices insulated test device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205691719U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117289094A (en) * | 2023-09-27 | 2023-12-26 | 江苏卓玉智能科技有限公司 | Insulation testing device for semiconductor components |
-
2016
- 2016-06-06 CN CN201620538298.6U patent/CN205691719U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117289094A (en) * | 2023-09-27 | 2023-12-26 | 江苏卓玉智能科技有限公司 | Insulation testing device for semiconductor components |
| CN117289094B (en) * | 2023-09-27 | 2024-04-19 | 江苏卓玉智能科技有限公司 | Insulation testing device for semiconductor components |
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| GR01 | Patent grant |