CN205685656U - A kind of electronic devices and components encapsulation lower mold - Google Patents
A kind of electronic devices and components encapsulation lower mold Download PDFInfo
- Publication number
- CN205685656U CN205685656U CN201620643298.2U CN201620643298U CN205685656U CN 205685656 U CN205685656 U CN 205685656U CN 201620643298 U CN201620643298 U CN 201620643298U CN 205685656 U CN205685656 U CN 205685656U
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- CN
- China
- Prior art keywords
- glue
- feeder
- electronic devices
- components
- groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Standing Axle, Rod, Or Tube Structures Coupled By Welding, Adhesion, Or Deposition (AREA)
Abstract
This utility model relates to a kind of electronic devices and components encapsulation lower mold, it includes pedestal, the glue-feeder being formed at described pedestal upper surface centre, is arranged at many locating dowels of described pedestal upper surface and is opened in described pedestal upper surface and the multiple element fixed mechanisms being connected with described glue-feeder, and described fixed mechanism is about described glue-feeder centrosymmetry；Each described fixed mechanism include multiple spaced fixing projection and be formed between described fixing projection and be connected with described glue-feeder enter glue runner and be embedded at described fixing projection in and with described enter multiple rows of fixed cell of being connected of glue runner, described fixed cell includes holding glue groove and is connected and spaced multiple stitch groove and the fixing post that holds in glue groove described in being arranged at the described glue groove that holds.So it is capable of the fixed clamp to electronic devices and components, and utilizes glue-feeder, enter glue runner and the cooperation held between glue groove makes epoxide-resin glue import the corresponding position of electronic devices and components and solidify.
Description
Technical field
This utility model relates to a kind of electronic component mould, is specifically related to a kind of electronic devices and components encapsulation lower mold.
Background technology
Electronic devices and components are electronic component and the small-sized machine of electricity, the ingredient of instrument, and itself is often by some parts
Constitute, can be general in like product；Often refer to some part of the industry such as electrical equipment, radio, instrument, as electric capacity, transistor,
The general name of the sub-device such as hairspring, clockwork spring.Common are diode etc..
Existing electronic devices and components generally comprise the current-carrying part prepared by metal material and have insulant to prepare
Non-conductive section.And metal material is typically tiny tinsel or wire netting, and insulant is typically epoxy resin etc..
How being introduced by epoxy resin on metal material and carrying out solidifying in the position needed is the difficult point of Electronic Components Manufacturing, and this is just
Need accurate making encapsulating mould.
Summary of the invention
This utility model purpose is to provide a kind of electronic devices and components encapsulation lower mold to overcome the deficiencies in the prior art.
For reaching above-mentioned purpose, the technical solution adopted in the utility model is: a kind of electronic devices and components encapsulation lower mold, its bag
Include pedestal, be formed at described pedestal upper surface centre glue-feeder, be arranged at many locating dowels of described pedestal upper surface with
And be opened in described pedestal upper surface and the multiple element fixed mechanisms being connected with described glue-feeder, described fixed mechanism about
Described glue-feeder centrosymmetry；Each described fixed mechanism includes multiple spaced fixing projection, is formed at described fixing
Be connected between projection and with described glue-feeder enter glue runner and be embedded at described fixing projection in and with described enter glue stream
Multiple rows of fixed cell that road is connected, described fixed cell includes that holding glue groove is connected and spaced with the described glue groove that holds
Multiple stitch grooves and the fixing post holding in glue groove described in being arranged at.
Further, described fixed mechanism also includes the multiple positioning convex being arranged on described fixing projection.
Optimally, described pedestal side is provided with the fixture block offering positioning through hole.
Owing to technique scheme is used, this utility model compared with prior art has the advantage that this utility model
Electronic devices and components encapsulation lower mold, by using the fixed mechanism of ad hoc structure, is so capable of fixing electronic devices and components
Clamping, and utilize glue-feeder, enter glue runner and the cooperation held between glue groove makes epoxide-resin glue import the right of electronic devices and components
Answer position and solidify.
Accompanying drawing explanation
Accompanying drawing 1 is the structural representation of this utility model electronic devices and components encapsulation lower mold；
Wherein, 1, pedestal；2, locating dowel；3, fixture block；31, positioning through hole；4, glue-feeder；5, fixed mechanism；51, fixing convex
Block；52, glue runner is entered；53, fixed cell；531, glue groove is held；532, stitch groove；533, fixing post；54, positioning convex.
Detailed description of the invention
Below in conjunction with accompanying drawing, this utility model preferred embodiment is described in detail:
Electronic devices and components encapsulation lower mold as shown in Figure 1, mainly includes pedestal 1, locating dowel 2, glue-feeder 4 and fixed mechanism
5。
Wherein, glue-feeder 4 is formed at the upper face center of pedestal 1, corresponding with the structure of encapsulation upper mold, for envelope
Load mould and introduce epoxide-resin glue.Locating dowel 2 is also disposed on the upper surface of pedestal 1, is normally at its corner, plays upper and lower mould
Primary Location and the effect of clamping.Fixed mechanism 5 has multiple, and they are opened in pedestal 1 upper surface and are connected with glue-feeder 4,
And about glue-feeder 4 centrosymmetry.
Each fixed mechanism 5 includes fixing projection 51, enters glue runner 52 and fixed cell 53.Fixing projection 51 has multiple,
They are spaced setting；In the present embodiment being three, bigger is in centre, and two less is positioned at its both sides.Enter glue runner 52
It is formed between fixing projection 51 and between fixing projection 51 and pedestal 1, for introducing glue to fixed mechanism 5.Fixing single
Unit 53 forms multiple rows of (often row has multiple fixed cell 53), is used for installing electronic component material belt；Each fixed cell 53 includes
Hold glue groove 531 and hold glue groove 531 and be connected and spaced multiple stitch groove 532(is for putting electronic device material strip
Stitch) and it is arranged at the fixing post 533 holding in glue groove 531, so enable to the glue correspondence at electronic component material belt
Position solidifies.
In the present embodiment, fixed mechanism 5 also includes the multiple positioning convex 54 being arranged on fixing projection 51, for electricity
The precise positioning of sub-components and parts material strip.The side of pedestal 1 is provided with the fixture block 3 offering positioning through hole 31, is also to play upper and lower mould
The effect of location.
Above-described embodiment only for technology of the present utility model design and feature are described, its object is to allow and is familiar with technique
Personage will appreciate that content of the present utility model and implement according to this, protection domain of the present utility model can not be limited with this,
All according to this utility model spirit made equivalence change or modify, all should contain protection domain of the present utility model it
In.
Claims (3)
1. an electronic devices and components encapsulation lower mold, it is characterised in that: it includes pedestal (1), is formed at described pedestal (1) upper surface
The glue-feeder (4) of centre, it is arranged at many locating dowels (2) of described pedestal (1) upper surface and is opened in described pedestal (1)
Upper surface and the multiple element fixed mechanisms (5) being connected with described glue-feeder (4), described fixed mechanism (5) about described enter
Jiao Kou (4) centrosymmetry；Each described fixed mechanism (5) include multiple spaced fixing projection (51), be formed at described
Be connected between fixing projection (51) and with described glue-feeder (4) enters glue runner (52) and is embedded at described fixing projection
(51) in and with described enter multiple rows of fixed cell (53) of being connected of glue runner (52), described fixed cell (53) includes holding glue groove
(531) it is connected and spaced multiple stitch groove (532) and hold glue groove described in being arranged at the described glue groove (531) that holds
(531) the fixing post (533) in.
Electronic devices and components the most according to claim 1 encapsulation lower mold, it is characterised in that: described fixed mechanism (5) also includes
It is arranged at the multiple positioning convex (54) on described fixing projection (51).
Electronic devices and components the most according to claim 1 encapsulation lower mold, it is characterised in that: described pedestal (1) side is provided with out
It is provided with the fixture block (3) of positioning through hole (31).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620643298.2U CN205685656U (en) | 2016-06-27 | 2016-06-27 | A kind of electronic devices and components encapsulation lower mold |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620643298.2U CN205685656U (en) | 2016-06-27 | 2016-06-27 | A kind of electronic devices and components encapsulation lower mold |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205685656U true CN205685656U (en) | 2016-11-16 |
Family
ID=57425138
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620643298.2U Expired - Fee Related CN205685656U (en) | 2016-06-27 | 2016-06-27 | A kind of electronic devices and components encapsulation lower mold |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205685656U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106863707A (en) * | 2017-02-27 | 2017-06-20 | 重庆达标电子科技有限公司 | Axial diode injection mold |
-
2016
- 2016-06-27 CN CN201620643298.2U patent/CN205685656U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106863707A (en) * | 2017-02-27 | 2017-06-20 | 重庆达标电子科技有限公司 | Axial diode injection mold |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20161116 Termination date: 20200627 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |