CN205685636U - Semiconductor plastic package release sheet - Google Patents
Semiconductor plastic package release sheet Download PDFInfo
- Publication number
- CN205685636U CN205685636U CN201620582904.4U CN201620582904U CN205685636U CN 205685636 U CN205685636 U CN 205685636U CN 201620582904 U CN201620582904 U CN 201620582904U CN 205685636 U CN205685636 U CN 205685636U
- Authority
- CN
- China
- Prior art keywords
- matrix
- implant
- plastic package
- semiconductor plastic
- high temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Materials For Medical Uses (AREA)
Abstract
This utility model relates to semiconductor plastic package release sheet, including matrix, implant, it is characterised in that described implant is uniformly embedded on matrix, and described matrix is made up of high temperature resistant sponge, and all there is implant on the two sides of described matrix.In production process, paraffin sheet is selected to be arranged on matrix both sides as implant, matrix is the high temperature resistant sponge of thickness 1mm, melted by heat and make paraffin sheet merge with high temperature resistant sponge, during use, semiconductor plastic package release sheet described in the utility model is rotated in mold cavity in advance, when carrying out semiconductor plastic package, implant is oozed out from matrix, and form steam by high temperature and be attached to mold cavity surface, thus the purpose that can successfully come off from mold cavity after realizing plastic packaging material solidification, overcome prior art and use clear mould adhesive tape and the loaded down with trivial details of mould release of spraying, complicated, the shortcomings such as waste.
Description
Technical field
This utility model relates to producing apparatus field, specifically semiconductor plastic package release sheet.
Background technology
Mould be in commercial production in order to be molded, to be blow molded, to extrude, the side such as die casting or forging forming, smelting, punching press, stretching
Method obtains various moulds and the instrument of required product.In brief, mould is used to the instrument of formed article, this instrument by
Various parts are constituted, and different moulds is made up of different parts.It is mainly come by the change of institute's moulding material physical state
Realize the processing of article profile.By the difference of the material of institute's molding, mould can be divided into metal die and nonmetal mould.Metal pattern
Tool is divided into again: casting mould (non-ferrous metal die casting, steel casting) and forging mold etc..
Mould is by the processing technique classification of processing metal, and conventional has: stamping die, including blanking die, bending die, drawing
Mould, flange die, reducing die, forcer, bulging die, sizing die etc.；Forging die, including die forging forging die, upsetting die etc.；And extruding
Mould and compression mod.Diel is the mould separated with blanking for sheet metal forming, including blanking die, bending die, drawing
Mould and plunging die etc..In diel, by mold cavity to sheet forming, by the stamping-out cutting edge of diel to plate
Implement to separate or cutting.The most frequently used diel only one of which station, completes one production process.For improving productivity ratio, can
By multi-step forming processes, as by process step design such as blanking, drawing, punching, trimmings in a diel, make plate at one
Completing multi-step forming processes on station, this diel is referred to as compound die.
In the prior art, when carrying out semiconductor plastic package process, after plastic packaging material solidification, it is difficult to depart from from die cavity, mesh
Front use clear mould adhesive tape or spraying mould release realize the demoulding after semiconductor plastic package, but this mode is loaded down with trivial details, complicated, and resource
Waste is serious.
Utility model content
This utility model is precisely in order to solve the problems referred to above, it is provided that one can be greatly saved raw material, easy to use, knot
Structure simple semiconductor plastic package release sheet.
This utility model is achieved through the following technical solutions:
Semiconductor plastic package release sheet, including matrix, implant, it is characterised in that described implant is uniformly embedded in matrix
On, described matrix is made up of high temperature resistant sponge, and all there is implant on the two sides of described matrix.Implant is paraffin.Implant is passed through
Heat is melted and matrix boil down to one.Matrix thickness is 1mm.
In production process, selecting paraffin sheet to be arranged on matrix both sides as implant, matrix is the high temperature resistant sea of thickness 1mm
Silk floss, is melted by heat and makes paraffin sheet merge with high temperature resistant sponge, during use, is used by semiconductor plastic package described in the utility model
Release sheet is rotated in mold cavity in advance, and when carrying out semiconductor plastic package, implant is oozed out from matrix, and is formed by high temperature
Steam and be attached to mold cavity surface, thus realize the mesh that can successfully come off from mold cavity after plastic packaging material solidification
, overcome prior art and use clear mould adhesive tape and the shortcoming such as loaded down with trivial details, complicated, waste of spraying mould release.
This utility model simple in construction, easy to use, with low cost.
Accompanying drawing explanation
In accompanying drawing, Fig. 1 is structural representation of the present utility model, wherein:
1 matrix, 2 implants.
Detailed description of the invention
The utility model is described in further detail below in conjunction with the accompanying drawings.
Semiconductor plastic package release sheet, including matrix 1, implant 2, it is characterised in that described implant 2 is uniformly embedded in
On matrix 1, described matrix 1 is made up of high temperature resistant sponge, and all there is implant 2 on the two sides of described matrix 1.Implant 2 is paraffin.Fill out
Fill thing 2 to be melted and matrix 1 boil down to one by heat.Matrix 1 thickness is 1mm.
In production process, selecting paraffin sheet to be arranged on matrix 1 both sides as implant 2, matrix 1 is the resistance to height of thickness 1mm
Temperature sponge, is melted by heat and makes paraffin sheet merge with high temperature resistant sponge, during use, moulded by quasiconductor described in the utility model
Envelope release sheet is rotated in mold cavity in advance, and when carrying out semiconductor plastic package, implant 2 is oozed out from matrix 1, and by height
Temperature forms steam and is attached to mold cavity surface, thus can successfully come off from mold cavity after realizing plastic packaging material solidification
Purpose, overcome prior art and use clear mould adhesive tape and the shortcoming such as loaded down with trivial details, complicated, waste of spraying mould release.
Above-described embodiment only for technology of the present utility model design and feature are described, its object is to allow and is familiar with technique
Personage will appreciate that content of the present utility model and implement according to this, protection domain of the present utility model can not be limited with this.
All according to this utility model spirit made equivalence change or modify, all should contain protection domain of the present utility model it
In.
Claims (4)
1. semiconductor plastic package release sheet, including matrix, implant, it is characterised in that described implant is uniformly embedded in matrix
On, described matrix is made up of high temperature resistant sponge, and all there is implant on the two sides of described matrix.
Semiconductor plastic package release sheet the most according to claim 1, it is characterised in that described implant is paraffin.
Semiconductor plastic package release sheet the most according to claim 1, it is characterised in that described implant is melted by heat and base
Body boil down to one.
Semiconductor plastic package release sheet the most according to claim 1, it is characterised in that described matrix thickness is 1mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620582904.4U CN205685636U (en) | 2016-06-16 | 2016-06-16 | Semiconductor plastic package release sheet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620582904.4U CN205685636U (en) | 2016-06-16 | 2016-06-16 | Semiconductor plastic package release sheet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205685636U true CN205685636U (en) | 2016-11-16 |
Family
ID=57428139
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620582904.4U Expired - Fee Related CN205685636U (en) | 2016-06-16 | 2016-06-16 | Semiconductor plastic package release sheet |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205685636U (en) |
-
2016
- 2016-06-16 CN CN201620582904.4U patent/CN205685636U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20161116 Termination date: 20180616 |