CN205680661U - Silicon wafer cleaning and drying machine - Google Patents
Silicon wafer cleaning and drying machine Download PDFInfo
- Publication number
- CN205680661U CN205680661U CN201620457944.6U CN201620457944U CN205680661U CN 205680661 U CN205680661 U CN 205680661U CN 201620457944 U CN201620457944 U CN 201620457944U CN 205680661 U CN205680661 U CN 205680661U
- Authority
- CN
- China
- Prior art keywords
- wafer cleaning
- inlet pipe
- magnetic valve
- cleaning drier
- end cap
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004140 cleaning Methods 0.000 title claims abstract description 31
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 28
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 26
- 239000010703 silicon Substances 0.000 title claims abstract description 26
- 238000001035 drying Methods 0.000 title abstract description 19
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 22
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 16
- 239000007788 liquid Substances 0.000 claims description 8
- 229910052757 nitrogen Inorganic materials 0.000 claims description 8
- 238000009413 insulation Methods 0.000 claims description 5
- 230000005611 electricity Effects 0.000 claims description 2
- 230000037081 physical activity Effects 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 12
- 238000004519 manufacturing process Methods 0.000 abstract description 10
- 238000003912 environmental pollution Methods 0.000 abstract description 4
- 238000007789 sealing Methods 0.000 abstract 2
- 238000004321 preservation Methods 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 description 20
- 239000007789 gas Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000010276 construction Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000012857 repacking Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 210000002268 wool Anatomy 0.000 description 1
Landscapes
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The utility model relates to a silicon chip washs drier. The problems that cleaning and drying can not be carried out simultaneously and the drying effect is poor in the production process of the solar silicon wafer are mainly solved. The end cover on open and to have the through-hole, through-hole upper portion sealing connection has the inlet tube, through-hole lower extreme sealing connection has the connecting pipe, the connecting pipe lower extreme is connected with the disc, be connected with the intake pipe on the inlet tube, the disc bottom surface is covered with the nozzle, the end cover in be equipped with electric heater unit and heat preservation, bottom of the body be equipped with the outlet. The silicon wafer cleaning and spin-drying machine integrates cleaning and spin-drying, improves production efficiency, reduces labor cost, has good drying effect, improves product quality, and has the advantages of simple structure, no environmental pollution, easiness in popularization and the like.
Description
Technical field
The utility model relates to a kind of drier, is specifically related to a kind of Wafer Cleaning drier.
Background technology
The production process of solar silicon wafers typically requires and relates to the various step cleaned and dry, and in tradition work
Cleaning in skill and drying and be all divided into what two operations completed, this mode of production greatly reduces production efficiency, improves people
Work cost, and, traditional drier general drying effect difference, operation still has part silicon chip moist, is bonded together after completing.
It cannot be guaranteed that whole silicon chips are dried separately, these silicon chips not being completely dried without being found to process in time, Jiu Hui
Silicon chip surface leaves water mark, has influence on surface wool manufacturing quality and the color consistency of cell piece, and serious even resulting in is cleaned by
Silicon chip surface is off quality and scraps.
Utility model content
In order to overcome the deficiency of background technology, the utility model provides a kind of Wafer Cleaning drier, mainly solves too
Sun can not be carried out and the problem of drying effect difference simultaneously in cleaning and drying in the production process of silicon chip, and this Wafer Cleaning gets rid of
Dry machine integrates cleaning and dries, and improves production efficiency, reduces cost of labor, and drying effect is good, improves product
Quality, has simple in construction, free from environmental pollution, it is easy to the advantages such as popularization.
The utility model be the technical scheme is that a kind of Wafer Cleaning drier, including propping up on body, body
Frame, end cap, motor and the silicon wafer carrying device being connected with motor, be provided with cavity, described silicon wafer carrying device in described body
Being placed in cavity, described end cap having through hole, through hole top seal is connected with water inlet pipe, and through hole lower end is sealedly connected with even
Adapter, described connecting tube lower end is connected with disk, and described water inlet pipe is connected with air inlet pipe, and described disk bottom surface is covered with nozzle,
Being provided with electric heater unit and heat-insulation layer in described end cap, described organism bottom is provided with discharge outlet.
Further, described water inlet pipe, air inlet pipe and discharge outlet are respectively equipped with the first magnetic valve, the second magnetic valve and
3rd magnetic valve.
Further, described end cap is provided with hinge, and end cap is connected with body activities by hinge.
Further, described water inlet pipe is connected with pond, is provided with booster pump in described pond.
Further, described air inlet pipe is connected with elevated pressure nitrogen source of the gas.
Further, described body inwall is provided with temperature sensor and liquid level sensor.
Further, described nozzle diameter is 0.5mm ~ 0.2mm.
Further, described Wafer Cleaning drier also includes PLC control centre, described the first magnetic valve, second
During magnetic valve, the 3rd magnetic valve, temperature sensor, liquid level sensor, motor, booster pump and electric heater unit all control with PLC
The heart connects.
The beneficial effects of the utility model are: owing to taking technique scheme, and this Wafer Cleaning drier collection cleans and gets rid of
Do in one, improve production efficiency, reduce cost of labor, and drying effect is good, improves product quality, has structure
Simply, free from environmental pollution, it is easy to the advantages such as popularization.
Brief description
Fig. 1 is structural representation of the present utility model.
Fig. 2 is the top view of end cap 3 in Fig. 1.
Fig. 3 is the upward view of disk 9 in Fig. 1.
1st, body in figure;2nd, support;3rd, end cap;4th, silicon wafer carrying device;5th, cavity;6th, through hole;7th, water inlet pipe;8th, connect
Pipe;9th, disk;10th, air inlet pipe;11st, nozzle;12nd, electric heater unit;13rd, heat-insulation layer;14th, discharge outlet;15th, the first magnetic valve;
16th, hinge;17th, pond;18th, elevated pressure nitrogen source of the gas;19th, temperature sensor;20th, liquid level sensor;21st, motor;22nd, the second electromagnetism
Valve;23rd, the 3rd magnetic valve.
Detailed description of the invention
Below in conjunction with the accompanying drawings the utility model embodiment is described further.
As Fig. 1 combines shown in Fig. 2, Fig. 3, a kind of Wafer Cleaning drier, including support the 2nd, the end cap on body the 1st, body 1
3rd, motor 21 and the silicon wafer carrying device 4 being connected with motor 21, be provided with cavity 5, described silicon wafer carrying device in described body 1
4 are placed in cavity 5, and described end cap 6 has through hole 6, and through hole 6 top seal is connected with water inlet pipe 7, and through hole 6 lower end seals
Being connected with connecting tube 8, described connecting tube 8 lower end is connected with disk 9, described water inlet pipe 7 is connected with air inlet pipe 10, described disk
9 bottom surfaces are covered with nozzle 11, are provided with electric heater unit 12 and heat-insulation layer 13, the row of being provided with bottom described body 1 in described end cap 3
The mouth of a river 14, is internally provided with electric heater unit 12 and heat-insulation layer 13 at end cap 3, in order to silicon chip is being carried out by Wafer Cleaning drier
During drying, for the carrying out of silicon chip is heated, it is possible to increase speed that silicon chip surface is dried and drying effect.
Preferably, described water inlet pipe the 7th, air inlet pipe 10 and discharge outlet 14 are respectively equipped with the first magnetic valve the 15th, the second electricity
Magnet valve 22 and the 3rd magnetic valve 23, described end cap 3 is provided with hinge 16, and end cap 3 is flexibly connected with body 1 by hinge 16,
Described water inlet pipe 7 is connected with pond 17, is provided with booster pump in described pond 17, and when cleaning, booster pump can make current
Form higher hydraulic pressure, make current eject from the nozzle 11 of disk 9, utilize current to wash away the impurity on silicon chip, improve
Wafer Cleaning efficiency.
Preferably, described air inlet pipe 10 is connected with elevated pressure nitrogen source of the gas 18, when drying, is passed through high pressure nitrogen, high pressure
When nitrogen flows through disk 9, ejection from the nozzle 11 of disk 9 forms scattered air-flow, under air-flow and centrifugal action,
Drying efficiency and drying effect can be improved.
Preferably, described body 1 inwall is provided with temperature sensor 19 and liquid level sensor 20, and described nozzle 11 is straight
Footpath is 0.5mm ~ 0.2mm, and described Wafer Cleaning drier also includes PLC control centre, the first described magnetic valve the 15th, second
Magnetic valve the 22nd, the 3rd magnetic valve the 23rd, temperature sensor the 19th, liquid level sensor the 20th, motor the 21st, booster pump and electric heater unit 12 is equal
Being connected with PLC control centre, during cleaning and being dried, temperature sensor 19 and liquid level sensor 20 can reflect machine in real time
Temperature in body 1 and water level conditions are to PLC control centre, when temperature and water level are too high, it will stop adding to body 1
Heat and water supply.
Its course of work is as described below: when needs clean, is placed in silicon chip on silicon wafer carrying device 4, covers
End cap 3, opens the first magnetic valve 15 on water inlet pipe 7, and water inlet pipe 7 water supply start under the effect of booster pump, current flow through circle
Spraying from nozzle 11 after dish 9, silicon chip is rinsed by the current being formed with certain pressure, and motor 21 drives silicon chip to carry simultaneously
Device 4 rotates, and under the effect of centrifugal force and current, is carried out silicon chip, after completing to clean, and the on opening water discharge mouth 14
Three magnetic valves 23, make water discharge at discharge outlet 14;When drying, the second magnetic valve 22 opened in air inlet pipe 10 is passed through
High pressure nitrogen, simultaneously driven by motor silicon wafer carrying device 4 High Rotation Speed, utilize centrifugal force to be dried, be passed through high pressure nitrogen
Can form steady air flow to take away steam and improve drying effect, above control process Jun You PLC control centre realizes automation
Control.
This Wafer Cleaning drier integrates cleaning and dries, and improves production efficiency, reduces cost of labor, Er Qiegan
Dry effect is good, improves product quality, has simple in construction, free from environmental pollution, it is easy to the advantages such as popularization.
Every technical staff's notice: although the utility model describes according to above-mentioned detailed description of the invention, but this
The invention thought of utility model is not limited to that utility model, the repacking of any utilization inventive concept, all will include this in specially
In profit scope of patent protection.
Claims (8)
1. a Wafer Cleaning drier, including support on body, body, end cap, motor and the silicon chip being connected with motor hold
Carrying and putting, be provided with cavity in described body, described silicon wafer carrying device is placed in cavity, it is characterised in that: described end cap
On have through hole, through hole top seal is connected with water inlet pipe, and through hole lower end is sealedly connected with connecting tube, and described connecting tube lower end is even
Being connected to disk, described water inlet pipe being connected with air inlet pipe, described disk bottom surface is covered with nozzle, is provided with electrical heating in described end cap
Device and heat-insulation layer, described organism bottom is provided with discharge outlet.
2. Wafer Cleaning drier according to claim 1, it is characterised in that: described water inlet pipe, air inlet pipe and draining
It is respectively equipped with the first magnetic valve, the second magnetic valve and the 3rd magnetic valve on Kou.
3. Wafer Cleaning drier according to claim 1, it is characterised in that: described end cap is provided with hinge, end cap
It is connected with body activities by hinge.
4. Wafer Cleaning drier according to claim 2, it is characterised in that: described water inlet pipe is connected with pond, institute
It is provided with booster pump in stating pond.
5. Wafer Cleaning drier according to claim 1, it is characterised in that: described air inlet pipe is connected with high pressure nitrogen
Source.
6. Wafer Cleaning drier according to claim 4, it is characterised in that: described body inwall is provided with temperature and passes
Sensor and liquid level sensor.
7. Wafer Cleaning drier according to claim 1, it is characterised in that: described nozzle diameter be 0.5mm ~
0.2mm。
8. Wafer Cleaning drier according to claim 6, it is characterised in that: described Wafer Cleaning drier also includes
PLC control centre, described the first magnetic valve, the second magnetic valve, the 3rd magnetic valve, temperature sensor, liquid level sensor, electricity
Machine, booster pump and electric heater unit are all connected with PLC control centre.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201620457944.6U CN205680661U (en) | 2016-05-18 | 2016-05-18 | Silicon wafer cleaning and drying machine |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201620457944.6U CN205680661U (en) | 2016-05-18 | 2016-05-18 | Silicon wafer cleaning and drying machine |
Publications (1)
Publication Number | Publication Date |
---|---|
CN205680661U true CN205680661U (en) | 2016-11-09 |
Family
ID=57436010
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201620457944.6U Expired - Fee Related CN205680661U (en) | 2016-05-18 | 2016-05-18 | Silicon wafer cleaning and drying machine |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN205680661U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109065485A (en) * | 2018-09-04 | 2018-12-21 | 江苏晶品新能源科技有限公司 | A kind of monocrystalline silicon production line silicon wafer high-efficiency washing device |
CN112802782A (en) * | 2021-03-29 | 2021-05-14 | 西安奕斯伟硅片技术有限公司 | Pretreatment system and method for testing minority carrier lifetime of monocrystalline silicon wafer by charge passivation |
-
2016
- 2016-05-18 CN CN201620457944.6U patent/CN205680661U/en not_active Expired - Fee Related
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109065485A (en) * | 2018-09-04 | 2018-12-21 | 江苏晶品新能源科技有限公司 | A kind of monocrystalline silicon production line silicon wafer high-efficiency washing device |
CN112802782A (en) * | 2021-03-29 | 2021-05-14 | 西安奕斯伟硅片技术有限公司 | Pretreatment system and method for testing minority carrier lifetime of monocrystalline silicon wafer by charge passivation |
CN112802782B (en) * | 2021-03-29 | 2022-04-05 | 西安奕斯伟硅片技术有限公司 | Pretreatment system and method for testing minority carrier lifetime of monocrystalline silicon wafer by charge passivation |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee | ||
CP02 | Change in the address of a patent holder |
Address after: 325000 Wenzhou economic and Technological Development Zone, Zhejiang Binhai Road, No. twelve, No. 500 Patentee after: Zhejiang shun new energy Co. Ltd. Address before: The streets of Yongxing Yongle Village in Longwan District of Wenzhou City, Zhejiang province 325000 Hing Road No. 51 Patentee before: Zhejiang shun new energy Co. Ltd. |
|
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20161109 Termination date: 20190518 |
|
CF01 | Termination of patent right due to non-payment of annual fee |