CN205674494U - A kind of 3D printer platform - Google Patents
A kind of 3D printer platform Download PDFInfo
- Publication number
- CN205674494U CN205674494U CN201620568764.5U CN201620568764U CN205674494U CN 205674494 U CN205674494 U CN 205674494U CN 201620568764 U CN201620568764 U CN 201620568764U CN 205674494 U CN205674494 U CN 205674494U
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- plate
- semiconductor chilling
- heat
- chilling plate
- conducting
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Abstract
The open a kind of 3D printer platform of the utility model, including base plate, panel, heat-conducting plate and microcomputer, it is provided with groove on described base plate and panel, described heat-conducting plate is installed in groove, described heat-conducting plate and groove agree with, it is provided with the first semiconductor chilling plate and the second semiconductor chilling plate on described heat-conducting plate, described first semiconductor chilling plate and the second semiconductor chilling plate are provided with cold end face and hot junction face, described first semiconductor chilling plate rectangular array distribution, described second semiconductor chilling plate rectangular array is distributed in the first semiconductor chilling plate area defined, the hot junction face of described first semiconductor chilling plate is embedded in heat-conducting plate, the cold end face of described second semiconductor chilling plate is embedded in heat-conducting plate, described panel sides is provided with heat insulating mattress, described microcomputer is embedded in heat insulating mattress and arranges；This 3D printer platform can carry out heating and freezing, and applicability is good.
Description
Technical field
The utility model relates to a kind of 3D printer platform.
Background technology
The one of 3 D-printing, i.e. RP technique, based on it is a kind of mathematical model file, uses powdered gold
Belong to or plastics etc. can jointing material, by way of successively printing, carry out the technology of constructed object.Past, it was often in Making mold, work
The fields such as industry design are used for modeling, are now increasingly used for the direct manufacture of some products.Particularly some high values should
With the parts having had this technology of use to print." 3 D-printing " means the universal of this technology.3 D-printing
It is typically with digital technology file printing machine to realize.The yield of this printer and sales volume since 21st century just
Having been obtained for increasing greatly, its price also just declines year by year.3D prints and brings worldwide manufacturing industry revolution, is portion in the past
Can part design the production technology that places one's entire reliance upon and realize, and the appearance of 3D printer, it will overturning this production thinking, this makes
Enterprise does not consider further that production technology problem when producing parts, and the design of any complicated shape all can pass through 3D printer
Realize.
But the platform kind of 3D printer on the market is single at present, bad to special adaptability for materials, is unfavorable for
The development of 3 D-printing.
Utility model content
The technical problems to be solved in the utility model is to provide one and can carry out heating and freezing, and the good 3D of applicability prints
Machine platform.
For solving the problems referred to above, the utility model adopts the following technical scheme that
A kind of 3D printer platform, including base plate, panel, heat-conducting plate and microcomputer, described base plate and panel is all provided with
Being equipped with groove, described heat-conducting plate is installed in groove, and described heat-conducting plate and groove agree with, and described heat-conducting plate is provided with the first half
Conductor cooling piece and the second semiconductor chilling plate, described first semiconductor chilling plate and the second semiconductor chilling plate are provided with cold
End face and hot junction face, described first semiconductor chilling plate rectangular array distribution, the described second rectangular battle array of semiconductor chilling plate
Column distribution is in the first semiconductor chilling plate area defined, and the hot junction face of described first semiconductor chilling plate is embedded in heat conduction
In plate, the cold end face of described second semiconductor chilling plate is embedded in heat-conducting plate, and described panel sides is provided with heat insulating mattress, described
Microcomputer is embedded in heat insulating mattress and arranges.
As preferably, described panel and heat insulating mattress removably connect, easy accessibility, connect reliable, facilitate user to clean
And replacing.
As preferably, described base plate and panel mortise-tenon joint, bond strength is high, and good stability is durable in use.
As preferably, cell wall and the bottom surface of described groove are provided with heat conducting coating, can promote leading of base plate and panel
Hot property.
As preferably, described base plate being inlaid with temperature sensor, described temperature sensor is electrically connected with microcomputer,
The temperature of base plate can be detected.
As preferably, described temperature sensor is distributed in a # shape, and can reduce the error of detection.
The beneficial effects of the utility model are: be provided by the first semiconductor chilling plate and the second semiconductor chilling plate,
And the hot junction face of the first semiconductor chilling plate is embedded in heat-conducting plate, the cold end face of the second semiconductor chilling plate is embedded in heat conduction
In plate, the first semiconductor chilling plate and the second semiconductor chilling plate equal rectangular array distribution, can play good heating and
Refrigeration, such that it is able to change the surface temperature of platform according to the character of different materials, applicability is good, additionally, panel
Removably connect with heat insulating mattress, easy accessibility, connect reliable, facilitate user to clean and change, base plate and panel mortise-tenon joint,
Bond strength is high, good stability, and durable in use, cell wall and the bottom surface of groove are provided with heat conducting coating, can promote base plate and
The heat conductivility of panel, base plate is inlaid with temperature sensor, and temperature sensor is electrically connected with microcomputer, can be to base plate
Temperature detect, temperature sensor is distributed in a # shape, and can reduce the error of detection.
Brief description
For the technical scheme being illustrated more clearly that in the utility model embodiment, required in embodiment being described below
Accompanying drawing to be used is briefly described, it should be apparent that, the accompanying drawing in describing below is only some realities of the present utility model
Execute example, for those of ordinary skill in the art, on the premise of not paying creative work, can also be according to these accompanying drawings
Obtain other accompanying drawing.
Fig. 1 is the sectional view of the utility model a kind of 3D printer platform；
Fig. 2 is the top view of the heat-conducting plate of the utility model a kind of 3D printer platform.
Detailed description of the invention
As shown in Figure 1-2, a kind of 3D printer platform, including base plate the 1st, panel the 2nd, heat-conducting plate 3 and microcomputer 4, described
Being provided with groove (not shown) on base plate 1 and panel 2, described heat-conducting plate 3 is installed in groove, described heat-conducting plate 3 and groove
Agree with, good positioning and fixed effect can be played, be possible to prevent to cause because of vibrations heat-conducting plate 3 to be subjected to displacement, described lead
It is provided with the first semiconductor chilling plate 4 and the second semiconductor chilling plate 5, described first semiconductor chilling plate 4 and second on hot plate 3
Semiconductor chilling plate 5 is provided with cold end face (not shown) and hot junction face (not shown), and described first semiconductor chilling plate 4 is in square
Shape array distribution, described second semiconductor chilling plate 5 rectangular array is distributed in the first semiconductor chilling plate 4 area defined
In, the hot junction face of described first semiconductor chilling plate 4 is embedded in heat-conducting plate 3, the cold end face of described second semiconductor chilling plate 5
Being embedded in heat-conducting plate 3, the first semiconductor chilling plate 4 can freeze with counter plate 2, and the second semiconductor chilling plate 5 can be right
Panel 2 heats, and described panel 2 side is provided with heat insulating mattress 6, and described microcomputer 4 is embedded in heat insulating mattress 6 and arranges, permissible
Prevent heat to be delivered on microcomputer 4, cause microcomputer 4 overheated and have influence on service life, be provided by the first half
Conductor cooling piece 4 and the second semiconductor chilling plate 5, the first semiconductor chilling plate 4 and the second semiconductor chilling plate 5 are all and micro electric
Brain 4 is electrically connected with, and the hot junction face of the first semiconductor chilling plate 4 is embedded in heat-conducting plate 3, the second semiconductor chilling plate 5
Cold end face is embedded in heat-conducting plate 3, the first semiconductor chilling plate 4 and the distribution of the second semiconductor chilling plate 5 rectangular array, permissible
Play good heating and refrigeration, such that it is able to change the surface temperature of platform according to the character of different materials, suitable
Good by property.
Having the beneficial effect that of the present embodiment is provided by the first semiconductor chilling plate and the second semiconductor chilling plate, and
And first the hot junction face of semiconductor chilling plate be embedded in heat-conducting plate, the cold end face of the second semiconductor chilling plate is embedded in heat-conducting plate
In, the first semiconductor chilling plate and the distribution of the second semiconductor chilling plate equal rectangular array, good heating and system can be played
Cold effect, such that it is able to change the surface temperature of platform according to the character of different materials, applicability is good.
Embodiment 2
As shown in Figure 1-2, a kind of 3D printer platform, including base plate the 1st, panel the 2nd, heat-conducting plate 3 and microcomputer 4, described
Being provided with groove (not shown) on base plate 1 and panel 2, described heat-conducting plate 3 is installed in groove, described heat-conducting plate 3 and groove
Agree with, good positioning and fixed effect can be played, be possible to prevent to cause because of vibrations heat-conducting plate 3 to be subjected to displacement, described lead
It is provided with the first semiconductor chilling plate 4 and the second semiconductor chilling plate 5, described first semiconductor chilling plate 4 and second on hot plate 3
Semiconductor chilling plate 5 is provided with cold end face (not shown) and hot junction face (not shown), and described first semiconductor chilling plate 4 is in square
Shape array distribution, described second semiconductor chilling plate 5 rectangular array is distributed in the first semiconductor chilling plate 4 area defined
In, the hot junction face of described first semiconductor chilling plate 4 is embedded in heat-conducting plate 3, the cold end face of described second semiconductor chilling plate 5
Being embedded in heat-conducting plate 3, the first semiconductor chilling plate 4 and the second semiconductor chilling plate 5 are all electrically connected with microcomputer 4, the
Semiconductor cooling piece 4 can freeze with counter plate 2, and the second semiconductor chilling plate 5 can heat with counter plate 2, described
Panel 2 side is provided with heat insulating mattress 6, and described microcomputer 4 is embedded in heat insulating mattress 6 and arranges, is possible to prevent heat to be delivered to miniature
On computer 4, causing microcomputer 4 overheated and having influence on service life, described panel 2 and heat insulating mattress 6 removably connect, dismounting side
Just, connecting reliably, facilitating user to clean and change, described base plate 1 and panel 2 mortise-tenon joint, bond strength is high, stability
Good, durable in use, the cell wall of described groove and bottom surface are provided with heat conducting coating (not shown), can promote base plate 1 and panel 2
Heat conductivility, described base plate 1 is inlaid with temperature sensor (not shown), described temperature sensor is electrical with microcomputer 4
Connecting, can detecting the temperature of base plate 1, described temperature sensor is distributed in a # shape, and can reduce the error of detection,
It is provided by the first semiconductor chilling plate 4 and the second semiconductor chilling plate 5, and the hot junction face of the first semiconductor chilling plate 4
Being embedded in heat-conducting plate 3, the cold end face of the second semiconductor chilling plate 5 is embedded in heat-conducting plate 3, the first semiconductor chilling plate 4 He
Second semiconductor chilling plate 5 rectangular array distribution, can play good heating and refrigeration, such that it is able to according to difference
The character of material change the surface temperature of platform, applicability is good.
Having the beneficial effect that of the present embodiment is provided by the first semiconductor chilling plate and the second semiconductor chilling plate, and
And first the hot junction face of semiconductor chilling plate be embedded in heat-conducting plate, the cold end face of the second semiconductor chilling plate is embedded in heat-conducting plate
In, the first semiconductor chilling plate and the distribution of the second semiconductor chilling plate equal rectangular array, good heating and system can be played
Cold effect, such that it is able to change the surface temperature of platform according to the character of different materials, applicability is good, panel and heat insulating mattress
Removably connect, easy accessibility, connect reliable, facilitate user to clean and change, base plate and panel mortise-tenon joint, bond strength
Height, good stability, durable in use, cell wall and the bottom surface of groove are provided with heat conducting coating, can promote leading of base plate and panel
Hot property, base plate is inlaid with temperature sensor, and temperature sensor is electrically connected with microcomputer, can enter the temperature of base plate
Row detection, temperature sensor is distributed in a # shape, and can reduce the error of detection.
The above, detailed description of the invention only of the present utility model, but protection domain of the present utility model does not limit to
In this, any change expected without creative work or replacement, all should cover within protection domain of the present utility model.
Claims (6)
1. a 3D printer platform, it is characterised in that: include base plate, panel, heat-conducting plate and microcomputer, described base plate and face
Being provided with groove on plate, described heat-conducting plate is installed in groove, and described heat-conducting plate and groove agree with, and described heat-conducting plate is arranged
Having the first semiconductor chilling plate and the second semiconductor chilling plate, described first semiconductor chilling plate and the second semiconductor chilling plate are equal
It is provided with cold end face and hot junction face, described first semiconductor chilling plate rectangular array distribution, described second semiconductor chilling plate
Rectangular array is distributed in the first semiconductor chilling plate area defined, and the hot junction face of described first semiconductor chilling plate is embedding
Entering in heat-conducting plate, the cold end face of described second semiconductor chilling plate is embedded in heat-conducting plate, described panel sides be provided with every
Heat pad, described microcomputer is embedded in heat insulating mattress and arranges.
2. 3D printer platform according to claim 1, it is characterised in that: described panel and heat insulating mattress removably connect.
3. 3D printer platform according to claim 2, it is characterised in that: described base plate and panel mortise-tenon joint.
4. 3D printer platform according to claim 3, it is characterised in that: cell wall and the bottom surface of described groove are provided with
Heat conducting coating.
5. 3D printer platform according to claim 4, it is characterised in that: it is inlaid with temperature sensor on described base plate,
Described temperature sensor is electrically connected with microcomputer.
6. 3D printer platform according to claim 5, it is characterised in that: described temperature sensor is distributed in a # shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620568764.5U CN205674494U (en) | 2016-06-14 | 2016-06-14 | A kind of 3D printer platform |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620568764.5U CN205674494U (en) | 2016-06-14 | 2016-06-14 | A kind of 3D printer platform |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205674494U true CN205674494U (en) | 2016-11-09 |
Family
ID=57432254
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620568764.5U Active CN205674494U (en) | 2016-06-14 | 2016-06-14 | A kind of 3D printer platform |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205674494U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106827497A (en) * | 2017-01-12 | 2017-06-13 | 四川阿泰因机器人智能装备有限公司 | A kind of 3D printer hott bed |
| CN108481747A (en) * | 2018-04-23 | 2018-09-04 | 广州迈普再生医学科技股份有限公司 | A kind of ultralow temperature print platform of biology 3D printer |
-
2016
- 2016-06-14 CN CN201620568764.5U patent/CN205674494U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106827497A (en) * | 2017-01-12 | 2017-06-13 | 四川阿泰因机器人智能装备有限公司 | A kind of 3D printer hott bed |
| CN108481747A (en) * | 2018-04-23 | 2018-09-04 | 广州迈普再生医学科技股份有限公司 | A kind of ultralow temperature print platform of biology 3D printer |
| CN108481747B (en) * | 2018-04-23 | 2020-12-25 | 广州迈普再生医学科技股份有限公司 | Ultralow temperature printing platform of biological 3D printer |
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| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |