CN205666229U - Wafer is got and is put device - Google Patents

Abstract

The utility model provides a wafer is got and is put device, this wafer is got and is put device be used for getting put in the card casket or wafer conveyer in the wafer, including the support and install in the gyro wheel of two symmetric distributions on the support all is provided with a plurality of recesses on every gyro wheel, the recess of mutual disposition constitutes the trench that bears the weight of the wafer on two gyro wheels, wherein, and the recess that has two kind at least degree of depth on at least one gyro wheel to constitute the trench of two kind at least width, the width of one of them part trench is less than the diameter of wafer, and the width of another part trench is greater than the diameter of wafer. The utility model provides a wafer is got and is put device is last to be provided with two kind at least trenches, arranges through the trench of difference and once only to select the wafer that need select to filter the wafer need not select, and do not need to pass through again the process of manual burst, make the operation more convenient, and misoperation's risk when reducing the manual burst of personnel.

Description

Wafer fetching device

Technical field

This utility model relates to technical field of manufacturing semiconductors, particularly to a kind of wafer fetching device.

Background technology

In the manufacture process of semiconductor device, it is often necessary to use wafer fetching device by wafer from cassette (cassette) take out in and be positioned in process equipment, or the wafer in process equipment is taken out and is positioned in cassette.

Traditional wafer fetching device includes support and two rollers, and described support can perform to rise and down maneuver, with Time drive the roller that is installed on support to carry out elevating movement.Wherein, each roller is provided with multiple groove, two rollers Upper relative groove composition is for carrying the groove position 122 of wafer.Fig. 1 is that the structure of the groove position being positioned on roller in prior art is shown It is intended to, as it is shown in figure 1, the groove position 121 ' width D 1 that the distance between the bottom land of said two groove 121 is described groove position, and The width of described groove position 121 ' is respectively less than brilliant diameter of a circle.Fig. 2 be wafer fetching device when choosing wafer the groove position on roller with The position view of wafer, as in figure 2 it is shown, owing to the groove bit width D1 of the described groove position 121 ' for carrying wafer is less than wafer The diameter D2 of 300, the groove 121 on the most described roller can block the marginal position of wafer 300 and support wafer, thus realizing Wafer is chosen.

Wafer fetching device of the prior art can pick and place wafer in cassette or in wafer handler, but can only be real The function now wafer in cassette or in wafer handler all chosen or all do not choose.And in actual production, The most only need to choose the part wafer in cassette, such as, in semiconductor production process, relatively conventional situation For, the wafer in odd number draw-in groove in cassette need to be carried out different technological processes respectively from the wafer in even number draw-in groove, now only The wafer in odd number draw-in groove need to be chosen or only choose the wafer in even number draw-in groove.Existing solution need to be first in cassette Wafer carries out manual burst, is taken out by the wafer that need not choose, then re-uses wafer fetching device and pick and place wafer, this side Method is i.e. lost time and easily causes unnecessary risk, as wafer may be caused to choose mistake etc..

Summary of the invention

The purpose of this utility model is to provide a kind of wafer fetching device, picks and places dress solving wafer of the prior art Put function singleness, it is impossible to the wafer in cassette is carried out the problem that part is chosen.

This utility model provides a kind of wafer fetching device, in described wafer fetching device is used for picking and placeing cassette or wafer passes Send the wafer in device, including support and be installed on two symmetrical rollers on described support, each roller is respectively provided with Multiple groove, groove positioned opposite on two rollers is had to constitute the groove position of carrying wafer, it is characterised in that: at least one roller On there is the groove of at least two degree of depth, to constitute the groove position of at least two width, the width of a portion groove position is less than crystalline substance Diameter of a circle, the width of another part groove position is more than brilliant diameter of a circle.

Optionally, described roller is can the swing roller of autobiography.

Optionally, two described swing rollers are provided with a rectangular section, on two swing rollers relative to rectangle Distance between tangent plane is more than brilliant diameter of a circle.

Optionally, described swing roller is on different angle positions, and the arrangement of the groove of described different depth is different.

Optionally, the described swing roller reeded degree of depth of institute on one of them angle position is the most identical.

Optionally, described swing roller, on one of them angle position, is placed with the groove of two kinds of different depths.

Optionally, the groove of two kinds of different depths is arranged on described swing roller with the form at interval.

Optionally, one of them described roller having the groove of at least two degree of depth, the groove on another roller is deep Spend the most identical.

Optionally, two described rollers are respectively provided with the groove of two kinds of degree of depth.

Optionally, described roller is also equipped with a driving means in the one end near support.Further, described driving Device is cylinder.

Optionally, the fetching device of described wafer also includes that a position sensor, described position sensor are used for detecting institute State the position of driving means.

Compared with prior art, the wafer fetching device that this utility model provides has the advantage that

1, it is provided with two kinds of different groove positions, in actual production process on the wafer fetching device that this utility model provides In, the first groove position on swing roller and the can be set according to the position of the wafer in the cassette that need to choose and the quantity of wafer The distribution of two groove positions, makes described wafer fetching device can disposably choose the wafer of needs, and may filter that the wafer being not required to choose, Without again through the process of manual burst.

2, the wafer fetching device that this utility model provides also can be arranged on the different rotary angle position of swing roller Different groove position distributions, makes described swing roller wafer of diverse location in the different optional card taking in angle position caskets, it is achieved The functional diversities of described wafer fetching device.In the production or test of wafer, can be according to the wafer in the cassette that need to choose Position and the quantity of wafer, use corresponding angle position on swing roller that wafer is chosen, can realize required Choosing of wafer.

Accompanying drawing explanation

Fig. 1 is the structural representation of the groove position being positioned on roller in prior art；

Fig. 2 is wafer fetching device position view of the groove position on roller and wafer when choosing wafer；

Fig. 3 is the structural representation of the wafer fetching device of this utility model embodiment one；

Fig. 4 is the sign picture of the angle position of the swing roller of this utility model embodiment one；

Fig. 5 is the distribution schematic diagram of the swing roller of this utility model embodiment one groove position on an angle position；

Fig. 6 is the structural representation of the wafer fetching device of this utility model embodiment two；

Fig. 7 is that the wafer fetching device of this utility model embodiment two chooses showing of the wafer in even number draw-in groove in cassette It is intended to；

Fig. 8 is that the wafer fetching device of this utility model embodiment two chooses showing of the wafer in odd number draw-in groove in cassette It is intended to；

Fig. 9 is that the wafer fetching device of this utility model embodiment three chooses the wafer in the draw-in groove of the latter half in cassette Schematic diagram.

Detailed description of the invention

This utility model provides a kind of wafer fetching device, and described wafer fetching device is by arranging different groove bit wides Degree, thus wafer handler can be chosen according to needs of production or wafer that cassette domestic demand is chosen, filter simultaneously and be not required to choosing The wafer taken, without again through the process of manual burst.It is provided with several use in described wafer handler and cassette Draw-in groove in storing wafer.

Make the most specifically below in conjunction with the drawings and specific embodiments wafer fetching device to the utility model proposes Bright.According to following explanation and claims, advantage of the present utility model and feature will be apparent from.It should be noted that, accompanying drawing is equal Use the form simplified very much and all use non-ratio accurately, only in order to aid in illustrating the embodiment of the present invention conveniently, lucidly Purpose.

Embodiment one

Fig. 3 is the structural representation of the wafer fetching device of this utility model embodiment one, as it is shown on figure 3, described wafer Fetching device includes a support 110 and two the symmetrical rollers 120 being installed on described support.Wherein, described support 110 can perform to rise and down maneuver, drive the roller 120 being installed on support to carry out rising and declining simultaneously.Further, each Being provided with multiple groove 121 on roller 120, groove 121 positioned opposite on each roller constitutes the groove position of carrying wafer, its In, at least one roller has the groove of at least two degree of depth, to constitute the groove position of at least two width, a portion groove The width of position is less than brilliant diameter of a circle, and the width of another part groove position is more than brilliant diameter of a circle.When described wafer fetching device enters When row picks and places wafer, the wafer corresponding less than the position of the groove position of diameter wafer with groove bit width is selected, and another part Groove bit width is not selected more than the wafer corresponding to groove position of diameter wafer.

Such as, one of them described roller has the groove of at least two degree of depth, the depth of groove on another roller The most identical.In the present embodiment, two described rollers 120 are respectively provided with the groove of two kinds of degree of depth, and then constitute two kinds of width Groove position.Preferably, the depth difference of the two groove is 10mm, a diameter of 30mm of described roller.

Preferably, described roller 120 is can the swing roller of autobiography.Further, on two described swing rollers 120 all Be provided with a rectangular section 122, on two swing rollers 120 relative to rectangular section 120 between straight more than wafer of distance Footpath, thus when described swing roller 120 rotate on two rectangular section be relative position time, wafer is not chosen.

It is also preferred that the left described swing roller 120 is on different angle positions, the arrangement of the groove 121 of different depth is different, And then the arrangement difference that the groove position of composition different in width is on different angle positions, therefore can be by by described swing roller 120 rotate to the most different angle position, to realize the function picking and placeing the wafer of diverse location, it is achieved multiple to wafer Choose mode.Concrete, the described swing roller 120 reeded degree of depth of institute on one of them angle position is the most identical.Or Person, in the present embodiment, on one of them angle position, is placed with the groove of two kinds of different depths, thus constitutes two kinds of differences The groove position of width.Preferably, the groove of two kinds of different depths is arranged on described swing roller 120 with the form at interval.Due to The width of one of which groove position is more than brilliant diameter of a circle, and the width of another kind of groove position is less than brilliant diameter of a circle, therefore, when described rolling When wheel 120 is positioned at this angle position, the wafer of odd number draw-in groove in cassette or the wafer of even number draw-in groove can be chosen.

Fig. 4 is the sign picture of the angle position of the swing roller of this utility model embodiment one.For ease of new to this practicality The description of type and understanding, carry out angle position labelling as shown in Figure 4 to described swing roller 120, with described rectangular section 122 Position is 0 ° of position, according to the direction of rotation of described swing roller 120, and the angle position of labelling swing roller successively.This enforcement In example, as a example by two swing rollers 120 rotate the most in the same direction, denote 0 °, 90 °, 180 ° and 270 ° of positions respectively.

Fig. 5 is the distribution schematic diagram of the groove position on an angle position of the swing roller in this utility model embodiment one. In the present embodiment, the groove position distribution on 90 ° of positions of the described swing roller 120 is as it is shown in figure 5, two kinds of groove positions in the present embodiment Being respectively 121a and 121b, wherein the width of groove position 121a is more than brilliant diameter of a circle, and the width of groove position 121b is straight less than wafer Footpath.The two groove position is with the form arrangement at interval, thus works as described swing roller 120 and rotate to 90 ° of positions, can be in cassette The corresponding wafer of odd number draw-in groove or the wafer of even number draw-in groove pick and place.

Additionally, for making described wafer fetching device i.e. can be used for choose the wafer of odd number draw-in groove in cassette it can also be used to choosing The wafer of even number draw-in groove in card taking casket, can be additionally used in the whole wafers choosing in cassette simultaneously.In the present embodiment, described rotation is rolled The arrangement mode taking turns groove position on such as 270 ° of positions is contrary with its groove position arrangement mode on 90 ° of positions.That is, when The groove bit width that on 90 ° of positions, the wafer of odd number draw-in groove is corresponding more than brilliant diameter of a circle, the groove position that the wafer of even number draw-in groove is corresponding When width is less than brilliant diameter of a circle；The groove bit width that then wafer of odd number draw-in groove is corresponding on 270 ° of positions is straight less than wafer Footpath, the groove position that the wafer of even number draw-in groove is corresponding is more than brilliant diameter of a circle.Thus when being implemented in 90 ° of positions, even number draw-in groove can be chosen Wafer, when 270 ° of positions, the wafer of odd number draw-in groove can be chosen.Meanwhile, described swing roller on such as 180 ° of positions only Arrange a kind of groove position, and groove bit width is less than brilliant diameter of a circle, thus what the whole wafers in cassette were chosen by realization Function.

In the present embodiment, different groove position distributions is set in four angle positions of described swing roller 120, by rotating Described swing roller 120 is in different angle positions so that the wafer in cassette can be carried out all by described wafer fetching device Choose, only take the wafer of even bin position or only take the wafer of odd bin position, it is achieved the functional diversities of wafer fetching device.

Embodiment two

Fig. 6 is the structural representation of the wafer fetching device of this utility model embodiment two.The present embodiment and embodiment one Difference be, the wafer fetching device in the present embodiment, in addition to the structure described in embodiment one, also includes: drive dress Putting 130, described driving means 130 is installed on described swing roller 120 one end near support, and described driving means 130 can Described swing roller 120 is driven to move along the length direction of described swing roller.In preferred version, the fetching device of described wafer Also include that a position sensor 140, described position sensor 140 are used for detecting driving means 130 and whether operate and put in place, make rotation The shift position of roller 120 is the most accurate.It is also preferred that the left described driving means 130 can be cylinder.

Owing to described swing roller 120 can move along its length, therefore for ensure to have on described swing roller 120 with The groove position that all draw-in grooves in described cassette are corresponding, it is also preferred that the left the quantity of the groove position arranged on described swing roller 120 is more than institute State the quantity of draw-in groove in cassette.

Similar with embodiment one, for the ease of identifying, the groove position coding on swing roller described in labelling and described rotation The angle position of roller, mark mode is identical with embodiment one.

Same, in the present embodiment, swing roller is distributed identical with embodiment one, i.e. in 90 ° in the groove position of 90 ° of positions Two kinds of groove positions on position are with the form arrangement at interval.But, in the present embodiment, due to described swing roller 120 one end also Having a driving means, therefore, when swing roller picks and places wafer in 90 ° of positions, described wafer fetching device only can realize Choose the wafer of even number draw-in groove, it is possible to realize only choosing the wafer of odd number draw-in groove.

The wafer fetching device of Fig. 7 Yu Fig. 8 respectively this utility model embodiment two chooses odd number card respectively from cassette Wafer in groove and the schematic diagram of the wafer in even number draw-in groove.As it is shown in fig. 7, when in actual production, even in cassette 200 need to be chosen When counting the wafer 300 of draw-in groove, then the angle position of swing roller 120 is adjusted to 90 ° of positions, by described driving means 130 Drive described swing roller 120 to move, make groove bit width on described swing roller 120 be less than groove position and the cassette of diameter wafer The position of the even number draw-in groove of 200 is corresponding, can choose the wafer 300 of even number draw-in groove in cassette 200.Otherwise, when needing choosing In card taking casket 200 during the wafer 300 of odd number draw-in groove, as shown in Figure 8, drive described swing roller by described driving means 130 120 move, and make the groove bit width on described swing roller 120 be less than the groove position of diameter wafer and the odd number draw-in groove of cassette 200 Position is corresponding, can choose the wafer 300 of odd number draw-in groove in cassette.

Similar with embodiment one, on 180 ° of positions of described swing roller 120, there is a kind of groove position the most respectively, and The width of this groove position is less than brilliant diameter of a circle.Therefore, when swing roller picks and places wafer in 180 ° of positions, all crystalline substances in cassette Circle is all selected.

In the present embodiment, different groove position distributions is set in three angle positions of described swing roller 120, by adjusting Swing roller 120 is in different angle positions, and uses driving means 130 to drive described swing roller to move to relevant position, Described wafer fetching device can be realized the wafer in cassette all choose, only take the wafer of even bin position or only take The function of the wafer of odd bin position.

Embodiment three

The fetching device of wafer that this utility model provides, except can be to the wafer of odd number draw-in groove in cassette and even number draw-in groove Wafer pick and place respectively outside, also can set according to the actual requirements on described swing roller groove position distribution, make described wafer take Put device and can pick and place the wafer of diverse location in cassette.Such as, only choose the wafer of top half in cassette, or only choose cassette The wafer etc. of interior the latter half.

In the present embodiment, for the wafer of the latter half in cassette only need to be chosen, can by described swing roller with cassette The groove bit width of the groove position that interior top half draw-in groove position is corresponding is set greater than brilliant diameter of a circle, i.e. groove position shown in Fig. 9 121a, the groove bit width of the groove position corresponding with draw-in groove position in the latter half in cassette is set smaller than in brilliant diameter of a circle, i.e. Fig. 9 Shown groove position 121b, thus the merit that the wafer of the latter half in cassette is only chosen by described wafer fetching device can be realized Energy.Simultaneously, it is possible to groove position distribution contrary to the above is set in other angle positions of selected swing roller, it is achieved described wafer The function that the wafer of the latter half in cassette is only chosen by fetching device.

It should be noted that the angular marking of the employing in each embodiment in this specification, it is illustration, not For limiting.In this specification, each embodiment uses the mode gone forward one by one to describe, and what each embodiment stressed is and it The difference of his embodiment, between each embodiment, identical similar portion sees mutually.

Foregoing description is only the description to this utility model preferred embodiment, not any limit to this utility model scope Fixed, any change that the those of ordinary skill in this utility model field does according to the disclosure above content, modification, belong to right and want Seek the protection domain of book.

Claims (12)

1. a wafer fetching device, including support and be installed on two symmetrical rollers on described support, each roller On be provided with multiple groove, groove positioned opposite on two rollers constitutes the groove position of carrying wafer, it is characterised in that: at least There is on one roller the groove of at least two degree of depth, to constitute the groove position of at least two width, the width of a portion groove position Degree is brilliant diameter of a circle less than one, and the width of another part groove position is more than described brilliant diameter of a circle.

2. wafer fetching device as claimed in claim 1, it is characterised in that: described roller is can the swing roller of autobiography.

3. wafer fetching device as claimed in claim 2, it is characterised in that: it is provided with a square on two described swing rollers Shape tangent plane, on two swing rollers relative to rectangular section between distance more than brilliant diameter of a circle.

4. wafer fetching device as claimed in claim 2, it is characterised in that: described swing roller is in different angle positions On, the arrangement of the groove of described different depth is different.

5. wafer fetching device as claimed in claim 4, it is characterised in that: described swing roller is in one of them angle position On institute the reeded degree of depth the most identical.

6. wafer fetching device as claimed in claim 4, it is characterised in that: described swing roller is in one of them angle position On, it is placed with the groove of two kinds of different depths.

7. wafer fetching device as claimed in claim 6, it is characterised in that: the groove of two kinds of different depths is with the form at interval It is arranged on described swing roller.

8. wafer fetching device as claimed in claim 1, it is characterised in that: on one of them described roller, there is at least two The groove of the degree of depth, the depth of groove on another roller is the most identical.

9. wafer fetching device as claimed in claim 1, it is characterised in that: it is respectively provided with two kinds of degree of depth on two described rollers Groove.

10. wafer fetching device as claimed in claim 1, it is characterised in that: near the one of described support on described roller End is also equipped with a driving means.

11. wafer fetching devices as claimed in claim 10, it is characterised in that: described driving means is cylinder.

The 12. wafer fetching devices as described in claim 10 or 11, it is characterised in that: the fetching device of described wafer also includes One position sensor, described position sensor is for detecting the position of described driving means.