CN205655117U - Polycrystal package type emitting diode module and hi -lite lighting device - Google Patents
Polycrystal package type emitting diode module and hi -lite lighting device Download PDFInfo
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- CN205655117U CN205655117U CN201620426533.0U CN201620426533U CN205655117U CN 205655117 U CN205655117 U CN 205655117U CN 201620426533 U CN201620426533 U CN 201620426533U CN 205655117 U CN205655117 U CN 205655117U
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- emitting diode
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Abstract
The utility model provides a polycrystal package type emitting diode module and hi -lite lighting device, polycrystal package type emitting diode module contain the naked crystalline substance of a plurality of emitting diode, a plurality of wiring and base of leading. The naked crystalline substance of emitting diode includes two naked crystalline substances of yellow optical diode and two naked crystalline substances of white optical diode, and the radiant power of the naked crystalline substance of each emitting diode is between 2 to 6 watts. The naked crystalline substance of yellow optical diode concatenates through partly wiring of leading each other, the white naked crystalline substance of optical diode concatenates through the wiring of leading of another part each other. This base defines a diameter and is the circular region between 4 to 6.8 millimeters, supplies the naked crystalline substance of emitting diode is fixed in this circle intra -area. Borrow this, can install at the finite space, have the advantage that the spotlight effect of effect and preferred was looked to higher light.
Description
Technical field
This utility model relates to a kind of polycrystalline encapsulation type light emitting diode module, particularly relates to one
Plant the polycrystalline envelope that can produce higher radiant power (radiant power) in minimum unit are
Dress type light emitting diode module (multiple chip LED) and high-brightness illuminating device.
Background technology
The definition of known radiant power (radiant power) refers to that a radiation source sends radiation
Power, unit is watt.Hereby apply by light emitting diode and illustrate such as a example by illuminator out of doors
Under.
One of which outdoor illumination device arranges at least three monolithic package on lamp socket
Integrated circuit, owing to being the three kinds of bare crystalline needing to send respectively HONGGUANG, green glow or blue light, and respectively
The radiant power of the integrated circuit of monolithic package is 1 to 5 watt, integral radiation power be 3 to
15 watts, there is high emittance but shortcoming is that erection space is bigger needed for lamp socket.
Another kind is the integrated circuit using single multi-die package, has in single IC for both
The bare crystalline of white light, HONGGUANG and blue light, required installing space is less, the radiant power of each bare crystalline
Being 2 to 5 watts, the radiant power of single IC for both entirety is 8 to 20 watts.
How can produce higher light under the restriction of the confined space further and regard effect, be to wait to solve
Problem certainly.
Summary of the invention
A wherein purpose of the present utility model is to provide a kind of prior art that solves to lack many
Brilliant encapsulation type light emitting diode module and high-brightness illuminating device.
It is naked that this utility model polycrystalline encapsulation type light emitting diode module comprises multiple light emitting diode
Wire-connectings brilliant, multiple and a pedestal.Described light emitting diode bare crystalline includes two gold-tinted diodes
Bare crystalline and two white light-emitting diodes bare crystalline, and respectively this light emitting diode bare crystalline radiant power between
Between 2 to 6 watts.Described gold-tinted diode bare crystalline is concatenated with one another by the wire-connecting of a part,
Described white light-emitting diodes bare crystalline is concatenated with one another by the wire-connecting of another part.This pedestal defines one
Border circular areas between a diameter of 4 to 6.8 millimeters, is fixed on for described light emitting diode bare crystalline
In this border circular areas.
Polycrystalline encapsulation type light emitting diode module described in the utility model, described light emitting diode
Bare crystalline directly routing and encapsulation on the base, and described light emitting diode bare crystalline and this pedestal
Surface flushes and will not expose the side of described light emitting diode bare crystalline.
Polycrystalline encapsulation type light emitting diode module described in the utility model, also includes that a plane is thrown
Penetrating sheet structure, this planar projective sheet structure has a circuit board and and has phosphor powder and silicon
The encapsulation glue-line of glue, this circuit board has a plate body and the multiple weld pads being formed on this plate body,
Described bare crystalline is pasted on this circuit board and described wire-connecting is to be welded in described weld pad, and passes through
This encapsulation glue-line is covered in described bare crystalline and described wire-connecting.
Polycrystalline encapsulation type light emitting diode module described in the utility model, respectively this light emitting diode
The luminous component of this circuit board that bare crystalline is projected on has main light-emitting area and a lateral direction light emission
Face, this encapsulation glue-line is made up of a yellow fluorescent powder coating and a white phosphor powder glue-line, and should
Yellow fluorescent powder coating covers main light-emitting area and the lateral direction light emission of described gold-tinted diode bare crystalline
Face, this white phosphor powder glue-line covers the main light-emitting area of described white light-emitting diodes bare crystalline and lateral
Light-emitting area.
Polycrystalline encapsulation type light emitting diode module described in the utility model, described gold-tinted diode
Bare crystalline is co-located at same string and described white light-emitting diodes bare crystalline is co-located at another row.
Polycrystalline encapsulation type light emitting diode module described in the utility model, also includes an integrated electricity
Road encapsulating structure, it has a packaging body and a lead frame, and this packaging body is in order to encapsulate described sending out
Optical diode bare crystalline, described wire-connecting and this pedestal, this lead frame has branched lead foot, respectively should
One end of lead foot and connects respectively this wire-connecting in this packaging body respectively, and another of each this lead foot
End is positioned at outside this packaging body.
Polycrystalline encapsulation type light emitting diode module described in the utility model, respectively this light emitting diode
The luminous efficiency of bare crystalline is that 80 lumens/watt are to 120 lumens/watt.
Polycrystalline encapsulation type light emitting diode module described in the utility model, also includes an electrical connection
The driving means of described lead foot, described light emitting diode bare crystalline accepts this driving means and controls, bag
Include following one of which to combine:
Combination one is that described light emitting diode bare crystalline is lighted simultaneously, colour temperature 3200K-4500K；
Combination two is that the most described gold-tinted diode bare crystalline is lighted, colour temperature 2200K-3200K；And
Combination three is that the most described white light-emitting diodes bare crystalline is lighted, colour temperature 4600-6500K
This utility model high-brightness illuminating device includes that multiple encapsulation type of polycrystalline as mentioned is luminous
Diode modules, and multiple reflector, respectively the bottom of this reflector is respectively arranged at respectively that these are many
The border circular areas of brilliant encapsulation type light emitting diode module is peripheral to reach spotlight effect.
The beneficial effects of the utility model are: the light emitting diode bare crystalline of employing includes two Huangs
Optical diode bare crystalline and two white light-emitting diodes bare crystalline, and the radiation merit of each light emitting diode bare crystalline
Rate is between 2 to 6 watts, and is installed on the circle between a diameter of 4 to 6.8 millimeters
Territory, has concurrently and can install and have, in the confined space, the advantage that higher light regards effect.And one implement
Light emitting diode bare crystalline in example flushes with the surface of pedestal and will not expose described light-emitting diodes
The side of pipe bare crystalline；Yellow fluorescent powder coating in another embodiment covers gold-tinted diode bare crystalline
Main light-emitting area and lateral direction light emission face, white phosphor powder glue-line covers white light-emitting diodes bare crystalline
Main light-emitting area and lateral direction light emission face, two kinds of embodiments all can avoid light emitting diode bare crystalline lateral
It is dissipated into this pedestal to cause reflective and produce colour temperature error, and there is preferably spotlight effect.
Accompanying drawing explanation
Fig. 1 is light emitting diode bare crystalline of the present utility model and a wire-connecting signal on pedestal
Figure；
Fig. 2 is the one of the first embodiment of this utility model polycrystalline encapsulation type light emitting diode module
Schematic top plan view；
Fig. 3 is a schematic side view of this first embodiment of Fig. 2；
Fig. 4 is the one of the second embodiment of this utility model polycrystalline encapsulation type light emitting diode module
Schematic top plan view；
Fig. 5 is a schematic side view of this second embodiment of Fig. 4；
Fig. 6 is an embodiment of the associated circuit components of this utility model high-brightness illuminating device
One schematic diagram；
Fig. 7 is multiple polycrystalline encapsulation type light emitting diodes of this utility model high-brightness illuminating device
Module and a three-dimensional exploded view of multiple reflector；
Fig. 8 be this utility model polycrystalline encapsulation type light emitting diode module send 3 watts and 5 watts warm up
White light and the forward current of 3 watts and 5 watts white lights and a curve chart of lumen fraction；
Fig. 9 be this utility model polycrystalline encapsulation type light emitting diode module send 3 watts and 5 watts warm up
White light and the forward voltage of 3 watts and 5 watts white lights and a curve chart of forward current；And
Figure 10 is that a light emitting anger of this utility model polycrystalline encapsulation type light emitting diode module is write music
Line chart.
Detailed description of the invention
Below in conjunction with the accompanying drawings and this utility model is described in detail by embodiment.
Before this utility model is described in detail, it shall be noted that in the following description content,
Similar element is to be identically numbered to represent.
Refering to Fig. 1 to Fig. 3, in a first embodiment of the present utility model, polycrystalline encapsulation type is sent out
Optical diode module 1 comprises a pedestal 10, multiple wire-connecting 13, integrated antenna package knot
Structure 14 and multiple light emitting diode bare crystalline.Described light emitting diode bare crystalline is directly at this pedestal 10
Upper routing and encapsulation, and described light emitting diode bare crystalline flushes with the surface of this pedestal 10 and not
The side of described light emitting diode bare crystalline can be exposed.
Refering to Fig. 1, described light emitting diode bare crystalline includes two gold-tinted diode bare crystalline 11 and two
Individual white light-emitting diodes bare crystalline 12.The described gold-tinted diode bare crystalline 11 wire-connecting by a part
13 is concatenated with one another, and described white light-emitting diodes bare crystalline 12 is by the wire-connecting 13 of another part each other
Concatenation.Described gold-tinted diode bare crystalline 11 is co-located at same string and described white light-emitting diodes is naked
Brilliant 12 are co-located at another row.Each arranged side by side by HUANGBAI(sic) light, make luminescence to interfere with each other.
Refering to Fig. 1 and Fig. 2, in the present embodiment, the length d1=width of each light emitting diode bare crystalline
Degree d2=1.2 millimeter.The luminous efficiency of each light emitting diode bare crystalline is 40 to 120 lumens/watt
Special.The radiant power of each light emitting diode bare crystalline between 2 to 6 watts, polycrystalline encapsulation type
The radiant power of light emitting diode module 1 entirety is 8 to 24 watts.
Integrated circuit package structure 14 has packaging body 140 and a lead frame 141.Packaging body
140 is silica gel material, in order to described light emitting diode bare crystalline, described wire-connecting 13 to be packaged in
On pedestal 10.Lead frame 141 has branched lead foot 142, and one end of each lead foot 142 is in encapsulation
Body 140 is interior and connects wire-connecting 13, and the other end of each lead foot 142 is positioned at packaging body 140
Outward.The polycrystalline encapsulation type light emitting diode module 1 beeline r3=8 milli without lead foot 142
Rice, the polycrystalline encapsulation type light emitting diode module 1 width containing lead foot 142 is from r4=15 millimeter.
The external diameter r2=9.6 millimeter of pedestal 10, it is 4 to 6.8 that pedestal 10 defines a diameter r1 in inside
Border circular areas 101 between Hao meter, is fixed on border circular areas 101 for described light emitting diode bare crystalline
In.
Refering to Fig. 4 and Fig. 5, in one second embodiment of the present utility model, polycrystalline encapsulation type is sent out
Optical diode module 1 ' has similar element, except for the difference that, this enforcement with first embodiment
By the integrated circuit package structure 14 of first embodiment with a chip on board (Chip On Board；
COB) encapsulating structure 5 replacement.
Chip on board encapsulating structure 5 has circuit board 50 and an encapsulation glue-line 51, a circuit board
50 have a plate body and the multiple weld pad (not shown) being formed on plate body, due to planar projective light
Sheet is existing encapsulation technology and non-this case emphasis, and not in this to go forth.In the present embodiment,
The polycrystalline encapsulation type light emitting diode module 1 ' the height H1=2.3 millimeter without encapsulation glue-line 51,
Polycrystalline encapsulation type light emitting diode module 1 ' is containing the height H2=3 millimeter of encapsulation glue-line 51.
In the present embodiment, the luminous component of the circuit board 50 that each light emitting diode bare crystalline is projected on
There is a main light-emitting area and side to light-emitting area.Encapsulation glue-line 51 is coated with by a yellow fluorescent powder
Layer 511 and a white phosphor powder glue-line 512 form, and yellow fluorescent powder coating 511 covers institute
State main light-emitting area and the lateral direction light emission face of gold-tinted diode bare crystalline 11, white phosphor powder glue-line
The 512 main light-emitting area covering described white light-emitting diodes bare crystalline 12 and lateral direction light emission faces.Namely
Yellow fluorescent powder coating 511 and white phosphor powder glue-line 512 fill gold-tinted diode bare crystalline respectively
11 and the peripheral semi-circular portion in white light-emitting diodes bare crystalline 12 position.Therefore, can avoid
Light emitting diode bare crystalline is laterally dissipated into this pedestal and causes reflective and produce colour temperature error, and has
Preferably spotlight effect.
Refering to Fig. 5, Fig. 6 and Fig. 7, high-brightness illuminating device 100 includes that multiple polycrystalline encapsulates
Type light emitting diode module 1 ' and multiple reflector 3, the bottom of each reflector 3 sets respectively
It is placed in border circular areas 101 periphery of each polycrystalline encapsulation type light emitting diode module 1' to reach poly-
Light effect.
High-brightness illuminating device 100 also includes the driving means 2 of a described lead foot of electrical connection 142,
Driving means 2 have power-switching circuit 20,1 first wiring 21,1 second wiring 22,
One DC source 23, switch 24, one substrate 25 and multiple fixture 251.Reflector 3
And polycrystalline encapsulation type light emitting diode module 1 ' is fixed on substrate 25.Fixture 251 can be by
Substrate 25 is fixed in a lamp socket (not shown).Power-switching circuit 20 has such as MP2480
The elements such as controller, inductance, electric capacity and diode, in order to be converted to base by DC source 23
The driving electric needed for multiple grain illuminating module on plate.First wiring 21 is connected to power supply and turns
Changing between circuit 20 and substrate, the second wiring 22 is connected to power-switching circuit 20 and direct current
Between power supply 23, switch 24 is then for controlling to switch the power supply of DC source 23.
In the present embodiment, described light emitting diode bare crystalline accepts driving means 2 and controls, including under
The one of which combination of row.Combination one is that described light emitting diode bare crystalline is lighted simultaneously, colour temperature
3200K-4500K.Combination two is that the most described gold-tinted diode bare crystalline 11 is lighted, colour temperature
2200K-3200K.Combination three is that the most described white light-emitting diodes bare crystalline 12 is lighted, colour temperature
4600-6500K。
Refering to Fig. 8, send 3 watts in vain for this utility model polycrystalline encapsulation type light emitting diode module
Light, 3 watts of warm light and the forward current of 5 watts of warm whites and the curve chart of lumen fraction.
Refering to Fig. 9, send 3 watts in vain for this utility model polycrystalline encapsulation type light emitting diode module
Light, 3 watts of warm light and the forward voltage of 5 watts of warm whites and the curve chart of forward current.
Refering to Figure 10, for the lighting angle of this utility model polycrystalline encapsulation type light emitting diode module
Curve chart, it can be seen that spotlight effect is concentrated very much.
In sum, this utility model at least has following effect: the light emitting diode of employing is naked
Crystalline substance includes two gold-tinted diode bare crystalline 11 and two white light-emitting diodes bare crystalline 12, and each luminescence
The radiant power of diode bare crystalline is between 2 to 6 watts, and is installed on a diameter of 4 to 6.8
Border circular areas 101 between Hao meter, has concurrently to install in the confined space and have higher light and regards
The advantage of effect, therefore really can reach the purpose of this utility model.
The above, embodiment the most of the present utility model, when not limiting this reality with this
By the scope of novel enforcement, the most generally according to this utility model claims and description institute
The simple equivalence change made with modify, the most still belong in the range of this utility model patent contains.
Claims (9)
1. a polycrystalline encapsulation type light emitting diode module, it is characterised in that: this polycrystalline encapsulation type light emitting diode module comprises:
Multiple light emitting diode bare crystalline, including two gold-tinted diode bare crystalline and two white light-emitting diodes bare crystalline, and the radiant power of each light emitting diode bare crystalline is between 2 to 6 watts；
Multiple wire-connectings, described gold-tinted diode bare crystalline is concatenated with one another by the wire-connecting of a part, and described white light-emitting diodes bare crystalline is concatenated with one another by the wire-connecting of another part；And
One pedestal, defines a border circular areas between a diameter of 4 to 6.8 millimeters, is fixed in this border circular areas for described light emitting diode bare crystalline.
2. polycrystalline encapsulation type light emitting diode module as claimed in claim 1, it is characterized in that: directly routing and the encapsulation on the base of described light emitting diode bare crystalline, and described light emitting diode bare crystalline flushes with the surface of this pedestal and will not expose the side of described light emitting diode bare crystalline.
3. polycrystalline encapsulation type light emitting diode module as claimed in claim 1, it is characterized in that: this polycrystalline encapsulation type light emitting diode module also includes a chip on board encapsulating structure, this chip on board encapsulating structure has a circuit board and and has the encapsulation glue-line of phosphor powder and silica gel, this circuit board has a plate body and the multiple weld pads being formed on this plate body, described bare crystalline is pasted on this circuit board and described wire-connecting is welded in described weld pad, and is covered in described bare crystalline and described wire-connecting by this encapsulation glue-line.
4. polycrystalline encapsulation type light emitting diode module as claimed in claim 3, it is characterized in that: each light emitting diode bare crystalline is projected on the luminous component of this circuit board and has a main light-emitting area and side to light-emitting area, this encapsulation glue-line is made up of a yellow fluorescent powder coating and a white phosphor powder glue-line, and this yellow fluorescent powder coating covers main light-emitting area and the lateral direction light emission face of described gold-tinted diode bare crystalline, this white phosphor powder glue-line covers main light-emitting area and the lateral direction light emission face of described white light-emitting diodes bare crystalline.
5. polycrystalline encapsulation type light emitting diode module as claimed in claim 4, it is characterised in that: described gold-tinted diode bare crystalline is co-located at same string and described white light-emitting diodes bare crystalline is co-located at another row.
6. polycrystalline encapsulation type light emitting diode module as claimed in claim 1, it is characterized in that: this polycrystalline encapsulation type light emitting diode module also includes an integrated circuit package structure, it has a packaging body and a lead frame, this packaging body is in order to encapsulate described light emitting diode bare crystalline, described wire-connecting and this pedestal, this lead frame has branched lead foot, one end of each lead foot and connects each wire-connecting in this packaging body respectively, and the other end of each lead foot is positioned at outside this packaging body.
7. the polycrystalline encapsulation type light emitting diode module as described in any claim in claim 1 to 6, it is characterised in that: the luminous efficiency of each light emitting diode bare crystalline is that 80 lumens/watt are to 120 lumens/watt.
8. the polycrystalline encapsulation type light emitting diode module as described in any claim in claim 1 to 6, it is characterized in that: this polycrystalline encapsulation type light emitting diode module also includes a driving means, described light emitting diode bare crystalline accepts this driving means and controls, the one of which combination including following:
Combination one is that described light emitting diode bare crystalline is lighted simultaneously, colour temperature 3200K-4500K；
Combination two is that the most described gold-tinted diode bare crystalline is lighted, colour temperature 2200K-3200K；And
Combination three is that the most described white light-emitting diodes bare crystalline is lighted, colour temperature 4600-6500K.
9. a high-brightness illuminating device, including multiple polycrystalline encapsulation type light emitting diode module as according to any one of claim 1 to 6, and multiple reflector, the border circular areas that the bottom of each reflector is respectively arranged at each polycrystalline encapsulation type light emitting diode module is peripheral to reach spotlight effect.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620426533.0U CN205655117U (en) | 2016-05-12 | 2016-05-12 | Polycrystal package type emitting diode module and hi -lite lighting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620426533.0U CN205655117U (en) | 2016-05-12 | 2016-05-12 | Polycrystal package type emitting diode module and hi -lite lighting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205655117U true CN205655117U (en) | 2016-10-19 |
Family
ID=57402559
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620426533.0U Active CN205655117U (en) | 2016-05-12 | 2016-05-12 | Polycrystal package type emitting diode module and hi -lite lighting device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205655117U (en) |
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2016
- 2016-05-12 CN CN201620426533.0U patent/CN205655117U/en active Active
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |