CN205645783U - Semiconductor device's equipment tool - Google Patents
Semiconductor device's equipment tool Download PDFInfo
- Publication number
- CN205645783U CN205645783U CN201620421693.6U CN201620421693U CN205645783U CN 205645783 U CN205645783 U CN 205645783U CN 201620421693 U CN201620421693 U CN 201620421693U CN 205645783 U CN205645783 U CN 205645783U
- Authority
- CN
- China
- Prior art keywords
- chip
- suction disc
- suction
- turnover
- rocker
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model discloses a semiconductor device's equipment tool, include that positioning bottom plate, chip divide to rocker, turnover suction disc, the last suface detachable of positioning bottom plate is connected with the welded plate, and the upper surface of welded plate is provided with the frame constant head tank, and the chip branch is provided with the chip positioning groove to the rocker upper surface, and turnover suction disc inside is provided with the cavity and turnover suction disc side is provided with the extraction opening that is linked together with the cavity, and the lower surface that has enough to meet the need the suction disc is provided with a plurality of convex suction nozzles, is provided with on the suction nozzle and has enough to meet the need the suction hole that suction disc inside cavity is linked together. The beneficial effects of the utility model are that: can convenient and fast ground have enough to meet the need semiconductor device chip, improved work efficiency greatly, avoided the condition such as damage that the chip appears at the turnover in -process, off normal, rotation moreover, improved the product quality after welding.
Description
Technical field
This utility model relates to the assembled fixture of a kind of semiconductor device.
Background technology
At present, semiconductor device chip is when welding, firstly the need of by shake, chip is separated one by one, then use suction spindle to pick up one by one to be placed on welded plate, but this mode is inefficient, and the syringe needle of suction spindle is easily blocked by chip, thus cause the unfavorable conditions such as chip is impaired, chip off normal, rotation, ultimately cause the low quality of semiconductor device.
Summary of the invention
For solving above technical deficiency, this utility model provides a kind of easy to use, the assembled fixture of the semiconductor device that efficiency is high.
This utility model is realized by following measures:
nullThe assembled fixture of a kind of semiconductor device of the present utility model，Including rectangular positioning plate、Chip divides to rocker and can be fastened on chip respectively and divide the turnover suction disc on rocker and positioning plate，Described positioning plate upper surface is removably connected with welded plate，The upper surface of described welded plate is provided with the framework locating slot that can embed semiconductor frame，Described chip divides rocker upper surface is provided with groove，Described bottom portion of groove is provided with some chip positioning grooves，Described turnover suction disc is internally provided with cavity and has enough to meet the need suction disc side and be provided with the bleeding point being connected with cavity，The lower surface of turnover suction disc is provided with the suction nozzle of some protrusions，It is provided with on described suction nozzle and has enough to meet the need the suction hole that suction disc internal cavities is connected，When have enough to meet the need suction disc be fastened on chip divide on rocker time，Suction nozzle and the upper and lower one_to_one corresponding of chip positioning groove，When having enough to meet the need suction disc and being fastened on positioning plate，Suction nozzle and the upper and lower one_to_one corresponding of chip welding position in the semiconductor frame being embedded in framework locating slot.
The middle part upper surface of above-mentioned positioning plate is provided with draw-in groove, card trench bottom two ends are vertically arranged with alignment pin I, welded plate two ends are provided with hole I, location, when welded plate is embedded in draw-in groove, welded plate upper surface is concordant with the positioning plate upper surface at draw-in groove edge, and alignment pin I penetrates in hole I, location.
The lower surface two ends of above-mentioned turnover suction disc are provided with alignment pin II, the positioning plate upper surface two ends at draw-in groove edge are provided with the hole, location II that can penetrate alignment pin II, and the chip at groove edge divides and is provided with the hole, location III that can penetrate alignment pin II to rocker upper surface two ends.
The upper surface two ends of above-mentioned turnover suction disc stretch out with handles.
The beneficial effects of the utility model are: can be had enough to meet the need by semiconductor device chip conveniently and efficiently, substantially increase work efficiency, and avoid the situations such as damage that chip occurs in circular flow, off normal, rotation, improve the product quality after welding.
Accompanying drawing explanation
Fig. 1 is this utility model positioning plate and the structural representation of welded plate assembled state.
Fig. 2 is the structural representation of this utility model positioning plate.
Fig. 3 is the structural representation of this utility model welded plate.
Fig. 4 is the structural representation that this utility model chip divides to rocker.
Fig. 5 is the structural representation of turnover suction disc of the present utility model.
Wherein: 1 positioning plate, 2 welded plates, 3 holes II, location, 4 semiconductor frame, 5 holes I, location, 6 alignment pins I, 7 chips divide to rocker, 8 chip positioning grooves, 9 holes III, location, 10 turnover suction discs, 11 suction nozzles, 12 handles, 13 alignment pins II.
Detailed description of the invention
Below in conjunction with the accompanying drawings this utility model is done further detailed description:
nullSuch as Fig. 1、4、Shown in 5，The assembled fixture of a kind of semiconductor device of the present utility model，Including rectangular positioning plate 1、Chip divides to rocker 7 and can be fastened on chip respectively and divide the turnover suction disc 10 on rocker 7 and positioning plate 1，Described positioning plate 1 upper surface is removably connected with welded plate 2，The upper surface of described welded plate 2 is provided with the framework locating slot that can embed semiconductor frame 4，Described chip divides rocker 7 upper surface is provided with groove，Described bottom portion of groove is provided with some chip positioning grooves 8，Described turnover suction disc 10 is internally provided with cavity and has enough to meet the need suction disc 10 side and be provided with the bleeding point being connected with cavity，The lower surface of turnover suction disc 10 is provided with the suction nozzle 11 of some protrusions，It is provided with on described suction nozzle 11 and has enough to meet the need the suction hole that suction disc 10 internal cavities is connected，When have enough to meet the need suction disc 10 be fastened on chip divide on rocker 7 time，Suction nozzle 11 and chip positioning groove about 8 one_to_one corresponding，When having enough to meet the need suction disc 10 and being fastened on positioning plate 1，Suction nozzle 11 and the upper and lower one_to_one corresponding of chip welding position in the semiconductor frame 4 being embedded in framework locating slot.
As shown in Figure 2,3, the middle part upper surface of positioning plate 1 is provided with draw-in groove, card trench bottom two ends are vertically arranged with alignment pin I 6, welded plate 2 two ends are provided with hole I 5, location, when welded plate 2 is embedded in draw-in groove, welded plate 2 upper surface is concordant with positioning plate 1 upper surface at draw-in groove edge, and alignment pin I 6 penetrates in hole I 5, location.The lower surface two ends of turnover suction disc 10 are provided with alignment pin II 13, the positioning plate 1 upper surface two ends at draw-in groove edge are provided with the hole, location II 3 that can penetrate alignment pin II 13, and the chip at groove edge divides and is provided with the hole, location III 9 that can penetrate alignment pin II 13 to rocker 7 upper surface two ends.The upper surface two ends of turnover suction disc 10 stretch out with handles 12.
Its operation principle is: be first placed on by welded plate 2 in the draw-in groove of positioning plate 1, in now the alignment pin I 6 on positioning plate 1 penetrates the hole, location I 5 on welded plate 2, thus is fixed by welded plate 2, it is to avoid welded plate 2 rocks, and improves the stability of welding.Then semiconductor frame 4 is embedded in the framework locating slot on welded plate 2, it is to avoid semiconductor frame 4 tilts and offsets.Then multiple semiconductor chips are placed on chip divide and rock in rocker 7, one chip correspondence falls in a chip positioning groove 8, and unnecessary chip is taken out, turnover suction disc 10 being buckled in chip and divides on rocker 7, alignment pin II 13 penetrates in hole III 9, location, position, suction nozzle 11 on turnover suction disc 10 is aligned in the chip in chip positioning groove 8 one by one, bleeds turnover suction disc 10 with air pump, thus is picked up by chip, then turnover suction disc 10 is fastened on positioning plate 1
Alignment pin II 13 penetrates in hole II 3, location, positions, stops bleeding, and chip one_to_one corresponding falls in semiconductor frame 4 at chip welding position, thus conveniently carries out the welding operation of next step.
The above is only the preferred implementation of this patent; it should be pointed out that, for those skilled in the art, on the premise of without departing from the art of this patent principle; can also make some improvement and replacement, these improve and replace the protection domain that also should be regarded as this patent.
Claims (4)
- null1. the assembled fixture of a semiconductor device，It is characterized in that: include rectangular positioning plate、Chip divides to rocker and can be fastened on chip respectively and divide the turnover suction disc on rocker and positioning plate，Described positioning plate upper surface is removably connected with welded plate，The upper surface of described welded plate is provided with the framework locating slot that can embed semiconductor frame，Described chip divides rocker upper surface is provided with groove，Described bottom portion of groove is provided with some chip positioning grooves，Described turnover suction disc is internally provided with cavity and has enough to meet the need suction disc side and be provided with the bleeding point being connected with cavity，The lower surface of turnover suction disc is provided with the suction nozzle of some protrusions，It is provided with on described suction nozzle and has enough to meet the need the suction hole that suction disc internal cavities is connected，When have enough to meet the need suction disc be fastened on chip divide on rocker time，Suction nozzle and the upper and lower one_to_one corresponding of chip positioning groove，When having enough to meet the need suction disc and being fastened on positioning plate，Suction nozzle and the upper and lower one_to_one corresponding of chip welding position in the semiconductor frame being embedded in framework locating slot.
- The assembled fixture of semiconductor device the most according to claim 1, it is characterized in that: the middle part upper surface of described positioning plate is provided with draw-in groove, card trench bottom two ends are vertically arranged with alignment pin I, welded plate two ends are provided with hole I, location, when welded plate is embedded in draw-in groove, welded plate upper surface is concordant with the positioning plate upper surface at draw-in groove edge, and alignment pin I penetrates in hole I, location.
- The assembled fixture of semiconductor device the most according to claim 1, it is characterized in that: the lower surface two ends of described turnover suction disc are provided with alignment pin II, the positioning plate upper surface two ends at draw-in groove edge are provided with the hole, location II that can penetrate alignment pin II, and the chip at groove edge divides and is provided with the hole, location III that can penetrate alignment pin II to rocker upper surface two ends.
- The assembled fixture of semiconductor device the most according to claim 1, it is characterised in that: the upper surface two ends of described turnover suction disc stretch out with handles.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620421693.6U CN205645783U (en) | 2016-05-11 | 2016-05-11 | Semiconductor device's equipment tool |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620421693.6U CN205645783U (en) | 2016-05-11 | 2016-05-11 | Semiconductor device's equipment tool |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205645783U true CN205645783U (en) | 2016-10-12 |
Family
ID=57058027
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620421693.6U Active CN205645783U (en) | 2016-05-11 | 2016-05-11 | Semiconductor device's equipment tool |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205645783U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105870046A (en) * | 2016-05-11 | 2016-08-17 | 山东迪电子科技有限公司 | Semiconductor device chip turnover welding assembly |
-
2016
- 2016-05-11 CN CN201620421693.6U patent/CN205645783U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105870046A (en) * | 2016-05-11 | 2016-08-17 | 山东迪电子科技有限公司 | Semiconductor device chip turnover welding assembly |
| CN105870046B (en) * | 2016-05-11 | 2018-08-10 | 山东迪一电子科技有限公司 | Semiconductor device chip has enough to meet the need weld assembly |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN205645783U (en) | Semiconductor device's equipment tool | |
| CN206181722U (en) | Paster suction nozzle | |
| CN205645781U (en) | Semiconductor device chip's turnover device | |
| CN105870046A (en) | Semiconductor device chip turnover welding assembly | |
| CN204025248U (en) | A kind of cultivation box linkage structure | |
| CN205645760U (en) | Semiconductor device's chip welding base | |
| CN208410100U (en) | Furniture board cutting device | |
| CN205765114U (en) | A kind of fixing tool facilitating cylinder bore hole | |
| CN202367374U (en) | Welding positioning tool for short welding strip | |
| CN203726152U (en) | Four-cavity vacuum suction milling and cutting tool for cell phone housing | |
| CN207539660U (en) | A kind of jig convenient for LED light bar patch double faced adhesive tape | |
| CN206393538U (en) | Screen device is unloaded for what mobile phone was reprocessed | |
| CN206588259U (en) | A kind of frock for carrying out quick punching operation | |
| CN206764057U (en) | A kind of circuit board soldering tin fixture | |
| CN216657780U (en) | PIN needle inserting jig for nixie tube | |
| CN104322179B (en) | A kind of plate hole formula garlic planting device and using method thereof | |
| CN205950445U (en) | Chip grinds foot ware | |
| CN205889389U (en) | Rubber shoe sole mould | |
| CN205395574U (en) | Clamping device for engraver | |
| CN106425800A (en) | Square iron rod slot cutting platform with exchangeable module | |
| CN217834003U (en) | Bamboo processing is with cuing open bamboo equipment | |
| CN205128339U (en) | Platform is glued to point | |
| CN216682337U (en) | Millet pepper cutting machine convenient to it is clean | |
| CN207616393U (en) | A kind of fixture Xiu Lun mechanisms of polishing machine | |
| CN203973706U (en) | Firmer chisel cutter |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20200102 Address after: Yan Yan Road 272100 in Shandong Province, Jining city Yanzhou District northbound (Tian Qi Miao Village West) Patentee after: Shandong core electronic Polytron Technologies Inc Address before: 250000 Jining Economic Development Zone, Shandong Patentee before: Shandong Diyi Electronic Science and Technology Co., Ltd. |