CN205611154U - Equipment system of fingerprint identification module - Google Patents
Equipment system of fingerprint identification module Download PDFInfo
- Publication number
- CN205611154U CN205611154U CN201620308551.9U CN201620308551U CN205611154U CN 205611154 U CN205611154 U CN 205611154U CN 201620308551 U CN201620308551 U CN 201620308551U CN 205611154 U CN205611154 U CN 205611154U
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- China
- Prior art keywords
- fingerprint recognition
- plate
- basic ring
- recognition module
- compress
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- Expired - Fee Related
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- 229920000297 Rayon Polymers 0.000 claims abstract description 3
- 239000000758 substrate Substances 0.000 claims description 28
- 239000012790 adhesive layer Substances 0.000 claims description 23
- 239000003292 glue Substances 0.000 claims description 8
- 239000010410 layer Substances 0.000 claims 1
- 238000000465 moulding Methods 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 21
- 230000008569 process Effects 0.000 abstract description 9
- 238000004519 manufacturing process Methods 0.000 abstract description 8
- 230000008901 benefit Effects 0.000 abstract description 6
- 230000007306 turnover Effects 0.000 abstract description 5
- 238000004806 packaging method and process Methods 0.000 abstract description 4
- 235000008331 Pinus X rigitaeda Nutrition 0.000 abstract 1
- 235000011613 Pinus brutia Nutrition 0.000 abstract 1
- 241000018646 Pinus brutia Species 0.000 abstract 1
- 238000001723 curing Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 238000011084 recovery Methods 0.000 description 3
- 208000031481 Pathologic Constriction Diseases 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 210000001215 vagina Anatomy 0.000 description 2
- 241000208340 Araliaceae Species 0.000 description 1
- 235000005035 Panax pseudoginseng ssp. pseudoginseng Nutrition 0.000 description 1
- 235000003140 Panax quinquefolius Nutrition 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000005489 elastic deformation Effects 0.000 description 1
- 239000013536 elastomeric material Substances 0.000 description 1
- 235000008434 ginseng Nutrition 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Abstract
The utility model discloses an equipment system of fingerprint identification module, equipment system of fingerprint identification module includes: it will to be used for the base ring pastes the dress and is in subsides dress device on the base plate, support the clamp plate, it is in to support the clamp plate overlap joint the relative both sides edge of base ring, the bottom of supporting the clamp plate with be equipped with between the upper surface of fingerprint identification chip be used for with it pastes to support the clamp plate viscose layer on the fingerprint identification chip, be used for being equipped with support the clamp plate the fingerprint identification module carries out the curing oven that solidifies. According to the utility model discloses this equipment system can effectively solve the base ring pine problem of taking off among the assembly process of fingerprint identification module, has with low costs, small advantage for the clamp plate that supports in prior art this equipment system moreover, can not produce the danger of scratch to the fingerprint identification module, easy operation, the difficult inefficacy, in the equipment system working process turnover convenient, and then improved the production packaging efficiency.
Description
Technical field
This utility model relates to electronic device field, particularly relates to the package system of a kind of fingerprint recognition module.
Background technology
In correlation technique, the mounting process of fingerprint equipment assembly is through SMT (Surface by fingerprint recognition chip and basic ring
Mount Technology, surface mounting technology) it is welded on circuit board.
In SMT technique, basic ring needs to be fixed on the circuit board of fingerprint recognition module by form for dispensing glue, but should
Hot-setting adhesive is in a liquid state shape before by heat cure, and tack performance is relatively low, cause the circular flow before heated baking and
Slight vibrations during overcuring stove will make basic ring come off or monolateral warp, and the most easily produce basic ring and fix
The problem loosely and highly surpassing tolerance, eventually becomes defective products, and cannot do over again, and production yield thus can be caused to decline,
Monomer cost increases.
In relevant production process, can reach by the way of increasing pressurize baking tool and basic ring is pressed on body
To the tight purpose of basic ring.But pressurize baking is controlled and is had the disadvantages that
1, material is handware, expensive, individual heavy, turnover inconvenience；
2, tool individuality weight is big, occupies this tool, can cause the generation of the motionless situation of conveyer belt band in curing oven；
3, in production process, tool has the risk of scratching products high finish surface；
4, two of tool has for providing the quick clip adding holding force, operation inconvenience, and insensitive after using for a long time,
There is failure risk, cause pressing dynamics not enough, need periodic replacement, improve cost；
5, after crossing high temperature, tool is hot, needs cool time.
Utility model content
One of technical problem that this utility model is intended to solve in correlation technique the most to a certain extent.To this end, this practicality
The package system of novel proposition a kind of fingerprint recognition module, this package system can effectively solve the problem that the assembling of fingerprint recognition module
During basic ring get loose problem, and to have low cost, volume little relative to the plate that compresses in this package system of prior art
Advantage, will not to fingerprint recognition module produce scratch danger, simple to operate, be difficult to lost efficacy, package system is worked
In journey, turnover is convenient, and then improves production and assembly efficiency.
The package system of the fingerprint recognition module according to this utility model embodiment, including: described fingerprint recognition module includes
Substrate, fingerprint recognition chip and basic ring, described fingerprint recognition chip and described basic ring are all provided with on the substrate, described base
Ring is arranged around described fingerprint recognition chip and the top edge of described basic ring is higher than the upper surface of described fingerprint recognition chip, institute
State package system to include: for described basic ring is mounted mounting device on the substrate；Compress plate, described in compress plate
Be overlapped on the relative dual-side of described basic ring, described in compress the bottom of plate and described fingerprint recognition chip upper surface it
Between be provided with for compressing, by described, the adhesive-layer that plate is pasted onto on described fingerprint recognition chip；For compressing plate described in being provided with
Described fingerprint recognition module carry out the curing oven that solidifies.
The plate that compresses in fingerprint recognition module group assembling system according to this utility model embodiment has certain deformability,
And there is certain recovery toughness, for pressurize of the prior art baking tool, new according to this practicality
Type embodiment compress the advantage that plate has low cost, volume is little, owing to compressing the non-handware of plate, thus compress plate will not
Fingerprint recognition module is produced the danger of scratch, and compresses plate and need not arrange pressurize baking tool two in prior art
Quick clip, it is only necessary to be positioned at part above fingerprint recognition chip suppress compressing plate to chip direction, make to compress plate and glue
It is attached on chip, simple to operate, and owing to parts are few, thus compress plate and be difficult to lose efficacy.Due to according to this reality
Tool light weight is toasted relative to existing five metals pressurize, so being provided with this to compress plate with the plate that compresses of new embodiment
The turnover in the work process assembled of fingerprint recognition module is convenient, such that it is able to improve the production and assembly efficiency of product.
In some preferred embodiments, described package system also includes: shift unit, and described shift unit is for by described
Compress plate to move to the precalculated position of described fingerprint recognition module.
In some preferred embodiments, described adhesive-layer be also located at described in compress between plate and described basic ring to compress described
Plate is pasted onto on described basic ring.
In some preferred embodiments, described in compress plate be overlapped on the width of described basic ring relative to dual-side on,
The plate length being smaller in size than described basic ring along the length direction of described basic ring is compressed described in and.
In some preferred embodiments, compressing plate described in is elastic plate.
In some preferred embodiments, compressing plate described in is plastic plate.
Additional aspect of the present utility model and advantage will part be given in the following description, and part will from the following description
Become obvious, or recognized by practice of the present utility model.
Accompanying drawing explanation
Above-mentioned and/or additional aspect of the present utility model and advantage are from combining the accompanying drawings below description to embodiment and will become
Obtain substantially with easy to understand, wherein:
Fig. 1 is the structural representation of the fingerprint recognition module according to this utility model embodiment；
Fig. 2 is the fingerprint recognition module according to this utility model embodiment and the structural representation of package system thereof；
Fig. 3 is the fingerprint recognition module according to this utility model embodiment and the sectional view of package system thereof；
Fig. 4 is the fingerprint recognition module according to this utility model embodiment and the top view of package system thereof.
Reference:
Compress plate 1；Adhesive-layer 11；
Suction nozzle 2；
Fingerprint recognition module 200；Substrate 201；Fingerprint recognition chip 202；Basic ring 203.
Detailed description of the invention
Of the present utility model embodiment is described below in detail, and the example of described embodiment is shown in the drawings, the most extremely
Same or similar label represents same or similar element or has the element of same or like function eventually.Below by ginseng
It is exemplary for examining the embodiment that accompanying drawing describes, and is only used for explaining this utility model, and it is not intended that to this utility model
Restriction.
In description of the present utility model, it is to be understood that term " on ", D score, "front", "rear", "left", "right"
It is based on orientation shown in the drawings or position relationship in the orientation indicated or position relationship, is for only for ease of this practicality of description
Novel and simplification describes rather than indicates or imply that the device of indication or element must have specific orientation, with specifically
Azimuth configuration and operation, therefore it is not intended that to restriction of the present utility model.
In description of the present utility model, it should be noted that unless otherwise clearly defined and limited, term " install ",
" be connected ", " connection " should be interpreted broadly, and connects for example, it may be fixing, it is also possible to be to removably connect, or one
Ground connects；Can be to be joined directly together, it is also possible to be indirectly connected to by intermediary, can be the connection of two element internals
Or the interaction relationship of two elements.For the ordinary skill in the art, can understand as the case may be
Above-mentioned term concrete meaning in this utility model.
The package system of the fingerprint recognition module 200 according to this utility model embodiment is described below with reference to Fig. 1-Fig. 4.Root
Include mounting device according to the package system of the fingerprint recognition module 200 of this utility model embodiment, compress plate 1 and curing oven.
Firstly the need of explanation, adapted to the fingerprint recognition module assembled according to the package system of this utility model embodiment
200 include: substrate 201, fingerprint recognition chip 202 and basic ring 203, fingerprint recognition chip 202 and basic ring 203 are all provided with
On substrate 201, basic ring 203 is arranged around fingerprint recognition chip 202 and the top edge of basic ring 203 is higher than fingerprint recognition
The upper surface of chip 202.Specifically, basic ring 203 is ring-shaped and inside has and the shape of fingerprint recognition chip 202
The through hole of shape laminating, fingerprint recognition chip 202 is arranged in this through hole, and wherein fingerprint recognition chip 202 is arranged on substrate
On 201, basic ring 203 is welded on substrate 201.
The most above-mentioned mounting device, for basic ring 203 is mounted on substrate 201, compresses plate 1 and is overlapped on basic ring 203
Relative dual-side on, compress and be provided with between the bottom of plate 1 and the upper surface of fingerprint recognition chip 202 for compressing
Plate 1 is pasted onto the adhesive-layer 11 on fingerprint recognition chip 202, and curing oven will be for being provided with the fingerprint recognition mould compressing plate 1
Group 200 solidifies.
Top edge due to basic ring 203 is higher than the upper surface of fingerprint recognition module 200, so being overlapped on base when compressing plate 1
Time on ring 203, compress, between the lower surface of plate 1 and the upper surface of fingerprint recognition module 200, there is predetermined gap, between being somebody's turn to do
The height of gap is equal to the spacing between top edge and the upper surface of fingerprint recognition module 200 of basic ring 203.
In embodiment of the present utility model, compress and be provided with between the bottom of plate 1 and the upper surface of fingerprint recognition chip 202
For the adhesive-layer 11 that plate 1 is pasted onto on fingerprint recognition chip 202 will be compressed, say, that compress plate 1 and be overlapped on base
Time on ring 203, it is positioned at the part applying above fingerprint recognition chip 202 towards fingerprint recognition chip 202 to compressing plate 1
The power in direction, such that it is able to utilize adhesive-layer 11 to be positioned at compress plate 1 in the part above fingerprint recognition chip 202 and finger
Stricture of vagina identification chip 202 is pasted.Thus, compressing plate 1 due to local and there occurs deformation, and it is positioned at fingerprint recognition core
Part above sheet 202 is pasted and fixed on fingerprint recognition chip 202, so compressing plate 1 to recover this deformation,
The part being positioned at fingerprint recognition chip 202 both sides compressing plate 1 can produce downward pressure to basic ring 203, the most permissible
Basic ring 203 is stably compressed on substrate 201, such that it is able to prevent basic ring 203 from coming off or monolateral warp.
Thus utilizing to come fingerprint recognition mould according to the package system of the fingerprint recognition module 200 of this utility model embodiment
When group 200 assembles, no matter for pasting whether the hot-setting adhesive of basic ring 203 and substrate 201 solidifies, or to finger
Circular flow before stricture of vagina identification module 200 heated baking and the vibrations when overcuring stove, all will not make basic ring 203
Coming off or monolateral warp, the most after the solidification is complete, the product fraction defective of fingerprint recognition module 200 is substantially reduced, and enters
And cost can be reduced, improve packaging efficiency.
Content from the above mentioned understands, and compresses plate 1 structure being made up of handware the most of the prior art, according to this reality
With the plate 1 that compresses in fingerprint recognition module 200 package system of new embodiment, there is certain deformability, and have
There is certain recovery toughness, for pressurize of the prior art baking tool, implement according to this utility model
Example compress the advantage that plate 1 has low cost, volume is little, owing to compressing the non-handware of plate 1, thus compress plate 1 will not
Fingerprint recognition module 200 is produced the danger of scratch, and compresses plate 1 and need not arrange pressurize baking in prior art and control
The quick clip at tool two, it is only necessary to be positioned at part above fingerprint recognition chip 202 suppress compressing plate 1 to chip direction,
Make to compress plate 1 to be pasted onto on chip, simple to operate, and owing to parts are few, thus compress plate 1 and be difficult to lose efficacy.
Owing to the plate 1 that compresses according to this utility model embodiment toasts tool light weight relative to existing five metals pressurize, so setting
Put the turnover in the work process assembled of this fingerprint recognition module 200 compressing plate 1 convenient, such that it is able to improve product
Production and assembly efficiency.
The package system of the fingerprint recognition module 200 according to this utility model embodiment is described in detail below with reference to Fig. 1-Fig. 4.
Describe referring first to Fig. 1 and be suitable for, according to the package system of this utility model embodiment, the fingerprint recognition module assembled
200.Fingerprint recognition module 200 according to this utility model embodiment can be disposed on mobile terminal for coupling use
The assembly of family finger print information.Mobile terminal can be such as mobile phone, notebook computer, panel computer, player, game
The movably electronic equipment such as machine.Fingerprint recognition module 200 can be embedded on the fuselage of mobile terminal.
As it is shown in figure 1, fingerprint recognition module 200 includes substrate 201, fingerprint recognition chip 202 and basic ring 203.Substrate
201 can be the circuit board with printed circuit, and circuit board electrically connects with the control assembly of mobile terminal, fingerprint recognition core
Sheet 202 and basic ring 203 are respectively provided with on circuit boards, wherein fingerprint recognition chip 202 can with substantially electrically connect, fingerprint
Identification chip 202 can be coupled to user's finger print, when the finger of user is close or is fitted in fingerprint recognition chip 202
Time upper, fingerprint recognition chip 202 can identify user finger print information (i.e. sensing user's finger on fingerprint ridge line information),
And finger print information can be transferred to control on assembly by fingerprint recognition chip 202, control assembly can according to finger print information,
Send corresponding control instruction.Basic ring 203 can also electrically connect with substrate 201, and basic ring 203 is ring-shaped and internal tool
Having the through hole of adhered shape with fingerprint recognition chip 202, basic ring 203 is arranged around fingerprint recognition chip 202, wherein
The upper end of basic ring 203 is higher than the upper surface of fingerprint recognition chip 202.It is understood that the upper end of basic ring 203 refers to
The uppermost edge of basic ring 203, the upper end of basic ring 203 can be plane, can also be the inclined-plane with certain angle of inclination.
Wherein, basic ring 203 can pass through the welding of SMT (Surface Mount Technology, surface mounting technology) technique
On circuit board.The problem falling off in SMT technique in order to avoid basic ring 203 or warping, according to this practicality
Proposing one in the package system of new embodiment and compress plate 1, this compresses plate 1 and is overlapped on the relative both sides of basic ring 203
Bian Shang, such as, shown in Fig. 2, compress on the dual-side of the width that plate 1 can be overlapped on basic ring 203.Due to basic ring
The upper end of 203 is higher than the upper surface of fingerprint recognition chip 202, so when compressing plate 1 and being overlapped on basic ring 203, supporting
Having a certain distance between middle part meeting and the upper surface of fingerprint recognition chip 202 of pressing plate 1, this distance is basic ring 203
Upper end and fingerprint recognition chip 202 upper surface between distance.
In embodiment of the present utility model, compress and be provided with between the bottom of plate 1 and the upper surface of fingerprint recognition chip 202
For the adhesive-layer 11 that plate 1 is pasted onto on fingerprint recognition chip 202 will be compressed, say, that the middle part compressing plate 1 can
Fix to carry out pasting by viscose glue between the upper surface of fingerprint recognition chip 202.Wherein in operation engineering, permissible
Now compress plate 1 to be placed on basic ring 203, and the middle part compressing plate 1 is applied downward power, in order to make to compress plate
1 pastes with fingerprint recognition chip 202 phase.Press owing to compressing the middle subordinate of plate 1 and be secured at fingerprint recognition chip 202
Time upper, compressed plate 1 and there occurs elastic deformation, so in order to recover this deformation, the structure compressing plate 1 both sides can be to basic ring
203 apply downward pressure, such that it is able to be closely compressed on substrate 201 by basic ring 203, do not come off.
Alternatively, this adhesive-layer 11 can be located at the lower section compressing plate 1 in advance, it is also possible to is set in advance in fingerprint recognition core
On the upper surface of sheet 202, or in order to improve the sticking efficiency of the two, this adhesive-layer 11 can be preset in simultaneously to
On the lower section of pressing plate 1 and the upper surface of fingerprint recognition chip 202.
The area of adhesive-layer 11 can be less than the area compressing plate 1, and the area of adhesive-layer 11 might be less that fingerprint recognition
The area of chip 202, thus with the consumption of less glue, and can avoid unnecessary glue the most right
Other structures produce to be polluted, and makes more convenient to operate.As shown in Figure 4, the shape of adhesive-layer 11 can be generally
Rectangle, adhesive-layer 11 may be located at and compresses plate 1 and the middle part of fingerprint recognition chip 202, and such adhesive-layer 11 can be right
The stickup performance compressing plate 1 and fingerprint recognition chip 202 is more firm, more stable.
Alternatively, compress plate 1 and be overlapped on the width (left and right directions in such as Fig. 2) of basic ring 203 the most relative
On dual-side, and compress plate 1 along basic ring 203 length direction (direction before and after in such as Fig. 2) be smaller in size than base
The length of ring 203.The structure being so possible not only to make to compress plate 1 is smaller and more exquisite, light, and owing to compressing plate 1 edge
The length being smaller in size than basic ring 203 of the length direction of basic ring 203, such that it is able to utilize operator to package system
Observe and operation, and then packaging efficiency can be improved.
Wherein, the length of adhesive-layer 11 is equal to compress the width of plate 1, and adhesive-layer 11 thus can be made compressing plate 1 He
The stickup of fingerprint recognition chip 202 is more firm, stable.
In an example of the present utility model, this adhesive-layer 11 is also located at and compresses between plate 1 and basic ring 203 compressing
Plate 1 is pasted onto on basic ring 203.Here, on the one hand utilize adhesive-layer 11 to compress plate 1 and basic ring 203 is pasted
Connect, may further ensure that the connective stability compressed between plate 1 and basic ring 203, may further ensure that basic ring 203
Will not get loose；Additionally, by arranging adhesive-layer 11 between plate 1 and basic ring 203 compressing, can be to by basic ring 203
When moving to substrate 201, first will compress plate 1 and paste with basic ring 203, then move compressing plate 1, from
And basic ring 203 can be driven to move, until basic ring 203 is moved to substrate 201.
Alternatively, compressing plate 1 can be elastic plate, say, that compresses plate 1 and has elasticity, and elastic shape can occur
Become.Such as compress plate 1 to be made up of elastomeric material.Basic ring 203 can be produced certain big to make to compress plate 1
Little pressure, compresses plate 1 and also should have certain recovery toughness, and alternatively, compressing plate 1 can be plastic plate.
Package system according to this utility model embodiment also includes shift unit, and shift unit moves for compressing plate 1
To the precalculated position of fingerprint recognition module 200.As in figure 2 it is shown, shift unit can be negative pressure device, this device can
To have suction nozzle 2, it is possible to use the principle of negative pressure will compress plate 1 and adsorb at suction nozzle 2, then will compress plate 1 move to
On the precalculated position of fingerprint recognition module 200, and this suction nozzle 2 is utilized to apply downward power to compressing plate 1, in order to will
Compress plate 1 to be pasted onto on fingerprint recognition chip 202.
Wherein, shift unit can be integrated morphology with mounting device, say, that same device can realize simultaneously
Attachment and the work of displacement.Such as can be by utilizing point gum machine to realizing attachment and the work of displacement simultaneously.
Below with reference to Fig. 1-Fig. 4, a kind of assemble method of the fingerprint recognition module according to this utility model embodiment is described,
Wherein fingerprint recognition module includes substrate, fingerprint recognition chip and basic ring,
Assemble method comprises the steps:
Glue is put on any one face in the surfaces opposite to each other of basic ring and substrate；
Basic ring is mounted on substrate；
Plate will be compressed be overlapped on basic ring and will compress plate and be pasted onto on fingerprint recognition chip；
To solidify with the fingerprint recognition module compressing plate；
Removing compresses plate；
Clean.
In above-mentioned assemble method, the above-mentioned order between each step can not be limited by above-mentioned putting in order, example
It is overlapped on basic ring can carry out before or after basic ring is mounted on substrate as plate will be compressed.
The assemble method of the fingerprint recognition module according to this utility model embodiment, it is ensured that basic ring in moving process,
Or when being given a shock, will not come off from substrate or warp.And the method easily shows, packaging efficiency is high, enters
And the manufacturing cost of product can be reduced.
During the most above-mentioned, the method for some glue process, attachment operation curing process and matting can be with existing skill
Corresponding operation method in art is identical, naturally it is also possible to differ.
In embodiment of the present utility model, before basic ring is mounted on substrate, can arrange viscous in the bottom compressing plate
Glue-line, utilizes and compresses that plate is viscous to be taken and mobile basic ring is on substrate.It is to say, the bottom compressing plate can be in relevant position
Place arranges adhesive-layer, and basic ring can be pasted by this adhesive-layer, it is possible to utilize shift unit to move basic ring to substrate
Corresponding position carry out positioning, mounting.The mobile process that thus can make basic ring is simpler, convenient.
In embodiment of the present utility model, can be manually to compressing plate pressure and plate will be compressed be pasted onto fingerprint recognition core
On the upper surface of sheet, or can also press by shift unit to compressing plate and plate will be compressed be pasted onto fingerprint recognition chip
Upper surface on.In an optional example of the present utility model, shift unit can be negative pressure device, and this device is permissible
There is suction nozzle, it is possible to use the principle of negative pressure will compress plate and adsorb at suction nozzle, then will compress plate and move to fingerprint recognition mould
On the precalculated position of group, and this suction nozzle is utilized to apply downward power to compressing plate, in order to plate will be compressed and be pasted onto fingerprint knowledge
On other chip.
In the description of this specification, reference term " embodiment ", " some embodiments ", " illustrative examples ", " show
Example ", the description of " concrete example " or " some examples " etc. means to combine this embodiment or example describes specific features, knot
Structure, material or feature are contained at least one embodiment of the present utility model or example.In this manual, to upper
The schematic representation stating term is not necessarily referring to identical embodiment or example.And, the specific features of description, structure,
Material or feature can combine in any one or more embodiments or example in an appropriate manner.
Embodiment the most of the present utility model, it will be understood by those skilled in the art that:
Without departing from these embodiments being carried out multiple change in the case of principle of the present utility model and objective, revise, replace
And modification, scope of the present utility model is limited by claim and equivalent thereof.
Claims (7)
1. the package system of a fingerprint recognition module, it is characterised in that
Described fingerprint recognition module includes substrate, fingerprint recognition chip and basic ring, described fingerprint recognition chip and described basic ring
Being all provided with on the substrate, described basic ring is arranged around described fingerprint recognition chip and the top edge of described basic ring is higher than described
The upper surface of fingerprint recognition chip,
Described package system includes:
For described basic ring is mounted mounting device on the substrate；
Compress plate, described in compress plate and be overlapped on the relative dual-side of described basic ring, described in compress the bottom of plate and described
It is provided with between the upper surface of fingerprint recognition chip for compressing, by described, the viscose glue that plate is pasted onto on described fingerprint recognition chip
Layer；
For compressing, described in being provided with, the curing oven that the described fingerprint recognition module of plate solidifies.
The package system of fingerprint recognition module the most according to claim 1, it is characterised in that described package system is also
Including:
Shift unit, described shift unit is for moving the precalculated position to described fingerprint recognition module by the described plate that compresses.
The package system of fingerprint recognition module the most according to claim 1, it is characterised in that described adhesive-layer also sets
Compress between plate and described basic ring described so that the described plate that compresses is pasted onto on described basic ring.
The package system of fingerprint recognition module the most according to claim 1, it is characterised in that described in compress plate overlap joint
On the width of described basic ring relative to dual-side on, and described in compress the plate size along the length direction of described basic ring
Length less than described basic ring.
The package system of fingerprint recognition module the most according to claim 1, it is characterised in that described in compress plate be bullet
Property plate.
The package system of fingerprint recognition module the most according to claim 1, it is characterised in that described in compress plate for moulding
Flitch.
7. according to the package system of the fingerprint recognition module according to any one of claim 1-6, it is characterised in that described
The area of adhesive-layer compresses the area of plate described in being less than.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620308551.9U CN205611154U (en) | 2016-04-13 | 2016-04-13 | Equipment system of fingerprint identification module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620308551.9U CN205611154U (en) | 2016-04-13 | 2016-04-13 | Equipment system of fingerprint identification module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205611154U true CN205611154U (en) | 2016-09-28 |
Family
ID=56972764
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620308551.9U Expired - Fee Related CN205611154U (en) | 2016-04-13 | 2016-04-13 | Equipment system of fingerprint identification module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205611154U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105813448A (en) * | 2016-04-13 | 2016-07-27 | 广东欧珀移动通信有限公司 | Assembling system and assembling method for fingerprint recognition module |
-
2016
- 2016-04-13 CN CN201620308551.9U patent/CN205611154U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105813448A (en) * | 2016-04-13 | 2016-07-27 | 广东欧珀移动通信有限公司 | Assembling system and assembling method for fingerprint recognition module |
| CN105813448B (en) * | 2016-04-13 | 2019-02-05 | Oppo广东移动通信有限公司 | The package system and assemble method of fingerprint recognition mould group |
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Address after: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Patentee after: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. Address before: Changan town in Guangdong province Dongguan 523859 usha Beach Road No. 18 Patentee before: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. |
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