CN205609481U - Semiconductor manufacturing equipment - Google Patents

Abstract

The utility model provides a: a semiconductor manufacturing equipment, includes: the working chamber has an opening at least, transported gas device, output high cleanliness is gaseous, and the opening part of working chamber forms the gas curtain, block that external dust gets into the working chamber inside, the gaseous cleanliness factor of high cleanliness is higher than or equals gaseous cleanliness factor among the desired operational environment of the machine normal during operation of equipment.

Description

A kind of semiconductor manufacturing facility

Technical field

This utility model relates to field of semiconductor manufacture, a kind of semiconductor manufacturing facility with high air purity.

Background technology

High requirement is had for air purity, it is desirable to production environment is under dustless working environment in the production of many electronic products.Especially, in semiconductor production process, the air purity of working environment is required high.

At present, quasiconductor is usually and manufactures in high clean degree operating room, due to design and the use supplementary material reason of semiconductor fabrication equipment, a large amount of dust granules can be caused to be present in operating room so that it is be still extremely difficult to the semiconductor manufacturing facility requirement to air purity.

Summary of the invention

For the problems referred to above, this utility model provides a kind of semiconductor manufacturing facility, carries out blowing afloat formation gas curtain by clean air and stops, only pure air can be inside access arrangement, it is ensured that its device interior cleanliness factor.

This utility model solves the technical scheme of the problems referred to above: a kind of semiconductor manufacturing facility, including: working chamber, at least there is an opening；Air delivery device, output high-cleanness, high gas, and at the opening part formation gas curtain of described working chamber, stop that external dust enters inside working chamber, the cleanliness factor of gas in the working environment that the cleanliness factor of described high-cleanness, high gas is required when normally working greater than or equal to described machine equipment.

Preferably, described semiconductor manufacturing facility also includes an exhaust apparatus, makes described working chamber internal gas discharge.

Preferably, described exhaust apparatus is positioned at the rear wall of working chamber.

Preferably, described air delivery device includes appendix and filter.

Preferably, described appendix is directly connected to an air conditioning system, thus realizes gas output.

Preferably, described air delivery device includes an air outlet, and its width is more than or equal to the width of the opening of described working chamber.

Preferably, the height of described air outlet is 50 ~ 200mm.

Preferably, described semiconductor manufacturing facility also includes a lid, for closing the opening of described working chamber.

Preferably, described air delivery device also includes an air valve.

Preferably, described equipment is evaporator, scribing machine or waxing machine.

This utility model at least possesses following beneficial effect: the working chamber opening at described semiconductor manufacturing facility increases gas curtain structure everywhere, gas curtain uses high-cleanness, high gas, make the air within entrance board without big dust particle, coordinate air draft to improve the internal cleanliness factor of board, improve product yield.

Other features and advantages of the utility model will illustrate in the following description, and, partly become apparent from description, or understand by implementing the present invention.

Accompanying drawing explanation

Accompanying drawing is for providing a further understanding of the present invention, and constitutes a part for description, is used for together with embodiments of the present invention explaining the present invention, is not intended that limitation of the present invention.

Fig. 1 is the structural representation of semiconductor manufacturing facility one preferred embodiment of the novel offer of this use.

Fig. 2 is the schematic diagram of the air delivery device output gas formation gas curtain of Fig. 1 semiconductor manufacturing facility.

Detailed description of the invention

Being described in detail semiconductor manufacturing facility of the present utility model below in conjunction with schematic diagram, to this utility model, how application technology means solve technical problem whereby, and the process that realizes reaching technique effect can fully understand and implement according to this.Should be appreciated that specific embodiment described herein, only in order to explain this utility model, is not used to limit this utility model.

Refer to Fig. 1 and Fig. 2, semiconductor manufacturing facility 100, including: working chamber 110 and air delivery device 130, wherein working chamber has opening 120, air delivery device 130 exports high-cleanness, high gas, and at the opening 130 of described working chamber, form gas curtain 210, stop that external dust enters inside working chamber, the cleanliness factor of gas in the working environment that the cleanliness factor of described high-cleanness, high gas is required when normally working greater than or equal to described machine equipment.

Here, described semiconductor manufacturing facility 100 refers to need to be under high-cleanness, high environment the equipment worked, such as the CVD equipment in semiconductor manufacturing industry or PVD equipment.The cleanliness factor of gas in the working environment that the cleanliness factor of described high-cleanness, high gas is required when normally working greater than or equal to described semiconductor manufacturing facility, can normally work under the air ambient of ten thousand class precisions if all described equipment 1 needs to be in, the cleanliness factor of high-cleanness, high gas should be greater than or equal to ten thousand class precisions；Can normally work under the air ambient of hundred class precisions if described equipment 1 needs to be in, the cleanliness factor of high-cleanness, high gas should be greater than or equal to hundred class precisions, and other level accuracy require that the rest may be inferred.Wherein, during ten thousand class precisions refer to the air of every cubic feet, the diameter microgranule more than 3 microns is not higher than 10000；Hundred class precisions refer to that in the air of every cubic feet, the diameter microgranule more than 3 microns is not higher than 100.

In first preferred embodiment of the present utility model, air delivery device 130 is made up of appendix 131, air filter 133 and air outlet 132, wherein appendix 131 is directly connected to an air conditioning system, realize gas 200 and input appendix, air outlet 132 is arranged at the top of working chamber peristome, its width is more than or equal to the width of the peristome of working chamber, to ensure that the gas curtain formed is completely covered peristome.Concrete, appendix 131 uses irony white baking vanish tubing, position and Workshop air conditioner system position that concrete size is laid according to semiconductor manufacturing facility are customized processing, high efficiency particle air filter 133 is added with air conditioning system air outlet junction, it is ensured that air-out air purity is up to standard at appendix 131.The design of uniform circular hole filter screen is used, it is ensured that air outlet uniform flow flows out, thus ensures device interior air purity, it is also preferred that the left the height of air outlet is 50 ~ 200mm at air outlet 132.

In second preferred embodiment of the present utility model, also can also set up a lid at the opening part of working chamber 110, for closing the opening of described working chamber.

In the 3rd preferred embodiment of the present utility model, one exhaust apparatus connected with working chamber also can be set, by the air that air delivery device blowout is the cleanest, gas curtain is formed before described semiconductor manufacturing facility, stop inside external dust access arrangement, and the internal air draft of cooperating equipment, improve device interior cleaning gas degree.Wherein, on the rear wall that peristome during exhaust apparatus may be disposed at working chamber is relative.

In the 4th preferred embodiment of the present utility model, air delivery device includes a pneumatic compression devices, realizes the gas transmission to air delivery device by air valve and controls.

The foregoing is only preferred embodiment of the present utility model, not in order to limit this utility model, all any amendment, equivalent and improvement etc. made within spirit of the present utility model and principle, within should be included in protection domain of the present utility model.

Claims (10)

1. a semiconductor manufacturing facility, including: working chamber, its sidewall at least has an opening；Air delivery device, there is an air outlet, this air outlet is arranged at the top of working chamber opening and gives vent to anger below opening, described air delivery device exports high-cleanness, high gas by described air outlet, and at the opening part formation gas curtain of described working chamber, stop that external dust enters inside working chamber, the cleanliness factor of gas in the working environment that the cleanliness factor of described high-cleanness, high gas is required when normally working greater than or equal to described machine equipment.

Semiconductor manufacturing facility the most according to claim 1, it is characterised in that: also include an exhaust apparatus, make described working chamber internal gas discharge.

Semiconductor manufacturing facility the most according to claim 2, it is characterised in that: described exhaust apparatus is positioned at the rear wall of working chamber.

Semiconductor manufacturing facility the most according to claim 1, it is characterised in that: described air delivery device includes appendix and filter.

Semiconductor manufacturing facility the most according to claim 4, it is characterised in that: described appendix is directly connected to an air conditioning system, thus realizes gas output.

Semiconductor manufacturing facility the most according to claim 1, it is characterised in that: described air delivery device includes an air outlet, and its width is more than or equal to the width of the opening of described working chamber.

Semiconductor manufacturing facility the most according to claim 6, it is characterised in that: the height of described air outlet is 50 ~ 200mm.

Semiconductor manufacturing facility the most according to claim 1, it is characterised in that: also include a lid, for closing the opening of described working chamber.

Semiconductor manufacturing facility the most according to claim 1, it is characterised in that: air delivery device also includes an air valve.

Semiconductor manufacturing facility the most according to claim 1, it is characterised in that: described equipment is evaporator, scribing machine or waxing machine.