CN205607930U - Ultrasonic transducer of high SNR - Google Patents

Ultrasonic transducer of high SNR Download PDF

Info

Publication number
CN205607930U
CN205607930U CN201521111041.4U CN201521111041U CN205607930U CN 205607930 U CN205607930 U CN 205607930U CN 201521111041 U CN201521111041 U CN 201521111041U CN 205607930 U CN205607930 U CN 205607930U
Authority
CN
China
Prior art keywords
wafer
damping piece
piezoelectric chip
piezoelectricity wafer
damping block
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201521111041.4U
Other languages
Chinese (zh)
Inventor
程强
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SHANGHAI BINRUI INSPECTION TECHNOLOGY SERVICE Co Ltd
Original Assignee
SHANGHAI BINRUI INSPECTION TECHNOLOGY SERVICE Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SHANGHAI BINRUI INSPECTION TECHNOLOGY SERVICE Co Ltd filed Critical SHANGHAI BINRUI INSPECTION TECHNOLOGY SERVICE Co Ltd
Priority to CN201521111041.4U priority Critical patent/CN205607930U/en
Application granted granted Critical
Publication of CN205607930U publication Critical patent/CN205607930U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Landscapes

  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)

Abstract

The utility model discloses an ultrasonic transducer of high SNR, it contains shell, sound absorbent, slide wedge, piezoelectricity wafer, damping piece and cable conductor, be equipped with sound absorbent in the shell, the slide wedge setting together bonds after piezoelectricity wafer upper portion is connected with the damping piece again and arrives in sound absorbent sound absorbent in, and the lower part of piezoelectricity wafer fixes on the inclined plane of slide wedge, cable conductor one end is passed the damping piece and is connected with the piezoelectricity wafer, the piezoelectricity wafer adopts is lithium metasilicate piezoelectricity wafer, the damping piece adds the high speed centrifugation processing through the method of pouring and bonds with the piezoelectricity wafer, the area of damping piece is unanimous with the area of wafer size, and thickness is 5mm to reduce pulse width, improve the SNR. Its advantage is: its size through reducing the damping piece combines lithium metasilicate piezoelectricity wafer and the method of pouring to add high speed centrifugation and handles the backing of doing to restrict the interact probability of thick crystalline grain and ultrasonic beam, reach and reduce pulse width, improve the purpose of SNR.

Description

The ultrasound probe of high s/n ratio
Technical field
This utility model relates to ultrasonic detection technology field, is specifically related to the ultrasound probe of a kind of high s/n ratio.
Background technology
Increasing industrial products, such as chemical tanker, nuclear reactor and pressure vessel etc., the use coarse grain material such as rustless steel or two phase stainless steel is as its welding base metal, but this material is because being coarse grain material, and each diversity is extremely difficult for ultrasound examination;
Now, the ultrasound probe detected for rustless steel or two phase stainless steel, be used mostly is twin crystal longitudinal wave oblique probe, and this kind of probe easily produces waveform conversion in above material, and signal to noise ratio is low, the ultrasonic signal sent for probe is not easy to distinguish, depending entirely on the wafer material that probe is used, this kind of wafer generally uses piezoelectric ceramic wafer, its ultrasonic pulse width produced, detection sensitivity is low, it is impossible to the size of qualitative deficiency and location.
Utility model content
The purpose of this utility model is to provide the ultrasound probe of a kind of high s/n ratio, it is by reducing the size of damping block, the backing that high speed centrifugal treating is done is added in conjunction with Lithium metasilicate piezoelectric chip and casting method, to limit the interaction probability of coarse grain and ultrasonic beam, reach to reduce pulse width, improve the purpose of signal to noise ratio.
In order to achieve the above object, this utility model is achieved through the following technical solutions:
A kind of ultrasound probe of high s/n ratio, it comprises shell, sound-absorbing material, wedge, piezoelectric chip, damping block and cable, it is characterized in that:
It is provided with sound-absorbing material in described shell, wedge is arranged in sound-absorbing material, piezoelectric chip top is another with bonding in described sound-absorbing material after being connected with damping block, and the bottom of piezoelectric chip is fixed on the inclined-plane of wedge, and cable one end is connected through damping block with piezoelectric chip;
Described piezoelectric chip uses Lithium metasilicate piezoelectric chip;It is bonding with piezoelectric chip that described damping block adds high speed centrifugal treating through casting method;The area of described damping block is consistent with the size of wafer, and thickness is 5mm, to reduce pulse width, improve signal to noise ratio.
The ultrasound probe of above-mentioned high s/n ratio, wherein:
The key groove of described wedge is 45 °.
This utility model compared with prior art has the advantage that it is by the size reducing damping block, the backing that high speed centrifugal treating is done is added in conjunction with Lithium metasilicate piezoelectric chip and casting method, to limit the interaction probability of coarse grain and ultrasonic beam, reach to reduce pulse width, improve the purpose of signal to noise ratio.
Accompanying drawing explanation
Fig. 1 is overall structure schematic diagram of the present utility model.
Detailed description of the invention
Below in conjunction with accompanying drawing, by describing a preferably specific embodiment in detail, this utility model is further elaborated.
As it is shown in figure 1, the ultrasound probe of a kind of high s/n ratio, it comprises shell 4, sound-absorbing material 1, wedge 2, piezoelectric chip 6, damping block 3 and cable 5;It is provided with sound-absorbing material 1 in described shell 4, wedge 2 is arranged in sound-absorbing material 1, piezoelectric chip 6 top is another with bonding in described sound-absorbing material 1 after being connected with damping block 3, and the bottom of piezoelectric chip 6 is fixed on the inclined-plane of wedge 2, cable 5 one end is connected through damping block 3 with piezoelectric chip 6;Described piezoelectric chip 6 uses Lithium metasilicate piezoelectric chip;It is bonding with piezoelectric chip 6 that described damping block 3 adds high speed centrifugal treating through casting method;The area of described damping block 3 is consistent with the size of wafer 6, and thickness is 5mm, to reduce pulse width, improves signal to noise ratio;The key groove of described wedge 2 is 45 °.
This utility model have employed Lithium metasilicate and does piezoelectric chip, and use casting method to add high speed centrifugal treating to do backing, reducing the size of damping block to reduce pulse width, the high-frequency narrow-pulse probe of making significantly improves resolution and signal to noise ratio, it is achieved that high precision test simultaneously.
Although content of the present utility model has been made to be discussed in detail by above preferred embodiment, but it should be appreciated that the description above is not considered as restriction of the present utility model.After those skilled in the art have read foregoing, multiple amendment of the present utility model and replacement all be will be apparent from.Therefore, protection domain of the present utility model should be limited to the appended claims.

Claims (2)

1. a ultrasound probe for high s/n ratio, it comprises shell (4), sound-absorbing material (1), wedge (2), piezoelectric chip (6), damping block (3) and cable (5), it is characterised in that:
Sound-absorbing material (1) it is provided with in described shell (4), wedge (2) is arranged in sound-absorbing material (1), piezoelectric chip (6) top is another with bonding in described sound-absorbing material (1) after being connected with damping block (3), and the bottom of piezoelectric chip (6) is fixed on the inclined-plane of wedge (2), cable (5) one end is connected through damping block (3) with piezoelectric chip (6);
Described piezoelectric chip (6) uses Lithium metasilicate piezoelectric chip;It is bonding with piezoelectric chip (6) that described damping block (3) adds high speed centrifugal treating through casting method;The area of described damping block (3) is consistent with the size of wafer (6), and thickness is 5mm, to reduce pulse width, improves signal to noise ratio.
2. the ultrasound probe of high s/n ratio as claimed in claim 1, it is characterised in that:
The key groove of described wedge (2) is 45 °.
CN201521111041.4U 2015-12-29 2015-12-29 Ultrasonic transducer of high SNR Expired - Fee Related CN205607930U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201521111041.4U CN205607930U (en) 2015-12-29 2015-12-29 Ultrasonic transducer of high SNR

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201521111041.4U CN205607930U (en) 2015-12-29 2015-12-29 Ultrasonic transducer of high SNR

Publications (1)

Publication Number Publication Date
CN205607930U true CN205607930U (en) 2016-09-28

Family

ID=56960840

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201521111041.4U Expired - Fee Related CN205607930U (en) 2015-12-29 2015-12-29 Ultrasonic transducer of high SNR

Country Status (1)

Country Link
CN (1) CN205607930U (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107727747A (en) * 2017-11-08 2018-02-23 中国石油集团渤海石油装备制造有限公司 A kind of big chip twin crystal longitudinal wave probe of high-frequency
CN108562652A (en) * 2018-04-04 2018-09-21 河海大学常州校区 A kind of sliceable underwater works detection array ultrasonic probe
CN109142541A (en) * 2018-09-25 2019-01-04 南京通用化工设备技术研究院 A kind of wear-resisting probe of ultrasound examination
CN111220713A (en) * 2020-04-07 2020-06-02 国电科学技术研究院有限公司 Intelligent monitoring and detecting system and method for defects and stress of in-service wind power bolts
RU2820460C1 (en) * 2023-07-17 2024-06-04 Акционерное общество "Обнинское научно-производственное предприятие "Технология" им. А.Г. Ромашина" Method of ultrasonic non-destructive testing

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107727747A (en) * 2017-11-08 2018-02-23 中国石油集团渤海石油装备制造有限公司 A kind of big chip twin crystal longitudinal wave probe of high-frequency
CN108562652A (en) * 2018-04-04 2018-09-21 河海大学常州校区 A kind of sliceable underwater works detection array ultrasonic probe
CN109142541A (en) * 2018-09-25 2019-01-04 南京通用化工设备技术研究院 A kind of wear-resisting probe of ultrasound examination
CN109142541B (en) * 2018-09-25 2024-01-12 上海中核维思仪器仪表股份有限公司 Ultrasonic detection wear-resistant probe
CN111220713A (en) * 2020-04-07 2020-06-02 国电科学技术研究院有限公司 Intelligent monitoring and detecting system and method for defects and stress of in-service wind power bolts
CN111220713B (en) * 2020-04-07 2024-03-29 国家能源集团科学技术研究院有限公司 Intelligent supervision and detection system and method for defects and stress of in-service wind power bolts
RU2820460C1 (en) * 2023-07-17 2024-06-04 Акционерное общество "Обнинское научно-производственное предприятие "Технология" им. А.Г. Ромашина" Method of ultrasonic non-destructive testing

Similar Documents

Publication Publication Date Title
CN205607930U (en) Ultrasonic transducer of high SNR
US20140060196A1 (en) Ultrasonic testing apparatus
CN108872393B (en) Nonlinear ultrasonic frequency mixing method for detecting structural fatigue crack direction
CN103543206A (en) Method for carrying out ultrasonic inspection on residual stress of aluminium alloy pre-stretching board by water immersion
JP2009229355A (en) Device and method for monitoring oscillation of nuclear reactor
JP5311766B2 (en) Interface inspection apparatus and interface inspection method
CN106248802A (en) A kind of high-resolution TOFD detection ultrasound probe
CN202886034U (en) Ultrasonic residual stress measurement device for welded joint of welding structure
JP2017167100A (en) Monitoring system for structure, and method for monitoring structure
CN206096037U (en) Ultrasonic testing device of metal tubular product defect based on time reversal and lamb wave
JP5810873B2 (en) Ultrasonic flaw detection method
CN104422734A (en) Adaptive curvature seal coupling wedge applied to ultrasonic phased array probe
KR20110046061A (en) Pipe inspection device using plural channel ultra-sonic and the inspection method thereof
CN204514866U (en) A kind of sheet workpiece phased array supersonic guided wave image-forming detecting system
Liu et al. A novel laser ultrasonic thickness measurement method for metal plate based on spectral analysis
CN204758547U (en) Semi -circular ultrasonic transducer
CN104990988A (en) Anti-interference ultrasonic probe
US20140036633A1 (en) Ultrasonic probe
CN204789478U (en) Anti -jamming ultrasonic transducer
Islas-Cital et al. Phase calibration of sonar systems using standard targets and dual-frequency transmission pulses
CN207601019U (en) For detecting the ultrasonic probe of helical water-cooled wall bandage weld seam
CN207689435U (en) A kind of TOFD probes of strong antijamming capability
Tanaka et al. Basic properties of ultrasonic probe with a through hole for medical application
Erhard et al. Calculation and construction of phased array-UT probes
Wu et al. Circumference Damage Identification in a Pipe Using Mode Conversion of Longitudinal Guided Wave

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20160928

Termination date: 20191229

CF01 Termination of patent right due to non-payment of annual fee