CN205601327U - A vapour -pressure type upset assembly device for electronic product - Google Patents
A vapour -pressure type upset assembly device for electronic product Download PDFInfo
- Publication number
- CN205601327U CN205601327U CN201521038244.5U CN201521038244U CN205601327U CN 205601327 U CN205601327 U CN 205601327U CN 201521038244 U CN201521038244 U CN 201521038244U CN 205601327 U CN205601327 U CN 205601327U
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- CN
- China
- Prior art keywords
- upper mold
- mould
- fixed block
- lower mold
- vapour
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Abstract
The utility model relates to a vapour -pressure type upset assembly device for electronic product, including equipment anchor clamps and drive assembly, the equipment anchor clamps include the mould fixed block, go up mould flip structure, go up mould and lower mould. But fixed block vertical direction rebound, upward there is the stopper in the fixed module of mould, go up the mould fixed block and connect air compressor, it includes pivot and pneumatic rotating head to go up mould flip structure, it passes through to go up the mould it connects to go up mould flip structure go up on the mould fixed block, go up the mould overturn to horizontal position move down perpendicularly with the complete pressfitting of lower mould. Drive assembly includes frame, servo motor, cam, slider, support arm, swing arm and connecting block, servo motor is provided with the actuating shaft connection cam. Characteristics such as this a vapour -pressure type upset assembly device for electronic product can be used to pinpoint cell -phone face -piece and gum, improves the yields, has convenient to use, degree of automation is high, the practicality is strong.
Description
Technical field
This utility model relates to gum manufacture field, is specifically related to a kind of vapour-pressure type for electronic product and overturns assembling device.
Background technology
Along with the development of science and technology, the application of mobile phone is the most universal, and in order to more preferable protective housing is not easily susceptible to damage, the housing of mobile phone the most all can assemble gum.In Cellphone Accessories carry out the field produced, streamline is the most all used to produce.Existing patch gum method is relatively backward, operates the most by hand, and accessory hand assembled exists that length in man-hour, yields be low, the problem of quality weak effect.
The mobile phone shell positioner function having at present is relatively easy, have is only simple positioning function, and fixture ease for use is poor, still needs to manual too much participation in operating process, automaticity is low, causes that the efficiency automatically pasting back-gluing machine is low, quality is unstable, spillage of material is serious.
Utility model content
In view of this, this utility model discloses a kind of vapour-pressure type for electronic product and overturns assembling device.
The purpose of this utility model is achieved through the following technical solutions:
A kind of vapour-pressure type for electronic product overturns assembling device, and including assembling fixture and driving assembly, described assembling fixture includes that upper mold fixed block, upper mold overturn structure, upper die and lower die；Upper mold fixed block is fixedly connected on contiguous block, is connected with air compressor simultaneously, can vertical direction move；On described upper mold fixed block, upper mold upset structure closure is provided with limited block；Described upper mold upset structure includes the Pneumatic rotary head of rotating shaft and its two ends, and described rotating shaft is positioned at below limited block；Described Pneumatic rotary head is fixing with upper mold fixed block to be connected；Described upper mold is flexibly connected with described upper mold fixed block by described rotating shaft；Described upper mold includes upper mold vac sorb location structure and centrally located upper mold core；Described upper mold vac sorb location structure includes vacuum pumping hole and the upper mold detent being positioned at upper mold core surrounding, and described upper mold detent is the sunk structure being positioned at upper mold core side；Described lower mold includes lower mold vac sorb location structure and centrally located lower mold core；Described lower mold vac sorb location structure includes vacuum pumping hole and the lower mold location punch being positioned at lower mold core, and described lower mold location punch is the bulge-structure being positioned at lower mold core side, matches with upper mold detent.The upset of described upper mold vertically moves down pressing complete with described lower mold to horizontal level.Described upper mold vac sorb location structure is all connected with vacuum equipment with lower mold vac sorb location structure；Described driving assembly includes frame, servomotor, cam, slide block, support arm, swing arm and contiguous block, described servomotor is provided with drive shaft and connects cam, described cam is provided with oval-shaped groove, is provided with slide block in described oval-shaped groove, and described slide block connects support arm, described support arm upper end connects swing arm end, the described swing arm other end is provided with contiguous block, swingable in the middle part of described swing arm is set up in frame, and described contiguous block connects upper mold fixed block.
Further, described upper mold core is to be positioned at the sunk structure of upper mold central authorities, is conducive to being accurately positioned further while saving space.
Further, four drift angles of described upper mold are provided with guide pin bushing, and four drift angles of described lower mold are provided with the guide pillar matched with guide pin bushing, are conducive to being accurately positioned further.
The beneficial effects of the utility model are: move up and down by driving Component driver to assemble fixture, the upset of upper clamping fixture is assembled by pneumatic control, mobile telephone surface shell and mobile phone gum are adsorbed location by vacuum adsorption positioning apparatus respectively simultaneously, upper mold air-actuated turnover is to horizontal level, upper mold fixed block vertically moves down, make the complete pressing of upper die and lower die, thus complete the accurate bonding process of mobile telephone surface shell and gum.This vapour-pressure type upset assembling device being used for electronic product can be used for being accurately positioned mobile telephone surface shell and gum, raising yields, have easy to use, automaticity is high, the feature such as practical.
Accompanying drawing explanation
Fig. 1 is assembling fixture perspective view of the present utility model.
Fig. 2 is the front view that this utility model assembles fixture.
Fig. 3 is upper die structure schematic diagram of the present utility model.
Fig. 4 is lower die structure schematic diagram of the present utility model.
Fig. 5 is the structural representation that this utility model drives assembly.
1 it is upper mold fixed block, 2 upper molds upset structures, 3 is upper mold, 4 is lower mold, 11 is limited block, 21 is rotating shaft, 22 is Pneumatic rotary head, 31 is upper mold vac sorb location structure, 32 is upper mold core, 33 is vacuum pumping hole, 34 is upper mold detent, 35 is guide pin bushing, 41 is lower mold vac sorb location structure, 42 is the lower mold heart, 43 is lower mold location punch, 44 is guide pillar, 5 is frame, 51 is cam, 52 is slide block, 53 is support arm, 54 is swing arm, 55 is contiguous block.
Detailed description of the invention
This utility model is described in further detail below in conjunction with embodiment for the ease of it will be appreciated by those skilled in the art that:
Embodiment 1
The present embodiment provides a kind of vapour-pressure type for electronic product to overturn assembling device, and as Figure 1-Figure 5, including assembling fixture and driving assembly, described assembling fixture includes upper mold fixed block 1, upper mold upset structure 2, upper mold 3 and lower mold 4；Upper mold fixed block 1 is fixedly connected on contiguous block, is connected with air compressor simultaneously, can vertical direction move；On described upper mold fixed block 1, upper mold upset structure 2 closure is provided with limited block 11；Described upper mold upset structure 2 includes the Pneumatic rotary head 22 at rotating shaft 21 and its two ends, and described rotating shaft 21 is positioned at below limited block 11；Described Pneumatic rotary head 22 is fixing with upper mold fixed block 1 to be connected；Described upper mold 3 is flexibly connected with described upper mold fixed block 1 by described rotating shaft 21；Described upper mold 3 includes upper mold vac sorb location structure 31 and centrally located upper mold core 32；Described upper mold vac sorb location structure 31 includes vacuum pumping hole 33 and the upper mold detent 34 being positioned at upper mold core 32 surrounding, and described upper mold detent 34 is the sunk structure being positioned at upper mold core 32 side；Described lower mold 4 includes lower mold vac sorb location structure 41 and centrally located lower mold core 42；Described lower mold vac sorb location structure 41 includes vacuum pumping hole 33 and the lower mold location punch 43 being positioned at lower mold core 42, and described lower mold location punch 43 is the bulge-structure being positioned at lower mold core 42 side, matches with upper mold detent 34.Described upper mold 3 overturns to horizontal level and vertically moves down and the described complete pressing of lower mold 4.Described upper mold vac sorb location structure 31 is all connected with vacuum equipment with lower mold vac sorb location structure 41；Described driving assembly includes frame 5, servomotor (does not shows in figure), cam 51, slide block 52, support arm 53, swing arm 54 and contiguous block 55, described servomotor is provided with drive shaft (not showing in figure) and connects cam 51, described cam 51 is provided with oval-shaped groove, slide block 52 it is provided with in described oval-shaped groove, described slide block 52 connects support arm 53, described support arm 53 upper end connects swing arm 54 end, described swing arm 54 other end is provided with contiguous block 55, swingable in the middle part of described swing arm 54 it is set up in frame 5, described contiguous block 55 connects upper mold fixed block 1.
Described upper mold core 32 is the sunk structure being positioned at upper mold 3 central authorities, is conducive to being accurately positioned further while saving space.
3 four drift angles of described upper mold are provided with guide pin bushing 35, and 4 four drift angles of described lower mold are provided with the guide pillar 44 matched with guide pin bushing 35, are conducive to being accurately positioned further.
Being more than wherein specific implementation of the present utility model, it describes more concrete and detailed, but therefore can not be interpreted as the restriction to this utility model the scope of the claims.It should be pointed out that, for the person of ordinary skill of the art, without departing from the concept of the premise utility, it is also possible to make some deformation and improvement, these obvious alternative forms belong to protection domain of the present utility model.
Claims (3)
1. the vapour-pressure type upset assembling device for electronic product, it is characterised in that: including assembling fixture and driving assembly, described assembling fixture includes that upper mold fixed block, upper mold overturn structure, upper die and lower die；On described upper mold fixed block, upper mold upset structure closure is provided with limited block；Described upper mold upset structure includes the Pneumatic rotary head of rotating shaft and its two ends, and described rotating shaft is positioned at below limited block；Described Pneumatic rotary head is fixing with upper mold fixed block to be connected；Described upper mold is flexibly connected with described upper mold fixed block by described rotating shaft；Described upper mold includes upper mold vac sorb location structure and centrally located upper mold core；Described upper mold vac sorb location structure includes vacuum pumping hole and the upper mold detent being positioned at upper mold core surrounding, and described upper mold detent is the sunk structure being positioned at upper mold core side；Described lower mold includes lower mold vac sorb location structure and centrally located lower mold core；Described lower mold vac sorb location structure includes vacuum pumping hole and the lower mold location punch being positioned at lower mold core, and described lower mold location punch is the bulge-structure being positioned at lower mold core side, matches with upper mold detent；Described driving assembly includes frame, servomotor, cam, slide block, support arm, swing arm and contiguous block, described servomotor is provided with drive shaft and connects cam, described cam is provided with oval-shaped groove, is provided with slide block in described oval-shaped groove, and described slide block connects support arm, described support arm upper end connects swing arm end, the described swing arm other end is provided with contiguous block, swingable in the middle part of described swing arm is set up in frame, and described contiguous block connects upper mold fixed block.
Vapour-pressure type for electronic product the most according to claim 1 overturns assembling device, it is characterised in that: described upper mold core is to be positioned at the sunk structure of upper mold central authorities.
Vapour-pressure type for electronic product the most according to claim 1 overturns assembling device, it is characterised in that: four drift angles of described upper mold are provided with guide pin bushing, and four drift angles of described lower mold are provided with the guide pillar matched with guide pin bushing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521038244.5U CN205601327U (en) | 2015-12-15 | 2015-12-15 | A vapour -pressure type upset assembly device for electronic product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521038244.5U CN205601327U (en) | 2015-12-15 | 2015-12-15 | A vapour -pressure type upset assembly device for electronic product |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205601327U true CN205601327U (en) | 2016-09-28 |
Family
ID=56959846
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201521038244.5U Expired - Fee Related CN205601327U (en) | 2015-12-15 | 2015-12-15 | A vapour -pressure type upset assembly device for electronic product |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205601327U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108819184A (en) * | 2018-08-01 | 2018-11-16 | 长兴曼尔申机械科技有限公司 | A kind of automatic loading and unloading plastic uptake equipment |
-
2015
- 2015-12-15 CN CN201521038244.5U patent/CN205601327U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108819184A (en) * | 2018-08-01 | 2018-11-16 | 长兴曼尔申机械科技有限公司 | A kind of automatic loading and unloading plastic uptake equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20190424 Address after: 516001 Second Floor of No.3 Workshop of Weihuang East Road, Shuikou Town, Huicheng District, Guangdong Province Patentee after: Huizhou Jiehuan Technology Co., Ltd. Address before: 516000 No. 16 Huifeng East Second Road, Zhongkai High-tech Zone, Huizhou City, Guangdong Province Patentee before: GUANGDONG KESI ELECTRONIC TECHNOLOGY CO., LTD. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160928 Termination date: 20191215 |