CN205595373U - Emitting diode structure and display device - Google Patents
Emitting diode structure and display device Download PDFInfo
- Publication number
- CN205595373U CN205595373U CN201620352413.0U CN201620352413U CN205595373U CN 205595373 U CN205595373 U CN 205595373U CN 201620352413 U CN201620352413 U CN 201620352413U CN 205595373 U CN205595373 U CN 205595373U
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- conductive feet
- emitting diode
- sets
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- 235000012431 wafers Nutrition 0.000 claims description 44
- 239000000758 substrate Substances 0.000 claims description 26
- 238000010276 construction Methods 0.000 claims description 23
- 230000005611 electricity Effects 0.000 claims description 3
- 230000001788 irregular Effects 0.000 claims description 3
- 239000013078 crystal Substances 0.000 abstract 7
- 230000000694 effects Effects 0.000 description 6
- 230000000007 visual effect Effects 0.000 description 6
- 238000003384 imaging method Methods 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 238000004020 luminiscence type Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 241001270131 Agaricus moelleri Species 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
Landscapes
- Led Device Packages (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The utility model provides an emitting diode structure and display device, the emitting diode structure includes base plate, at least two sets of LED crystal plate group, at least two sets of conductive feet group and public conductive feet, on at least two sets of LED crystal plate group all located the base plate, every LED crystal plate group of group was become by red, green, blue tri colour three crystal plate group, at least two sets of conductive feet group all locates on the base plate to correspond with at least two sets of LED crystal plate group and be connected, public conductive feet locates on the base plate to respectively with at least two sets of conductive feet group links. Owing to set up at least two sets of LED crystal plate group to correspond simultaneously and has set up at least two sets of conductive feet group, make behind at least two sets of LED crystal plate group and at least two sets of conductive feet group links, can produce two at least pixels, be equivalent to same kind of product picture picture point apart from unchangeable and the pixel becomes close, thereby make the image more clear, brighter.
Description
Technical field
This utility model relates to the technical field of light emitting diode, particularly relate to a kind of light emitting diode construction and
There is the display device of this light emitting diode construction.
Background technology
LED (Light Emitting Diode) is the semiconductor device of a kind of solid-state, it
Directly electricity can be converted into light.It is luminous and the luminescence of electricity-saving lamp tricolor powder that it changes electric filament lamp tungsten filament
Principle, and use electroluminescence.Clearly, life-span length, light efficiency are high, radiationless and low for the feature of LED
Power consumption.
The spectrum almost all of LED concentrates on visible light frequency band.LED light source may utilize red, green, blue three base
Chromogen is managed, and makes three kinds of colors have 256 grades of gray scales and arbitrarily mix, can produce under computer technology control
Raw 256 × 256 × 256=16777216 kind color, forms different photochromic combination and variation multiterminal, it is achieved rich
Rich colorful dynamic variation effect and various image.
Along with the development of LED technology, LED display is increasingly used in indoor, room
The multiple occasion such as outer.And when LED display is applied in some occasions such as gymnasium, cinema, stations,
It may require that have the feature that visible angle is big.But, owing to current LED display is the most SMD
Structure so that it cannot meet the indoor of the big visual angle of various requirement or half indoor place, therefore, limits
The scope of application of LED display.
Simultaneously, along with the raising of quality of the life, people's definition to display screen, the light emitting anger of pixel
Degree, brightness, imaging effect are proposed requirement, increasingly to high definition, low-density, big visual angle display screen
Imaging standards is close.And current light emitting diode only has three wafers that red, green, blue is trichroism mostly, and
The light emitting diode only one of which pixel of this kind of structure, also limit definition and brightness undoubtedly.
Therefore, it is necessary to provide a kind of technological means to solve drawbacks described above.
Utility model content
The purpose of this utility model is to overcome the defect of prior art, it is provided that a kind of light emitting diode construction,
Only have trichroism three wafers of red, green, blue so that limiting it solving light emitting diode of the prior art
Definition and the problem of brightness.
This utility model is achieved in that a kind of light emitting diode construction, including:
Substrate；
At least two group LED wafer groups, LED wafer group described at least two groups is all located on described substrate, often group
Described LED wafer group is made up of three wafers that red, green, blue is trichroism；
At least two group conductive feet groups corresponding with the quantity of LED wafer group described at least two groups, at least two group institutes
State conductive feet group to be all located on described substrate, and connection corresponding with LED wafer group described at least two groups；
Public conductive feet, described public conductive feet is located on described substrate, and is led with described at least two groups respectively
Electricity foot group connects.
Specifically, often organize described conductive feet group and include three conductive feet, three described conductive feet respectively with often group
Three wafer correspondences of described LED wafer group connect.
Specifically, LED wafer group described at least two groups is regularly arranged or irregular is arranged in described base
On plate.
Specifically, described LED wafer group is provided with two groups, and described in two groups, LED wafer component is located at described substrate
Two ends；
Described conductive feet group is correspondingly provided with two groups, and described in two groups, conductive feet component is located at the both sides of described substrate
End.
Specifically, described public conductive feet is located at the side of described substrate.
The technique effect of light emitting diode construction of the present utility model is: owing to being provided with at least two groups LED
Wafer set, and be simultaneously correspondingly arranged at least two group conductive feet groups, make at least two group LED wafer groups with
After at least two group conductive feet groups connect, at least two pixel can be produced, be equivalent to same product picture point
Become close away from constant and pixel, so that apparent, brighter to image.
This utility model also provides for a kind of display device, has above-mentioned light emitting diode construction.Owing to this shows
Show that equipment has above-mentioned light emitting diode construction, the definition of display device and bright can be greatly increased with this
Degree, and increase the imaging effect at the big visual angle of display device simultaneously, improve the visual experience of user.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of light emitting diode construction of the present utility model；
Fig. 2 is the schematic diagram of another angle of the light emitting diode construction of Fig. 1；
Fig. 3 is the circuit diagram of light emitting diode construction of the present utility model.
Detailed description of the invention
In order to make the purpose of this utility model, technical scheme and advantage clearer, below in conjunction with accompanying drawing
And embodiment, this utility model is further elaborated.Should be appreciated that described herein specifically
Embodiment, only in order to explain this utility model, is not used to limit this utility model.
The embodiment of light emitting diode construction:
Referring to Fig. 1 to Fig. 3, this utility model provides a kind of light emitting diode construction, below to this luminescence
The embodiment of diode structure is illustrated.
The light emitting diode construction 100 of the present embodiment, including substrate 10, at least two group LED wafer group 20,
At least two group conductive feet group 30 and public conductive feet 40, the below each parts to light emitting diode construction 100
It is described further:
Substrate 10 is for for parts installation settings, and simultaneously, this substrate 10 may be selected to be aluminium base or copper base,
It is beneficial to heat radiation；
At least two group LED wafer groups 20 are all located on substrate 10, it is preferred that LED wafer group 20 can be led to
Cross heat radiation glue and be located on substrate 10, improve its radiating effect with this；It addition, often organize LED wafer group
20 are made up of three wafers 21 that red, green, blue is trichroism；
At least two group conductive feet groups 30 are corresponding, wherein, at least with the quantity of at least two group LED wafer groups 20
Two groups of conductive feet groups 30 are all located on substrate 10, and connection corresponding with at least two group LED wafer groups 20；
Public conductive feet 40 is located on substrate 10, and is connected with at least two group conductive feet groups 30 respectively, with
This controls the switch of at least two group LED wafer groups 20.
Owing to being provided with at least two group LED wafer groups 20, and at least two group conductive feet it have been correspondingly arranged simultaneously
Group 30, makes, after at least two group LED wafer groups 20 are connected with at least two group conductive feet groups 30, can produce
Raw at least two pixel, is equivalent to same product picture point away from constant and pixel becomes close, so that arriving
Image is apparent, brighter.
Referring to Fig. 1, the LED wafer group 20 of the present embodiment is provided with two groups, certainly, it is possible to according to reality
Situation and arrange three groups, four groups etc., these embodiments fall within the protection category of the present embodiment；Two groups
LED wafer group 20 interval is divided into the two ends of substrate 10, while being beneficial to installation settings, it is possible to avoid
Influence each other；
Conductive feet group 30 is correspondingly provided with two groups, and two groups of conductive feet groups 30 are divided into the two side ends of substrate 10,
It is beneficial to the electrical connection of conductive feet group 30 and LED wafer group 20.
Refer to Fig. 1, it is preferable that often group conductive feet group 30 includes three conductive feet 31, three conductive feet
31 connections corresponding with three wafers 21 often organizing LED wafer group 20 respectively.Wherein, conductive feet group is often organized
30 arrange three conductive feet 31, are conducive to and three wafer 21 one_to_one corresponding often organizing LED wafer group 20
Connect, the beneficially installation settings of producers.
Simultaneously, for the ease of the connection of two groups of conductive feet groups 30 with public conductive feet 40, public conductive feet
40 sides being located at substrate 10.
Referring to Fig. 1, two groups of LED wafer groups 20 in the present embodiment are in regularly arranged or irregular arrangement
Arrange on the substrate 10.And if two groups of LED wafer groups 20 are in regularly arranged setting, it can linearly arrange
Arrange, in order to the manufacturing of producers.
The embodiment of display device:
Referring to Fig. 1 to Fig. 3, this utility model provides a kind of display device, below to this display device
Embodiment is illustrated.
The display device of the present embodiment, can be LCDs or liquid crystal flat-plate television, and it has above-mentioned
Light emitting diode construction 100.So, owing to this display device has above-mentioned light emitting diode construction 100,
The definition that can be greatly increased display device with this and brightness, and increase the imaging at the big visual angle of display device simultaneously
Effect, improves the visual experience of user.
The foregoing is only this utility model preferred embodiment, its structure is not limited to above-mentioned enumerating
Shape, all any amendment, equivalent and improvement etc. made within spirit of the present utility model and principle,
Within should be included in protection domain of the present utility model.
Claims (6)
1. a light emitting diode construction, it is characterised in that including:
Substrate；
At least two group LED wafer groups, LED wafer group described at least two groups is all located on described substrate, often group
Described LED wafer group is made up of three wafers that red, green, blue is trichroism；
At least two group conductive feet groups corresponding with the quantity of LED wafer group described at least two groups, at least two group institutes
State conductive feet group to be all located on described substrate, and connection corresponding with LED wafer group described at least two groups；
Public conductive feet, described public conductive feet is located on described substrate, and is led with described at least two groups respectively
Electricity foot group connects.
2. light emitting diode construction as claimed in claim 1, it is characterised in that: often organize described conductive feet group
Including three conductive feet, three described conductive feet are corresponding with three wafers often organizing described LED wafer group respectively
Connect.
3. light emitting diode construction as claimed in claim 1, it is characterised in that: LED described at least two groups
Wafer set be regularly arranged or irregular spread configuration on the substrate.
4. light emitting diode construction as claimed in claim 1, it is characterised in that: described LED wafer group sets
Having two groups, described in two groups, LED wafer component is located at the two ends of described substrate；
Described conductive feet group is correspondingly provided with two groups, and described in two groups, conductive feet component is located at the both sides of described substrate
End.
5. the light emitting diode construction as described in any one of claim 1-4, it is characterised in that: described public
Conductive feet is located at the side of described substrate.
6. a display device, it is characterised in that: there is the light-emitting diodes described in any one of claim 1-5
Tubular construction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620352413.0U CN205595373U (en) | 2016-04-25 | 2016-04-25 | Emitting diode structure and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620352413.0U CN205595373U (en) | 2016-04-25 | 2016-04-25 | Emitting diode structure and display device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205595373U true CN205595373U (en) | 2016-09-21 |
Family
ID=56936155
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620352413.0U Expired - Fee Related CN205595373U (en) | 2016-04-25 | 2016-04-25 | Emitting diode structure and display device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205595373U (en) |
-
2016
- 2016-04-25 CN CN201620352413.0U patent/CN205595373U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160921 |