CN205594566U - Computer low noise cooling system - Google Patents
Computer low noise cooling system Download PDFInfo
- Publication number
- CN205594566U CN205594566U CN201620364329.0U CN201620364329U CN205594566U CN 205594566 U CN205594566 U CN 205594566U CN 201620364329 U CN201620364329 U CN 201620364329U CN 205594566 U CN205594566 U CN 205594566U
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- Prior art keywords
- heat
- computer
- noise
- heat radiation
- fan
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Abstract
The utility model discloses a computer low noise cooling system, including microprocessor, fan, microchannel fin, pipe, air pump, temperature sensor, semiconductor cooler, heat conducting gas accumulator and cooling box, be equipped with porous sound absorbing layer and ventilation hole on the cooling box box wall, microprocessor the fan the air pump semiconductor cooler with the heat conducting gas accumulator is all established in the cooling box, temperature sensor establishes the surface that needs radiating part at the computer, the microchannel fin covers the surface that needs radiating part at the computer. The utility model discloses can avoid or reduce the dust quick -witted incasement portion of entering and reduce the noise that the fan sent, separately, effectively avoid the dust to get into quick -witted case the essential element district and the workspace of dispelling the heat of computer machine case, the heat dissipation in the essential element district of computer machine case can effectively be guaranteed to the microchannel fin moreover, has reduced the noise that the fan during operation sent simultaneously.
Description
Technical field
This utility model relates to computer hardware field, dissipates more particularly, to a kind of computer low noise
Hot systems.
Background technology
In order to make computer have preferable performance, computer user would generally configure the parts that performance is higher,
Such as video card, sound card, CPU, mainboard etc., and higher its working condition of parts of performance requires relatively
Strictly, wherein relatively strict to temperature requirement, too high being likely to of temperature causes parts to burn, and therefore counts
Calculation machine user tries every means and dispels the heat.And existing desk computer generally uses air-cooled mode to dispel the heat,
Air flowing in utilizing fan to make cabinet, to reach purpose of dispelling the heat, and this mode not only radiating efficiency
Low, dust also can be made cumulative in cabinet, and can when the part temperatures such as CPU raise suddenly,
Fan can work overloadingly, and sends bigger sound, i.e. produces bigger noise, if the parts such as CPU
Can not lower the temperature at short notice, then fan can work overloadingly in the long period, also will be in the long period
Inside send loud noise.And the dust in cabinet not only can produce infringement, Er Qiehui to the parts in cabinet
Reducing radiating effect, and then fan can be made to work overloadingly for a long time, in such cases, fan will be
Make a noise in long period, and be in for a long time in noisy environment, the emotion of people can be made by serious shadow
Ring, even can affect the endocrine of people.
Utility model content
Because in this, this utility model purpose is that offer one can be avoided or reduce dust and enter
The computer low-noise heat radiation system of the noise that cabinet inside and reduction fan send, by computer cabinet
Critical piece district separate with heat radiation working area, is prevented effectively from dust entrance cabinet, and microchannel fin
The heat radiation in the critical piece district of computer cabinet can be effectively ensured, send when reducing fan work simultaneously
Noise.
For reaching above-mentioned purpose, this utility model uses following technical proposals: computer low-noise heat radiation system
System, including microprocessor, fan, microchannel fin, conduit, air pump, temperature sensor, half
Conductor refrigerator, heat-conducting gas bin and heat dissipation box, described heat dissipation box box wall is provided with porous sound absorbing layer
And air vent；Described microprocessor, described fan, described air pump, described semiconductor cooler and institute
State heat-conducting gas bin to be each provided in described heat dissipation box；Described temperature sensor is located at computer to be needed to dissipate
The surface of the parts of heat, described microchannel fin covers the surface needing the parts dispelled the heat at computer；
The signal output part of described temperature sensor communicates to connect with the signal input part of described microprocessor, described
Microprocessor communicates to connect with described air pump, described fan and described semiconductor cooler respectively；Described
The air inlet of air pump is connected by the conducting of described catheter fluid with the gas outlet of described microchannel fin,
The air inlet of described microchannel fin passes through described conduit stream with the gas outlet of described heat-conducting gas bin
Body conducting connects, and the air inlet of described heat-conducting gas bin and the gas outlet of described air pump are by described
Catheter fluid conducting connects；The refrigeration end of described semiconductor cooler is located in described heat-conducting gas bin,
The end that heats of described semiconductor cooler is located at the outlet side of described fan.
Above computer low-noise heat radiation system, the end that heats of described semiconductor cooler is provided with fin.
Above computer low-noise heat radiation system, the refrigeration end of described semiconductor cooler is provided with fin.
Above computer low-noise heat radiation system, the gas outlet of described heat-conducting gas bin is provided with pressure limiting valve.
Above computer low-noise heat radiation system, the gas outlet of described heat-conducting gas bin is provided with air and divides
Stream plate, described pressure limiting valve is located between gas outlet and the described air distributor of described heat-conducting gas bin.
Above computer low-noise heat radiation system, the air inlet of described microchannel fin is provided with flow distribution plate,
The gas outlet of described microchannel fin is provided with collector plate；On the fin of described microchannel, adjacent two
In microchannel, air flow is contrary.
Above computer low-noise heat radiation system, is provided with temperature sensor in described heat-conducting gas bin,
The signal output part of described temperature sensor communicates to connect with the signal input part of described microprocessor.
The beneficial effects of the utility model are as follows:
1. the fan in this utility model is without overwork, also would not send bigger sound, thus
Reduce the noise in radiation processes, and utilize microchannel heat radiation to can ensure that CPU, video card, sound card
And the normal effectively heat radiation of power lights parts.
2. in heat dissipation box and cabinet, the critical piece place such as CPU, video card, sound card, power supply and mainboard is empty
Between be independently arranged, it is to avoid dust enters the critical pieces such as CPU, video card, sound card, power supply and mainboard
The space at place, thus avoid dust accumulation in cabinet.
3. utilize semiconductor refrigerating and microchannel heat radiation to combine, advantageously reduce in semiconductor cooler and partly lead
The usage amount of body material, reduces cost, ensure that the radiating effect of computer heat radiation system simultaneously.
Accompanying drawing explanation
Fig. 1 is the fundamental diagram of this utility model computer low-noise heat radiation system；
Fig. 2 is the heat dissipating ring line structure schematic diagram of this utility model computer low-noise heat radiation system；
Fig. 3 is the perspective view of the heat dissipation box of this utility model computer low-noise heat radiation system；
Fig. 4 is the cross-sectional structure schematic diagram of the heat dissipation box of this utility model computer low-noise heat radiation system.
In figure: 1-air pump；2-heat-conducting gas bin；3-microchannel fin；4-conduit；5-pressure limiting
Valve；6-air distributor；7-flow distribution plate；8-collector plate；9-heat dissipation box；10-air vent；11-porous is inhaled
Sound-absorbing layer.
Detailed description of the invention
In order to be illustrated more clearly that this utility model, new to this practicality below in conjunction with preferred embodiments and drawings
Type is described further.Parts similar in accompanying drawing are indicated with identical reference.This area
It will be appreciated by the skilled person that specifically described content is illustrative and be not restrictive below, should not
Protection domain of the present utility model is limited with this.
This utility model computer low-noise heat radiation system, as shown in Figures 1 to 3, computer low-noise heat radiation
System, including microprocessor, fan, microchannel fin 3, conduit 4, air pump 1, temperature sensing
Device, semiconductor cooler, heat-conducting gas bin 2 and heat dissipation box 9, described heat dissipation box 9 box wall is provided with
Porous sound absorbing layer 11 and air vent 10；Described microprocessor, described fan, described air pump 1, described
Semiconductor cooler and described heat-conducting gas bin 2 are each provided in described heat dissipation box 9；Described temperature passes
Sensor is located at the surface that computer needs the parts of heat radiation, and described microchannel fin 3 covers at computer
Need the surface of the parts of heat radiation；The signal output part of described temperature sensor and the letter of described microprocessor
The communication connection of number input, described microprocessor respectively with described air pump 1, described fan and described partly lead
Chiller communicates to connect；The air inlet of described air pump 1 and the gas outlet of described microchannel fin 3
Connected by described conduit 4 fluid communication, the air inlet of described microchannel fin 3 and described thermal conductivity gas
The gas outlet of body bin 2 is connected by described conduit 4 fluid communication, described heat-conducting gas bin 2
Air inlet be connected by described conduit 4 fluid communication with the gas outlet of described air pump 1；Described partly lead
The refrigeration end of chiller is located in described heat-conducting gas bin 2, heating of described semiconductor cooler
End is located at the outlet side of described fan.Wherein, described air pump 1, described conduit 4, described microchannel dissipate
Backing 3 and described heat-conducting gas bin 2 constitute heat radiation loop of the present utility model, as shown in Figure 2.
In order to enable the end that heats of described semiconductor cooler to be dispersed as early as possible by heat, at described quasiconductor
The end that heats of refrigerator is provided with fin, simultaneously for the air to make in described heat-conducting gas bin 2
Lowering the temperature quickly, the refrigeration end at described semiconductor cooler is provided with fin.And in order to make thermal conductivity gas
Physical ability carries out enough coolings by described semiconductor cooler in described heat-conducting gas bin 2, this
In embodiment, it is provided with pressure limiting valve 5 in the gas outlet of described heat-conducting gas bin 2, and at described thermal conductivity gas
The gas outlet of body bin 2 is provided with air distributor 6, so that each parts needing heat radiation in computer
Can be dispelled the heat equably, wherein, described pressure limiting valve 5 is located at the gas outlet of described heat-conducting gas bin 2
And between described air distributor 6.And in order to enable the parts needing heat radiation in computer by uniformly
Heat radiation, without occurring that local temperature is too high, in the present embodiment, as in figure 2 it is shown, in described microchannel
The air inlet of fin 3 is provided with flow distribution plate 7, and is provided with afflux in the gas outlet of described microchannel fin 3
Plate 8, and on described microchannel fin 3, in two adjacent microchannels, air flow is contrary.
In view of the refrigeration end temperature of semiconductor refrigerating equipment is relatively low, there is efficient refrigeration, for avoiding
Described semiconductor cooler freezes for a long time, causes a large amount of liquid of the heat-conducting gas in heat-conducting gas bin 2
Change (such as carbon dioxide), in the present embodiment, in described heat-conducting gas bin 2, be provided with temperature sensor,
The signal output part of described temperature sensor communicates to connect with the signal input part of described microprocessor.
After being configured with computer booting of the present utility model, computer needs on the parts surface of heat radiation
Described temperature sensor can by each need heat radiation component surface temperature information send described micro-process to
Device, described microprocessor then can send to described air pump 1, described fan and described semiconductor cooler and open
Dynamic instruction, described air pump 1 drives heat radiation loop in heat-conducting gas (such as carbon dioxide) edge in heat radiation loop
Flowing, and the heat come through the conduction of described microchannel fin 3 is carried away, and described quasiconductor
Heat-conducting gas then can be lowered the temperature in described heat-conducting gas bin 2 by the refrigeration end of refrigerator, and in view of institute
The refrigeration stating semiconductor cooler is relatively strong, may for easy liquid gas (such as carbon dioxide)
Heat-conducting gas can be caused to liquefy, described heat-conducting gas bin 2 internal gas pressure can be made to reduce rapidly, institute simultaneously
To be also provided with a temperature sensor in described heat-conducting gas bin 2, to monitor described heat-conducting gas
Temperature in bin 2.The end that heats being made described semiconductor cooler by described fan is lowered the temperature, and only needs
Ensure normally to work, it is not necessary to work overloadingly because of computer needing the part temperatures dispelled the heat too high,
Thus avoid decreasing the noise that the overwork of described fan produces.
And the described heat dissipation box 9 in this utility model independent of with CPU in cabinet, video card, sound card,
Space, the critical piece place such as power supply and mainboard is independently arranged, it is to avoid dust enter CPU, video card,
The space at the critical piece places such as sound card, power supply and mainboard, thus avoid dust accumulation in cabinet.
This utility model can also reduce the usage quantity of fan in computer, thus reduces further because fan turns
The dynamic noise brought, and described porous sound absorbing layer also can will absorb a part of sound wave, reduces further and
The noise rotated from fan.
Above-described embodiment of the present utility model is only for clearly demonstrating this utility model example,
And it is not the restriction to embodiment of the present utility model, those of ordinary skill in the field are come
Say, can also make other changes in different forms on the basis of the above description, here cannot
All of embodiment is given exhaustive, every belong to that the technical solution of the utility model extended out aobvious
And the change being clear to or variation are still in the row of protection domain of the present utility model.
Claims (7)
1. computer low-noise heat radiation system, it is characterised in that include that microprocessor, fan, microchannel dissipate
Backing (3), conduit (4), air pump (1), temperature sensor, semiconductor cooler, heat-conducting gas
Bin (2) and heat dissipation box (9), described heat dissipation box (9) box wall is provided with porous sound absorbing layer (11)
With air vent (10)；Described microprocessor, described fan, described air pump (1), described quasiconductor system
Cooler and described heat-conducting gas bin (2) are each provided in described heat dissipation box (9)；Described temperature sensing
Device is located at the surface that computer needs the parts of heat radiation, and described microchannel fin (3) covers at computer
Need the surface of the parts of heat radiation；The signal output part of described temperature sensor and the letter of described microprocessor
The communication connection of number input, described microprocessor respectively with described air pump (1), described fan and described
Semiconductor cooler communicates to connect；The air inlet of described air pump (1) and described microchannel fin (3)
Gas outlet by described conduit (4) fluid communication connect, the air inlet of described microchannel fin (3)
Mouth is connected by described conduit (4) fluid communication with the gas outlet of described heat-conducting gas bin (2),
The gas outlet of the air inlet of described heat-conducting gas bin (2) and described air pump (1) is led described in passing through
Pipe (4) fluid communication connects；The refrigeration end of described semiconductor cooler is located at described heat-conducting gas bin
(2), in, the end that heats of described semiconductor cooler is located at the outlet side of described fan.
Computer low-noise heat radiation system the most according to claim 1, it is characterised in that described partly lead
The end that heats of chiller is provided with fin.
Computer low-noise heat radiation system the most according to claim 1, it is characterised in that described partly lead
The refrigeration end of chiller is provided with fin.
Computer low-noise heat radiation system the most according to claim 1, it is characterised in that described heat conduction
The gas outlet of gas reservoir (2) is provided with pressure limiting valve (5).
Computer low-noise heat radiation system the most according to claim 4, it is characterised in that described heat conduction
The gas outlet of gas reservoir (2) is provided with air distributor (6), and described pressure limiting valve (5) is located at described
Between gas outlet and the described air distributor (6) of heat-conducting gas bin (2).
6. according to the arbitrary described computer low-noise heat radiation system of Claims 1 to 5, it is characterised in that
The air inlet of described microchannel fin (3) is provided with flow distribution plate (7), described microchannel fin (3)
Gas outlet be provided with collector plate (8)；On described microchannel fin (3), in two adjacent microchannels
Air flow is contrary.
7. according to the arbitrary described computer low-noise heat radiation system of Claims 1 to 5, it is characterised in that
It is provided with temperature sensor, the signal output part of described temperature sensor in described heat-conducting gas bin (2)
Communicate to connect with the signal input part of described microprocessor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620364329.0U CN205594566U (en) | 2016-04-27 | 2016-04-27 | Computer low noise cooling system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620364329.0U CN205594566U (en) | 2016-04-27 | 2016-04-27 | Computer low noise cooling system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205594566U true CN205594566U (en) | 2016-09-21 |
Family
ID=56935998
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620364329.0U Expired - Fee Related CN205594566U (en) | 2016-04-27 | 2016-04-27 | Computer low noise cooling system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205594566U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107479675A (en) * | 2017-09-11 | 2017-12-15 | 合肥缤赫信息科技有限公司 | A kind of main frame energy-saving radiating system |
| CN109491466A (en) * | 2018-11-13 | 2019-03-19 | 浙江东方职业技术学院（浙江东方专修学院） | A kind of computer generalization denoising device |
-
2016
- 2016-04-27 CN CN201620364329.0U patent/CN205594566U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107479675A (en) * | 2017-09-11 | 2017-12-15 | 合肥缤赫信息科技有限公司 | A kind of main frame energy-saving radiating system |
| CN109491466A (en) * | 2018-11-13 | 2019-03-19 | 浙江东方职业技术学院（浙江东方专修学院） | A kind of computer generalization denoising device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160921 Termination date: 20170427 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |