CN205587314U - To disk formula voltage dependent resistor chip thickness sorter - Google Patents
To disk formula voltage dependent resistor chip thickness sorter Download PDFInfo
- Publication number
- CN205587314U CN205587314U CN201620366305.9U CN201620366305U CN205587314U CN 205587314 U CN205587314 U CN 205587314U CN 201620366305 U CN201620366305 U CN 201620366305U CN 205587314 U CN205587314 U CN 205587314U
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- China
- Prior art keywords
- baffle
- bracing frame
- cylinders
- support frame
- motors
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Abstract
The utility model discloses a to disk formula voltage dependent resistor chip thickness sorter, which comprises a frame, the frame includes first support frame and second support frame, be equipped with the loading board in the first support frame, the top of loading board is equipped with centrifugal vibration dish, and the top of loading board still is equipped with two motors, two motors are located the both sides of centrifugal vibration dish respectively, be equipped with in the second support frame and connect the material dry measure used in former times, and one side that the second support frame is close to first support frame is equipped with first baffle, the opposite side of second support frame is equipped with the second baffle, be connected with two cylinders between first baffle and the second baffle. The utility model discloses a centrifugal vibration dish, two cylinders and two motors cooperate, reach the different voltage gradient's of quickly separating znO piezo -resistor's different thickness black -films to isolate the defective products of bonding die biplate from the batch product, 100% non -defective unit gets into next working procedure, realizes non -defective unit and defective products separation, the efficiency and the quality of improvement operation.
Description
Technical field
This utility model relates to separator technical field, is specially a kind of for wafer-type voltage dependent resistor chip thickness separator.
Background technology
Thickness separator is a kind of screening installation made a distinction for the different-thickness of voltage dependent resistor chip.Owing to existing ZnO varistor element sheet (black-film) is after screening (flat raft) sinters, there is the bonding die biplate phenomenon of part in sintering black-film out, this bonding die biplate product cannot operation being coated with silver when, need to be chosen by the defective products of bonding die before operation, affect efficiency and the quality of operation, and there is certain diversity in the thickness of the ZnO varistor black-film of different formulations system voltage gradient, if the black-film of different-thickness or silver strip mix in operation process, commonsense method is difficult to separating, therefore we need a kind of thickness separator.
Utility model content
The purpose of this utility model is to provide a kind of for wafer-type voltage dependent resistor chip thickness separator, with the problem solving to propose in above-mentioned background technology.
nullFor achieving the above object，This utility model provides following technical scheme: a kind of for wafer-type voltage dependent resistor chip thickness separator，Including frame，Described frame includes the first bracing frame and the second bracing frame，It is provided with loading plate in first bracing frame，The top of loading plate is provided with centrifugal vibrating disk，And the top of loading plate is additionally provided with two motors，Two motors lay respectively at the both sides of centrifugal vibrating disk，Splicing dry measure used in former times it is provided with in second bracing frame，And the second bracing frame is provided with the first baffle plate near the side of the first bracing frame，The opposite side of the second bracing frame is provided with second baffle，Connect between first baffle plate and second baffle and have two cylinders，And the front center of second baffle is provided with the second open slot，The front of second baffle is additionally provided with two the first open slots，Two the first open slots lay respectively at the both sides of the second open slot，Connect in second open slot and have discharging bin，And connect on second baffle and have two fixture blocks，Two fixture blocks lay respectively at the both sides of discharging bin，Two cylindrical one end outfan with two motors respectively is connected，Two cylindrical other ends extend through two the first open slots and are connected with two fixture blocks respectively，And the discharging opening of centrifugal vibrating disk be arranged right below screening plate，One end of screening plate extends to two cylindrical surfaces.
Preferably, the bottom of described screening plate offers six groups of circular holes, a diameter of 3 centimetres of circular hole, and the horizontal tilt angle of screening plate is 15 degree.
Preferably, the front of described second baffle and the front of fixture block offer the screwed hole matched, and connecting in screwed hole has bolt.
Preferably, the charging aperture place horizontal plane of described discharging bin is less than place, two cylinder section centers of circle horizontal plane.
Compared with prior art, the beneficial effects of the utility model are: this utility model is for the problem proposed in background technology, it is provided with a kind of for wafer-type voltage dependent resistor chip thickness separator, by centrifugal vibrating disk automatic blanking, wafer-type voltage dependent resistor chip enters between two cylinders by screening plate, the inverse export-oriented rolling of two cylinders of two driven by motor also sorts wafer-type voltage dependent resistor chip, by centrifugal vibrating disk, two cylinders and two motors coordinate, reach the different-thickness black-film of the ZnO varistor of sharp separation difference voltage gradient, and the defective products of bonding die biplate is separated from bulk article, the non-defective unit of 100% enters subsequent work program, realize non-defective unit to separate with defective products, improve efficiency and the quality of operation.
Accompanying drawing explanation
Fig. 1 is the structural representation of this utility model top view；
Fig. 2 is this utility model connecting board structure schematic diagram.
In figure: 1 frame, 2 loading plates, 3 centrifugal vibrating disks, 4 first baffle plates, 5 second baffles, 6 splicing dry measures used in former times, 7 cylinders, 8 first open slots, 9 fixture blocks, 10 bolts, 11 second open slots, 12 discharging bins, 13 motors, 14 screening plates.
Detailed description of the invention
Below in conjunction with the accompanying drawing in this utility model embodiment, the technical scheme in this utility model embodiment is clearly and completely described, it is clear that described embodiment is only a part of embodiment of this utility model rather than whole embodiments.Based on the embodiment in this utility model, the every other embodiment that those of ordinary skill in the art are obtained under not making creative work premise, broadly fall into the scope of this utility model protection.
nullRefer to Fig. 1-2，This utility model provides a kind of technical scheme: a kind of for wafer-type voltage dependent resistor chip thickness separator，Including frame 1，Frame 1 includes the first bracing frame and the second bracing frame，Loading plate 2 it is provided with in first bracing frame，The top of loading plate 2 is provided with centrifugal vibrating disk 3，And the top of loading plate 2 is additionally provided with two motors 13，Two motors 13 lay respectively at the both sides of centrifugal vibrating disk 3，Splicing dry measure used in former times 6 it is provided with in second bracing frame，And the second bracing frame is provided with the first baffle plate 4 near the side of the first bracing frame，The opposite side of the second bracing frame 5 is provided with second baffle 5，Connect between first baffle plate 4 and second baffle 5 and have two cylinders 7，And the front center of second baffle 5 is provided with the second open slot 11，The front of second baffle 5 is additionally provided with two the first open slots 8，Two the first open slots 8 lay respectively at the both sides of the second open slot 11，Connect in second open slot 11 and have discharging bin 12，The charging aperture place horizontal plane of discharging bin 12 is less than place, the center of circle, two cylinder 7 cross sections horizontal plane，The defective products being easy to sub-elect is imported in discharging bin 12，And discharging bin 12 is obliquely installed，The defective products being easy in discharging bin 12 skids off discharging bin 12，And connect on second baffle 5 and have two fixture blocks 9，Two fixture blocks 9 lay respectively at the both sides of discharging bin 12，The front of second baffle 5 and the front of fixture block 9 offer the screwed hole matched，Connect in screwed hole and have bolt 10，It is easy to fixture block 9 be fixed on second baffle 5，Fixture block 9 can move，Reach to regulate the effect of the spacing of two cylinders 7，One end of two cylinders 7 outfan with two motors 13 respectively is connected，The other end of two cylinders 7 extends through two the first open slots 8 and is connected with two fixture blocks 9 respectively，And the discharging opening of centrifugal vibrating disk 3 be arranged right below screening plate 14，One end of screening plate 14 extends to the surface of two cylinders 7，The bottom of screening plate 14 offers six groups of circular holes，A diameter of 3 centimetres of circular hole，After centrifugal vibrating disk 3 automatic blanking enters screening plate 14，Screened for the first time by circular hole，Alleviate the workload of two cylinders 7，To increase sorting index，Improve work efficiency，And the horizontal tilt angle of screening plate 14 is 15 degree，Voltage dependent resistor chip is made to facilitate access for the top of two cylinders 7 in the second bracing frame.Coordinated by 3, two cylinders 7 of centrifugal vibrating disk and two motors 13, reach the different-thickness black-film of the ZnO varistor of sharp separation difference voltage gradient, and the defective products of bonding die biplate is separated from bulk article, the non-defective unit of 100% enters subsequent work program, realize non-defective unit to separate with defective products, improve efficiency and the quality of operation.
Operation principle: during utility model works, first pass through mobile fixture block 9 and set the distance between two cylinders 7, again by centrifugal vibrating disk 3 automatic blanking, entered the top of two cylinders 7 by screening plate 14, drive inverse export-oriented rolling of two cylinders 7 to sort by two motors 13.
Embodiment the most of the present utility model, for the ordinary skill in the art, being appreciated that in the case of without departing from principle of the present utility model and spirit and these embodiments can carry out multiple change, revise, replace and modification, scope of the present utility model is defined by the appended claims and the equivalents thereof.
Claims (4)
- null1. one kind for wafer-type voltage dependent resistor chip thickness separator，Including frame (1)，It is characterized in that: described frame (1) includes the first bracing frame and the second bracing frame，Loading plate (2) it is provided with in first bracing frame，The top of loading plate (2) is provided with centrifugal vibrating disk (3)，And the top of loading plate (2) is additionally provided with two motors (13)，Two motors (13) lay respectively at the both sides of centrifugal vibrating disk (3)，Splicing dry measure used in former times (6) it is provided with in second bracing frame，And the second bracing frame is provided with the first baffle plate (4) near the side of the first bracing frame，The opposite side of the second bracing frame is provided with second baffle (5)，Connect between first baffle plate (4) and second baffle (5) and have two cylinders (7)，And the front center of second baffle (5) is provided with the second open slot (11)，The front of second baffle (5) is additionally provided with two the first open slots (8)，Two the first open slots (8) lay respectively at the both sides of the second open slot (11)，Connect in second open slot (11) and have discharging bin (12)，And the upper connection of second baffle (5) has two fixture blocks (9)，Two fixture blocks (9) lay respectively at the both sides of discharging bin (12)，One end of two cylinders (7) outfan with two motors (13) respectively is connected，The other end of two cylinders (7) extends through two the first open slots (8) and is connected with two fixture blocks (9) respectively，And the discharging opening of centrifugal vibrating disk (3) be arranged right below screening plate (14)，One end of screening plate (14) extends to the surface of two cylinders (7).
- One the most according to claim 1 is for wafer-type voltage dependent resistor chip thickness separator, it is characterized in that: the bottom of described screening plate (14) offers six groups of circular holes, a diameter of 3 centimetres of circular hole, and the horizontal tilt angle of screening plate (14) is 15 degree.
- One the most according to claim 1 is for wafer-type voltage dependent resistor chip thickness separator, it is characterised in that: the front of described second baffle (5) and the front of fixture block (9) offer the screwed hole matched, and connecting in screwed hole has bolt (10).
- One the most according to claim 1 is for wafer-type voltage dependent resistor chip thickness separator, it is characterised in that: the charging aperture place horizontal plane of described discharging bin (12) is less than place, two cylinder (7) centers of circle, cross section horizontal plane.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620366305.9U CN205587314U (en) | 2016-04-27 | 2016-04-27 | To disk formula voltage dependent resistor chip thickness sorter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620366305.9U CN205587314U (en) | 2016-04-27 | 2016-04-27 | To disk formula voltage dependent resistor chip thickness sorter |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205587314U true CN205587314U (en) | 2016-09-21 |
Family
ID=56932291
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620366305.9U Expired - Fee Related CN205587314U (en) | 2016-04-27 | 2016-04-27 | To disk formula voltage dependent resistor chip thickness sorter |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205587314U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114524670A (en) * | 2022-03-15 | 2022-05-24 | 福建省乔光电子科技有限公司 | Ceramic resistor formula and processing technology and equipment |
-
2016
- 2016-04-27 CN CN201620366305.9U patent/CN205587314U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114524670A (en) * | 2022-03-15 | 2022-05-24 | 福建省乔光电子科技有限公司 | Ceramic resistor formula and processing technology and equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20191025 Address after: 364400 Dayang Road, Xiyuan Town, Zhangping City, Longyan City, Fujian Province Patentee after: Fujian Qiaoguang Electronic Technology Co., Ltd Address before: 523755 Guangdong city of Dongguan Province Huang Zhenlong Qinglong see Tamura Road No. 2 Patentee before: Dongguan Qiao Guang Electronic Co., Ltd. |
|
| TR01 | Transfer of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160921 Termination date: 20200427 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |