CN205587310U - Automatic test control apparatus of semiconductor chip - Google Patents

Automatic test control apparatus of semiconductor chip Download PDF

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Publication number
CN205587310U
CN205587310U CN201620316821.0U CN201620316821U CN205587310U CN 205587310 U CN205587310 U CN 205587310U CN 201620316821 U CN201620316821 U CN 201620316821U CN 205587310 U CN205587310 U CN 205587310U
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China
Prior art keywords
relay
plc module
waste product
control
test
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Application number
CN201620316821.0U
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Chinese (zh)
Inventor
王俊文
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Yuechi Yuhong science and Technology Co., Ltd.
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Yuechi Yibang Industry Co Ltd
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Priority to CN201620316821.0U priority Critical patent/CN205587310U/en
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Abstract

The utility model relates to an automatic test control apparatus of semiconductor chip, including the PLC module, the PLC module is exported control signal and is given first relay, controls and tests stretching out of positioning electromagnet, and the flexible of locating plate is tested in control, and a travel switch who installs testing the locating plate transmits the module for PLC with being location signal, and second relay, third relay are controlled to the PLC module, controls stretching out and drawing back of left needle file electricity survey iron, the electric survey iron of right needle file, and the left needle file of testing of control is tested with the tight chip of right test needle file clamp, the test result signal of semiconductor chip tester is received to the PLC module, control fourth relay, and the control waste product keeps off the flexible of material electro -magnet, makes the normal product chip get into normal product discharging channel, the 2nd travel switch who installs at the waste product striker plate is used for transmitting the module for PLC with the being location signal who detects, the 5th relay of PLC module control, and stretching out and drawing back of control waste product liftout electro -magnet pushes up waste product discharging channel with the waste product chip.

Description

The automatic test control device of semiconductor chip
Technical field
This utility model relates to semiconductor die testing field, particularly to a kind of automatic test control device of semiconductor chip.
Background technology
It is known that semiconductor chip is all by the automated production of professional production producer out, though also going through some detections, but there are a small amount of waste product in the middle of inevitable product.This has certain percent defective to be normal for semiconductor chip manufacturer, but for using semiconductor chip to produce the producer of miscellaneous equipment, the chip load facility that useless is the most quite produced a useless equipment.So, use the producer of semiconductor chip will the semiconductor chip bought be tested, can use after test passes.And be usually at present and use semiconductor chip dedicated tester, from the pipe of cartridge chip, to take out chip, remove to survey chip one by one with artificial, the time one is long, and workman will occur fatigue, thus causes the error of test, it is likely that be placed in certified products by waste product again.
Summary of the invention
The purpose of this utility model is the deficiency existed for prior art, it is provided that one automatically, the automatic test control device of semiconductor chip accurately and efficiently.
The purpose of this utility model is to use following proposal to realize: a kind of automatic test control device of semiconductor chip, including PLC module, power supply, multiple instruction input switches and multiple travel switch and multiple extension electromagnetic ferrum as executive component, described power supply is for powering to whole device, described PLC module electrically connects with semiconductor die testing instrument and multiple instruction input switch, described PLC module is for receiving the command signal of instruction input switch, output control signal gives the first relay K A1, test position fix plate is driven to stretch out for controlling test position fix electric magnet, the chip positioning to be measured slided along test tracks is being tested position;It is arranged on the first travel switch SQ1 of test position fix plate for the signal that puts in place detected is passed to PLC module, described PLC module is for receiving the signal that puts in place of the first travel switch SQ1, output control signal gives the second relay K A2, the 3rd relay K A3, control left needle stand electrical measurement ferrum, right needle stand electrical measurement ferrum flexible, control left test needle stand and right test needle stand clamping chip tested;Described PLC module is for receiving the test result signal of semiconductor die testing instrument, output control signal gives the first relay K A1, control test position fix electric magnet to retract, chip is made to slide along test tracks, and export control signal to the 4th relay K A4, controlling the flexible of waste product backgauge electric magnet, control is arranged on the flexible of the waste product striker plate of certified products tapping channel mouth, makes certified products chip enter certified products tapping channel;It is arranged on the second travel switch SQ2 of waste product striker plate for the signal that puts in place detected is passed to PLC module, described PLC module is for receiving the signal that puts in place of the second travel switch SQ2, output control signal gives the 5th relay K A5, control the flexible of waste product liftout electric magnet, control the flexible of waste product die pad, waste product chip is headed into waste product tapping channel.
Described PLC module connects display screen 。
Described PLC module uses single phase poaer supply to power, and is provided with PLC on and off switch QS1 between PLC module and single phase poaer supply, and being connected between described PLC module and power supply has fuse.
Described instruction input switch, the first travel switch SQ1, one end of normally opened contact of the second travel switch SQ2 connect the input of PLC module respectively, the other end connects negative voltage V-, described first relay K A1, the second relay K A2, the 3rd relay K A3, the 4th relay K A4, the 5th relay K A5 coil one end connect PLC module outfan, the other end connects negative voltage V-, the common port COM of described PLC module and connects positive voltage V+ by fuse.
This utility model has the advantage, that and can be seen that from technical scheme, owing to the automatic test control device of semiconductor chip of the present invention have employed the combination of relay and electric magnet, PLC module and Electromagnetic Control have been carried out perfect combination simultaneously, everything is all to be operated under PLC module control, by tester automatic distinguishing certified products, waste product, and certified products is individually placed with waste product, not only avoid artificial error, and a people can keep an eye on multiple stage detection equipment, improves work efficiency and degree of accuracy.Fully meet the present invention automatically, goal of the invention accurately and efficiently.
Accompanying drawing explanation
Fig. 1 is the circuit diagram of the automatic test control device of semiconductor chip of the present invention.
Detailed description of the invention
See Fig. 1, a kind of automatic test control device of semiconductor chip, including PLC module, power supply, multiple instruction input switches and multiple travel switch and multiple extension electromagnetic ferrum as executive component, described power supply is for powering to whole device, described PLC module electrically connects with semiconductor die testing instrument and multiple instruction input switch, described PLC module is for receiving the command signal of instruction input switch, output control signal gives the first relay K A1, control stretching out of test position fix electric magnet D1, control the flexible of test position fix plate, the chip positioning to be measured slided along test tracks is being tested position;nullIt is arranged on the first travel switch SQ1 of test position fix plate for the signal that puts in place detected is passed to PLC module,Described PLC module is for receiving the signal that puts in place of the first travel switch SQ1,Output control signal gives the second relay K A2、3rd relay K A3,Control left needle stand electrical measurement ferrum D2、Right needle stand electrical measurement ferrum D3's is flexible,Control left test needle stand and right test needle stand clamping chip is tested,PLC module output test starting signal is to semiconductor die testing instrument,Semiconductor die testing instrument starts test,Described PLC module is for receiving the test result signal of semiconductor die testing instrument,Output control signal gives the first relay K A1,Control test position fix electric magnet to retract,Chip is made to slide along test tracks,And export control signal to the 4th relay K A4,Control the flexible of waste product backgauge electric magnet D4,Control is arranged on the flexible of the waste product striker plate of certified products tapping channel mouth,Certified products chip is made to enter certified products tapping channel;It is arranged on the second travel switch SQ2 of waste product striker plate for the signal that puts in place detected is passed to PLC module, described PLC module is for receiving the signal that puts in place of the second travel switch SQ2, output control signal gives the 5th relay K A5, control the flexible of waste product liftout electric magnet D5, control the flexible of waste product die pad, waste product chip is headed into waste product tapping channel.
Described PLC module connects display screen 。
Described PLC module uses single phase poaer supply to power, and is provided with PLC on and off switch QS1 between PLC module and single phase poaer supply, and being connected between described PLC module and power supply has fuse.
Described instruction input switch, the first travel switch SQ1, one end of normally opened contact of the second travel switch SQ2 connect the input of PLC module respectively, the other end connects negative voltage V-, described first relay K A1, the second relay K A2, the 3rd relay K A3, the 4th relay K A4, the 5th relay K A5 coil one end connect PLC module outfan, the other end connects negative voltage V-, the common port COM of described PLC module and connects positive voltage V+ by fuse.
Guide rail is tilting is fixed in frame in test so that chip can be along the test automatic slide downward of guide rail.Display screen, instruction input switch are arranged on the control panel in frame.Instruction input switch includes start key, feeler switch, positioning key, waste product liftout key, waste product backgauge key, manual/auto permutator.Test guide rail upper end is connected with one and puts bobbin carriage, test guide rail middle and upper part positional symmetry is connected with left needle stand electrical measurement ferrum, right needle stand electrical measurement ferrum, left needle stand electrical measurement ferrum, left test needle stand fixed respectively by the expansion link of right needle stand electrical measurement ferrum, right test needle stand, test guide rail side is positioned at left needle stand electrical measurement ferrum, waste product liftout electric magnet and waste product backgauge electric magnet it is connected with successively below right needle stand electrical measurement ferrum, lower end, test tracks surface is connected with a discharging pressing plate, discharging pressing plate divides the channel into certified products tapping channel and waste product tapping channel, waste product backgauge electric magnet is arranged on the entrance of certified products tapping channel and is sealed by certified products tapping channel.The centrage of certified products tapping channel is positioned at same straight line with the centrage of test guide rail, and waste product tapping channel is positioned at certified products tapping channel side.Certified products discharging opening and waste product discharging opening are respectively provided with certified products sebific duct, waste product sebific duct, and the product after test is respectively put into certified products sebific duct or the waste product sebific duct being inserted in certified products discharging opening and waste product discharging opening.
Turn on the power switch, semiconductor chip dedicated tester is connected with PLC module, permutator is switched on automatic transmission, the sebific duct equipped with chip is loaded onto in putting bobbin carriage, chip in sebific duct will glide automatically along inclined-plane, enter into test position, stop after bumping against test position fix plate, the signal that puts in place detected is passed to PLC module by the first travel switch SQ1, described PLC module output control signal gives the second relay K A2, 3rd relay K A3, control left needle stand electrical measurement ferrum, stretching of right needle stand electrical measurement ferrum, control left test needle stand and right test needle stand clamping chip is tested.PLC module is in the test result signal receiving semiconductor die testing instrument, output control signal gives the first relay K A1, control test position fix electric magnet to retract, chip is made to slide along test tracks, and export control signal to the 4th relay K A4, control waste product backgauge electric magnet to stretch, when the authentic signal that chip dedicated tester sends, then waste product striker plate is retracted, certified products chip is directly entered certified products tapping channel, control is arranged on the flexible of the waste product striker plate of certified products tapping channel mouth, makes certified products chip enter certified products tapping channel.When the waste product signal that chip dedicated tester sends, then waste product striker plate stretches out and seals certified products tapping channel, waste product chip slides and bumps against waste product striker plate, the signal that puts in place detected is passed to PLC module by the second travel switch SQ2, described PLC module receives the signal that puts in place of the second travel switch SQ2, output control signal gives the 5th relay K A5, controls the flexible of waste product liftout electric magnet, by waste product die pad, waste product chip is headed into waste product tapping channel.
The foregoing is only preferred embodiment of the present utility model, be not limited to this utility model, it is clear that those skilled in the art can carry out various change and modification without deviating from spirit and scope of the present utility model to this utility model.So, if these amendments of the present utility model and modification belong within the scope of this utility model claim and equivalent technologies thereof, then this utility model is also intended to comprise these change and modification.

Claims (4)

1. the automatic test control device of semiconductor chip, it is characterized in that: include PLC module, power supply, multiple instruction input switches and multiple travel switch and multiple extension electromagnetic ferrum as executive component, described power supply is for powering to whole device, described PLC module electrically connects with semiconductor die testing instrument and multiple instruction input switch, described PLC module is for receiving the command signal of instruction input switch, output control signal gives the first relay (KA1), test position fix plate is driven to stretch out for controlling test position fix electric magnet, the chip positioning to be measured slided along test tracks is being tested position;It is arranged on first travel switch (SQ1) of test position fix plate for the signal that puts in place detected is passed to PLC module, described PLC module is for receiving the signal that puts in place of the first travel switch (SQ1), output control signal gives the second relay (KA2), the 3rd relay (KA3), control left needle stand electrical measurement ferrum, right needle stand electrical measurement ferrum flexible, control left test needle stand and right test needle stand clamping chip tested;Described PLC module is for receiving the test result signal of semiconductor die testing instrument, output control signal gives the first relay (KA1), control test position fix electric magnet to retract, and output control signal is to the 4th relay (KA4), control the flexible of waste product backgauge electric magnet, control is arranged on the flexible of the waste product striker plate of certified products tapping channel mouth, makes certified products chip enter certified products tapping channel;It is arranged on second travel switch (SQ2) of waste product striker plate for the signal that puts in place detected is passed to PLC module, described PLC module is for receiving the signal that puts in place of the second travel switch (SQ2), output control signal gives the 5th relay (KA5), control the flexible of waste product liftout electric magnet, control the flexible of waste product die pad, waste product chip is headed into waste product tapping channel.
The automatic test control device of semiconductor chip the most according to claim 1, it is characterised in that: described PLC module connects display screen 。
The automatic test control device of semiconductor chip the most according to claim 1, it is characterized in that: described PLC module uses single phase poaer supply to power, being provided with PLC on and off switch QS1 between PLC module and single phase poaer supply, being connected between described PLC module and power supply has fuse.
The automatic test control device of semiconductor chip the most according to claim 1, it is characterized in that: described instruction input switch, the first travel switch (SQ1), one end of normally opened contact of the second travel switch (SQ2) connect the input of PLC module respectively, the other end connects negative voltage V-, described first relay (KA1), the second relay (KA2), the 3rd relay (KA3), the 4th relay (KA4), the 5th relay (KA5) coil one end connect PLC module outfan, the other end connect negative voltage V-.
CN201620316821.0U 2016-04-15 2016-04-15 Automatic test control apparatus of semiconductor chip Active CN205587310U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201620316821.0U CN205587310U (en) 2016-04-15 2016-04-15 Automatic test control apparatus of semiconductor chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201620316821.0U CN205587310U (en) 2016-04-15 2016-04-15 Automatic test control apparatus of semiconductor chip

Publications (1)

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CN205587310U true CN205587310U (en) 2016-09-21

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112207058A (en) * 2019-07-10 2021-01-12 株洲中车时代电气股份有限公司 Chip screening device and method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112207058A (en) * 2019-07-10 2021-01-12 株洲中车时代电气股份有限公司 Chip screening device and method

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C14 Grant of patent or utility model
GR01 Patent grant
TR01 Transfer of patent right

Effective date of registration: 20180117

Address after: 638300 Chengnan Industrial Park, Kowloon Town, Yuechi County, Guang'an City, Sichuan province (New Road)

Patentee after: Yuechi Yuhong science and Technology Co., Ltd.

Address before: 638300 Yuechi County Industrial Park in Guang'an, Sichuan

Patentee before: Yuechi Yibang Industry Co., Ltd.

TR01 Transfer of patent right