CN205580591U - Wafer frequency testing arrangement - Google Patents
Wafer frequency testing arrangement Download PDFInfo
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- CN205580591U CN205580591U CN201620362589.4U CN201620362589U CN205580591U CN 205580591 U CN205580591 U CN 205580591U CN 201620362589 U CN201620362589 U CN 201620362589U CN 205580591 U CN205580591 U CN 205580591U
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- wafer
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- amplitude
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Abstract
The utility model provides a wafer frequency testing arrangement, the device include metal probe, metal platform face, mount and frequency test instrument, and wherein elastic component connection mount is passed through on metal probe's top, and the bottom is provided with the sheetmetal parallel with the metal platform face, frequency test instrument is used for applying the alternating current power supply of different frequency to the metal platform face to under the alternating current power supply of different frequency, measure the amplitude of placing the wafer between sheetmetal and the metal platform face in, thus the amplitude -frequency curve of shape crystallization piece, with the resonant frequency who confirms the wafer according to the amplitude -frequency curve. Through the utility model discloses, can reduce the damage of wafer capability test in -process to the wafer to the degree of accuracy of wafer frequency test can improve.
Description
Technical field
This utility model belongs to wafer and manufactures production technical field, is specifically related to a kind of wafer frequency test dress
Put.
Background technology
Along with the development of electronics manufacturing, wafer is widely used in electronic manufacture, how to crystalline substance
The performance of sheet is effectively tested, thus obtains qualified wafer and become problem of concern.At present,
When the frequency performance of wafer is tested, general " contact " method of testing that uses, i.e. generally first
First use two metal probes to push down wafer, then apply alternating current power supply, root respectively to two metal probes
The humorous of wafer is determined with the amplitude of the combination of wafer according to two metal probes under different ac power frequencies
Vibration frequency.But, wafer may be caused damage when two metal probes are pushed down wafer by the method,
And it has been investigated that, the wafer resonant frequency that the method test draws is compared to wafer actual resonance frequency
Relatively low, i.e. the accuracy of the wafer resonant frequency that the method test draws is relatively low.And use " air-gap "
Method of testing, the metal probe of top leaves wafer surface a certain distance to sense the vibration of wafer, meeting
Causing certain energy loss, the amplitude frequency curve response of test on frequency test instrument is more weak, and amplitude is
Big corresponding Frequency point is inaccurate, can not accurately test out the resonant frequency of wafer.
Utility model content
This utility model provides a kind of wafer frequency testing device, to solve at present wafer is being carried out frequency
Wafer and accuracy relatively low problem it is easily damaged during test.
First aspect according to this utility model embodiment, it is provided that a kind of wafer frequency testing device, including
Metal probe, metal table top, fixed mount and frequency test instrument, the top of wherein said metal probe leads to
Crossing elastic parts and connect described fixed mount, bottom is provided with the sheet metal parallel with described metal table top；
Described frequency test instrument is for applying difference successively between described metal table top and described sheet metal
The alternating current power supply of frequency, and under the alternating current power supply of described different frequency, it is opposite to described sheet metal and institute
The amplitude stating the wafer between metal table top measures, thus forms the amplitude frequency curve of described wafer, with
The resonant frequency of described wafer is determined according to described amplitude frequency curve.
In the optional implementation of one, the frequency that in described amplitude frequency curve, amplitude peak is corresponding is
The resonant frequency of described wafer.
In the optional implementation of another kind, the area of described sheet metal is humorous along with the expection of described wafer
Vibration frequency, the increase of electromechanical coupling factor and reduce, reduce and institute along with the reduction of described wafer size
State the sheet metal area area less than described wafer.
In the optional implementation of another kind, described metal probe uses threaded mode to be fixed on
In described fixed mount.
In the optional implementation of another kind, the measurement end of described frequency test instrument and described elastic group
In part, described metal probe and described sheet metal, any one is attached, to be opposite to described sheet metal
And the amplitude of the wafer between described metal table top measures.
In the optional implementation of another kind, described frequency test instrument is at described different frequency
Under alternating current power supply, it is opposite to the shaking of centered region of the wafer between described sheet metal and described metal table top
Width measures.
The beneficial effects of the utility model are:
1, the metal of wafer frequency testing device medium frequency test instrunment pair of the present utility model and contact wafers
The alternating current power supply of different frequency is applied successively, therefore at metal between sheet metal directly over table top and wafer
Can form the AC field of different frequency between sheet and metal table top, wafer is in the AC field of different frequency
Under can vibrate, be fixed on metal probe bottom additionally, due to sheet metal and metal probe top is passed through
Elastic parts Connection Bracket, wafer can give metal probe one upwards at vibration processes Elastic assembly
Pulling force, therefore can alleviate the impact that wafer is vibrated by metal probe and sheet metal, so that frequency test
The amplitude that instrument test goes out can more accurately reflect the actual vibration situation of wafer, and then can carry
The test accuracy of high wafer resonant frequency；Additionally, this utility model is by being fixed on metal by sheet metal
Probe bottom and metal probe top by elastic parts Connection Bracket, can make wafer be placed in metal
After between sheet and metal table top, sheet metal, wafer and metal table top each other can with good contact, but
It is unlikely to again wafer is caused damage；
2, this utility model is by making the area expection resonant frequency along with wafer of sheet metal, mechanical-electric coupling
The increase of coefficient and reduce, reduce along with the reduction of wafer size, the frequency test of wafer can be improved
Accuracy；
3, this utility model is by making the area area less than wafer of sheet metal, can improve the frequency of wafer
Rate test accuracy；
4, this utility model by metal probe is used threaded by the way of be fixed in fixed mount, can
To facilitate tester to change metal according to expection resonant frequency, electromechanical coupling factor and the size of wafer
Sheet, such that it is able to improve the scope of application of this wafer frequency testing device；
5, this utility model can reflect wafer Vibration Condition by being connected by the measurement end of frequency test instrument
Elastic parts or metal probe or sheet metal, and indirect connection wafer, amplitude measurement mistake can be reduced
The impact that wafer is vibrated by journey；
6, this utility model carries out frequency by being placed between sheet metal and metal table top by the centered region of wafer
Rate is tested, and thus can improve the frequency test accuracy of wafer further.
Accompanying drawing explanation
Fig. 1 is an example structure figure of this utility model wafer frequency testing device.
Detailed description of the invention
For the technical scheme making those skilled in the art be more fully understood that in this utility model embodiment,
And it is understandable to enable the above-mentioned purpose of this utility model embodiment, feature and advantage to become apparent from, knot below
Close accompanying drawing technical scheme in this utility model embodiment is described in further detail.
In description of the present utility model, unless otherwise prescribed and limit, it should be noted that term " even
Connect " should be interpreted broadly, for example, it may be mechanically connected or electrical connection, it is also possible to be two element internals
Connection, can be to be joined directly together, it is also possible to be indirectly connected to by intermediary, general for this area
For logical technical staff, the concrete meaning of above-mentioned term can be understood as the case may be.
See Fig. 1, for an example structure figure of this utility model wafer frequency testing device.This crystalline substance
Sheet frequency testing device can include that metal probe 110, metal table top 120, fixed mount 130 and frequency are surveyed
Test instrument 140, wherein elastic parts 150 Connection Bracket 130 can be passed through in the top of metal probe 110,
Top can be provided with the sheet metal 160 parallel with metal table top 120, and frequency test instrument 140 is permissible
For to applying the alternating current power supply of different frequency between metal table top 120 and sheet metal 160 successively, and
Under the alternating current power supply of different frequency, the wafer 170 being opposite between sheet metal 160 and metal table top 120
Amplitude measure, thus form the amplitude frequency curve of this wafer 170, to determine according to this amplitude frequency curve
The resonant frequency of this wafer 170.
In the present embodiment, before testing the frequency characteristic of wafer, metal probe 110 top is even
The elastic parts 150 connect may be at extended state, and the sheet metal 160 that metal probe 110 bottom connects
(this distance preset can be less than corresponding wafer with there is default distance between metal table top 120
Design thickness).So, when wafer 170 is placed between sheet metal 160 and metal table top 120,
Sheet metal 160, wafer 170 and metal table top 120 with good contact, but can be unlikely to each other
Wafer 170 is caused damage.
When the frequency performance of wafer is tested, first wafer 170 can be placed in sheet metal 160
And between metal table top 120, then controlling frequency test instrument 140 provides different to metal table top 120
The alternating current power supply of frequency, and under the alternating current power supply of different frequency, the amplitude of this wafer 170 is surveyed
Amount, thus form the amplitude frequency curve of this wafer 170.Hereafter, can be by the highest for amplitude in this amplitude frequency curve
The frequency of some correspondence is as the resonant frequency of this wafer 170.After the resonant frequency determining wafer 170,
May determine that the resonant frequency of wafer 170 that test draws whether in expection resonant frequency range, if so,
Then represent that the resonant frequency of this wafer 170 meets requirement, otherwise, represent the resonant frequency of this wafer 170
It is unsatisfactory for requirement.
It has been investigated that, when the area of sheet metal is more than the area of wafer, wafer is being carried out frequency survey
Be equivalent to increase the mass loading of wafer during examination, may cause testing the wafer resonant frequency drawn and be less than
Actual wafer resonant frequency, thus cause the frequency test accuracy of wafer relatively low.Based on this, this reality
With novel by making the area area less than wafer of sheet metal, the frequency test that can improve wafer is accurate
Degree.
It has been investigated that, sheet metal of the same area for heterogeneous expectations resonant frequency, different materials and
When various sizes of wafer carries out frequency test, frequency test accuracy is not quite similar.Generally along with wafer
Expection resonant frequency, the increase of electromechanical coupling factor (can be used for characterize wafer material) and reduce metal
Sheet area, then can improve the frequency test accuracy of wafer, and subtract along with the reduction of wafer size
Lamellule area, it is also possible to improve the frequency test accuracy of wafer.In the present embodiment, metal is visited
110 can by use threaded in the way of be fixed in fixed mount 130, when each metal probe bottom
During the sheet metal area difference arranged, different area can be changed in the way of using replacing metal probe
Sheet metal.This utility model by metal probe is used threaded by the way of be fixed in fixed mount,
Tester can be facilitated to change gold according to expection resonant frequency, electromechanical coupling factor and the size of wafer
Belong to sheet, such that it is able to improve the scope of application of this wafer frequency testing device.
It addition, it has been investigated that, the resonant frequency of wafer centered region can preferably reflect whole wafer
Resonant frequency, therefore this utility model is when carrying out frequency test to wafer, can be by wafer 170
Centered region is placed between sheet metal 160 and metal table top 120, thus can improve wafer further
Frequency test accuracy.It is to be noted that above-mentioned elastic parts 150 can be spring, sponge etc.,
Owing to sheet metal 160 is by metal probe 110, elastic parts 150 Connection Bracket, wafer 170 exists
Also sheet metal 160, metal probe 110 and elastic parts 150 can be driven while vibration to vibrate,
Therefore frequency test instrument 140 is when measuring the amplitude of wafer, can be measured end with elastic
In assembly 150, metal probe 110 and sheet metal 160, any one is attached.This utility model leads to
Cross to connect the measurement end of frequency test instrument and can reflect that the elastic parts of wafer Vibration Condition or metal are visited
Head or sheet metal, and indirect connection wafer, can reduce the impact that wafer is vibrated by amplitude measurement process.
As seen from the above-described embodiment, wafer frequency testing device medium frequency test instrunment pair of the present utility model
Exchanging of different frequency is applied successively with between the sheet metal directly over the metal table top of contact wafers and wafer
Power supply, therefore can form the AC field of different frequency between sheet metal and metal table top, and wafer is not
Can vibrate under the AC field of same frequency, be fixed on metal probe bottom additionally, due to sheet metal and
Elastic parts Connection Bracket is passed through on metal probe top, and wafer can give gold at vibration processes Elastic assembly
Belong to and visit first pulling force upwards, therefore can alleviate the impact that wafer is vibrated by metal probe and sheet metal,
So that the amplitude that frequency test instrument tests out can more accurately reflect the actual vibration feelings of wafer
Condition, and then the test accuracy of wafer resonant frequency can be improved.Additionally, this utility model is by by gold
Genus sheet is fixed on metal probe bottom and elastic parts Connection Bracket is passed through on metal probe top, can make
Wafer is after being placed between sheet metal and metal table top, and sheet metal, wafer and metal table top each other may be used
With good contact, but it is unlikely to wafer is caused damage.
Those skilled in the art, after considering description and putting into practice utility model disclosed herein, will easily think
To other embodiment of the present utility model.The application is intended to any modification of the present utility model, use
Way or adaptations, these modification, purposes or adaptations follow of the present utility model typically
Property principle also includes the undocumented common knowledge in the art of this utility model or conventional techniques hands
Section.Description and embodiments is considered only as exemplary, true scope of the present utility model and spirit by under
The claim in face is pointed out.
It should be appreciated that this utility model is not limited to described above and illustrated in the accompanying drawings
Precision architecture, and various modifications and changes can carried out without departing from the scope.Model of the present utility model
Enclose and only limited by appended claim.
Claims (6)
1. a wafer frequency testing device, it is characterised in that include metal probe, metal table top, consolidate
Determining frame and frequency test instrument, the top of wherein said metal probe connects described fixing by elastic parts
Frame, bottom is provided with the sheet metal parallel with described metal table top；
Described frequency test instrument is for applying difference successively between described metal table top and described sheet metal
The alternating current power supply of frequency, and under the alternating current power supply of described different frequency, it is opposite to described sheet metal and institute
The amplitude stating the wafer between metal table top measures, thus forms the amplitude frequency curve of described wafer, with
The resonant frequency of described wafer is determined according to described amplitude frequency curve.
Device the most according to claim 1, it is characterised in that in described amplitude frequency curve, amplitude is the highest
The frequency that point is corresponding is the resonant frequency of described wafer.
Device the most according to claim 1, it is characterised in that the area of described sheet metal is along with institute
State the expection resonant frequency of wafer, the increase of electromechanical coupling factor and reduce, along with described wafer size
Reduce and reduce and described sheet metal area is less than the area of described wafer.
Device the most according to claim 1, it is characterised in that described metal probe uses screw thread even
The mode connect is fixed in described fixed mount.
Device the most according to claim 1, it is characterised in that the measurement of described frequency test instrument
In end and described elastic parts, described metal probe and described sheet metal, any one is attached, with right
The amplitude being placed in the wafer between described sheet metal and described metal table top measures.
Device the most according to claim 1 or 5, it is characterised in that described frequency test instrument is used
Under the alternating current power supply at described different frequency, it is opposite between described sheet metal and described metal table top
The amplitude of the centered region of wafer measures.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620362589.4U CN205580591U (en) | 2016-04-26 | 2016-04-26 | Wafer frequency testing arrangement |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620362589.4U CN205580591U (en) | 2016-04-26 | 2016-04-26 | Wafer frequency testing arrangement |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105675120A (en) * | 2016-04-26 | 2016-06-15 | 中国电子科技集团公司第二十六研究所 | Wafer frequency test device |
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2016
- 2016-04-26 CN CN201620362589.4U patent/CN205580591U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105675120A (en) * | 2016-04-26 | 2016-06-15 | 中国电子科技集团公司第二十六研究所 | Wafer frequency test device |
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