CN205572823U - IC module curing equipment - Google Patents
IC module curing equipment Download PDFInfo
- Publication number
- CN205572823U CN205572823U CN201620366000.8U CN201620366000U CN205572823U CN 205572823 U CN205572823 U CN 205572823U CN 201620366000 U CN201620366000 U CN 201620366000U CN 205572823 U CN205572823 U CN 205572823U
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- China
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- heat block
- module
- temperature sensor
- state relay
- utility
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- Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)
Abstract
The utility model provides a IC module curing equipment, include: transportation track, heating piece, temperature sensor, solid state relay and PLC, the heating piece is installed on the transportation track, temperature sensor installs on the heating piece, temperature sensor and PLC are connected, the heating piece is connected with solid state relay's input, solid state relay's output and PLC are connected, the utility model discloses low cost, easy operation dismantles the maintenance convenience.
Description
Technical field
This utility model relates to a kind of production equipment, a kind of IC module curing apparatus.
Background technology
IC module needs solidification after packaging is accomplished, and in prior art, many employing UV lamps are heating and curing, and use the curing mode of UV lamp to solidify IC module, and it is relatively costly, and the maintenance of UV lamp takes a long time with changing needs.
Summary of the invention
The purpose of this utility model is to overcome above-mentioned weak point, thus provides a kind of IC module curing apparatus.This utility model solves above-mentioned technical problem by following technical proposals: a kind of IC module curing apparatus, including: conveying track 1, heat block 2, temperature sensor, solid-state relay and PLC module, described heat block 2 is arranged on conveying track 1, described temperature sensor is arranged on heat block 2, described temperature sensor is connected with PLC module, described heat block 2 is connected with the input of solid-state relay, and the outfan of described solid-state relay is connected with PLC module.
Preferably, described heat block 2 is provided with handle 3, is drawn up taking off heat block 2.
Preferably, boundary's point of described heat block 2 heating-up temperature is 160 degrees Celsius.
Preferably, the number of described heat block 2 is 3, and described heat block 2 is removable heat block.
The beneficial effects of the utility model: this utility model is with low cost, simple to operate, detachable maintaining and easy maintenance.
Accompanying drawing explanation
Fig. 1 is structure chart of the present utility model
Fig. 2 is heat block control principle drawing of the present utility model
In figure: 1-conveying track；2-heat block；3-handle.
Detailed description of the invention
The following is specific embodiment of the utility model and combine accompanying drawing, the technical solution of the utility model is further described, but this utility model is not limited to these examples.
As illustrated in fig. 1 and 2, a kind of IC module curing apparatus, including: conveying track 1, heat block 2, temperature sensor, solid-state relay and PLC module, described heat block 2 is arranged on conveying track 1, described temperature sensor is arranged on heat block 2, described temperature sensor is connected with PLC module, and described heat block 2 is connected with the input of solid-state relay, and the outfan of described solid-state relay is connected with PLC module.
In the present embodiment, it is preferred that on described heat block 2, handle 3 is installed, it is drawn up taking off heat block 2.
In the present embodiment, it is preferred that boundary's point of described heat block 2 heating-up temperature is 160 degrees Celsius, when heat block 2 temperature is more than 160 degrees Celsius, temperature sensor feedback controls solid-state relay dead electricity to PLC module, PLC module, and heat block 2 stops heating；When heat block 2 temperature is less than 160 degrees Celsius, temperature sensor feedback is to PLC module, and PLC module controls solid-state relay and obtains electric, and heat block 2 begins to warm up；When heat block 2 needs repairing and maintains, can individually dismantle heat block 2 unit.
In the present embodiment, it is preferred that the number of described heat block 2 is 3, described heat block 2 is removable heat block.
The foregoing is only preferred embodiment mode of the present utility model; the scope that can not limit this utility model protection with this, the change of any unsubstantiality that those skilled in the art is done on the basis of this utility model and replacement belong to this utility model scope required for protection.
Claims (4)
1. an IC module curing apparatus, including: conveying track (1), heat block (2), temperature sensor, solid-state relay and PLC module, described heat block (2) is arranged on conveying track (1), described temperature sensor is arranged on heat block (2), described temperature sensor is connected with PLC module, described heat block (2) is connected with the input of solid-state relay, and the outfan of described solid-state relay is connected with PLC module.
2. a kind of IC module curing apparatus as claimed in claim 1, it is characterised in that be provided with handle (3) on described heat block (2).
3. a kind of IC module curing apparatus as claimed in claim 2, it is characterised in that boundary's point of described heat block (2) heating-up temperature is 160 degrees Celsius.
4. a kind of IC module curing apparatus as claimed in claim 3, it is characterised in that the number of described heat block (2) is 3, described heat block (2) is removable heat block.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620366000.8U CN205572823U (en) | 2016-04-27 | 2016-04-27 | IC module curing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620366000.8U CN205572823U (en) | 2016-04-27 | 2016-04-27 | IC module curing equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205572823U true CN205572823U (en) | 2016-09-14 |
Family
ID=56861456
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620366000.8U Active CN205572823U (en) | 2016-04-27 | 2016-04-27 | IC module curing equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205572823U (en) |
-
2016
- 2016-04-27 CN CN201620366000.8U patent/CN205572823U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |