CN205571481U - Trompil device is pressed in semiconductor mill pipeline area - Google Patents
Trompil device is pressed in semiconductor mill pipeline area Download PDFInfo
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- CN205571481U CN205571481U CN201620005552.6U CN201620005552U CN205571481U CN 205571481 U CN205571481 U CN 205571481U CN 201620005552 U CN201620005552 U CN 201620005552U CN 205571481 U CN205571481 U CN 205571481U
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Abstract
The utility model provides a trompil device is pressed in semiconductor mill pipeline area includes: lifting set spare, sandwich valve device, pressure system, suction pump and hole digger, lifting set spare and female pipe fixed connection, the central authorities of lifting set spare are located to the sandwich valve device, and pressure system and suction pump are connected with lifting set spare, and hole digger is connected with the top of sandwich valve device. The utility model discloses under the circumstances that can realize not shutting down bump new old pipeline and connect together, reduced the stoppage in transit of semiconductor mill and the huge production loss that brings, coordinate complete pressure system simultaneously, reduce the hidden danger of booster in the middle of the construction, improve the construction success rate greatly.
Description
Technical field
This utility model relates to a kind of boring device, is specifically related to that a kind of semiconductor factory is pipe pressurized opens
Aperture apparatus.
Background technology
It is known that the production line of 8 inches in semicon industry, need to invest 7～800,000,000 U.S. dollars；
And the production line of 12 inches, the investment of needs reaches 12～1,500,000,000 U.S. dollars, if can not keep continuous
Producing, only the equipment depreciation of every day just reaches 35～700,000 dollars.And its dynamical system is quasiconductor
The heart of industry and blood vessel, it is desirable to its reliability of operation and seriality are the highest, such as power system
General employing is supplied power with double circuit, tap water uses two-way tap water, compressed air system to use nitrogen to carry out
Standby, the system such as pure water waste water, process cooling water, chilled water all uses N+1 to design, and
Whole system is designed to loop.The employing of these technology, is provided to ensure half dramatically
Conductor produces from uninterruptedly.
But, the update of semiconductor manufacturing industry, than very fast, has to carry out in process of production
Dilatation and transformation, thus all dynamical systems extending capacity reformation to be carried out, but can not be interrupted these and move
The supply in power source.Therefore, for fluid aspect, a new problem especially set out: can be with pressure
Perforate.
When a new fluid line is connected in original tubing, traditional method is by existing
There is pipeline to carry out isolating (i.e. closing upstream and downstream valve), then the fluid in pipeline is discharged or row
Letting out, then carry out pipeline connection, detection and pressure testing by rear fluid replacement and are resumed operation.This side
The disadvantage of method seeks to stop this power source, and this technique would generally be time-consuming 1～3 day.Thus
Affect the normal production of semiconductor production line.But modern industry and production thereof do not allow to do so
, the most annual 365 days of 24 hours every days, needs produced round-the-clockly.
And current punching device under pressure is in processing procedure, owing to the aging corrosion etc. of mother's pipe itself is asked
Topic causes generation sealing problem in welding process, causes last booster to be stopped work, does not the most solve to ask
Topic, exacerbates the order of severity of problem on the contrary.
Therefore, carry out to solve the problems referred to above.
Utility model content
The purpose of this utility model is, it is provided that a kind of semiconductor factory hole drilling device for pipeline with pressure, with
Overcome the disadvantages mentioned above existing for prior art and deficiency.
A kind of semiconductor factory hole drilling device for pipeline with pressure, it is characterised in that including: lifting external member,
Sandwich valve device, pressure system, suction pump and hole making drill, described lifting external member is fixing with female pipe to be connected,
Described sandwich valve device is located at the central authorities of lifting external member, described pressure system and suction pump and lifting external member
Connecting, described hole making drill is connected with the top of sandwich valve device.
Further, described lifting external member includes: connect limit, connection pipe body, clamping plate valve port, air bleeding valve
And tee T, described connection limit is connected with connection pipe body bottom, described connection pipe body by connect limit with
Female sealing of tube connects, and described clamping plate valve port is located at the stage casing of connection pipe body, described clamping plate valve port and clamping plate
Valve gear connects, and described air bleeding valve is located at the top of connection pipe body, and clamping plate valve port is located at by described tee T
Top, described tee T is located in connection pipe body, and described tee T is connected with pressure system.
Further, described pressure system includes: force (forcing) pump, Pressure gauge and oral siphon, described force (forcing) pump
Being connected with tee T with Pressure gauge, described oral siphon is connected with connection pipe body.
Further, described hole making drill includes: motor, main shaft, boring cutter, cutting external member and centre drill,
Described motor is connected with one end of main shaft, and the other end of described main shaft is connected with centre drill, described perforate
Cutter is through with main shaft to be connected, and is provided with cutting external member below described boring cutter.
The beneficial effects of the utility model:
This utility model be capable of non-stop-machine in the case of by new and old pipeline abut against together, decrease
The stoppage in transit of semiconductor factory and the huge production loss that brings, coordinate complete pressure system simultaneously, subtract
In the middle of Shaoshi work, the hidden danger of booster, is greatly improved and is constructed into power.
Accompanying drawing explanation
Fig. 1 is structure chart of the present utility model.
Reference:
Lifting external member 100, connection limit 110, connection pipe body 120, clamping plate valve port 130, air bleeding valve 140
With tee T 150.
Sandwich valve device 200, pressure system 300, force (forcing) pump 310, Pressure gauge 320 and oral siphon 330.
Suction pump 400, hole making drill 500, motor 510, main shaft 520, boring cutter 530, cutting external member
540 and centre drill 550.
Female pipe 600
Detailed description of the invention
Below in conjunction with specific embodiment, this utility model is made progressive explanation.Should be understood that following enforcement
Example is merely to illustrate this utility model not for limiting scope of the present utility model.
Embodiment 1
Fig. 1 is structure chart of the present utility model.
As it is shown in figure 1, a kind of semiconductor factory hole drilling device for pipeline with pressure, it is characterised in that including:
Lifting external member 100, sandwich valve device 200, pressure system 300, suction pump 400 and hole making drill 500,
Lifting external member 100 is fixing with female pipe 600 to be connected, and sandwich valve device 200 is located at lifting external member 100
Central authorities, pressure system 300 and suction pump 400 are connected with lifting external member 100, hole making drill 500 and folder
The top of plate valve device 200 connects.
Lifting external member 100 includes: connect limit 110, connection pipe body 120, clamping plate valve port 130, aerofluxus
Valve 140 and tee T 150, connect limit 110 and be connected with connection pipe body 120 bottom, connection pipe body 120
Being welded to connect with female pipe 600 by connecting limit 110, clamping plate valve port 130 is located at connection pipe body 120
Stage casing, clamping plate valve port 130 is connected with sandwich valve device 200, and air bleeding valve 140 is located at connection pipe body 120
Top, tee T 150 is located at the top of clamping plate valve port 130, and connection pipe body is located at by tee T 150
On 120, tee T 150 is connected with pressure system 300.
Pressure system 300 includes: force (forcing) pump 310, Pressure gauge 320 and oral siphon 330, force (forcing) pump 310
Being connected with tee T 150 with Pressure gauge 320, oral siphon 330 is connected with connection pipe body 120.
Hole making drill 500 includes: motor 510, main shaft 520, boring cutter 530, cutting external member 540 and
Centre drill 550, motor 510 is connected with one end of main shaft 520, the other end of main shaft 520 and center
Boring 550 connections, boring cutter 530 is through with main shaft 520 to be connected, and is provided with cutting below boring cutter 530
External member 540.
This utility model is by being connected on original female pipe by new pipeline lifting external member 100 with jump welding
On 600, and an inside diameter sandwich valve device 200 suitable with pipeline is installed, up under valve body
Trip mounting opening device 500.Under the guiding of centre drill 550, manage excising one piece on mother's pipe 600 with new
The saddle port that road internal diameter is suitable, and along with cutting external member 540 progressively exits, when boring cutter 530 falls back on
Behind sandwich valve 200 downstream, closing sandwich valve 200, remove plant etc., overall work completes.
In order to solve welding process occurs sealing problem, cause the problem that last booster is stopped work, this reality
Stress test is carried out with novel also needing in above-mentioned overall process.First passing through oral siphon 330 will be from
Water is fed in lifting external member 100, is then pressed inside by force (forcing) pump 310, then
Observe the numerical value of Pressure gauge 320.After placing a period of time, if the numerical value of Pressure gauge 320 does not has
Change then explanation sealing is good, is pumped by water by suction pump 400 and carries out tap operation,
The design of such structure can effectively solve the problem that the booster problem that sealing problem brings.
Above detailed description of the invention of the present utility model is illustrated, but this utility model not with
This is limited, and without departing from objective of the present utility model, this utility model can also have various change.
Claims (4)
1. semiconductor factory's hole drilling device for pipeline with pressure, it is characterized in that, including: lifting external member (100), sandwich valve device (200), pressure system (300), suction pump (400) and hole making drill (500), described lifting external member (100) is fixing with female pipe (600) to be connected, described sandwich valve device (200) is located at the central authorities of lifting external member (100), described pressure system (300) and suction pump (400) are connected with lifting external member (100), described hole making drill (500) is connected with the top of sandwich valve device (200).
nullA kind of semiconductor factory the most according to claim 1 hole drilling device for pipeline with pressure，It is characterized in that: described lifting external member (100) including: connect limit (110)、Connection pipe body (120)、Clamping plate valve port (130)、Air bleeding valve (140) and tee T (150)，Described connection limit (110) is connected with connection pipe body (120) bottom，Described connection pipe body (120) is welded to connect with female pipe (600) by connecting limit (110)，Described clamping plate valve port (130) is located at the stage casing of connection pipe body (120)，Described clamping plate valve port (130) is connected with sandwich valve device (200)，Described air bleeding valve (140) is located at the top of connection pipe body (120)，The top of clamping plate valve port (130) is located at by described tee T (150)，Described tee T (150) is located in connection pipe body (120)，Described tee T (150) is connected with pressure system (300).
A kind of semiconductor factory the most according to claim 1 hole drilling device for pipeline with pressure, it is characterized in that: described pressure system (300) including: force (forcing) pump (310), Pressure gauge (320) and oral siphon (330), described force (forcing) pump (310) and Pressure gauge (320) are connected with tee T (150), and described oral siphon (330) is connected with connection pipe body (120).
A kind of semiconductor factory the most according to claim 1 hole drilling device for pipeline with pressure, it is characterized in that: described hole making drill (500) including: motor (510), main shaft (520), boring cutter (530), cutting external member (540) and centre drill (550), described motor (510) is connected with one end of main shaft (520), the other end of described main shaft (520) is connected with centre drill (550), described boring cutter (530) is through with main shaft (520) to be connected, described boring cutter (530) lower section is provided with cutting external member (540).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620005552.6U CN205571481U (en) | 2016-01-04 | 2016-01-04 | Trompil device is pressed in semiconductor mill pipeline area |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620005552.6U CN205571481U (en) | 2016-01-04 | 2016-01-04 | Trompil device is pressed in semiconductor mill pipeline area |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205571481U true CN205571481U (en) | 2016-09-14 |
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ID=56882970
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620005552.6U Active CN205571481U (en) | 2016-01-04 | 2016-01-04 | Trompil device is pressed in semiconductor mill pipeline area |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205571481U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107932082A (en) * | 2017-11-17 | 2018-04-20 | 广州自来水专业建安有限公司 | A kind of steel pipe jag of not cutting off the water is plugged into construction method |
| CN107931665A (en) * | 2017-11-17 | 2018-04-20 | 广州自来水专业建安有限公司 | A kind of method of work of tapping machine |
| CN109424812A (en) * | 2017-08-31 | 2019-03-05 | 山西通才工贸有限公司 | A kind of waterpipe with pressure increases the installation method of valve |
| CN110355402A (en) * | 2018-03-26 | 2019-10-22 | 中国石油天然气股份有限公司 | Pipe connecting device with pressure |
-
2016
- 2016-01-04 CN CN201620005552.6U patent/CN205571481U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109424812A (en) * | 2017-08-31 | 2019-03-05 | 山西通才工贸有限公司 | A kind of waterpipe with pressure increases the installation method of valve |
| CN107932082A (en) * | 2017-11-17 | 2018-04-20 | 广州自来水专业建安有限公司 | A kind of steel pipe jag of not cutting off the water is plugged into construction method |
| CN107931665A (en) * | 2017-11-17 | 2018-04-20 | 广州自来水专业建安有限公司 | A kind of method of work of tapping machine |
| CN110355402A (en) * | 2018-03-26 | 2019-10-22 | 中国石油天然气股份有限公司 | Pipe connecting device with pressure |
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| GR01 | Patent grant |