CN205566635U - MEMS microphone - Google Patents
MEMS microphone Download PDFInfo
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- CN205566635U CN205566635U CN201620203197.3U CN201620203197U CN205566635U CN 205566635 U CN205566635 U CN 205566635U CN 201620203197 U CN201620203197 U CN 201620203197U CN 205566635 U CN205566635 U CN 205566635U
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- chip
- mems
- mems microphone
- asic
- wiring board
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- 239000002184 metal Substances 0.000 claims abstract description 24
- 229910052751 metal Inorganic materials 0.000 claims abstract description 24
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 6
- 239000006071 cream Substances 0.000 claims description 6
- 238000001914 filtration Methods 0.000 claims description 3
- 230000008878 coupling Effects 0.000 claims description 2
- 238000010168 coupling process Methods 0.000 claims description 2
- 238000005859 coupling reaction Methods 0.000 claims description 2
- 238000005538 encapsulation Methods 0.000 claims 1
- 238000004806 packaging method and process Methods 0.000 abstract 4
- 230000006870 function Effects 0.000 description 5
- 230000037007 arousal Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 241000218202 Coptis Species 0.000 description 2
- 235000002991 Coptis groenlandica Nutrition 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 238000005265 energy consumption Methods 0.000 description 2
- 241000209140 Triticum Species 0.000 description 1
- 235000021307 Triticum Nutrition 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000002596 correlated effect Effects 0.000 description 1
- 230000000875 corresponding effect Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 230000005236 sound signal Effects 0.000 description 1
- 230000001755 vocal effect Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
Abstract
The utility model discloses a MEMS microphone. This MEMS microphone includes: metal casing (1), circuit board (2), MEMS chip (3), ASIC chip (4) and sound inlet aperture (9), metal casing (1) and circuit board (2) forms MEMS microphone's outside packaging structure, and MEMS chip (3) and ASIC chip (4) set up in packaging structure's inside, and sound inlet aperture (9) set up on packaging structure, and this MEMS microphone still includes: the setting is in inside DSP chip (5) of packaging structure. The utility model discloses an utilizing that the microphone operating current is little, the characteristics of low power dissipation, adding in current MEMS microphone and have the DSP chip that pronunciation awaken the function up, the pronunciation that utilize the DSP chip awaken the function up and awaken the rear end treater up to realize the liberation both hands, save the electric energy, prolong the stand -by time of rear end equipment.
Description
Technical field
This utility model relates to acoustic-electric product technical field, particularly to a kind of MEMS microphone.
Background technology
Mike is a kind of acoustic sensor, in order to pick up voice and sound, and can convert thereof into electricity
Signal.MEMS microphone be use MEMS (Micro-Eletro-Mechanical System,
MEMS) mini microphone that technique makes, the most generally applies among mobile device.
And existing most of mobile device to be changed into mode of operation from standby mode defeated typically by button
Enter, touch screen touch wakes up up or voice wakes up three kinds of modes up.Wherein key-press input and touch screen touch wake-up mode,
Wake up up owing to needs utilize both hands that mobile terminal is carried out operation so that user and the mutual body of mobile terminal
Test unsatisfactory；And the voice of present stage wake up up algorithm operate in mobile terminal APP processor or
On CODEC, and perform voice and wake up that the application program electric current of algorithm is big, power consumption is high, affect user's up
Experience.
Utility model content
In view of the above problems, this utility model provides a kind of MEMS microphone, to solve prior art
Poor with the interactive experience of terminal unit realizing the user resulted in voice wakeup process, and owing to holding
The application program electric current that lang sound wakes up up is big, the problem of waste electric energy.
For reaching above-mentioned purpose, the technical solution of the utility model is achieved in that
This utility model provides a kind of MEMS microphone, including: metal shell 1, wiring board 2,
MEMS chip 3, asic chip 4 and sound hole 9；Metal shell 1 and wiring board 2 form MEMS
The outer enclosure structure of mike, MEMS chip 3 and asic chip 4 are arranged on the interior of encapsulating structure
Portion, sound hole 9 is arranged on encapsulating structure, and this MEMS microphone also includes: be arranged on encapsulating structure
Internal dsp chip 5；
MEMS microphone picks up voice signal by sound hole 9, and pickup is arrived by MEMS chip 3
Voice signal is converted to analog voice signal and is sent to asic chip 4, and asic chip 4 will receive
Analog voice signal be converted to audio digital signals, and be sent to dsp chip 5 by wiring board 2,
Dsp chip 5 wakes up backend application up according to the audio digital signals received.
Preferably, MEMS chip 3 and dsp chip 5 distribution are arranged on the relevant position of wiring board 2
Place；
Asic chip 4 is positioned at the position above MEMS chip 3 or dsp chip 5, and ASIC core
Sheet 4 and MEMS chip 3, or asic chip 4 and the dsp chip 5 projection on wiring board 2
Least partially overlapped.
It is further preferred that asic chip 4 is arranged on dsp chip 5.
Preferably, sound hole 9 is arranged on wiring board 2, and MEMS chip 3 covers sound hole 9；
Or, sound hole 9 is arranged on metal shell 1.
Preferably, the cap-like structure that metal shell 1 is formed in one；
Or, the cap-like structure that metal shell 1 is the hollow cavity by sidewall and top board is constituted.
It is further preferred that metal shell 1 is welded on described wiring board 2 by tin cream 8.
Preferably, MEMS microphone also includes: be arranged on the electric capacity 10 within encapsulating structure, electric capacity (10)
Clutter is coupled for filtering the power supply of dsp chip 5.
This utility model embodiment provides the benefit that: this utility model utilize microphone works electric current little,
Feature low in energy consumption, adds the dsp chip with voice arousal function in traditional MEMS mike,
Utilize the voice arousal function of dsp chip to wake up back-end processor up.MEMS wheat of the present utility model
Gram wind, compared to prior art, is not only able to liberate both hands, save electric energy, additionally it is possible to extend rear end equipment
Stand-by time.
Accompanying drawing explanation
The cross-sectional view of the MEMS microphone that Fig. 1 provides for this utility model embodiment；
The cross-section structure signal of the another kind of MEMS microphone that Fig. 2 provides for this utility model embodiment
Figure；
The perspective view of the MEMS microphone that Fig. 3 provides for this utility model embodiment；
In figure: 1, metal shell；2, wiring board；3, MEMS chip；4, asic chip；5、
Dsp chip；6, gold thread；7, bonded adhesives；8, tin cream；9, sound hole；10, electric capacity.
Detailed description of the invention
For making the purpose of this utility model, technical scheme and advantage clearer, below in conjunction with accompanying drawing pair
This utility model embodiment is described in further detail.
Embodiment one:
The cross-sectional view of the MEMS microphone that Fig. 1 and Fig. 2 provides for the present embodiment, Fig. 3
The perspective view of MEMS microphone provided for the present embodiment, as Fig. 1 to Fig. 3 jointly shown in,
The MEMS microphone of the present embodiment includes: metal shell 1, wiring board 2, MEMS chip 3, ASIC
Chip 4 and sound hole 9；Metal shell 1 and wiring board 2 form the outer enclosure knot of MEMS microphone
Structure, MEMS chip 3 and asic chip 4 are arranged on the inside of encapsulating structure, and sound hole 9 is arranged on
On encapsulating structure, this MEMS microphone also includes: be arranged on the dsp chip 5 within encapsulating structure.
MEMS microphone picks up voice signal by sound hole 9, and pickup is arrived by MEMS chip 3
Voice signal is converted to analog voice signal and is sent to asic chip 4, and asic chip 4 will receive
Analog voice signal be converted to audio digital signals, and be sent to dsp chip 5 by wiring board 2,
Dsp chip 5 wakes up backend application up according to the audio digital signals received.
After the processor held upon awakening, the dsp chip 5 of the present embodiment is follow-up by MEMS microphone
The audio signal picked up is sent to the processor of rear end.
In actual applications, the dsp chip 5 of the present embodiment is capable of identify that the identity of teller, raising are called out
The degree of safety waken up.Concrete, dsp chip 5 according to the phonetic feature of the digital audio and video signals received,
Mate with phonetic feature set in advance, after after the match is successful, this digital audio and video signals of recycling wakes up up
The processor of end.Phonetic feature in the present embodiment is including, but not limited to vocal print feature.
It should be noted that the dsp chip in the present embodiment can be correlated with according to actually used demand integration
Functional module, such as can be with integrated noise processed module, speech command module, detecting language environment mould
Block, to increase the attainable function of dsp chip.
Embodiment two:
MEMS microphone in the present embodiment is similar with the structure of the MEMS microphone in embodiment one.
MEMS chip 3 and dsp chip 5 distribution are arranged on the corresponding position of wiring board 2, ASIC
Chip 4 is positioned at the position above MEMS chip 3 or dsp chip 5, and asic chip 4 and MEMS
Chip 3, or asic chip 4 is least partially overlapped with the dsp chip 5 projection on wiring board 2.
Wherein, the position that asic chip 4 is positioned at above MEMS chip 3 or dsp chip 5 is appreciated that
For: asic chip 4 is arranged on metal shell 1, and asic chip 4 is positioned at MEMS chip 3
Or above dsp chip 5；Or, asic chip 4 is arranged on MEMS chip 3 or dsp chip 5
On.Certainly, in actual applications, can change according to the layout requirements of MEMS microphone components and parts
MEMS chip, asic chip with dsp chip in the relative position within encapsulating structure, as by MEMS
Chip is arranged on the top of encapsulating structure, is arranged in the circuit board by dsp chip, is set by asic chip
Put on dsp chip；Or, the distribution of MEMS chip, asic chip and dsp chip is arranged
In the circuit board.
The present embodiment passes through following preferred version, describes MEMS chip, asic chip and DSP in detail
Chip is at the position relationship within encapsulating structure, and the electric connection mode of chip chamber.
With reference to shown in Fig. 1 or Fig. 2, in the preferred version of the present embodiment, MEMS chip 3 and DSP
Chip 5 is separately positioned on the pre-position of wiring board 2, and asic chip 4 is arranged on dsp chip 5
On.By being arranged on dsp chip 5 by asic chip 4, MEMS chip, ASIC can be reduced
The lateral dimension within encapsulating structure shared by chip and dsp chip, installs sky such that it is able to save
Between, product is made less, meets the market demand of miniaturization of electronic products.
In actual applications, it is possible to use MEMS chip 3 is bonded on wiring board 2 by bonded adhesives 7,
Asic chip 4 is bonded in dsp chip 5, utilizes tin cream 8 that dsp chip 5 is welded on wiring board
On 2.Now, for realizing transmission and the process of voice signal, it is preferable that MEMS chip 3 is by gold
Line 6 electrically connects asic chip 4, and asic chip 4 is by gold thread 6 electrical interconnection plate 2, DSP
Chip 5 is electrical interconnection plate 2 by the way of welding.I.e. MEMS chip 3 and asic chip 4 it
Between realize by the way of routing electrical connection, by the side of routing between asic chip 4 and wiring board 2
Formula realizes electrical connection, and due to when packaged dsp chip is welded in the circuit board, dsp chip
Each pin can be welded to the setting position of wiring board such that it is able to realize dsp chip and patch panel it
Between electrical connection so that asic chip and dsp chip realize electrical connection by wiring board.Need explanation
, the wiring board in the present embodiment is provided with pad, pad by MEMS microphone inside chip with
External electronic circuits electrically connects.
After the electrical connection realized between MEMS chip, asic chip and dsp chip, MEMS
Chip gathers the voice signal being entered MEMS microphone package inside configuration by sound hole, and is believed by voice
Number being converted to analog voice signal is sent to asic chip, and analog voice signal is converted to by asic chip
Audio digital signals is sent to dsp chip by wiring board, and audio digital signals is carried out phase by dsp chip
The process answered also obtains wake command, by pad, wake command is sent to external electronic circuits, i.e. sends out
Give backend application, thus realize the arousal function of backend application.
It should be noted that the dsp chip in this preferred version can also use mode and the circuit of routing
Plate realizes electrical connection.
Need further exist for explanation, be distributed in MEMS chip and dsp chip and arrange in the circuit board
Time, asic chip can also be arranged in MEMS chip.Now, it is preferred to use tin cream is by MEMS
Chip welds in the circuit board, i.e. MEMS chip electrically connects with wiring board by the way of welding, ASIC
Chip can be electrically connected with MEMS chip in the way of using welding or routing.In the present embodiment
Asic chip, after electrically connecting with MEMS chip, realizes electrically connecting with dsp chip by wiring board.
Embodiment three:
The MEMS microphone of the present embodiment and the MEMS microphone in embodiment one or embodiment two
Structure is similar to.
With reference to shown in Fig. 1 or Fig. 2, the hat shape that the metal shell 1 in the present embodiment can be formed in one
Structure；Metal shell 1 can also be for the cap-like structure being made up of hollow cavity and the top board of sidewall.Wherein,
Metal shell 1 is welded on wiring board 2 by tin cream 8, constitutes the encapsulating structure of MEMS microphone.
Sound hole 9 in the present embodiment can be arranged on wiring board 2, it is also possible to is arranged on metal shell
On 1.As it is shown in figure 1, when sound hole 9 is arranged on wiring board 2, MEMS chip 3 cover into
Acoustic aperture 9, preferably sound hole 9 are positioned at the underface of MEMS chip 3；As in figure 2 it is shown, when entering sound
When hole 9 is arranged on metal shell 1, sound hole 9 can be arranged on top or the sidepiece of metal shell 1,
Preferably sound hole 9 is positioned at the surface of MEMS chip 3.
As it is shown on figure 3, the MEMS microphone in the present embodiment also includes: be arranged on inside encapsulating structure
Electric capacity 10, electric capacity 10 is for filtering the power supply coupling clutter of dsp chip 5.
In sum, the utility model discloses a kind of MEMS microphone, this utility model utilizes Mike
The feature that wind operating current is little, low in energy consumption, adds in traditional MEMS mike and has voice and wake up merit up
The dsp chip of energy, utilizes the voice arousal function of dsp chip to wake up back-end processor up.This practicality
Novel MEMS microphone, compared to prior art, is not only able to liberate both hands, save electric energy, moreover it is possible to
Enough extend the stand-by time of rear end equipment.
The foregoing is only preferred embodiment of the present utility model, be not intended to limit this utility model
Protection domain.All made within spirit of the present utility model and principle any amendment, equivalent,
Improve, be all contained in protection domain of the present utility model.
Claims (7)
1. a MEMS microphone, including: metal shell (1), wiring board (2), MEMS core
Sheet (3), asic chip (4) and sound hole (9)；Described metal shell (1) and described wiring board
(2) the outer enclosure structure of MEMS microphone, described MEMS chip (3) and described ASIC are formed
Chip (4) is arranged on the inside of described encapsulating structure, and described sound hole (9) is arranged on described encapsulation knot
On structure, it is characterised in that this MEMS microphone also includes: be arranged within described encapsulating structure
Dsp chip (5)；
Described MEMS microphone picks up voice signal, described MEMS core by described sound hole (9)
Sheet (3) by pickup to voice signal be converted to analog voice signal and be sent to described asic chip (4),
The analog voice signal received is converted to audio digital signals by described asic chip (4), and passes through
Described wiring board (2) is sent to dsp chip (5), and described dsp chip (5) basis receives
Audio digital signals wakes up backend application up.
MEMS microphone the most according to claim 1, it is characterised in that described MEMS core
Sheet (3) and described dsp chip (5) distribution are arranged on the corresponding position of described wiring board (2)；
Described asic chip (4) is positioned at described MEMS chip (3) or described dsp chip (5)
The position of top, and described asic chip (4) and described MEMS chip (3), or described ASIC
Chip (4) is least partially overlapped with the described dsp chip (5) projection on described wiring board (2).
MEMS microphone the most according to claim 2, it is characterised in that described ASIC core
Sheet (4) is arranged on described dsp chip (5).
MEMS microphone the most according to claim 1, it is characterised in that described sound hole (9)
Being arranged on described wiring board (2), described MEMS chip (3) covers described sound hole (9)；
Or, described sound hole (9) is arranged on described metal shell (1).
MEMS microphone the most according to claim 1, it is characterised in that described metal shell
(1) cap-like structure being formed in one；
Or, described metal shell (1) is the cap-like structure being made up of hollow cavity and the top board of sidewall.
MEMS microphone the most according to claim 5, it is characterised in that described metal shell
(1) it is welded on described wiring board (2) by tin cream (8).
7. according to the MEMS microphone described in any one of claim 1 to 6, it is characterised in that institute
State MEMS microphone also to include: be arranged on the electric capacity (10) within described encapsulating structure, described electric capacity
(10) it is used for filtering the power supply coupling clutter of described dsp chip (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620203197.3U CN205566635U (en) | 2016-03-16 | 2016-03-16 | MEMS microphone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620203197.3U CN205566635U (en) | 2016-03-16 | 2016-03-16 | MEMS microphone |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205566635U true CN205566635U (en) | 2016-09-07 |
Family
ID=56817004
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620203197.3U Active CN205566635U (en) | 2016-03-16 | 2016-03-16 | MEMS microphone |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205566635U (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107948865A (en) * | 2017-12-29 | 2018-04-20 | 华景传感科技（无锡）有限公司 | Low-power consumption microphone |
| WO2019061178A1 (en) * | 2017-09-28 | 2019-04-04 | 深圳传音通讯有限公司 | Voice processing apparatus, method and electronic device |
| CN109587588A (en) * | 2017-09-28 | 2019-04-05 | 瑞声声学科技(深圳)有限公司 | Microphone |
| CN111498791A (en) * | 2020-04-30 | 2020-08-07 | 青岛歌尔微电子研究院有限公司 | Micro-electro-mechanical system packaging structure and manufacturing method thereof |
| WO2020215382A1 (en) * | 2019-04-23 | 2020-10-29 | 瑞声声学科技(深圳)有限公司 | Glass break detection device and method |
| WO2020215381A1 (en) * | 2019-04-23 | 2020-10-29 | 瑞声声学科技(深圳)有限公司 | Glass breakage detection device and method |
| US10841710B1 (en) * | 2019-06-20 | 2020-11-17 | Solid State System Co., Ltd. | Package structure of micro-electro-mechanical-system microphone package and method for packaging the same |
| CN112954560A (en) * | 2021-03-01 | 2021-06-11 | 潍坊歌尔微电子有限公司 | Microphone and electronic device |
-
2016
- 2016-03-16 CN CN201620203197.3U patent/CN205566635U/en active Active
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019061178A1 (en) * | 2017-09-28 | 2019-04-04 | 深圳传音通讯有限公司 | Voice processing apparatus, method and electronic device |
| CN109587588A (en) * | 2017-09-28 | 2019-04-05 | 瑞声声学科技(深圳)有限公司 | Microphone |
| CN107948865A (en) * | 2017-12-29 | 2018-04-20 | 华景传感科技（无锡）有限公司 | Low-power consumption microphone |
| CN107948865B (en) * | 2017-12-29 | 2024-03-08 | 华景传感科技（无锡）有限公司 | Low-power consumption microphone |
| WO2020215382A1 (en) * | 2019-04-23 | 2020-10-29 | 瑞声声学科技(深圳)有限公司 | Glass break detection device and method |
| WO2020215381A1 (en) * | 2019-04-23 | 2020-10-29 | 瑞声声学科技(深圳)有限公司 | Glass breakage detection device and method |
| US10841710B1 (en) * | 2019-06-20 | 2020-11-17 | Solid State System Co., Ltd. | Package structure of micro-electro-mechanical-system microphone package and method for packaging the same |
| CN111498791A (en) * | 2020-04-30 | 2020-08-07 | 青岛歌尔微电子研究院有限公司 | Micro-electro-mechanical system packaging structure and manufacturing method thereof |
| CN112954560A (en) * | 2021-03-01 | 2021-06-11 | 潍坊歌尔微电子有限公司 | Microphone and electronic device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20200611 Address after: 266104 room 103, 396 Songling Road, Laoshan District, Qingdao, Shandong Province Patentee after: Goer Microelectronics Co.,Ltd. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee before: GOERTEK Inc. |