CN205566635U - MEMS microphone - Google Patents

MEMS microphone Download PDF

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Publication number
CN205566635U
CN205566635U CN201620203197.3U CN201620203197U CN205566635U CN 205566635 U CN205566635 U CN 205566635U CN 201620203197 U CN201620203197 U CN 201620203197U CN 205566635 U CN205566635 U CN 205566635U
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China
Prior art keywords
chip
mems
mems microphone
asic
wiring board
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CN201620203197.3U
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Chinese (zh)
Inventor
刘思桢
刘德安
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Goertek Microelectronics Inc
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Goertek Inc
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Abstract

The utility model discloses a MEMS microphone. This MEMS microphone includes: metal casing (1), circuit board (2), MEMS chip (3), ASIC chip (4) and sound inlet aperture (9), metal casing (1) and circuit board (2) forms MEMS microphone's outside packaging structure, and MEMS chip (3) and ASIC chip (4) set up in packaging structure's inside, and sound inlet aperture (9) set up on packaging structure, and this MEMS microphone still includes: the setting is in inside DSP chip (5) of packaging structure. The utility model discloses an utilizing that the microphone operating current is little, the characteristics of low power dissipation, adding in current MEMS microphone and have the DSP chip that pronunciation awaken the function up, the pronunciation that utilize the DSP chip awaken the function up and awaken the rear end treater up to realize the liberation both hands, save the electric energy, prolong the stand -by time of rear end equipment.

Description

A kind of MEMS microphone
Technical field
This utility model relates to acoustic-electric product technical field, particularly to a kind of MEMS microphone.
Background technology
Mike is a kind of acoustic sensor, in order to pick up voice and sound, and can convert thereof into electricity Signal.MEMS microphone be use MEMS (Micro-Eletro-Mechanical System, MEMS) mini microphone that technique makes, the most generally applies among mobile device.
And existing most of mobile device to be changed into mode of operation from standby mode defeated typically by button Enter, touch screen touch wakes up up or voice wakes up three kinds of modes up.Wherein key-press input and touch screen touch wake-up mode, Wake up up owing to needs utilize both hands that mobile terminal is carried out operation so that user and the mutual body of mobile terminal Test unsatisfactory;And the voice of present stage wake up up algorithm operate in mobile terminal APP processor or On CODEC, and perform voice and wake up that the application program electric current of algorithm is big, power consumption is high, affect user's up Experience.
Utility model content
In view of the above problems, this utility model provides a kind of MEMS microphone, to solve prior art Poor with the interactive experience of terminal unit realizing the user resulted in voice wakeup process, and owing to holding The application program electric current that lang sound wakes up up is big, the problem of waste electric energy.
For reaching above-mentioned purpose, the technical solution of the utility model is achieved in that
This utility model provides a kind of MEMS microphone, including: metal shell 1, wiring board 2, MEMS chip 3, asic chip 4 and sound hole 9;Metal shell 1 and wiring board 2 form MEMS The outer enclosure structure of mike, MEMS chip 3 and asic chip 4 are arranged on the interior of encapsulating structure Portion, sound hole 9 is arranged on encapsulating structure, and this MEMS microphone also includes: be arranged on encapsulating structure Internal dsp chip 5;
MEMS microphone picks up voice signal by sound hole 9, and pickup is arrived by MEMS chip 3 Voice signal is converted to analog voice signal and is sent to asic chip 4, and asic chip 4 will receive Analog voice signal be converted to audio digital signals, and be sent to dsp chip 5 by wiring board 2, Dsp chip 5 wakes up backend application up according to the audio digital signals received.
Preferably, MEMS chip 3 and dsp chip 5 distribution are arranged on the relevant position of wiring board 2 Place;
Asic chip 4 is positioned at the position above MEMS chip 3 or dsp chip 5, and ASIC core Sheet 4 and MEMS chip 3, or asic chip 4 and the dsp chip 5 projection on wiring board 2 Least partially overlapped.
It is further preferred that asic chip 4 is arranged on dsp chip 5.
Preferably, sound hole 9 is arranged on wiring board 2, and MEMS chip 3 covers sound hole 9;
Or, sound hole 9 is arranged on metal shell 1.
Preferably, the cap-like structure that metal shell 1 is formed in one;
Or, the cap-like structure that metal shell 1 is the hollow cavity by sidewall and top board is constituted.
It is further preferred that metal shell 1 is welded on described wiring board 2 by tin cream 8.
Preferably, MEMS microphone also includes: be arranged on the electric capacity 10 within encapsulating structure, electric capacity (10) Clutter is coupled for filtering the power supply of dsp chip 5.
This utility model embodiment provides the benefit that: this utility model utilize microphone works electric current little, Feature low in energy consumption, adds the dsp chip with voice arousal function in traditional MEMS mike, Utilize the voice arousal function of dsp chip to wake up back-end processor up.MEMS wheat of the present utility model Gram wind, compared to prior art, is not only able to liberate both hands, save electric energy, additionally it is possible to extend rear end equipment Stand-by time.
Accompanying drawing explanation
The cross-sectional view of the MEMS microphone that Fig. 1 provides for this utility model embodiment;
The cross-section structure signal of the another kind of MEMS microphone that Fig. 2 provides for this utility model embodiment Figure;
The perspective view of the MEMS microphone that Fig. 3 provides for this utility model embodiment;
In figure: 1, metal shell;2, wiring board;3, MEMS chip;4, asic chip;5、 Dsp chip;6, gold thread;7, bonded adhesives;8, tin cream;9, sound hole;10, electric capacity.
Detailed description of the invention
For making the purpose of this utility model, technical scheme and advantage clearer, below in conjunction with accompanying drawing pair This utility model embodiment is described in further detail.
Embodiment one:
The cross-sectional view of the MEMS microphone that Fig. 1 and Fig. 2 provides for the present embodiment, Fig. 3 The perspective view of MEMS microphone provided for the present embodiment, as Fig. 1 to Fig. 3 jointly shown in, The MEMS microphone of the present embodiment includes: metal shell 1, wiring board 2, MEMS chip 3, ASIC Chip 4 and sound hole 9;Metal shell 1 and wiring board 2 form the outer enclosure knot of MEMS microphone Structure, MEMS chip 3 and asic chip 4 are arranged on the inside of encapsulating structure, and sound hole 9 is arranged on On encapsulating structure, this MEMS microphone also includes: be arranged on the dsp chip 5 within encapsulating structure.
MEMS microphone picks up voice signal by sound hole 9, and pickup is arrived by MEMS chip 3 Voice signal is converted to analog voice signal and is sent to asic chip 4, and asic chip 4 will receive Analog voice signal be converted to audio digital signals, and be sent to dsp chip 5 by wiring board 2, Dsp chip 5 wakes up backend application up according to the audio digital signals received.
After the processor held upon awakening, the dsp chip 5 of the present embodiment is follow-up by MEMS microphone The audio signal picked up is sent to the processor of rear end.
In actual applications, the dsp chip 5 of the present embodiment is capable of identify that the identity of teller, raising are called out The degree of safety waken up.Concrete, dsp chip 5 according to the phonetic feature of the digital audio and video signals received, Mate with phonetic feature set in advance, after after the match is successful, this digital audio and video signals of recycling wakes up up The processor of end.Phonetic feature in the present embodiment is including, but not limited to vocal print feature.
It should be noted that the dsp chip in the present embodiment can be correlated with according to actually used demand integration Functional module, such as can be with integrated noise processed module, speech command module, detecting language environment mould Block, to increase the attainable function of dsp chip.
Embodiment two:
MEMS microphone in the present embodiment is similar with the structure of the MEMS microphone in embodiment one.
MEMS chip 3 and dsp chip 5 distribution are arranged on the corresponding position of wiring board 2, ASIC Chip 4 is positioned at the position above MEMS chip 3 or dsp chip 5, and asic chip 4 and MEMS Chip 3, or asic chip 4 is least partially overlapped with the dsp chip 5 projection on wiring board 2.
Wherein, the position that asic chip 4 is positioned at above MEMS chip 3 or dsp chip 5 is appreciated that For: asic chip 4 is arranged on metal shell 1, and asic chip 4 is positioned at MEMS chip 3 Or above dsp chip 5;Or, asic chip 4 is arranged on MEMS chip 3 or dsp chip 5 On.Certainly, in actual applications, can change according to the layout requirements of MEMS microphone components and parts MEMS chip, asic chip with dsp chip in the relative position within encapsulating structure, as by MEMS Chip is arranged on the top of encapsulating structure, is arranged in the circuit board by dsp chip, is set by asic chip Put on dsp chip;Or, the distribution of MEMS chip, asic chip and dsp chip is arranged In the circuit board.
The present embodiment passes through following preferred version, describes MEMS chip, asic chip and DSP in detail Chip is at the position relationship within encapsulating structure, and the electric connection mode of chip chamber.
With reference to shown in Fig. 1 or Fig. 2, in the preferred version of the present embodiment, MEMS chip 3 and DSP Chip 5 is separately positioned on the pre-position of wiring board 2, and asic chip 4 is arranged on dsp chip 5 On.By being arranged on dsp chip 5 by asic chip 4, MEMS chip, ASIC can be reduced The lateral dimension within encapsulating structure shared by chip and dsp chip, installs sky such that it is able to save Between, product is made less, meets the market demand of miniaturization of electronic products.
In actual applications, it is possible to use MEMS chip 3 is bonded on wiring board 2 by bonded adhesives 7, Asic chip 4 is bonded in dsp chip 5, utilizes tin cream 8 that dsp chip 5 is welded on wiring board On 2.Now, for realizing transmission and the process of voice signal, it is preferable that MEMS chip 3 is by gold Line 6 electrically connects asic chip 4, and asic chip 4 is by gold thread 6 electrical interconnection plate 2, DSP Chip 5 is electrical interconnection plate 2 by the way of welding.I.e. MEMS chip 3 and asic chip 4 it Between realize by the way of routing electrical connection, by the side of routing between asic chip 4 and wiring board 2 Formula realizes electrical connection, and due to when packaged dsp chip is welded in the circuit board, dsp chip Each pin can be welded to the setting position of wiring board such that it is able to realize dsp chip and patch panel it Between electrical connection so that asic chip and dsp chip realize electrical connection by wiring board.Need explanation , the wiring board in the present embodiment is provided with pad, pad by MEMS microphone inside chip with External electronic circuits electrically connects.
After the electrical connection realized between MEMS chip, asic chip and dsp chip, MEMS Chip gathers the voice signal being entered MEMS microphone package inside configuration by sound hole, and is believed by voice Number being converted to analog voice signal is sent to asic chip, and analog voice signal is converted to by asic chip Audio digital signals is sent to dsp chip by wiring board, and audio digital signals is carried out phase by dsp chip The process answered also obtains wake command, by pad, wake command is sent to external electronic circuits, i.e. sends out Give backend application, thus realize the arousal function of backend application.
It should be noted that the dsp chip in this preferred version can also use mode and the circuit of routing Plate realizes electrical connection.
Need further exist for explanation, be distributed in MEMS chip and dsp chip and arrange in the circuit board Time, asic chip can also be arranged in MEMS chip.Now, it is preferred to use tin cream is by MEMS Chip welds in the circuit board, i.e. MEMS chip electrically connects with wiring board by the way of welding, ASIC Chip can be electrically connected with MEMS chip in the way of using welding or routing.In the present embodiment Asic chip, after electrically connecting with MEMS chip, realizes electrically connecting with dsp chip by wiring board.
Embodiment three:
The MEMS microphone of the present embodiment and the MEMS microphone in embodiment one or embodiment two Structure is similar to.
With reference to shown in Fig. 1 or Fig. 2, the hat shape that the metal shell 1 in the present embodiment can be formed in one Structure;Metal shell 1 can also be for the cap-like structure being made up of hollow cavity and the top board of sidewall.Wherein, Metal shell 1 is welded on wiring board 2 by tin cream 8, constitutes the encapsulating structure of MEMS microphone.
Sound hole 9 in the present embodiment can be arranged on wiring board 2, it is also possible to is arranged on metal shell On 1.As it is shown in figure 1, when sound hole 9 is arranged on wiring board 2, MEMS chip 3 cover into Acoustic aperture 9, preferably sound hole 9 are positioned at the underface of MEMS chip 3;As in figure 2 it is shown, when entering sound When hole 9 is arranged on metal shell 1, sound hole 9 can be arranged on top or the sidepiece of metal shell 1, Preferably sound hole 9 is positioned at the surface of MEMS chip 3.
As it is shown on figure 3, the MEMS microphone in the present embodiment also includes: be arranged on inside encapsulating structure Electric capacity 10, electric capacity 10 is for filtering the power supply coupling clutter of dsp chip 5.
In sum, the utility model discloses a kind of MEMS microphone, this utility model utilizes Mike The feature that wind operating current is little, low in energy consumption, adds in traditional MEMS mike and has voice and wake up merit up The dsp chip of energy, utilizes the voice arousal function of dsp chip to wake up back-end processor up.This practicality Novel MEMS microphone, compared to prior art, is not only able to liberate both hands, save electric energy, moreover it is possible to Enough extend the stand-by time of rear end equipment.
The foregoing is only preferred embodiment of the present utility model, be not intended to limit this utility model Protection domain.All made within spirit of the present utility model and principle any amendment, equivalent, Improve, be all contained in protection domain of the present utility model.

Claims (7)

1. a MEMS microphone, including: metal shell (1), wiring board (2), MEMS core Sheet (3), asic chip (4) and sound hole (9);Described metal shell (1) and described wiring board (2) the outer enclosure structure of MEMS microphone, described MEMS chip (3) and described ASIC are formed Chip (4) is arranged on the inside of described encapsulating structure, and described sound hole (9) is arranged on described encapsulation knot On structure, it is characterised in that this MEMS microphone also includes: be arranged within described encapsulating structure Dsp chip (5);
Described MEMS microphone picks up voice signal, described MEMS core by described sound hole (9) Sheet (3) by pickup to voice signal be converted to analog voice signal and be sent to described asic chip (4), The analog voice signal received is converted to audio digital signals by described asic chip (4), and passes through Described wiring board (2) is sent to dsp chip (5), and described dsp chip (5) basis receives Audio digital signals wakes up backend application up.
MEMS microphone the most according to claim 1, it is characterised in that described MEMS core Sheet (3) and described dsp chip (5) distribution are arranged on the corresponding position of described wiring board (2);
Described asic chip (4) is positioned at described MEMS chip (3) or described dsp chip (5) The position of top, and described asic chip (4) and described MEMS chip (3), or described ASIC Chip (4) is least partially overlapped with the described dsp chip (5) projection on described wiring board (2).
MEMS microphone the most according to claim 2, it is characterised in that described ASIC core Sheet (4) is arranged on described dsp chip (5).
MEMS microphone the most according to claim 1, it is characterised in that described sound hole (9) Being arranged on described wiring board (2), described MEMS chip (3) covers described sound hole (9);
Or, described sound hole (9) is arranged on described metal shell (1).
MEMS microphone the most according to claim 1, it is characterised in that described metal shell (1) cap-like structure being formed in one;
Or, described metal shell (1) is the cap-like structure being made up of hollow cavity and the top board of sidewall.
MEMS microphone the most according to claim 5, it is characterised in that described metal shell (1) it is welded on described wiring board (2) by tin cream (8).
7. according to the MEMS microphone described in any one of claim 1 to 6, it is characterised in that institute State MEMS microphone also to include: be arranged on the electric capacity (10) within described encapsulating structure, described electric capacity (10) it is used for filtering the power supply coupling clutter of described dsp chip (5).
CN201620203197.3U 2016-03-16 2016-03-16 MEMS microphone Active CN205566635U (en)

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Application Number Priority Date Filing Date Title
CN201620203197.3U CN205566635U (en) 2016-03-16 2016-03-16 MEMS microphone

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Application Number Priority Date Filing Date Title
CN201620203197.3U CN205566635U (en) 2016-03-16 2016-03-16 MEMS microphone

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Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107948865A (en) * 2017-12-29 2018-04-20 华景传感科技(无锡)有限公司 Low-power consumption microphone
WO2019061178A1 (en) * 2017-09-28 2019-04-04 深圳传音通讯有限公司 Voice processing apparatus, method and electronic device
CN109587588A (en) * 2017-09-28 2019-04-05 瑞声声学科技(深圳)有限公司 Microphone
CN111498791A (en) * 2020-04-30 2020-08-07 青岛歌尔微电子研究院有限公司 Micro-electro-mechanical system packaging structure and manufacturing method thereof
WO2020215381A1 (en) * 2019-04-23 2020-10-29 瑞声声学科技(深圳)有限公司 Glass breakage detection device and method
WO2020215382A1 (en) * 2019-04-23 2020-10-29 瑞声声学科技(深圳)有限公司 Glass break detection device and method
US10841710B1 (en) * 2019-06-20 2020-11-17 Solid State System Co., Ltd. Package structure of micro-electro-mechanical-system microphone package and method for packaging the same
CN112954560A (en) * 2021-03-01 2021-06-11 潍坊歌尔微电子有限公司 Microphone and electronic device

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019061178A1 (en) * 2017-09-28 2019-04-04 深圳传音通讯有限公司 Voice processing apparatus, method and electronic device
CN109587588A (en) * 2017-09-28 2019-04-05 瑞声声学科技(深圳)有限公司 Microphone
CN107948865A (en) * 2017-12-29 2018-04-20 华景传感科技(无锡)有限公司 Low-power consumption microphone
CN107948865B (en) * 2017-12-29 2024-03-08 华景传感科技(无锡)有限公司 Low-power consumption microphone
WO2020215381A1 (en) * 2019-04-23 2020-10-29 瑞声声学科技(深圳)有限公司 Glass breakage detection device and method
WO2020215382A1 (en) * 2019-04-23 2020-10-29 瑞声声学科技(深圳)有限公司 Glass break detection device and method
US10841710B1 (en) * 2019-06-20 2020-11-17 Solid State System Co., Ltd. Package structure of micro-electro-mechanical-system microphone package and method for packaging the same
CN111498791A (en) * 2020-04-30 2020-08-07 青岛歌尔微电子研究院有限公司 Micro-electro-mechanical system packaging structure and manufacturing method thereof
CN112954560A (en) * 2021-03-01 2021-06-11 潍坊歌尔微电子有限公司 Microphone and electronic device

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Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
TR01 Transfer of patent right
TR01 Transfer of patent right

Effective date of registration: 20200611

Address after: 266104 room 103, 396 Songling Road, Laoshan District, Qingdao, Shandong Province

Patentee after: Goer Microelectronics Co.,Ltd.

Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268

Patentee before: GOERTEK Inc.