CN205540780U - Mobile device and fingerprint identification sensing apparatus - Google Patents

Mobile device and fingerprint identification sensing apparatus Download PDF

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Publication number
CN205540780U
CN205540780U CN201620059895.0U CN201620059895U CN205540780U CN 205540780 U CN205540780 U CN 205540780U CN 201620059895 U CN201620059895 U CN 201620059895U CN 205540780 U CN205540780 U CN 205540780U
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China
Prior art keywords
fingerprint recognition
sensing device
chip
fingerprint
display element
Prior art date
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Expired - Fee Related
Application number
CN201620059895.0U
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Chinese (zh)
Inventor
张海平
周意保
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Guangdong Oppo Mobile Telecommunications Corp Ltd
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Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Priority to CN201620059895.0U priority Critical patent/CN205540780U/en
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Abstract

The utility model discloses a mobile device and fingerprint identification sensing apparatus. The fingerprint identification sensing apparatus includes: the base plate, becket, becket have the centre bore and the becket is established on the base plate, display element, display element establish in the centre bore, fingerprint sensor subassembly, fingerprint sensor subassembly are established on the base plate and are located the centre bore, the fingerprint sensor subassembly be located display element the below and including the chip that is suitable for user's fingerprint of being coupled to user's finger, be suitable for and press sensitive response element and be used for wrapping up chip and response element's encapsulated layer, chip and substrate connection user's finger. According to the utility model discloses a fingerprint identification sensing apparatus, through with response element and chip parcel inside the encapsulated layer, can reduce external environment to the interference of fingerprint sensor subassembly from this, reduce the thickness of fingerprint identification sensing apparatus, improve the compact structure degree of fingerprint identification sensing apparatus.

Description

Mobile device and fingerprint recognition sensing device
Technical field
This utility model relates to a kind of mobile device and fingerprint recognition sensing device.
Background technology
Along with the development of mobile communications network and enriching of application software, mobile phone has become the development trend of mobile terminal.Mobile phone It is equipped with the operating system that abundant hardware interface can be open, provides the user a powerful information processing platform, Therefore mobile phone is not only a call instrument, and it is it is also possible that GPS device, high-definition camera, game machine, a Web Entrance etc..More precisely, it or a palm PC being connected with the Internet.
Due to the above-mentioned functions of mobile phone, on mobile phone, therefore store personal information, associated person information, photo, video, even Also have the sensitive information etc. of some enterprises, be the most common situation, and guarantee that above-mentioned information security is most important, so hands The Encryption Design of machine becomes a kind of important measures in current phone safe design.Fingerprint recognition cipher mode is safe and reliable with it Property high, become a kind of main implementation of mobile phone cipher design.Therefore, how to realize the fingerprint identification function of mobile phone, be A key issue in current phone design.
Utility model content
One of technical problem that this utility model is intended to solve in correlation technique the most to a certain extent.To this end, this practicality is new Type proposes a kind of fingerprint recognition sensing device, and described fingerprint recognition senses the advantage that device has simple in construction, production cost is low.
This utility model also provides for again a kind of mobile device, and described mobile device has fingerprint recognition as above sensing device.
Fingerprint recognition sensing device according to this utility model embodiment, including: substrate;Becket, described becket has Centre bore and described becket set on the substrate;Display element, described display element is located in described centre bore;Fingerprint Sensor cluster, described fingerprint sensor assembly sets on the substrate and is positioned at described centre bore, described fingerprint sensor Assembly is positioned at the lower section of described display element and includes being operably coupled to the chip of the user fingerprints of user's finger, being suitable to user Finger presses sensitive response element and for wrapping up described chip and the encapsulated layer of described response element, described chip and institute State substrate to connect.
Fingerprint recognition sensing device according to this utility model embodiment, by being wrapped in response element and chip in encapsulated layer Portion, the most not only can reduce the external environment interference to fingerprint sensor assembly, improves the sensitivity of fingerprint sensor assembly With the accuracy identifying function, it is also possible to reduce the thickness of fingerprint recognition sensing device, improve the knot of fingerprint recognition sensing device Structure compactness.
According to embodiments more of the present utility model, the upper surface of described substrate is provided with the shake-up being suitable to touch described response element Portion.
According to embodiments more of the present utility model, described touch part is formed as the lobe raised up.
According to embodiments more of the present utility model, described response element is embedded in described chip.
According to embodiments more of the present utility model, described response element is embedded the side of the close described substrate at described chip.
According to embodiments more of the present utility model, the upper surface of described fingerprint sensor assembly is equipped with glue layer.
According to embodiments more of the present utility model, the lower surface of described display element is equipped with ink layer.
According to embodiments more of the present utility model, described display element is glass cover-plate, ceramic cover plate or sapphire cover plate.
According to embodiments more of the present utility model, described chip includes the fingerprint that can be capacitively coupled to user's finger One group of capacitive element.
According to embodiments more of the present utility model, described fingerprint sensor assembly also includes that pad, described pad are wrapped in institute Stating in encapsulated layer, described chip is connected with described pad by gold thread, and described pad is connected with described substrate.
According to the mobile device of this utility model embodiment, sense device including fingerprint recognition as above.
According to the mobile device of this utility model embodiment, by arranging fingerprint recognition as above sensing device, Ke Yiti The integrated level of high mobile device, simplifies the structure of fingerprint recognition sensing device, reduces production cost.
Accompanying drawing explanation
Fig. 1 is the structural representation of the fingerprint recognition sensing device according to this utility model embodiment.
Fig. 2 is the partial structurtes schematic diagram of the fingerprint recognition sensing device according to this utility model embodiment.
Reference:
Fingerprint recognition sensing device 100,
Substrate 110, touch part 111,
Becket 120, centre bore 121,
Display element 130, ink layer 131,
Fingerprint sensor assembly 140, chip 141, response element 142, encapsulated layer 143, glue layer 144, gold thread 145.
Detailed description of the invention
Of the present utility model embodiment is described below in detail, and the example of described embodiment is shown in the drawings.Below with reference to The embodiment that accompanying drawing describes is exemplary, it is intended to be used for explaining this utility model, and it is not intended that to of the present utility model Limit.
Describe the fingerprint recognition according to this utility model embodiment in detail referring to Fig. 1-Fig. 2 and sense device 100.Need Bright, fingerprint recognition sensing device 100 can be arranged in electronic equipment or mobile device, such as, fingerprint recognition sensed Device 100 is arranged on mobile phone, and when the finger of user moves closer to fingerprint recognition sensing device 100, fingerprint recognition senses Device 100 can identify the finger print information of user, and is transferred to by finger print information on the control assembly of mobile phone, and controlling assembly can With according to finger print information, send corresponding control instruction.It addition, when the finger of user is close or pressing fingerprint recognition sensing dress When putting 100, fingerprint recognition sensing device 100 can with sensing finger near or pressing and by finger near or pressing letter Breath is transferred to control on assembly.
As Figure 1-Figure 2, sense device 100 according to the fingerprint recognition of this utility model embodiment to include: substrate 110, Becket 120, display element 130 and fingerprint sensor assembly 140.
Specifically, as it is shown in figure 1, becket 120 and fingerprint sensor assembly 140 are each provided on substrate 110.Metal Ring 120 has centre bore 121, display element 130 and fingerprint sensor assembly 140 and is each provided in centre bore 121.Fingerprint Sensor cluster 140 is positioned at the lower section of display element 130 and includes chip 141, response element 142 and encapsulated layer 143. Wherein, chip 141 is connected with substrate 110, chip 141 can be provided with sensor circuit and be operably coupled to user's finger User fingerprints, when user finger near or pressing display element 130 time, chip 141 can identify user fingerprint letter Finger print information can be transferred to control on assembly by breath (i.e. fingerprint ridge line information on sensing user's finger) and chip 141.
Response element 142 be suitable to user's finger pressing sensitivity, say, that response element 142 have to user's finger by The function of pressure-sensitive sense.Such as, when user's finger pressing fingerprint recognition sensing device 100, response element 142 can sense To the push action of finger, the information that finger presses can be transferred to control on assembly by response element 142 simultaneously.Thus, Fingerprint recognition sensing device 100 can be made to have the function of control, such as, there is HOME key function.Chip 141 and response element Part 142 is wrapped in encapsulated layer 143, the most not only can reduce the thickness of fingerprint recognition sensing device 100, and raising refers to The compact conformation degree of stricture of vagina identification sensing device 100, it is also possible to reduce the external environment interference to fingerprint sensor assembly 140, Improve the sensitivity of fingerprint sensor assembly 140 and identify the accuracy of function.
Fingerprint recognition sensing device 100 according to this utility model embodiment, by wrapping up response element 142 and chip 141 Inside encapsulated layer 143, the most not only can reduce the external environment interference to fingerprint sensor assembly 140, improve fingerprint The sensitivity of sensor cluster 140 and the accuracy of identification function, it is also possible to reduce the thickness of fingerprint recognition sensing device 100, Improve the compact conformation degree of fingerprint recognition sensing device 100.
According to an embodiment of the present utility model, the upper surface of substrate 110 is provided with the shake-up being suitable to touch response element 142 Portion 111, is thus easy to touch response element 142, and the reaction making response element 142 is sensitiveer.Further, at such as figure In example shown in 2, touch part 111 is formed as the lobe raised up.
For ease of display element 130 being arranged on the upper surface of fingerprint sensor assembly 140, according to of the present utility model one Individual embodiment, the upper surface of fingerprint sensor assembly 140 can be equipped with glue layer 144.According to of the present utility model one Individual embodiment, the lower surface of display element 130 is equipped with ink layer 131, thus can improve making of display element 130 Use performance.Alternatively, display element 130 can be glass cover-plate, ceramic cover plate or sapphire cover plate.Thus, it is possible to carry The architectural characteristic of high display element 130, meets the use demand of fingerprint recognition sensing device 100.
According to an embodiment of the present utility model, chip 141 includes the fingerprint that can be capacitively coupled to user's finger One group of capacitive element, capacitive element can be coupled to one end of display element 130, thus can simplify fingerprint pass The structure of sensor assembly 140.As depicted in figs. 1 and 2, according to an embodiment of the present utility model, response element 142 It is embedded in described chip 141.Thus can simplify fingerprint recognition sensing device 100 structure further, reduce fingerprint recognition The thickness of sensing device 100.Further, as in figure 2 it is shown, response element 142 is embedded the close base on chip 141 The position of the side of plate 110.Thus, it is possible to improve the response sensitivity of response element 142.
According to an embodiment of the present utility model, fingerprint sensor assembly 140 also includes pad, and pad is wrapped in encapsulated layer In 143, chip 141 is connected with pad by gold thread 145, and pad is connected with substrate 110.Thus, it is possible to raising fingerprint The structural strength of sensor cluster 140.Further, chip 141 is located on the upper surface of pad.
Describe the fingerprint recognition according to this utility model embodiment in detail referring to Fig. 1-Fig. 2 and sense device 100.It is worth reason Solve, described below be merely illustrative rather than to concrete restriction of the present utility model.
As Figure 1-Figure 2, fingerprint recognition sensing device 100 includes: substrate 110, becket 120, display element 130 And fingerprint sensor assembly 140.
Specifically, as it is shown in figure 1, becket 120 and fingerprint sensor assembly 140 are each provided on substrate 110.Metal Ring 120 has centre bore 121, display element 130 and fingerprint sensor assembly 140 and is each provided in centre bore 121.Display The lower surface of element 130 is equipped with ink layer 131, and the upper surface of fingerprint sensor assembly 140 is equipped with glue layer 144, Display element 130 is connected with fingerprint sensor assembly 140 by glue layer 144.
Fingerprint sensor assembly 140 is positioned at the lower section of display element 130 and includes chip 141, response element 142, encapsulated layer 143 and pad.Pad, chip 141 and response element 142 are all wrapped in encapsulated layer 143, the most permissible Reduce the thickness of fingerprint recognition sensing device 100, improve the compact conformation degree of fingerprint recognition sensing device 100, it is also possible to Reduce the external environment interference to fingerprint sensor assembly 140, improve the sensitivity of fingerprint sensor assembly 140 and identify merit The accuracy of energy.
Chip 141 is operably coupled to the user fingerprints of user's finger, when the finger of user is close or presses display element 130, Chip 141 can identify that the finger print information (i.e. fingerprint ridge line information on sensing user's finger) of user and chip 141 are permissible It is transferred to finger print information control on assembly.Further, chip 141 includes capacitive element, and capacitive element can be with Coupled capacitance-wise is to the fingerprint of user's finger, and capacitive element is alternatively coupled to one end of display element 130.Chip 141 Being located on the upper surface of pad and be connected with pad by wire (for example, gold thread 145), pad is connected with substrate 110. Thus, it is possible to improve the structural strength of fingerprint sensor assembly 140.
As in figure 2 it is shown, for the sensitivity improving response element 142, response element 142 can be embedded chip 141 times On end face, the upper surface of substrate 110 is provided with the touch part 111 being suitable to touch response element 142, touch part 111 and response Element 142 is corresponding, and when user's finger pressing display element 130, response element 142 can be touched in touch part 111, by This is easy to touch response element 142, and the reaction making response element 142 is sensitiveer.As in figure 2 it is shown, touch part 111 shape Become the lobe raised up.
Thus, internal by response element 142 and chip 141 being wrapped in encapsulated layer 143, the most not only can reduce and refer to The thickness of stricture of vagina identification sensing device 100, improves the compact conformation degree of fingerprint recognition sensing device 100, it is also possible to outside reduction The interference to fingerprint sensor assembly 140 of boundary's environment, improves the sensitivity of fingerprint sensor assembly 140 and identifies the standard of function Really property.
Provide a kind of mobile device according to embodiment of the present utility model, sense device including fingerprint recognition as above 100。
According to the mobile device of this utility model embodiment, by arranging fingerprint recognition as above sensing device 100, permissible Improve the integrated level of mobile device, simplify the structure of fingerprint recognition sensing device 100, reduce production cost.
In description of the present utility model, it is to be understood that term " " center ", " longitudinally ", " laterally ", " length ", " width Degree ", " thickness ", " on ", D score, "front", "rear", "left", "right", " vertically ", " level ", " top ", " end " The orientation of the instruction such as " interior ", " outward ", " clockwise ", " counterclockwise ", " axially ", " radially ", " circumferential " or position relationship For based on orientation shown in the drawings or position relationship, it is for only for ease of description this utility model and simplifies description rather than refer to Show or imply the device of indication or element must have specific orientation, with specific azimuth configuration and operation, therefore can not manage Solve as to restriction of the present utility model.
Additionally, term " first ", " second " are only used for describing purpose, and it is not intended that instruction or hint relative importance Or the implicit quantity indicating indicated technical characteristic.Thus, define " first ", the feature of " second " can be expressed Or implicitly include at least one this feature.In description of the present utility model, " multiple " are meant that at least two, example Such as two, three etc., unless otherwise expressly limited specifically.
In this utility model, unless otherwise clearly defined and limited, term " install ", " being connected ", " connection ", " Gu Fixed " etc. term should be interpreted broadly, connect for example, it may be fixing, it is also possible to be to removably connect, or integral;Can Be mechanically connected, it is also possible to be electrical connection or each other can communication;Can be to be joined directly together, it is also possible to by between intermediary Connect connected, can be connection or the interaction relationship of two elements of two element internals, unless otherwise clear and definite restriction. For the ordinary skill in the art, concrete in this utility model of above-mentioned term can be understood as the case may be Implication.
In this utility model, unless otherwise clearly defined and limited, fisrt feature second feature " on " or D score Can be that the first and second features directly contact, or the first and second features are by intermediary mediate contact.And, Fisrt feature second feature " on ", " top " and " above " but fisrt feature directly over second feature Or oblique upper, or it is merely representative of fisrt feature level height higher than second feature.Fisrt feature second feature " under ", " lower section " and " below " can be fisrt feature immediately below second feature or obliquely downward, or it is special to be merely representative of first Levy level height less than second feature.
In the description of this specification, reference term " embodiment ", " some embodiments ", " example ", " specifically show Example " or the description of " some examples " etc. means to combine this embodiment or example describes specific features, structure, material or Feature is contained at least one embodiment of the present utility model or example.In this manual, schematic to above-mentioned term Statement is necessarily directed to identical embodiment or example.And, the specific features of description, structure, material or feature Can be so that one or more embodiments in office or example to combine in an appropriate manner.Additionally, in the case of the most conflicting, Those skilled in the art can be by the different embodiments described in this specification or example and different embodiment or the spy of example Levy and be combined and combine.
Although above it has been shown and described that embodiment of the present utility model, it is to be understood that above-described embodiment is example Property, it is impossible to being interpreted as restriction of the present utility model, those of ordinary skill in the art can in the range of this utility model Above-described embodiment be changed, revise, to replace and modification.

Claims (11)

1. a fingerprint recognition sensing device, it is characterised in that including:
Substrate;
Becket, described becket has centre bore and described becket sets on the substrate;
Display element, described display element is located in described centre bore;
Fingerprint sensor assembly, described fingerprint sensor assembly sets on the substrate and is positioned at described centre bore, described finger Stricture of vagina sensor cluster is positioned at the lower section of described display element and includes being operably coupled to the chip of the user fingerprints of user's finger, fits In the response element sensitive to the pressing of user's finger and for wrapping up described chip and the encapsulated layer of described response element, described Chip is connected with described substrate.
Fingerprint recognition the most according to claim 1 sensing device, it is characterised in that the upper surface of described substrate is provided with suitable In the touch part touching described response element.
Fingerprint recognition the most according to claim 2 sensing device, it is characterised in that described touch part is formed as convex The lobe risen.
Fingerprint recognition the most according to claim 1 sensing device, it is characterised in that described response element is embedded described In chip.
Fingerprint recognition the most according to claim 4 sensing device, it is characterised in that described response element is embedded described The side of the close described substrate of chip.
Fingerprint recognition the most according to claim 1 sensing device, it is characterised in that described fingerprint sensor assembly upper Glue layer it is equipped with on surface.
Fingerprint recognition the most according to claim 1 sensing device, it is characterised in that on the lower surface of described display element It is equipped with ink layer.
Fingerprint recognition the most according to claim 1 sensing device, it is characterised in that described display element be glass cover-plate, Ceramic cover plate or sapphire cover plate.
Fingerprint recognition the most according to claim 1 sensing device, it is characterised in that described chip includes can be with electric capacity Mode is coupled to one group of capacitive element of the fingerprint of user's finger.
Fingerprint recognition the most according to claim 1 sensing device, it is characterised in that described fingerprint sensor assembly is also Including pad, described pad is wrapped in described encapsulated layer, and described chip is connected with described pad by gold thread, described pad It is connected with described substrate.
11. 1 kinds of mobile devices, it is characterised in that include according to the fingerprint recognition sense according to any one of claim 1-10 Survey device.
CN201620059895.0U 2016-01-21 2016-01-21 Mobile device and fingerprint identification sensing apparatus Expired - Fee Related CN205540780U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201620059895.0U CN205540780U (en) 2016-01-21 2016-01-21 Mobile device and fingerprint identification sensing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201620059895.0U CN205540780U (en) 2016-01-21 2016-01-21 Mobile device and fingerprint identification sensing apparatus

Publications (1)

Publication Number Publication Date
CN205540780U true CN205540780U (en) 2016-08-31

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Application Number Title Priority Date Filing Date
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Country Status (1)

Country Link
CN (1) CN205540780U (en)

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C14 Grant of patent or utility model
GR01 Patent grant
CP03 Change of name, title or address

Address after: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18

Patentee after: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd.

Address before: Changan town in Guangdong province Dongguan 523859 usha Beach Road No. 18

Patentee before: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd.

CP03 Change of name, title or address
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20160831

CF01 Termination of patent right due to non-payment of annual fee