CN205507158U - High -efficient big power semiconductor laser instrument coupling encapsulation subassembly - Google Patents
High -efficient big power semiconductor laser instrument coupling encapsulation subassembly Download PDFInfo
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- CN205507158U CN205507158U CN201620092100.6U CN201620092100U CN205507158U CN 205507158 U CN205507158 U CN 205507158U CN 201620092100 U CN201620092100 U CN 201620092100U CN 205507158 U CN205507158 U CN 205507158U
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- semiconductor laser
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- transmission fibers
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Abstract
The utility model discloses a high -efficient big power semiconductor laser instrument coupling encapsulation subassembly, include that semiconductor laser, bare fibre fibre core, terminal surface are the transmission fiber of curved surface, this bare fibre fibre core is located between semiconductor laser and the curved surface, the laser that semiconductor laser sent passes through the bare fibre fibre core and compresses the ascending angle of divergence in its fast axis side to the transmission fiber coupling of curved surface is through the terminal surface.
Description
Technical field
This utility model relates to high power semiconductor lasers, particularly a kind of high-efficiency high-power semiconductor laser coupling
Package assembling.
Background technology
Multiple semiconductor lasers are used to pass through optical fiber or other optical means coupling package swashing multiple outputs at present
Light is combined into after light beam and obtains high power laser light source, and this high power laser light source can be widely used for various illumination, various adds
The fields such as work and laser seed light source.The laser facula sent due to semiconductor laser is ellipse, and its different directions dissipates
Angle is different, and the angle of divergence is big (horizontal divergence angle is 8-10 degree, and vertical divergence angle is 35-45 degree).At present, optical fiber coupling is used
The system of Output of laser, (such as aspheric surface microtrabeculae lens, sphere microtrabeculae lens, secondary collimation post is saturating mainly to use optical lens
Mirror, focal lens etc.) the mode laser beam dissipated that laser crystal is sent be coupled into optical fiber, to improve laser
Coupling efficiency, said lens needs to do high-precision processing polishing, complex manufacturing, time length and also cost is high, herein
Proposing a kind of efficient coupled modes using all-fiber, technique is simple, low cost, and coupling efficiency is high.
Summary of the invention
In order to overcome the deficiencies in the prior art, this utility model provides a kind of high-efficiency high-power semiconductor laser coupling envelope
Arrangement, so that the efficient light energy output of semiconductor laser.
This utility model solves its technical problem and be the technical scheme is that
Being the Transmission Fibers of curved surface including semiconductor laser, bare fibre fibre core, end face, this bare fibre fibre core is positioned at partly leads
Between body laser and curved surface, the laser that described semiconductor laser is sent passes through bare fibre fibre core by its quick shaft direction
The angle of divergence is compressed, and is coupled by the Transmission Fibers that end face is curved surface.
The central axis of described bare fibre fibre core is parallel with the slow-axis direction of semiconductor laser, and and semiconductor laser
Quick shaft direction vertical, the optical axis more sending laser with semiconductor laser intersects；The centrage of described Transmission Fibers with partly lead
Body laser sends the light shaft coaxle of laser.
Described curved surface is sphere such that it is able to increases Transmission Fibers and receives the laser beam that laser instrument sends.
AR film it is coated with, to increase the transmitance of laser on described curved surface.
The beneficial effects of the utility model are: this utility model includes that semiconductor laser, bare fibre fibre core, end face are for song
The Transmission Fibers in face, this bare fibre fibre core is between semiconductor laser and curved surface, and described semiconductor laser is sent
The angle of divergence on its quick shaft direction is compressed by laser by bare fibre fibre core, and is coupled by the Transmission Fibers that end face is curved surface,
The all-fiber coupling scheme that this programme uses, utilizes ready-made optical fiber combination to form, without optics cold working, reduces cost,
It is beneficial to batch production, also improves coupling efficiency simultaneously.
Accompanying drawing explanation
With embodiment, this utility model is further illustrated below in conjunction with the accompanying drawings.
Fig. 1 is structural representation of the present utility model；
Fig. 2 is schematic top plan view of the present utility model.
Detailed description of the invention
With reference to Fig. 1, Fig. 2, the utility model discloses a kind of high-efficiency high-power semiconductor laser device coupling packaging component, partly
Conductor laser can use other encapsulation shapes that C-Mount packing forms or laser crystal 1 are directly encapsulated on heat dispersion heat sink 2
Formula.Bare fibre fibre core 3 is to peel off coat only to remain the round fiber rod of fibre core, presses close to the light-emitting area of laser crystal 1, described naked light
The central axis of long and slender core 3 is flat with the slow-axis direction (being parallel to semiconductor laser PN junction in-plane) of semiconductor laser
OK, and vertical, more with quasiconductor with the quick shaft direction of semiconductor laser (being perpendicular to semiconductor laser PN junction in-plane)
Laser instrument sends the optical axis of laser and intersects or be positioned at position near optical axis, thus guarantees to have and well realize angle of divergence pressure
The effect of contracting；The core diameter of bare fibre fibre core 3 can be chosen according to the size at laser instrument vertical divergence angle, and it is luminous with laser crystal 1
The distance of end face can be adjusted according to the numerical aperture of Transmission Fibers and coupling efficiency；The centrage of described Transmission Fibers 4 with
Semiconductor laser sends the light shaft coaxle of laser, and the end face optical fiber bonding machine of Transmission Fibers 4 or heat sealing machine burn till spherical, passes
The centrage of the fibre core losing fine 4 is directed at the optical axis center of laser crystal 1 and coaxial, and its position can be adjusted according to coupling efficiency
Whole.
The advantage summary of said structure is:
The 1 circular bare fibre fibre core 3 parallel with laser crystal 1 horizontal emission face, dissipating of compressible laser vertical direction
Angle, makes laser emitting hot spot close to circular, and laser beam is coupled into defeated by follow-up Transmission Fibers 4 ball-shaped end efficiently
Go out in optical fiber, simultaneously, it is possible to according to the numerical aperture of reception optical fiber, adjust position and the diameter of compression fiber core so that it is with
Match, improve efficiency.
2, the end of transmission Transmission Fibers 4 is for being melt into curved surface or spherical, can be in the wider laser light received after compressing
Bundle coupled into optical fibres, simultaneously, it is possible to adjust the position of Transmission Fibers 4 according to coupling efficiency, to improve laser delivery efficiency.
3, most laser-bounce luminous reflectance also can be gone out original optical path by spherical end surface, it is to avoid reflection light is to laser works
Impact, improve laser instrument job stability.
4, all-fiber coupling scheme that this programme uses, utilizes ready-made optical fiber combination to form, without optics cold working, fall
Low cost, is beneficial to batch production, also improves coupling efficiency simultaneously.
It addition, all optical fiber surfaces or section are plated with AR film (the most anti-reflection antireflective film), it is possible to reduce the reflection of laser,
Improve coupling efficiency.
A kind of high-efficiency high-power semiconductor laser device coupling packaging component above this utility model embodiment provided,
Being described in detail, principle of the present utility model and embodiment are set forth by specific case used herein, with
The explanation of upper embodiment is only intended to help to understand method of the present utility model and core concept thereof；Simultaneously for this area
Those skilled in the art, according to thought of the present utility model, the most all will change, and combine
Upper described, this specification content should not be construed as restriction of the present utility model.
Claims (4)
1. a high-efficiency high-power semiconductor laser device coupling packaging component, it is characterised in that: include semiconductor laser, naked light
Long and slender core, end face are the Transmission Fibers of curved surface, this bare fibre fibre core between semiconductor laser and curved surface, described quasiconductor
The angle of divergence on its quick shaft direction is compressed by the laser that laser instrument is sent by bare fibre fibre core, and is curved surface by end face
Transmission Fibers couples.
A kind of high-efficiency high-power semiconductor laser device coupling packaging component the most according to claim 1, it is characterised in that: institute
The central axis stating bare fibre fibre core is parallel with the slow-axis direction of semiconductor laser, and with the quick shaft direction of semiconductor laser
Vertically, the optical axis more sending laser with semiconductor laser intersects；The centrage of described Transmission Fibers is sent out with semiconductor laser
Go out the light shaft coaxle of laser.
A kind of high-efficiency high-power semiconductor laser device coupling packaging component the most according to claim 1 and 2, its feature exists
In: described curved surface is sphere such that it is able to increases Transmission Fibers and receives the laser beam that laser instrument sends.
A kind of high-efficiency high-power semiconductor laser device coupling packaging component the most according to claim 1 and 2, its feature exists
In: it is coated with AR film on described curved surface, to increase the transmitance of laser.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620092100.6U CN205507158U (en) | 2016-01-30 | 2016-01-30 | High -efficient big power semiconductor laser instrument coupling encapsulation subassembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620092100.6U CN205507158U (en) | 2016-01-30 | 2016-01-30 | High -efficient big power semiconductor laser instrument coupling encapsulation subassembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205507158U true CN205507158U (en) | 2016-08-24 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201620092100.6U Active CN205507158U (en) | 2016-01-30 | 2016-01-30 | High -efficient big power semiconductor laser instrument coupling encapsulation subassembly |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105549162A (en) * | 2016-01-30 | 2016-05-04 | 中山优盛光电科技有限公司 | Efficient high-power semiconductor laser coupling packaging assembly |
-
2016
- 2016-01-30 CN CN201620092100.6U patent/CN205507158U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105549162A (en) * | 2016-01-30 | 2016-05-04 | 中山优盛光电科技有限公司 | Efficient high-power semiconductor laser coupling packaging assembly |
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| GR01 | Patent grant |