CN205491148U - Thin film loudspeaker - Google Patents
Thin film loudspeaker Download PDFInfo
- Publication number
- CN205491148U CN205491148U CN201620004457.4U CN201620004457U CN205491148U CN 205491148 U CN205491148 U CN 205491148U CN 201620004457 U CN201620004457 U CN 201620004457U CN 205491148 U CN205491148 U CN 205491148U
- Authority
- CN
- China
- Prior art keywords
- wafer speaker
- utility
- model
- base plate
- membrane layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Audible-Bandwidth Dynamoelectric Transducers Other Than Pickups (AREA)
Abstract
The utility model discloses a thin film loudspeaker belongs to speaker technical field, including the base plate be provided with conduction film layer in the one side of base plate the opposite side equipartition of base plate is provided with the powerful permanent magnet ball of several, the last conductive terminal who is used for connecting signal processor and audio processor that still is provided with of conduction film layer. Compared with the prior art, the utility model has the advantages of flexible formula large tracts of land, light, thin, can also according to actual need cutting (only need reset electrically conductive cross -talk can) wantonly, satisfying the needs under the multiple condition, preparation technology is simple, and the controllability is strong, and sound effect is good, simple fashion, and convenient and practical can bring very big economic benefits.
Description
Technical field
This utility model belongs to loudspeaker techniques field, particularly relates to a kind of wafer speaker.
Background technology
Traditional loadspeaker structure is conical structure, and the structure of pyramid type speaker is divided into and has the vertebral body of vibrating reed and a cavity body structure empathized, but traditional loadspeaker structure
Have that weight is big and the problem such as volume is big, transport and install cumbersome, be increasingly not suitable for the life requirement that the fashion of Modern citizen is brisk.The problems referred to above, it would be highly desirable to solve.
Summary of the invention
This utility model is for deficiency of the prior art, it is provided that a kind of wafer speaker, this wafer speaker has bendable large area, light, thin advantage, additionally it is possible to the most arbitrarily cut.
In order to solve above-mentioned technical problem, this utility model is addressed by following technical proposals: wafer speaker, including substrate, the one side of described substrate is provided with conductive membrane layer, opposite side at described substrate is uniform is provided with several strength permanent magnet ball, and described conductive membrane layer is additionally provided with the conducting terminal for connecting signal processor and audio process.
In order to obtain superior technique effect, further technological improvement is, described substrate is bendable sheet material.
In order to obtain superior technique effect, further technological improvement is, described substrate is high molecular polymer insulation board.
In order to obtain superior technique effect, further technological improvement is, described high molecular polymer insulation board is by made by PT or PET or PI.
In order to obtain superior technique effect, further technological improvement is, described conductive membrane layer is the coil that spiral is square.
In order to obtain superior technique effect, further technological improvement is, described conductive membrane layer is aluminium foil or single gold Copper thin film.
In order to obtain superior technique effect, further technological improvement is, described strength permanent magnet ball is ndfeb magnet ball.
The beneficial effects of the utility model are: utilize three-dimensional printing technology mode to prepare this wafer speaker, suitably some key process parameters in control synthesis technique can obtain at sound all frequency range and significantly promote, and technical process has the highest repeatability；This wafer speaker also has bendable large area, light, thin advantage, can also the most arbitrarily cut (only need to reset conducting terminal), meet multiple in the case of needs, preparation technology is simple, controllability is strong, and sounding effect is good, simple fashion, convenient and practical, the biggest economic benefit can be brought.
Accompanying drawing explanation
Fig. 1 is front schematic view of the present utility model.
Fig. 2 is the generalized section in Fig. 1 along A-A.
Fig. 3 is schematic rear view of the present utility model.
Detailed description of the invention
With detailed description of the invention, this utility model is described in further detail below in conjunction with the accompanying drawings.
Embodiment: see shown in Fig. 1 to Fig. 3, a kind of specific embodiment of this utility model wafer speaker.Wafer speaker, including substrate 1, described substrate 1 is bendable high molecular polymer insulation board, the one side of described substrate 1 is provided with a square conductive membrane layer of circle spiral 2, this conductive membrane layer 2 aluminium foil layer or single gold Copper thin film, opposite side at described substrate 1 is uniform is provided with several strength permanent magnet ball 3, it is ndfeb magnet ball, ndfeb magnet ball is arranged in substrate 1 by geometrical rule, the diameter of ball is between 1 millimeter to 5 millimeter, the conducting terminal 4 for connecting signal processor and audio process it is additionally provided with on described conductive membrane layer 2, this conducting terminal 4 is one or two.
As preferably, described substrate can be made up of the heat proof material such as PT or PET or PI.
External signal processor and audio process is connected by conducting terminal, when starting to provide audio signal to this wafer speaker, electric charge is transferred to the spiral square conductive metal of this wafer speaker and belongs to layer, metal film layer can be allowed electrically charged, the metal film layer allowing centre produces vibration, and then air compression is sent sound.
Utilizing three-dimensional printing technology mode to prepare this wafer speaker, suitably some key process parameters in control synthesis technique can obtain at sound all frequency range and significantly promote, and technical process has the highest repeatability；This wafer speaker also has bendable large area, light, thin advantage, can also the most arbitrarily cut (only need to reset conducting terminal), meet multiple in the case of needs, preparation technology is simple, controllability is strong, and sounding effect is good, simple fashion, convenient and practical, the biggest economic benefit can be brought.
In technique scheme, described wafer speaker can be applicable on cell-phone cover, wallpaper, photo frame, plate mat, mural painting or decorative lampshade product.
In technique scheme, described wafer speaker can be applicable to poster, slogan banner or other display advertising.
In technique scheme, described wafer speaker can be applicable to earphone, mobile phone, computer, accutron
Or on electronic glasses.
Listed above is only specific embodiment of the utility model, it is clear that this utility model is not limited to above embodiment.All deformation that those of ordinary skill in the art can directly derive from this utility model disclosure or associate, all should belong to protection domain of the present utility model.
Claims (7)
1. wafer speaker, it is characterized in that: include substrate (1), the one side of described substrate (1) is provided with conductive membrane layer (2), opposite side at described substrate (1) is uniform is provided with several strength permanent magnet ball (3), and described conductive membrane layer (2) is additionally provided with the conducting terminal (4) for connecting signal processor and audio process.
Wafer speaker the most according to claim 1, it is characterised in that: described substrate (1) is bendable sheet material.
Wafer speaker the most according to claim 1 and 2, it is characterised in that: described substrate (1) is high molecular polymer insulation board.
Wafer speaker the most according to claim 3, it is characterised in that: described high molecular polymer insulation board is by made by PT or PET or PI.
Wafer speaker the most according to claim 1, it is characterised in that: described conductive membrane layer (2) is the coil that spiral is square.
Wafer speaker the most according to claim 1 or 5, it is characterised in that: described conductive membrane layer (2) is aluminium foil or single gold Copper thin film.
Wafer speaker the most according to claim 1, it is characterised in that: described strength permanent magnet ball is ndfeb magnet ball.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620004457.4U CN205491148U (en) | 2016-01-06 | 2016-01-06 | Thin film loudspeaker |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620004457.4U CN205491148U (en) | 2016-01-06 | 2016-01-06 | Thin film loudspeaker |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205491148U true CN205491148U (en) | 2016-08-17 |
Family
ID=56663909
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620004457.4U Expired - Fee Related CN205491148U (en) | 2016-01-06 | 2016-01-06 | Thin film loudspeaker |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205491148U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106454659A (en) * | 2016-10-31 | 2017-02-22 | 歌尔股份有限公司 | Sound production apparatus and manufacturing method thereof |
| CN106837122A (en) * | 2017-03-17 | 2017-06-13 | 宁波工程学院 | Shutter with wafer speaker structure |
| CN108566607A (en) * | 2018-06-26 | 2018-09-21 | 努比亚技术有限公司 | Flexible loud speaker and terminal |
-
2016
- 2016-01-06 CN CN201620004457.4U patent/CN205491148U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106454659A (en) * | 2016-10-31 | 2017-02-22 | 歌尔股份有限公司 | Sound production apparatus and manufacturing method thereof |
| CN106837122A (en) * | 2017-03-17 | 2017-06-13 | 宁波工程学院 | Shutter with wafer speaker structure |
| CN106837122B (en) * | 2017-03-17 | 2020-02-07 | 宁波工程学院 | Shutter with film loudspeaker structure |
| CN108566607A (en) * | 2018-06-26 | 2018-09-21 | 努比亚技术有限公司 | Flexible loud speaker and terminal |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160817 Termination date: 20180106 |