CN205488774U - Solder joint prevent condensation structure - Google Patents
Solder joint prevent condensation structure Download PDFInfo
- Publication number
- CN205488774U CN205488774U CN201620310576.2U CN201620310576U CN205488774U CN 205488774 U CN205488774 U CN 205488774U CN 201620310576 U CN201620310576 U CN 201620310576U CN 205488774 U CN205488774 U CN 205488774U
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- China
- Prior art keywords
- adhesive layer
- solder joint
- close adhesive
- soft attitude
- waterproof spacer
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Abstract
The utility model relates to a prevent the condensation structure, especially relate to a solder joint prevent condensation structure, including the close adhesive layer of soft attitude, waterproof spacer, the close adhesive layer of hard state, the close adhesive layer cladding of soft attitude is equipped with waterproof spacer in solder joint department outside the close adhesive layer of soft attitude, soft attitude close adhesive layer pack in waterproof spacer, waterproof spacer is equipped with the close adhesive layer of hard state outward, and the close adhesive layer of hard state is fixed with waterproof spacer. The utility model discloses a solder joint department is with the close adhesive layer cladding of soft attitude to guarantee that solder joint department is free state, be used for reducing the destruction of junction stress to the close adhesive layer of soft attitude, through wrap up the close adhesive layer of soft attitude with waterproof spacer for the protection solder joint guarantees that the close adhesive layer's of soft attitude is fully filling, through fixed at the close adhesive layer of waterproof spacer external application hard state for the removal of guaranteeing outside accessory does not exert an influence to the close adhesive layer of soft attitude, thereby plays the fine condensation effect of preventing, and the use of instrument is safer, the life -span is longer.
Description
Technical field
This utility model relates to anti-dewfall structure, particularly relates to the anti-dewfall structure of a kind of solder joint.
Background technology
At the control switch wire connection solder joint of gauge internal, at signal output solder joint etc. at solder joint, usually because solidifying
Dew or the poor sealing of instrument and produce water droplet, ultimately result in insulation breakdown, even cause output contact short
Road.
In prior art, generally it is provided with heater and ventilation installation in instrument or in instrument installation control chamber, makes
Obtaining the temperature in thermometer and be higher than external temperature, such moisture would not condense in thermometer.But it is such
Design energy consumption is big, and is all electronic device, is easily damaged.
Summary of the invention
In order to solve the problems referred to above, this utility model provides the anti-dewfall structure of a kind of solder joint.
Technical solutions of the utility model are: the anti-dewfall structure of a kind of solder joint, including soft state sealant layer, waterproof
Spacer, hard state sealant layer, described soft state sealant layer is coated at solder joint, is externally provided with at soft state sealant layer
Waterproof spacer, soft state sealant layer is filled in waterproof spacer, and described waterproof spacer is externally provided with hard state sealant layer,
Waterproof spacer is fixed by hard state sealant layer.
Further, the drainage arranged near solder joint is also included.
The beneficial effects of the utility model are:
By being coated with soft state sealant layer at solder joint, and ensure in free state at solder joint, in order to reduce connection
Place's stress destruction to soft state sealant layer；By wrapping up soft state sealant layer, in order to protect weldering with waterproof spacer
Put and ensure being filled up completely with of soft state sealant layer；By fixing at waterproof spacer external hard state sealant layer, use
Soft state sealant layer is not produced impact with the movement of the accessory outside guarantee, thus play good anti-condensation effect
Really, and the use of instrument is safer, and the life-span is longer.
Accompanying drawing explanation
With detailed description of the invention, this utility model is described in further detail below in conjunction with the accompanying drawings.
Fig. 1 is this utility model overall structure schematic diagram.
Detailed description of the invention
Below in conjunction with accompanying drawing, the technical solution of the utility model is further described, but this utility model is also
It is not limited to these embodiments.
In conjunction with accompanying drawing 1, the anti-dewfall structure of a kind of solder joint, including soft state sealant layer 1, waterproof spacer 2, hard
State sealant layer 3, described soft state sealant layer 1 is coated at solder joint, is externally provided with anti-at soft state sealant layer 1
Water spacer 2, soft state sealant layer 1 is filled in waterproof spacer 2, and it is close that described waterproof spacer 2 is externally provided with hard state
Adhesive layer 3, waterproof spacer 2 is fixed by hard state sealant layer 3, is provided with drainage 4 at solder joint.
Owing to connector volume is relatively big and is fixed on housing at the signal output solder joint of instrument, therefore use this reality
With novel carry out anti-condensation.Connector is located at the bottom of instrument housing, by switch leads connecting valve, grafting
Part is provided with solder joint at the electrical nodes of switch leads.At solder joint, it is coated with soft state sealant layer 1, and ensures grafting
Part is free state with the junction of switch leads；It is externally provided with waterproof spacer 2, protection at soft state sealant layer 1
Solder joint, it is ensured that being fully connected of soft state sealant layer 1, reduces junction stress to soft state fluid sealant simultaneously
The destruction of layer；It is externally provided with hard state sealant layer 3 at waterproof spacer 2 to seal, with the movement of the accessory outside guarantee
Soft state sealant layer 1 not being produced impact, it is ensured that the location of plug connector contact pin, what the most also raising sealed can
By property.Drainage 4 is for discharging the condensed water of gauge internal.
Multi-layer sealed protection is favourable and improves sealing reliability and life-span.
Specific embodiment described herein is only to this utility model spirit explanation for example.This practicality is new
Described specific embodiment can be made various amendment or benefit by type person of ordinary skill in the field
Fill or use similar mode to substitute, but without departing from spirit of the present utility model or surmount appended right and want
Seek scope defined in book.
Claims (2)
1. the anti-dewfall structure of a solder joint, it is characterised in that: include soft state sealant layer, waterproof spacer, hard state
Sealant layer, described soft state sealant layer is coated at solder joint, soft state sealant layer be externally provided with waterproof every
Set, soft state sealant layer is filled in waterproof spacer, and described waterproof spacer is externally provided with hard state sealant layer,
Waterproof spacer is fixed by hard state sealant layer.
The anti-dewfall structure of solder joint the most according to claim 1, it is characterised in that: also include setting near solder joint
The drainage put.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620310576.2U CN205488774U (en) | 2016-04-14 | 2016-04-14 | Solder joint prevent condensation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620310576.2U CN205488774U (en) | 2016-04-14 | 2016-04-14 | Solder joint prevent condensation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205488774U true CN205488774U (en) | 2016-08-17 |
Family
ID=56640448
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620310576.2U Active CN205488774U (en) | 2016-04-14 | 2016-04-14 | Solder joint prevent condensation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205488774U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112122084A (en) * | 2019-12-30 | 2020-12-25 | 中航百慕新材料技术工程股份有限公司 | Protection method of bolt for bridge and anti-corrosion bolt assembly |
-
2016
- 2016-04-14 CN CN201620310576.2U patent/CN205488774U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112122084A (en) * | 2019-12-30 | 2020-12-25 | 中航百慕新材料技术工程股份有限公司 | Protection method of bolt for bridge and anti-corrosion bolt assembly |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |