CN205483267U - Improve industrial field thermal imaging system temperature measurement's device - Google Patents
Improve industrial field thermal imaging system temperature measurement's device Download PDFInfo
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- CN205483267U CN205483267U CN201620280398.3U CN201620280398U CN205483267U CN 205483267 U CN205483267 U CN 205483267U CN 201620280398 U CN201620280398 U CN 201620280398U CN 205483267 U CN205483267 U CN 205483267U
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- imaging system
- thermal imaging
- platinum resistance
- temperature
- heat conduction
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Abstract
The utility model discloses an improve industrial field thermal imaging system temperature measurement's device. Divide into the top layer and the bottom is two -layer, and the bottom is the SMD temperature sensor who is mainly made by the heat conduction aluminum sheet that inlays the platinum resistance, the top layer be on the bottom evenly spray coating, the heat conduction aluminum sheet is ring shape, and it has four logical grooves to open along outer circumference interval equipartition ground on the heat conduction aluminum sheet, and platinum resistance, four external temperature instrument of platinum resistance both ends outconnector are all installed to every logical groove. The utility model discloses can through measuring different temperatures within range testee slin emissivity, realize on -the -spot object surface infrared temperature's measurement for industrial field provides portable thermal imaging system error of indication calibrating device to improve the accuracy of industrial field thermal imaging system temperature measurement.
Description
Technical field
This utility model relate to a kind of device improving thermal imaging system temperature measurement accuracy, has been specifically related to one and has carried
The device of high industry spot thermal imaging system temperature measurement accuracy.
Background technology
Need it is carried out indicating value according to before in industrial detection type thermal imaging system operating specification, regulation thermal imaging system uses every time
Calibration.In thermal imaging system calibrating standard (JJF1187-2008), generally use platinum resistance thermometer, thermoelectricity occasionally
Radiation thermometer measures black body radiation source temperature as standard.Owing to need to take at industry spot calibration thermal imaging system
Band plurality of devices, such as standard, blackbody radiation source etc., is difficult to operation and equipment performance is had infringement.
Body surface heat radiation can be converted into visual picture by thermal imaging system, and by emissivity, reflectance
It is modified with factors such as absorbancies, accurate Measuring Object surface temperature and surface temperature distribution.General industry
Detection type thermal imaging system has debugging functions, including the emissivity of object materials.Due to sending out of object materials
The factors such as rate and material character and apparent condition, especially surface temperature of penetrating are relevant, and actual field measures difficulty
Big and metal material emissivity is the lowest.At present, what Wang Zeyao etc. proposed is applicable to measure field body surface
Emissivity method (a kind of surface emissivity field calibration method, Chinese utility model patent publication number
104006887A, August 27 2014 publication date) it is easy to carry, but the method uses calibration target
Surface temperature replaces testee surface true temperature, and then obtains testee slin emissivity；Due to heat
There is thermal losses in conduction, there is error in two kinds of temperature, so the slin emissivity recorded and infrared temperature
It is inaccurate.
Utility model content
In order to improve the degree of accuracy of industry spot infrared measurement of temperature, and solve problem present in background technology, this
Utility model proposes a kind of device improving industry spot thermal imaging system temperature measurement accuracy.Specifically according to thermal imaging system
Calibrating standard (JJF1187-2008), device, as radioactive calibration source, is utilized respectively platinum resistance and thermal imaging system obtains
Obtain device coating surface Contact Temperature and read temperature, calculate the error of indication and realize thermal imaging system field calibration；
Based on infrared temperature-test technology principle, the platinum resistance in device as standard component Measuring Object surface Contact Temperature,
Coordinate calibrated thermal imaging system to obtain the infrared radiation temperature on testee surface, by being calculated not simultaneously
With the emissivity on testee surface under surface temperature, regulation thermal imaging system emissivity is testee surface emitting
Rate carries out body surface temperature survey, thus it is thermometric under different industrial environments to improve IR thermometry
Accuracy.
For solving above technical problem, this utility model is achieved through the following technical solutions:
This utility model is divided into top layer and bottom two-layer, and bottom is main by the heat conduction aluminium flake system being embedded with platinum resistance
The SMD temperature sensor become, top layer is the coating that even application a layer thickness is less than 50 μm on bottom,
Coating is coated in heat conduction aluminium flake and the surface of part platinum resistance, thus is fabricated to thermal imaging system calibration and fills with emissivity
Put.
Contact temperature-measuring element is A level film platinum resistor, and its precision is ± (0.15+0.002 | T |).
The emissivity of coatings used is known and is more than 0.95, and emissivity of coatings varies with temperature amplitude ± 5%.
Described heat conduction aluminium flake is annular, is round center hole in the middle of annular, and heat conduction aluminium flake edge is along circle
Weekly interval has four in uniform way and is mounted on platinum resistance, often for the groove placing platinum resistance, each groove
The two ends of individual platinum resistance are drawn through connecting line external temperature instrument.
Described platinum resistance divides two sides, film surface and ceramic surface, and film surface is measuring surface, four platinum
Resistance with wherein symmetrical two be a component be two groups, the installed surface of two groups of platinum resistance is in opposite direction, wherein
The film surface of two symmetrical platinum resistance contacts with on-the-spot object under test surface, the most symmetrical two
The film surface of platinum resistance is towards the side of heat conduction aluminium flake and is coated with coating.
Described coating spraying in the side of SMD temperature sensor, the opposite side of SMD temperature sensor
It is close to industry spot testee surface by heat-proof silica gel.
Also including thermometric instrument and the thermal imaging system towards industry spot testee surface, platinum resistance is connected to temperature
Degree instrument carries out temperature and shows.
Described heat conduction aluminium flake is identical with the thickness of platinum resistance.
The whole thickness of device is the thickness thickness plus coating of aluminium flake, and gross thickness is less than 0.45mm.
This utility model has the beneficial effect that
This utility model can carry out error of indication calibration to industry spot to thermal imaging system, by obtaining on-the-spot quilt
Survey surface emissivity and improve the precision of testee surface infrared measurement of temperature, there is easy to carry, operation letter
Single, precision relatively advantages of higher, has certain universality.
Device described in the utility model makes the testee surface at scene with device at same background same plane,
Make environmental factors identical with the impact of device on thermometric body surface with system noise.
This utility model can measure object in the range of different temperatures in industry spot by calibration thermal imaging system
Slin emissivity, obtains relatively accurate infrared temperature, thus improves infrared measurement of temperature precision.
Accompanying drawing explanation
Fig. 1 is the fabric front view of this utility model device；
Fig. 2 is the front schematic view of this utility model device；
Fig. 3 is the use schematic diagram that this utility model device is complete.
In figure: 1, heat conduction aluminium flake；2, groove；3, round center hole；7, platinum resistance；8, connecting line；
9, coating；10, device；11, thermal imaging system；12, testee surface；14, temperature secondary meter.
Detailed description of the invention
With examples of implementation, this utility model is further described below in conjunction with the accompanying drawings.
As it is shown in figure 1, this utility model device 10 is divided into top layer and bottom two-layer, mainly by being embedded with thin film platinum
The SMD temperature sensor that the heat conduction aluminium flake 1 of resistance 7 is made is as bottom, heat conduction aluminium flake 1 and platinum resistance 7
Thickness identical, on bottom even application a layer thickness less than the coating 9 of 50 μm as top layer, such as Fig. 2
Shown in, coating does not cover No. I and No. III two platinum resistance 7, thus is fabricated to thermal imaging system calibration and emissivity
Device.
This utility model also includes thermometric instrument 14 and the thermal imaging system towards industry spot testee surface 12
11, platinum resistance 7 is connected to thermometric instrument and carries out temperature and show.
Heat conduction aluminium flake 1 is annular, heat conduction aluminium flake 1 has four along excircle for putting uniformly at intervals
Putting the groove 2 of platinum resistance 7, each groove 2 is mounted on the chi of platinum resistance 7, groove size and platinum resistance 7
Very little identical, four platinum resistance 7 two ends outconnector 8 external temperature instrument are used for showing contact type measurement temperature
Degree.7 points of two sides of platinum resistance, film surface and ceramic surface, film surface is measuring surface.Platinum resistance 7 is installed
Time, No. II and IV platinum resistance film surface and coating layer touch, as in figure 2 it is shown, measure Coated Surface Temperature；
No. I contacts with on-the-spot object under test surface with III platinum resistance, measures object under test surface temperature.
As it is shown in figure 1, coating 9 is sprayed at the side of SMD temperature sensor, SMD temperature sensor
Opposite side be close to industry spot testee surface by heat-proof silica gel.The emissivity of coatings used is known
And more than 0.95, emissivity of coatings varies with temperature amplitude ± 5%.
The whole thickness of this utility model device is the thickness thickness plus coating of aluminium flake, and gross thickness is less than
0.45mm。
Specific embodiment of the utility model and implementation process thereof are as follows:
First, use laser cutting technique, complete the making of SMD temperature sensor according to design drawing,
Outward appearance is diameter 2cm, and internal diameter is the annular aluminium flake of 1cm, opens 4 2.2mm along excircle on aluminium flake
The groove of × 2.7mm is used for placing film platinum resistor, the thickness phase of the thickness of film platinum resistor and heat conduction aluminium flake
With, the long 2.5mm of film platinum resistor and wide 2.0mm, in enforcement, the temperature-measuring range of platinum resistance exists
-50 DEG C～400 DEG C, temperature measurement error is ± (0.15+0.002 | T |).
By the connecting line external temperature instrument at four platinum resistance two ends, to be done after at substrate surface even application
A layer thickness, less than the coating of 50 μm, is fabricated to thermal imaging system calibration and emissivity device, and the whole thickness of device is little
In 0.45mm.
When using described device 10, connecting line 8 two ends of device 10 are connected with thermometric instrument 14 and beat
Open.Then heat-proof silica gel is applied in device 10 non-sprayed coating side, and it is closely affixed on on-the-spot tested
Body surface 12.
During industry spot calibration thermal imaging system 11, device 10 is as radioactive calibration source, by the transmitting of thermal imaging system 11
Rate is adjusted to known coating 9 emissivity of coatings alignment device coating 9, it is thus achieved that on device 10 face coat 9
Read temperature, the simultaneously platinum resistance 7 of seal coat on device 10, measure coating 9 surface for No. I and No. IV and connect
Touch temperature.According to thermal imaging system calibrating standard (JJF1187-2008), it is thus achieved that go out the error of indication；
Use calibrated thermal imaging system 11, the emissivity of thermal imaging system 11 is adjusted to 1, the circle of alignment lens device
In shape centre bore 3, it is thus achieved that the infrared radiation temperature of testee surface 11；Meanwhile, No. I and III platinum resistance
Measure and obtain body surface Contact Temperature；Use indoor temperature meter that ambient temperature is measured, it is thus achieved that environment
Temperature.Utilize ambient temperature, body surface radiation temperature and body surface Contact Temperature that above-mentioned steps obtains
It is calculated testee slin emissivity.
By obtaining the emissivity on on-the-spot testee surface, regulation thermal imaging system 11 emissivity can be aligned
True infrared temperature, can be used directly calibrated thermal imaging system in follow-up temperature survey and obtains surface temperature.
Embodiment is as follows:
This utility model use Fluke Ti25 thermal imaging system and digital display heated at constant temperature platform are as subjects, between pair
Carry out error of indication calibration every a period of time untapped Fluke Ti25 thermal imaging system, and measure heated at constant temperature platform
Surface emissivity in the range of different temperatures.The coated coating that this utility model uses is that guarantor's gift profit is high temperature resistant
Auto spray painting, model is B-1939, and emissivity is 0.97, colors black, and heatproof 550 DEG C has rapid-drying properties
With good density.
Fluke Ti25 thermal imaging system, temperature-measuring range-20 DEG C-350 DEG C, accuracy ± 2%, there is emittance correction merit
Can, heat sensitivity is less than 0.1 DEG C.
Digital display heated at constant temperature platform temperature can be automatically adjusted temperature in 0 DEG C-400 DEG C, and its control mode is intelligence
Temp controlled meter adds fast reaction solid-state system, uses ambient temperature in-15 DEG C-60 DEG C, uses ambient humidity to exist
In 50-85%RH, temperature-controlled precision ± 0.8 DEG C, platform size 400mm*300mm*20mm, plant capacity
800W；Heated at constant temperature platform surface is polishing smooth aluminum prepared material, and its emissivity is extremely low, less than 0.2.
Field calibration Fluke Ti25 thermal imaging system 11, is placed in a temperature measurement mode by thermal imaging system, and emissivity is adjusted
Being 0.97, the current range of thermal imaging system is at 30 DEG C-150 DEG C, and selecting calibration temperature spot is 30 DEG C, 75 DEG C and 150 DEG C.
Device 10 is close to heated at constant temperature platform surface 12, and is connected with thermometric instrument 14.In each calibration temperature
Point, carries out measuring no less than 4 times.During measurement, record platinum resistance 7 measure coating surface Contact Temperature value and
By school thermal imaging system indicating value.Contact Temperature value tc5For: 30.1 DEG C, 30.0 DEG C, 30.1 DEG C, 30.2 DEG C, 30.1 DEG C；
75.1℃、75.2℃、75.0℃、74.9℃、74.9℃；150.2℃、150.0℃、149.9℃、149.9℃、
150.1℃；By school thermal imaging system indicating value tr5For: 31.4 DEG C, 31.2 DEG C, 31.2 DEG C, 31.3 DEG C, 31.3 DEG C；76.5℃、
76.4℃、76.5℃、76.4℃、76.3℃；149.6℃、149.7℃、149.6℃、149.6℃、149.7℃；
Respectively calculating meansigma methods is: tc=30.1 DEG C, 75.02 DEG C, 150.02 DEG C；tr=31.28 DEG C, 76.42 DEG C,
149.64℃；Therefore, at three by school temperature spot, the error of indication of thermal imaging system be respectively 1.18 DEG C, 1.4 DEG C,
-0.38℃。
In-site measurement heated at constant temperature platform surface emissivity in the range of different temperatures, 30 DEG C-90 DEG C,
90 DEG C of-150 DEG C of two temperature ranges choose 2 temperature spots 60 DEG C and 120 DEG C as emissivity measurement point.Will dress
Put 10 and be close to heated at constant temperature platform surface 12, and be connected with thermometric instrument 14, set heated at constant temperature platform temperature
Degree is successively respectively 60 DEG C and 120 DEG C.Use calibrated FLUKE Ti25 thermal imaging system 11 that locating tab assembly is filled
Put heated at constant temperature platform surface in round center hole 3, it is thus achieved that heated at constant temperature platform surface infrared radiation temperature t 'r5For
48.8 DEG C, 49.1 DEG C, 48.9 DEG C, 49.1 DEG C, 49.0 DEG C；87.3℃、87.4℃、87.2℃、87.1℃、87.3℃；
And obtain platinum resistance 7 measure heated at constant temperature platform surface Contact Temperature to5Be 61.5 DEG C, 61.4 DEG C, 61.6 DEG C,
61.4℃、61.3℃；118.6℃、118.7℃、118.5℃、118.8℃、118.6℃；Respectively calculate average
Value is t 'r=48.98 DEG C, 87.26 DEG C；to=61.44 DEG C, 118.64 DEG C.Indoor temperature meter is used to record environment temperature
Degree tuIt is 14.3 DEG C, and then obtains heated at constant temperature platform surface emissivity in the range of different temperatures.
The emissivity of regulation thermal imaging system is respectively 0.2984 and 0.1945, measures heated at constant temperature platform surface temperature
It is respectively 58.37 and 114.23.
Above-mentioned detailed description of the invention is used for illustrating this utility model rather than limiting this utility model
System, in spirit of the present utility model and scope of the claims, that makes this utility model is any
Modifications and changes, both fall within protection domain of the present utility model.
Claims (6)
1. the device improving industry spot thermal imaging system temperature measurement accuracy, it is characterised in that: it is divided into top layer and the end
Layer two-layer, bottom is that the SMD temperature being mainly made up of the heat conduction aluminium flake (1) being embedded with platinum resistance (7) passes
Sensor, top layer is that even application a layer thickness is coated with less than the coating (9) of 50 μm, coating (9) on bottom
Overlay on heat conduction aluminium flake (1) and the surface of part platinum resistance (7).
A kind of device improving industry spot thermal imaging system temperature measurement accuracy the most according to claim 1, it is special
Levy and be: described heat conduction aluminium flake (1) is annular, and heat conduction aluminium flake (1) edge is the most uniformly at intervals
Have four and be mounted on platinum resistance for the groove (2) placing platinum resistance (7), each groove (2)
(7), the two ends of each platinum resistance (7) are drawn through connecting line (8) external temperature instrument.
A kind of device improving industry spot thermal imaging system temperature measurement accuracy the most according to claim 1 and 2,
It is characterized in that: the film surface of two platinum resistance (7) that described platinum resistance (7) is the most symmetrical with
The contact of on-the-spot object under test surface, the film surface of two the most symmetrical platinum resistance (7) is towards heat conduction aluminum
The side of sheet (1) is also coated with coating (9).
A kind of device improving industry spot thermal imaging system temperature measurement accuracy the most according to claim 1, it is special
Levy and be: described coating (9) emissivity of coatings is known and the amplitude that varies with temperature is ± 5%, is sprayed
In the side of SMD temperature sensor, the opposite side of SMD temperature sensor is close to by heat-proof silica gel
Industry spot testee surface (12).
A kind of device improving industry spot thermal imaging system temperature measurement accuracy the most according to claim 4, it is special
Levy and be: also include thermometric instrument (14) and the thermal imaging system towards industry spot testee surface (12)
(11), four platinum resistance (7) two ends are connected respectively to thermometric instrument (14) and carry out temperature and show.
A kind of device improving industry spot thermal imaging system temperature measurement accuracy the most according to claim 1, it is special
Levy and be: described heat conduction aluminium flake (1) is identical with the thickness of platinum resistance (7).
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105716723A (en) * | 2016-04-05 | 2016-06-29 | 中国计量学院 | Device and method for improving temperature measuring precision of industrial site thermal imager |
| CN106353361A (en) * | 2016-09-29 | 2017-01-25 | 哈尔滨工业大学 | Method for testing laser absorptivity of material with coating layer |
-
2016
- 2016-04-05 CN CN201620280398.3U patent/CN205483267U/en not_active Withdrawn - After Issue
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105716723A (en) * | 2016-04-05 | 2016-06-29 | 中国计量学院 | Device and method for improving temperature measuring precision of industrial site thermal imager |
| CN105716723B (en) * | 2016-04-05 | 2018-08-07 | 中国计量学院 | Improve the apparatus and method of industry spot thermal imaging system temperature measurement accuracy |
| CN106353361A (en) * | 2016-09-29 | 2017-01-25 | 哈尔滨工业大学 | Method for testing laser absorptivity of material with coating layer |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20160817 Effective date of abandoning: 20180807 |
|
| AV01 | Patent right actively abandoned |