CN205474042U - Vertical continuous electroplating device - Google Patents
Vertical continuous electroplating device Download PDFInfo
- Publication number
- CN205474042U CN205474042U CN201620045598.0U CN201620045598U CN205474042U CN 205474042 U CN205474042 U CN 205474042U CN 201620045598 U CN201620045598 U CN 201620045598U CN 205474042 U CN205474042 U CN 205474042U
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- guide plate
- electroplating device
- vertical continuous
- continuous electroplating
- vertical
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Abstract
The utility model discloses a vertical continuous electroplating device, include: locating being used for in the plating bath and carrying out the baffle protected in circuit board both sides, the baffle is equipped with two -layerly at least in vertical direction, a adjustment Assembly for adjusting the baffle is in the ascending interval of vertical side. Adjustment Assembly can adjust the interval between the baffle among this kind of vertical continuous electroplating device, through this kind of regulation, can make the baffle can protect the whole face of each high circuit board, and the selectivity of minimum height, maximum height and the altitude range of the circuit board that can be suitable for is great, has improved vertical continuous electroplating device's suitability, and then has improved the functioning speed of circuit board in the plating bath.
Description
Technical field
This utility model relates to electroplating device field, sets particularly to a kind of vertical continuous plating
Standby.
Background technology
In electroplating technology, vertical continuous plating obtains wide because it has stable plating usefulness
General application.
In existing vertical continuous electroplating device, fixture has for preventing circuit board from bending
Guide plate, guide plate in the vertical direction at least two-layer, every layer of guide plate include two be oppositely arranged lead
Plate, the upside fixture of circuit board clamps, and downside is inserted between every layer of relative two guide plate.
Wherein, on vertical direction, the guide plate of different layers connects as one the fixing module of formula by vertical rod,
In fixing module, the spacing between bottom guide plate and top guide plate is to fix the height of module.
Owing to the height of fixing module is fixed, then for the biggest circuit board, have one
Plate face is divided not protected by guide plate, when the circuit board such as FPC soft board that electroplating thickness is relatively thin, for
Ensureing electroplating quality, the minimum constructive height of the FPC soft board that fixing module can be suitable for is not less than fixing
The height of module, and minimum constructive height is not less than 1/2nd of maximum height.Specifically, at present
The FPC soft board altitude range that can electroplate is 230mm to 400mm, limits and can electroplate
Altitude range；Meanwhile, when FPC soft board runs in coating bath, in order to prevent circuit board surface
Electroplating uneven or circuit board curling, the speed of service is typically smaller than 0.5 m/min, has a strong impact on
The electroplating quality of circuit board and electroplating efficiency.
Therefore, how to improve the suitability of vertical continuous electroplating device, be those skilled in the art
It is presently required and solves the technical problem that.
Utility model content
In view of this, the purpose of this utility model is to provide core of the present utility model and is to provide one
Planting vertical continuous electroplating device, the suitability of this equipment is preferable.
For achieving the above object, the following technical scheme of this utility model offer:
A kind of vertical continuous electroplating device, including:
Be located in electroplating bath for the guide plate carrying out protecting in circuit board both sides, described guide plate exists
Vertical direction is provided with at least two-layer；
For regulating the regulation parts of the spacing of described guide plate in the vertical direction.
Preferably, guide plate described in the superiors is fixedly connected on described electroplating bath.
Preferably, described regulation parts include connector and be connected to the scaffold of elevator, under
The described guide plate of layer is located on the upside of described scaffold, drives and be positioned at described in the superiors when described scaffold moves
Described guide plate on the downside of guide plate moves, and the length-adjustable described connector of in the vertical direction is located at
Described in adjacent layer between guide plate.
Preferably, being fixed with vertical guide post in described electroplating bath, described guide post is provided with
The guide plate fixture being connected is fixed respectively, guide plate fixture described in the superiors with a described guide plate
It is fixedly connected on described guide post, is positioned at the described guide plate on the downside of guide plate fixture described in the superiors
Fixture is socketed on described guide post slidably, and the two ends of described connector are connected to phase
Guide plate fixture described in adjacent bed.
Preferably, described in orlop, guide plate fixture is fixedly connected on described scaffold.
Preferably, described connector is flexible-belt.
Preferably, described flexible-belt is PP band.
Preferably, described flexible-belt and the junction point of described guide plate fixture are on described flexible-belt
It is uniformly distributed.
Preferably, described guide plate fixture is that side sets reeded flat board, and described guide plate is fixed
It is plugged in described groove.
Preferably, described guide post is cylindrical bar.
This utility model provide vertical continuous electroplating device in, regulation parts can to guide plate it
Between vertical spacing be adjusted, by this kind of regulation, guide plate can be enable to protect each high
The whole plate face of the circuit board of degree, then the minimum constructive height of the circuit board can being suitable for, maximum height
And the selectivity of altitude range is relatively big, improves the suitability of vertical continuous electroplating device, enter
And improve the circuit board speed of service in electroplating bath.
Accompanying drawing explanation
In order to be illustrated more clearly that this utility model embodiment or technical scheme of the prior art,
The accompanying drawing used required in embodiment or description of the prior art will be briefly described below,
It should be evident that the accompanying drawing in describing below is only embodiment of the present utility model, for this
From the point of view of the those of ordinary skill of field, on the premise of not paying creative work, it is also possible to according to
The accompanying drawing provided obtains other accompanying drawing.
Fig. 1 is that in prior art, vertical continuous electroplating device is protecting maximum height board state
Under schematic front view；
Fig. 2 is that in prior art, vertical continuous electroplating device is protecting maximum height board state
Under schematic side view；
Fig. 3 is that in prior art, vertical continuous electroplating device is protecting minimum constructive height board state
Under schematic front view；
Fig. 4 is that in prior art, vertical continuous electroplating device is protecting minimum constructive height board state
Under schematic side view.
Fig. 5 is provided vertical continuous electroplating device at protection maximum height circuit by this utility model
Schematic front view under board status；
Fig. 6 is provided vertical continuous electroplating device at protection maximum height circuit by this utility model
Schematic side view under board status；
Fig. 7 is provided vertical continuous electroplating device at protection minimum constructive height circuit by this utility model
Schematic front view under board status；
Fig. 8 is provided vertical continuous electroplating device at protection minimum constructive height circuit by this utility model
Schematic side view under board status.
In Fig. 1 to Fig. 8,1 is electroplating bath, and 2 is guide post, and 3 is scaffold, and 4 is flexible-belt,
5 is guide plate fixture, and 6 is guide plate, and 7 is circuit board, and 8 is elevator.
Detailed description of the invention
Below in conjunction with the accompanying drawing in this utility model embodiment, in this utility model embodiment
Technical scheme be clearly and completely described, it is clear that described embodiment be only this
The a part of embodiment of utility model rather than whole embodiments.Based in this utility model
Embodiment, those of ordinary skill in the art are obtained under not making creative work premise
Every other embodiment, broadly falls into the scope of this utility model protection.
Core of the present utility model is to provide a kind of vertical continuous electroplating device, being suitable for of this equipment
Property is preferable.
Refer to Fig. 1 to Fig. 8, Fig. 1 is that in prior art, vertical continuous electroplating device is being protected
Schematic front view under maximum height board state；Fig. 2 is vertical continuous electricity in prior art
Coating apparatus schematic side view under protection maximum height board state；Fig. 3 is prior art
Middle vertical continuous electroplating device schematic front view under protection minimum constructive height board state；Figure
4 is vertical continuous electroplating device side under protection minimum constructive height board state in prior art
Depending on schematic diagram.Fig. 5 is provided vertical continuous electroplating device maximum high in protection by this utility model
Schematic front view under degree board state；Fig. 6 is provided vertical continuous electricity by this utility model
Coating apparatus schematic side view under protection maximum height board state；Fig. 7 is that this practicality is new
Type provided vertical continuous electroplating device master under protection minimum constructive height board state regards signal
Figure；Fig. 8 is provided vertical continuous electroplating device at protection minimum constructive height circuit by this utility model
Schematic side view under board status.
In a kind of specific embodiment of this utility model provided vertical continuous electroplating device, including
The guide plate 6 being located in electroplating bath 1, generally, guide plate 6 in the vertical direction is provided with at least two-layer,
Every layer of guide plate 6 includes that two guide plates 6, two guide plates 6 are respectively provided at the circuit board 7 of setting
Both sides, after circuit board 7 is placed in electroplating liquid medicine, circuit board 7 can be always positioned at the two of every layer
Between individual guide plate 6 and along laterally running, then circuit board 7 can be protected by guide plate 6,
Crimp during to avoid circuit board 7 to run in electroplating bath 1.In this vertical continuous electroplating device
Also include the regulation parts of spacing for regulating guide plate 6 in the vertical direction, so that guide plate
6 circuit boards 7 going for differing heights.
Visible, by the regulation to guide plate 6 spacing in the present embodiment, can make the guide plate 6 can
Protect the whole plate face of each height circuit board 7, the minimum constructive height of the circuit board 7 that can be suitable for,
The selectivity of maximum height and altitude range is relatively big, improves the suitable of vertical continuous electroplating device
By property, and then improve the circuit board 7 speed of service in electroplating bath 1.It should be noted that
The height of circuit board 7 refers to circuit board 7 setting and is installed on vertical continuous electroplating device herein
Time in the vertical direction length.
In the above-described embodiments, the superiors' guide plate 6 can be fixedly connected on electroplating bath 1.
When regulating the spacing between guide plate 6, can be using the superiors' guide plate 6 as initial point, to going up most
The spacing between guide plate 6 and the superiors' guide plate 6 under layer guide plate 6 is adjusted, in order to right
The plating of circuit board 7.It is of course also possible to be fixed with other layer of guide plate 6 for initial point, Gu
Fixed position is also not necessarily limited to be electroplating bath 1.
Specifically, the regulation parts in above-described embodiment can include being connected to adjacent layer guide plate 6
Between connection member and control connection member power control unit, pass through electric power control portion
The part length adjustment to the vertical direction of connection member, it is achieved between guide plate 6 spacing regulation from
Dynamicization.Certainly, between guide plate 6, the control method of spacing is not limited.
Generally, in existing vertical continuous electroplating device, for ensureing to electroplate bottom circuit board 7
Uniformly, electroplating bath 1 is provided with scaffold 3, and scaffold 3 is connected to vertical continuous electroplating device
Elevator 8.Therefore, regulation to guide plate 6 spacing in the above-described embodiments, it is also possible to logical
The lifting crossing scaffold 3 realizes.Specifically, scaffold 3 is arranged on the downside of orlop guide plate 6,
Meanwhile, can connector be set between adjacent layer guide plate 6, connector in the vertical direction
Adjustable length.When moving on scaffold 3, connector in the vertical direction length reduces, scaffold 3
Promote and be positioned on the guide plate 6 on the downside of the superiors' guide plate 6 shifting, thus between turning down between guide plate 6
Away from；When scaffold 3 moves down, connector in the vertical direction length increases, and is positioned at the superiors and leads
Guide plate 6 on the downside of plate 6 moves down owing to being no longer influenced by the lifting force of scaffold 3, thus tunes up and lead
Distance between plate 6.This kind of regulative mode takes full advantage of in vertical continuous electroplating device existing
Parts realize the regulation of guide plate 6 spacing, arrange more convenient.
Each layer guide plate 6 in the vertical direction in above-described embodiment be placed with multiple realization side
Formula, for example, it is possible to be supported each layer guide plate 6 guiding by vertical guide post 2.More
It is possible to further arrange guide plate fixture 5 on guide post 2, each guide plate fixture 5
Being connected to a guide plate 6, wherein, guide post 2 is fixed in electroplating bath 1, the superiors
Guide plate fixture 5 is fixedly connected on guide post 2, is positioned on the downside of the superiors' guide plate fixture 5
Each layer guide plate fixture 5 is slidably connected to guide post 2.Specifically can be at the superiors' guide plate
The centre of the guide plate fixture 5 on the downside of fixture 5 arranges intermediate throughholes, and this intermediate throughholes is placed on
Outside guide post 2, further, the cross section of this intermediate throughholes and guide post 2 can be made
Shape adapts and in matched in clearance, is beneficial to the stable movement of guide plate fixture 5.Alternatively,
The two ends of connector can be connected on the guide plate fixture 5 of adjacent layer.
Generally, in vertical continuous electroplating device, transversely may be set side by side with at least two
Circuit board 7, and due to circuit board 7 enter after electroplating liquid medicine can along laterally running, then in order to
Adequately protect circuit board 7, selects the length of guide plate 6 typically the longest and along horizontal expansion.For
Each guide plate 6 stably fixed, the bearing of trend of guide plate 6 may be set up in parallel
There is the guide post 2 of at least two, say, that same guide plate 6 is connected at least two and leads
To bar 2.Now, the different identical height and positions of guide post 2 are respectively provided with above-mentioned guide plate solid
Locking member 5, and connect guide plate 6 and guide post 2 with guide plate fixture 5, for each guide plate 6
Fix to be connected and provide a great convenience while between at least two guide post 2.More enter one
Step ground, orlop guide plate fixture 5 can be fixedly connected on scaffold 3, to improve guide plate 6 edge
The stability that vertical direction moves.
Between adjacent layer guide plate 6, connector is provided with various ways, at above-described embodiment
On the basis of, connector can be set to flexible-belt 4.Time specifically used, when the position of scaffold 3
When putting relatively low, scaffold 3 upwardly orlop guide plate fixture 5 and guide plate 6, going up most
Under guide plate fixture 5 on the downside of layer guide plate fixture 5 and the action of gravity of guide plate 6, flexible
Band 4 is in straight condition everywhere, and the spacing between the superiors and orlop guide plate 6 is maximum；
When moving on scaffold 3, scaffold 3 upwardly orlop guide plate fixture 5 and guide plate 6,
Flexible-belt 4 between orlop guide plate fixture 5 and adjacent upper guide plate fixture 5 bends,
Spacing between orlop guide plate 6 and adjacent upper guide plate 6 diminishes, and the superiors lead with orlop
Spacing between plate 6 diminishes；If in the vertical direction guide plate 6 is at least three layers, along with
The upper of scaffold 3 moves, and the guide plate 6 of lower floor constantly contacts also with the guide plate 6 of adjacent upper
Promoting and move on adjacent upper guide plate 6, flexible-belt 4 is correspondingly in non-straight condition；When going up most
When layer guide plate 6 contacts with adjacent lower guide plate 6, flexible-belt 4 is in non-straight condition.
Concrete application can regulate the position of scaffold 3 lifting according to actual needs.Specifically, permissible
The side of the guide plate fixture 5 that flexible-belt 4 is bolted in above-described embodiment, with
Ensure the stability of guide plate fixture 5.
Visible, the use of flexible-belt 4, facilitate adjacent layer guide plate 6 and guide plate fixture 5
Between connection and control.Vertical continuous electroplating device in the present embodiment is applied to FPC soft board
Plating a kind of specific embodiment in, FPC soft board be suitable for altitude range be 180mm extremely
450mm, in electroplating bath 1, the speed of service is not less than 0.9 m/min.
Specifically, above-mentioned flexible-belt 4 can select PP to carry, i.e. polypropylene tape.Owing to PP carries
Corrosion Protection preferable, it is possible in the electroplating pool with corrosivity electroplating liquid medicine, realize guide plate
Being reliably connected between fixture 5.Certainly, connector can also select expansion link, bent
Bar or other connectors.
Maximum vertically distance between adjacent layer guide plate fixture 5 has a multiple set-up mode, such as,
The junction point of guide plate fixture 5 with flexible-belt 4 can be evenly provided on flexible-belt 4,
It is to say, under flexible-belt 4 straight condition, each adjacent layer guide plate 6 adjacent layer in other words is led
Vertical spacing between plate fixture 5 is identical, to ensure that guide plate 6 is to differing heights circuit
The protected effect of plate 7.Certainly, the setting of the spacing of adjacent layer guide plate 6 with the present embodiment is not
Limit.
Guide plate fixture 5 in each embodiment above-mentioned and have multiple concrete be connected between guide plate 6
Mode.In a kind of preferred embodiment, guide plate fixture 5 can be set to side and have recessed
The flat board of groove, is plugged in this groove by fixing for guide plate 6, in order to realize same guide plate 6 with
On different guide posts 2 and on same layer between at least two guide plate fixture 5 while connect
Connect.
Guide post 2 in each embodiment above-mentioned specifically could be arranged to cylindrical bar, leads to reduce
Resistance between plate fixture 5 and guide post 2.It is set to it is of course also possible to be directed to bar 2
Rectangular body rod or the bar of other shapes.
In this specification, each embodiment uses the mode gone forward one by one to describe, and each embodiment emphasis is said
Bright is all the difference with other embodiments, and between each embodiment, identical similar portion is mutual
See mutually.
Above vertical continuous electroplating device provided by the utility model is described in detail.
Principle of the present utility model and embodiment are set forth by specific case used herein,
The explanation of above example is only intended to help to understand that method of the present utility model and core thereof are thought
Think.It should be pointed out that, for those skilled in the art, without departing from this reality
On the premise of new principle, it is also possible to this utility model is carried out some improvement and modification, this
A little improvement and modification also fall in this utility model scope of the claims.
Claims (10)
1. a vertical continuous electroplating device, it is characterised in that including:
The guide plate (6) being used for carrying out in circuit board (7) both sides protecting being located in electroplating bath (1),
Described guide plate (6) is provided with at least two-layer at vertical direction；
For regulating the regulation parts of the spacing of described guide plate (6) in the vertical direction.
Vertical continuous electroplating device the most according to claim 1, it is characterised in that
Guide plate described in upper strata (6) is fixedly connected on described electroplating bath (1).
Vertical continuous electroplating device the most according to claim 2, it is characterised in that institute
State regulation parts include connector and be connected to the scaffold (3) of elevator (8), described in orlop
Described scaffold (3) upside is located at by guide plate (6), drives and be positioned at when described scaffold (3) is mobile
The described guide plate (6) of guide plate described in upper strata (6) downside is mobile, and in the vertical direction length can
The described connector adjusted is located between guide plate described in adjacent layer (6).
Vertical continuous electroplating device the most according to claim 3, it is characterised in that institute
Being fixed with vertical guide post (2) in stating electroplating bath (1), described guide post (2) is provided with
Fix, with a described guide plate (6), the guide plate fixture (5) being connected respectively, lead described in the superiors
Plate fixture (5) is fixedly connected on described guide post (2), is positioned at guide plate described in the superiors and fixes
The described guide plate fixture (5) of part (5) downside is socketed on described guide post (2) slidably,
The two ends of described connector are connected to guide plate fixture (5) described in adjacent layer.
Vertical continuous electroplating device the most according to claim 4, it is characterised in that
Described in lower floor, guide plate fixture (5) is fixedly connected on described scaffold (3).
Vertical continuous electroplating device the most according to claim 4, it is characterised in that institute
Stating connector is flexible-belt (4).
Vertical continuous electroplating device the most according to claim 6, it is characterised in that institute
Stating flexible-belt (4) is PP band.
Vertical continuous electroplating device the most according to claim 6, it is characterised in that institute
State the junction point of flexible-belt (4) and described guide plate fixture (5) on described flexible-belt (4)
It is uniformly distributed.
9. according to the vertical continuous electroplating device described in claim 4 to 8 any one, its
Being characterised by, described guide plate fixture (5) is that side sets reeded flat board, described guide plate (6)
Fix and be plugged in described groove.
Vertical continuous electroplating device the most according to claim 9, it is characterised in that institute
Stating guide post (2) is cylindrical bar.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620045598.0U CN205474042U (en) | 2016-01-18 | 2016-01-18 | Vertical continuous electroplating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620045598.0U CN205474042U (en) | 2016-01-18 | 2016-01-18 | Vertical continuous electroplating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205474042U true CN205474042U (en) | 2016-08-17 |
Family
ID=56671103
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620045598.0U Active CN205474042U (en) | 2016-01-18 | 2016-01-18 | Vertical continuous electroplating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205474042U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112779588A (en) * | 2020-12-25 | 2021-05-11 | 深圳市嘉之宏电子有限公司 | Limiting and guiding structure for vertical continuous electroplating of flexible PCB |
| CN114635176A (en) * | 2022-02-18 | 2022-06-17 | 上海山崎电路板有限公司 | Floating bed baffle device and method for VCP copper-plated wire |
-
2016
- 2016-01-18 CN CN201620045598.0U patent/CN205474042U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112779588A (en) * | 2020-12-25 | 2021-05-11 | 深圳市嘉之宏电子有限公司 | Limiting and guiding structure for vertical continuous electroplating of flexible PCB |
| CN112779588B (en) * | 2020-12-25 | 2021-10-29 | 深圳市嘉之宏电子有限公司 | Limiting and guiding structure for vertical continuous electroplating of flexible PCB |
| CN114635176A (en) * | 2022-02-18 | 2022-06-17 | 上海山崎电路板有限公司 | Floating bed baffle device and method for VCP copper-plated wire |
| CN114635176B (en) * | 2022-02-18 | 2024-01-02 | 上海山崎电路板有限公司 | VCP copper plating wire and copper plating method |
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| GR01 | Patent grant |