CN205439480U - New -type insulating pad - Google Patents
New -type insulating pad Download PDFInfo
- Publication number
- CN205439480U CN205439480U CN201521119882.XU CN201521119882U CN205439480U CN 205439480 U CN205439480 U CN 205439480U CN 201521119882 U CN201521119882 U CN 201521119882U CN 205439480 U CN205439480 U CN 205439480U
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- China
- Prior art keywords
- sided
- insulating barrier
- layers
- double
- main body
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Abstract
The utility model discloses a new -type insulating pad, its thermal insulation main part includes that upper end insulating layer lower surface bonds with middle heat conduction bonding glue film upper surface from last to down cascade arrangement's upper end insulating layer, middle heat conduction bonding glue film, lower extreme insulating layer in proper order, middle heat conduction bonding glue film lower surface bonds with lower extreme insulating layer upper surface, under the thermal insulation main part distolateral double - sided adhesive layer of installing, lie in under the double - sided adhesive layer distolaterally from the type membrane, the double - sided adhesive layer upper surface bonds with lower extreme insulating layer lower surface, bonds with the double - sided adhesive layer lower surface from the epimembranal surface of type, is provided with protrusion in the hand portion of tearing at the edge of thermal insulation main part, double - sided adhesive layer's edge from the edge part of type membrane, and the thickness of thermal insulation main part is 0.5mm, and double - sided adhesive layer's thickness is 0.15mm. Through the structure design, the utility model has the advantages of structural design is novel, various, the convenient to use of function.
Description
Technical field
This utility model relates to insulation spacer technical field, particularly relates to a kind of new-type insulation spacer.
Background technology
For insulation spacer, it is to be attached at electronic device surface and realize the gasket construction of insulation.
The insulation spacer structure of existence form various kinds in prior art;Wherein, for existing insulation spacer structure, it typically uses single layer structure to design, i.e. the monolayer plastic insulation layer structure by being bonded and fixed to electronic device surface realizes insulation.
For above-mentioned insulation spacer structure, during actual use, its generally exist function the most single and in-convenience in use defect.
Summary of the invention
The purpose of this utility model is to provide a kind of new-type insulation spacer for the deficiencies in the prior art, this new-type insulation spacer novel in structural design, diverse in function, easy to use.
For reaching above-mentioned purpose, this utility model is achieved through the following technical solutions.
A kind of new-type insulation spacer, include insulating heat-conductive main body, insulating heat-conductive main body includes and stacks gradually the upper end insulating barrier of layout, the bonding glue-line of intermediate thermal conductivity, lower end insulating barrier from top to bottom, the upper surface of the lower surface of upper end insulating barrier glue-line bonding with intermediate thermal conductivity is bonding, and the lower surface of the bonding glue-line of intermediate thermal conductivity is bonding with the upper surface of lower end insulating barrier;
The lower end side of insulating heat-conductive main body is equiped with layers of two-sided and is positioned at the mould release membrance of layers of two-sided lower end side, the upper surface of layers of two-sided and the lower surface bonds of lower end insulating barrier, the upper surface of mould release membrance and the lower surface bonds of layers of two-sided, the edge part of mould release membrance is provided with the hands at the edge protruding from the edge of insulating heat-conductive main body, layers of two-sided and tears portion, the thickness of insulating heat-conductive main body is 0.5mm, and the thickness of layers of two-sided is 0.15mm.
Wherein, described upper end insulating barrier is transparent PC plastic layer or transparent PET plastic layer.
Wherein, described lower end insulating barrier is transparent PC plastic layer or transparent PET plastic layer.
The beneficial effects of the utility model are: the new-type insulation spacer of one described in the utility model, its insulating heat-conductive main body includes stacking gradually the upper end insulating barrier of layout, the bonding glue-line of intermediate thermal conductivity, lower end insulating barrier from top to bottom, insulating barrier lower surface glue-line upper surface bonding with intermediate thermal conductivity in upper end is bonding, and intermediate thermal conductivity bonding glue-line lower surface is bonding with lower end insulating barrier upper surface;Insulating heat-conductive main body lower end side is installed layers of two-sided, is positioned at the mould release membrance of layers of two-sided lower end side, layers of two-sided upper surface and lower end insulating barrier lower surface bonds, mould release membrance upper surface and layers of two-sided lower surface bonds, the edge part of mould release membrance is provided with the hands at the edge protruding from the edge of insulating heat-conductive main body, layers of two-sided and tears portion, the thickness of insulating heat-conductive main body is 0.5mm, and the thickness of layers of two-sided is 0.15mm.Being designed by said structure, this utility model has novel in structural design, diverse in function, advantage easy to use.
Accompanying drawing explanation
Below with accompanying drawing, this utility model is further detailed, but the embodiment in accompanying drawing is not constituted any restriction of the present utility model.
Fig. 1 is structural representation of the present utility model.
Include in FIG:
1 upper end insulating barrier
The 2 bonding glue-lines of intermediate thermal conductivity
3 lower end insulating barriers
4 layers of two-sided
5 mould release membrances
51 handss tear portion.
Detailed description of the invention
Below in conjunction with specific embodiment, this utility model is illustrated.
As shown in Figure 1, a kind of new-type insulation spacer, it is characterized in that including insulating heat-conductive main body, insulating heat-conductive main body includes and stacks gradually the upper end insulating barrier 1 of layout, the bonding glue-line of intermediate thermal conductivity 2, lower end insulating barrier 3 from top to bottom, the upper surface of the lower surface of upper end insulating barrier 1 glue-line 2 bonding with intermediate thermal conductivity is bonding, and the lower surface of the bonding glue-line of intermediate thermal conductivity 2 is bonding with the upper surface of lower end insulating barrier 3.
Further, the lower end side of insulating heat-conductive main body is equiped with layers of two-sided 4 and is positioned at the mould release membrance 5 of layers of two-sided 4 lower end side, the upper surface of layers of two-sided 4 and the lower surface bonds of lower end insulating barrier 3, the upper surface of mould release membrance 5 and the lower surface bonds of layers of two-sided 4, the edge part of mould release membrance 5 is provided with the hands at the edge protruding from the edge of insulating heat-conductive main body, layers of two-sided 4 and tears portion 51, the thickness of insulating heat-conductive main body is 0.5mm, and the thickness of layers of two-sided 4 is 0.15mm.
It should further be noted that upper end of the present utility model insulating barrier 1 can use transparent PC or transparent PET material to be prepared from, upper end the most of the present utility model insulating barrier 1 can be transparent PC plastic layer or transparent PET plastic layer;Same, lower end of the present utility model insulating barrier 3 can use transparent PC or transparent PET material to be prepared from, and lower end the most of the present utility model insulating barrier 3 can be transparent PC plastic layer or transparent PET layer.Certainly, above-mentioned material is not intended that, to restriction of the present utility model, upper end the most of the present utility model insulating barrier 1, lower end insulating barrier 3 can also use other plastic material to be prepared from.
During this utility model uses, mould release membrance 5 is torn from the lower surface of layers of two-sided 4, and the lower surface of layers of two-sided 4 is pasted on the surface of electronic device;Need to be explained further, portion 51 is torn owing to mould release membrance 5 is provided with the hands at the edge protruding from the edge of insulating heat-conductive main body, layers of two-sided 4, when needing to tear mould release membrance 5 from the lower surface of layers of two-sided 4, staff only needs the hands of hand-held mould release membrance 5 tear portion 51 and tear by mould release membrance 5, easy to use.
During it should further be noted that use, insulating heat-conductive main body of the present utility model is pasted on the surface of electronic device by layers of two-sided 4;Wherein, the bonding glue-line of upper end insulating barrier 1, intermediate thermal conductivity 2, lower end insulating barrier 3 can realize the effect of insulation, and on the one hand insulating heat-conductive main body the most of the present utility model can be effectively realized insulating electronic device effect.Additionally, the bonding glue-line of intermediate thermal conductivity of the present utility model 2 has good conductive force, in electronic device work process, heat produced by electronic device conducts to the bonding glue-line of intermediate thermal conductivity 2 via layers of two-sided 4, lower end insulating barrier 3, heat spreader can be gone out by the bonding glue-line of intermediate thermal conductivity 2 rapidly, and on the other hand insulating heat-conductive main body the most of the present utility model is capable of promoting the purpose of dissipation from electronic devices.
Need to be explained further, upper end of the present utility model insulating barrier 1 is as protective layer structure on the upside of the bonding glue-line of intermediate thermal conductivity 2, and lower end insulating barrier 3 is as the downside protective layer structure of the bonding glue-line of intermediate thermal conductivity 2.
Summary situation understands, and is designed by said structure, and this utility model has novel in structural design, diverse in function, advantage easy to use.
Above content is only preferred embodiment of the present utility model, for those of ordinary skill in the art, according to thought of the present utility model, the most all will change, this specification content should not be construed as restriction of the present utility model.
Claims (3)
1. a new-type insulation spacer, it is characterized in that: include insulating heat-conductive main body, insulating heat-conductive main body includes and stacks gradually the upper end insulating barrier (1) of layout, the bonding glue-line of intermediate thermal conductivity (2), lower end insulating barrier (3) from top to bottom, the upper surface of lower surface glue-line bonding with intermediate thermal conductivity (2) of upper end insulating barrier (1) is bonding, and the lower surface of the bonding glue-line of intermediate thermal conductivity (2) is bonding with the upper surface of lower end insulating barrier (3);
The lower end side of insulating heat-conductive main body is equiped with layers of two-sided (4) and is positioned at the mould release membrance (5) of layers of two-sided (4) lower end side, the upper surface of layers of two-sided (4) and the lower surface bonds of lower end insulating barrier (3), the upper surface of mould release membrance (5) and the lower surface bonds of layers of two-sided (4), the edge part of mould release membrance (5) is provided with the hands at the edge protruding from the edge of insulating heat-conductive main body, layers of two-sided (4) and tears portion (51), the thickness of insulating heat-conductive main body is 0.5mm, and the thickness of layers of two-sided (4) is 0.15mm.
The new-type insulation spacer of one the most according to claim 1, it is characterised in that: described upper end insulating barrier (1) is transparent PC plastic layer or transparent PET plastic layer.
The new-type insulation spacer of one the most according to claim 2, it is characterised in that: described lower end insulating barrier (3) is transparent PC plastic layer or transparent PET plastic layer.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201521119882.XU CN205439480U (en) | 2015-12-30 | 2015-12-30 | New -type insulating pad |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201521119882.XU CN205439480U (en) | 2015-12-30 | 2015-12-30 | New -type insulating pad |
Publications (1)
Publication Number | Publication Date |
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CN205439480U true CN205439480U (en) | 2016-08-10 |
Family
ID=56572514
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201521119882.XU Expired - Fee Related CN205439480U (en) | 2015-12-30 | 2015-12-30 | New -type insulating pad |
Country Status (1)
Country | Link |
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CN (1) | CN205439480U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108679224A (en) * | 2018-07-27 | 2018-10-19 | 苏州国华特种线材有限公司 | A kind of high frequency die casting oscillator insulation spacer |
CN112143402A (en) * | 2020-09-27 | 2020-12-29 | 衡山县佳诚新材料有限公司 | High buffer pad of heat conduction |
-
2015
- 2015-12-30 CN CN201521119882.XU patent/CN205439480U/en not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108679224A (en) * | 2018-07-27 | 2018-10-19 | 苏州国华特种线材有限公司 | A kind of high frequency die casting oscillator insulation spacer |
CN112143402A (en) * | 2020-09-27 | 2020-12-29 | 衡山县佳诚新材料有限公司 | High buffer pad of heat conduction |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160810 Termination date: 20171230 |