CN205430837U - Metal -back thick film circuit module of bottom surface area boss - Google Patents
Metal -back thick film circuit module of bottom surface area boss Download PDFInfo
- Publication number
- CN205430837U CN205430837U CN201620225974.4U CN201620225974U CN205430837U CN 205430837 U CN205430837 U CN 205430837U CN 201620225974 U CN201620225974 U CN 201620225974U CN 205430837 U CN205430837 U CN 205430837U
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- CN
- China
- Prior art keywords
- thick film
- base
- film circuit
- pin
- circuit board
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000002184 metal Substances 0.000 title abstract description 7
- 238000001514 detection method Methods 0.000 claims description 4
- 238000003466 welding Methods 0.000 abstract description 3
- 239000011521 glass Substances 0.000 abstract 1
- 238000009434 installation Methods 0.000 description 2
- 230000032683 aging Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The utility model provides a metal -back thick film circuit module of bottom surface area boss, it is constituteed by lapping (1), thick film circuit board (2), base (3) and a set of DIP pin (4). Be equipped with a set of through -hole that is used for settling pin (4) on base (3), it is interior and insulating with base (3) that the through -hole is fixed in through glass blank (5) in pin (4), still be equipped with a set of fixed orifices (7) on base (3), the position that its bottom surface corresponds fixed orifices (7) is equipped with a set of boss (6), thick film circuit board (2) go up to open there is the through -hole, thick film circuit board (2) the suit that has assembled components and parts is on a set of pin (4), electric tie point welding on pin (4) and thick film circuit board (2) realizes electrical connection, and on being fixed in base (3) with circuit board (2), apron (1) forms a whole with base (3) welding together. Borrow by the utility model discloses, can obtain one kind has good shielding interference killing feature, the reliable circuit module of use.
Description
Technical field
This utility model relates to a kind of circuit module, the metal-back thick film circuit module of a kind of bottom surface band boss.
Background technology
Circuit module commonly uses cabinet and metal shell, wherein metal shell with its have good heat radiation, salable, shield the advantage such as anti-interference and be widely used.But owing to metal has electric conductivity, in existing technology, metal-back circuit module uses plane bottom structure substantially, there is housing in using and easily cause external detection equipment or the hidden danger of testing circuit short circuit.For avoiding the generation of this short-circuit conditions, mostly using the mode being additionally arranged at the bottom felt pad in metal-back module during use, this makes troubles to the installation operation of module, and insulant can occur aging in time simultaneously, makes module dependability be affected.
Summary of the invention
Technical problem to be solved in the utility model, it is aiming at above-mentioned deficiency, thering is provided a kind of and possess good shielding capacity of resisting disturbance, easy for installation, use can effectively prevent metal shell from causing the metal-back thick film circuit module of outer detecting circuit short circuit reliably, simultaneously.
For achieving the above object, this utility model adopts the following technical scheme that.
A kind of metal-back thick film circuit module of bottom surface band boss, it is made up of cover plate, thick film circuit board, base and one group of DIP pin, it is characterized in that base be provided with one group for the through hole disposing pin, insulate in pin is fixed on through hole by gob and with base；Being additionally provided with one group of fixing hole on base, the position of base end face correspondence fixing hole is provided with boss；Through hole is had on thick film circuit board, the thick film circuit board assembling components and parts is sleeved on one group of pin, pin realizes electrical connection with the electrical connection means of spot welds on thick film circuit board, and thick film circuit board is fixed on base, finally cover plate and base are welded together to form an entirety, circuit module is connected with external detection equipment or testing circuit by pin, it is achieved it inputs, exports and control function.
The utility model has the advantages that: circuit module uses the metal-back structure of bottom surface band boss, its bossing ensure that housing bottom surface keeps certain interval with external detection equipment or testing circuit, need not bottom circuit module during use install felt pad or other megohmite insulants additional, can effectively prevent module metal shell from causing the situation of outer detecting circuit short circuit to occur, there is good shielding interference free performance simultaneously.
Accompanying drawing explanation
Fig. 1: this utility model structural representation；
Fig. 2: base vertical view；
Fig. 3: cover plate figure.
Detailed description of the invention
Below by specific embodiment combine accompanying drawing the utility model will be further described.
As shown in FIG. 1 to 3, this utility model circuit module is made up of cover plate 1, thick film circuit board 2,3, eight DIP pins 4 of base, base 3 is cavity type structure, base 3 is provided with eight for the through hole installing pin 4, pin 4 is fixed on base 3 by gob 5 and is insulated with base 3, it is additionally provided with four through holes 7 for stuck-module on base 3, is provided with boss 6 in the position of the bottom surface correspondence fixing hole 7 of base 3.
Through hole is had on described thick film circuit board 2, the thick film circuit board 2 assembling components and parts is sleeved on one group of pin 4, pin 4 forms solder joint 8 with the electrical connection means of spot welds on thick film circuit board 2, realize the electrical connection of pin 4 and circuit board 2, and circuit board 2 is fixed on base 3, finally cover plate 1 and base 3 being welded by parallel seam welding, thick film circuit board 2 forms an entirety in being sealed in metal-back.
In the above-described embodiment, there is base the metal-back circuit modular structure of the bottom surface band boss of fixing hole to be illustrated, but the base ground without fixing hole can also arrange one group of boss, equally obtains the implementation result of above-described embodiment.
The above is only for illustrating design of the present utility model and feature, but is not limited thereto embodiment.Some changes and improvements that are all on the premise of without departing from present principles, that made, all should contain within protection domain of the present utility model.
Claims (3)
1. the metal-back thick film circuit module of a bottom surface band boss, it is made up of cover plate (1), thick film circuit board (2), base (3) and one group of DIP pin (4), it is characterized in that base (3) be provided with one group for the through hole disposing pin (4), insulate in pin (4) is fixed on through hole by gob (5) and with base (3).
2. according to the metal-back thick film circuit module of the bottom surface band boss described in claim 1, it is characterised in that: the bottom surface of described base (3) is additionally provided with one group of boss (6).
3. according to the metal-back thick film circuit module of the bottom surface band boss described in claim 1, it is characterized in that: on described thick film circuit board (2), have one group of through hole, the thick film circuit board (2) assembling components and parts is sleeved on one group of pin (4), one group of pin (4) and the electrical connection means of spot welds on thick film circuit board (2), and thick film circuit board (2) is fixed on base (3), cover plate (1) welds together with base (3), thick film circuit board (2) is sealed in metal-back, form an entirety, circuit module is connected with external detection equipment or testing circuit by pin (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620225974.4U CN205430837U (en) | 2016-03-23 | 2016-03-23 | Metal -back thick film circuit module of bottom surface area boss |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620225974.4U CN205430837U (en) | 2016-03-23 | 2016-03-23 | Metal -back thick film circuit module of bottom surface area boss |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205430837U true CN205430837U (en) | 2016-08-03 |
Family
ID=56548811
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620225974.4U Active CN205430837U (en) | 2016-03-23 | 2016-03-23 | Metal -back thick film circuit module of bottom surface area boss |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205430837U (en) |
-
2016
- 2016-03-23 CN CN201620225974.4U patent/CN205430837U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: A metal shell thick film circuit module with boss on the bottom Effective date of registration: 20230103 Granted publication date: 20160803 Pledgee: Xi'an innovation financing Company limited by guarantee Pledgor: XI'AN BOHANG ELECTRONICS CO.,LTD. Registration number: Y2023610000003 |
|
| PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Granted publication date: 20160803 Pledgee: Xi'an innovation financing Company limited by guarantee Pledgor: XI'AN BOHANG ELECTRONICS CO.,LTD. Registration number: Y2023610000003 |