CN205406508U - Radiator for semiconductor device - Google Patents
Radiator for semiconductor device Download PDFInfo
- Publication number
- CN205406508U CN205406508U CN201620145868.5U CN201620145868U CN205406508U CN 205406508 U CN205406508 U CN 205406508U CN 201620145868 U CN201620145868 U CN 201620145868U CN 205406508 U CN205406508 U CN 205406508U
- Authority
- CN
- China
- Prior art keywords
- semiconductor device
- inlet
- temperature sensor
- water storage
- storage box
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
Description
Claims (3)
- null1. a semiconductor device radiator,Including casing (1)、Lock chamber (2) and controller (8),It is characterized in that: described lock chamber (2) and controller (8) are installed on casing (1),Self priming pump (10) is installed in the case of described casing (1)、Inlet (11) and recirculated water water storage box (12),Described self priming pump (10) is connected with inlet (11) and recirculated water water storage box (12) respectively by pipeline,Described inlet (11) is connected to ammonium salt solution case (6) by pipeline,And ammonium salt solution case (6) is fixed on casing (1),In the case of described recirculated water water storage box (12), the second temperature sensor (13) is installed,The intracavity of described lock chamber (2) is fixed with semiconductor device (3) and the first temperature sensor (5),Described first temperature sensor (5) is flexibly connected with semiconductor device (3),And first temperature sensor (5) be positioned at the positive lower end of semiconductor device (3),The surface configuration of described lock chamber (2) has auxiliary heat dissipation passage (20) and finned tube (4),Described auxiliary heat dissipation passage (20) is equipped with anti-dust filter mesh (21),One end of described finned tube (4) is connected with inlet (11),The other end of finned tube (4) is connected with recirculated water water storage box (12),Described controller (8) and the first temperature sensor (5)、Self priming pump (10) and the second temperature sensor (13) electrical connection.
- 2. a kind of semiconductor device radiator according to claim 1, it is characterised in that: the junction of described ammonium salt solution case (6) and inlet (11) is provided with electromagnetic valve (7), and electromagnetic valve (7) electrically connects with controller (8).
- 3. a kind of semiconductor device radiator according to claim 1, it is characterised in that: described recirculated water water storage box (12) is provided with water inlet pipe (14).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201620145868.5U CN205406508U (en) | 2016-02-28 | 2016-02-28 | Radiator for semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201620145868.5U CN205406508U (en) | 2016-02-28 | 2016-02-28 | Radiator for semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
CN205406508U true CN205406508U (en) | 2016-07-27 |
Family
ID=56424194
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201620145868.5U Expired - Fee Related CN205406508U (en) | 2016-02-28 | 2016-02-28 | Radiator for semiconductor device |
Country Status (1)
Country | Link |
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CN (1) | CN205406508U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113161305A (en) * | 2021-03-25 | 2021-07-23 | 浙江焜腾红外科技有限公司 | Infrared thermal imaging chip refrigeration and heat dissipation device and using method thereof |
-
2016
- 2016-02-28 CN CN201620145868.5U patent/CN205406508U/en not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113161305A (en) * | 2021-03-25 | 2021-07-23 | 浙江焜腾红外科技有限公司 | Infrared thermal imaging chip refrigeration and heat dissipation device and using method thereof |
CN113161305B (en) * | 2021-03-25 | 2022-03-22 | 浙江焜腾红外科技有限公司 | Infrared thermal imaging chip refrigeration and heat dissipation device and using method thereof |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CB03 | Change of inventor or designer information |
Inventor after: Weng Ding Inventor before: Gu Wei |
|
CB03 | Change of inventor or designer information | ||
TR01 | Transfer of patent right |
Effective date of registration: 20170329 Address after: Room 416, block A, building No. 2, science and Technology Park, Xinbei District, Jiangsu, Changzhou, China Patentee after: Changzhou made clear Dazhi Technology Co. Ltd. Address before: 224600 Jiangsu province Yancheng City Xiangshui County town of Xiangshui River irrigation hit off incubator Patentee before: XIANGSHUI ZHICHENG INTELLECTUAL PROPERTY INFORMATION SERVICE CO., LTD. |
|
TR01 | Transfer of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160727 Termination date: 20170228 |
|
CF01 | Termination of patent right due to non-payment of annual fee |