CN205395181U - Use economizer of heating resin on SLA printer - Google Patents

Use economizer of heating resin on SLA printer Download PDF

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Publication number
CN205395181U
CN205395181U CN201620160895.XU CN201620160895U CN205395181U CN 205395181 U CN205395181 U CN 205395181U CN 201620160895 U CN201620160895 U CN 201620160895U CN 205395181 U CN205395181 U CN 205395181U
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CN
China
Prior art keywords
resin
air conditioner
storage tank
print area
switch board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201620160895.XU
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Chinese (zh)
Inventor
不公告发明人
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shanghai digital electromechanical Polytron Technologies Inc
Original Assignee
Shanghai Shuzao Electromechanical Technology Co Ltd
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Priority to CN201620160895.XU priority Critical patent/CN205395181U/en
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Abstract

The utility model discloses an use economizer of heating resin on SLA printer. It includes printing area, switch board, resin storage tank, semiconductor air conditioner, control center and temperature sensor, and printing area one side is provided with the switch board, and printing area contacts with the resin storage tank upper surface, and the semiconductor air conditioner sets up in the switch board, and air inlet, gas outlet and printing area on the semiconductor air conditioner are linked together, and resin storage tank department is provided with temperature sensor, and temperature sensor links to each other with semiconductor air conditioner and control center respectively. The utility model discloses can avoid the temperature response that whole heating appear to the resin in the whole resin storage tank slow, the resin is easily rotten, the phenomenons such as cooling of can not taking the initiative to the resin.

Description

A kind of it is applied on SLA printer the energy saver of heated resin
Technical field
The utility model relates to SLA printer resin technical field of heating, be specifically related to a kind of be applied on SLA printer the energy saver of heated resin.
Background technology
Current SLA printer is obtained at industry-by-industry and is widely applied.SLA printer is generally adopted photosensitive resin as its moulding material, but when printer works, the temperature of material is had extra high requirement.
Nowadays the method for modal control temperature is, by the heater being fixed on resin storage tank, all resins in whole trough is heated to operating temperature.The shortcoming of this mode is that heat time heating time is long, and the temperature control of working region resin can relatively lag behind.In resin storage tank, resin long-time heating and heating are uneven, and resin property has a significant impact the phenomenon even sometimes occurring that local resin is rotten.
A kind of it is applied on SLA printer the energy saver of heated resin accordingly, it would be desirable to design.
Summary of the invention
For the deficiency existed in prior art, this utility model purpose is to be in that providing a kind of is applied on SLA printer the energy saver of heated resin, the temperature-responsive that the resin in whole resin storage tank all heats appearance can be avoided slow, resin goes bad, and resin can only can not be carried out by resin heating the phenomenons such as cooling.
To achieve these goals, this utility model is to realize by the following technical solutions: a kind of be applied on SLA printer the energy saver of heated resin, including print area, switch board, resin storage tank, semiconductor air conditioner, air inlet, gas outlet, control centre and temperature sensor, print area side is provided with switch board, print area contacts with resin storage tank upper surface, semiconductor air conditioner is arranged in switch board, air inlet on semiconductor air conditioner, gas outlet is connected with print area, resin storage tank place is provided with temperature sensor, temperature sensor is connected with semiconductor air conditioner and control centre respectively.It it is the space of relative closure in described print area.Described print area, the relatively independent setting of switch board.
As preferably, the thermal source of the described heated resin in resin storage tank adopts cabinet air conditioner.
This utility model adopts the mode installing semiconductor air conditioner in machine that the resin of working region is carried out temperature control.Resin in the upper surface working region of resin storage tank is only carried out temperature control by this mode.This mode can avoid the temperature-responsive that the resin in whole resin storage tank all heats appearance slow, and resin goes bad, and resin can only can not be carried out by resin heating the phenomenons such as cooling.
The beneficial effects of the utility model: the temperature of the resin of utility model works layer controls response faster, only the resin of working lining is heated, not only the control to resin can be met but also resin can be avoided to go bad compared with the mode of traditional heating resin storage tank, and the power consumption of machine is lower, more energy efficient.When resin temperature is on the low side, it is possible to resin is heated, resin can also be lowered the temperature when resin temperature is too high.
Accompanying drawing explanation
This utility model is described in detail below in conjunction with the drawings and specific embodiments;
Fig. 1 is structural representation of the present utility model.
Detailed description of the invention
For the technological means making this utility model realize, creation characteristic, reach purpose and effect and be easy to understand, below in conjunction with detailed description of the invention, this utility model is expanded on further.
With reference to Fig. 1, this detailed description of the invention is by the following technical solutions: a kind of be applied on SLA printer the energy saver of heated resin, including print area 1, switch board 2, resin storage tank 3, semiconductor air conditioner 4, air inlet 5, gas outlet 6, control centre 7 and temperature sensor 8, print area 1 side is provided with switch board 2, print area 1 contacts with resin storage tank 3 upper surface, semiconductor air conditioner 4 is arranged in switch board 2, air inlet 5 on semiconductor air conditioner 4, gas outlet 6 is connected with print area 1, resin storage tank 3 place is provided with temperature sensor 8, temperature sensor 8 is connected with semiconductor air conditioner 4 and control centre 7 respectively.
It should be noted that the thermal source of the heated resin in described resin storage tank (3) adopts cabinet air conditioner.
This detailed description of the invention is applied to the SLA printer that print area is relatively independent with electric appliance control box.Its layout such as Fig. 1, print area 1 and switch board 2 are relatively independent, and relative closure in print area 1.Print area 1 contacts with the upper surface of resin storage tank 3.Semiconductor air conditioner 4 is arranged in switch board 2, and its air inlet 5 and gas outlet 6 communicate with print area 1.
Before printer starts to print, temperature inductor 8 can check the temperature of working region resin, and when resin temperature is too low, semiconductor air conditioner 4 is first started shooting work.The air of print area 1 is extracted in air-conditioning by air inlet 5 by semiconductor air conditioner 4, is then discharged in print area 1 by gas outlet 6 by the air after heating.Hot-air can scatter the upper surface with resin storage tank 3 at print area 1, heat is passed to resin, it is achieved the heating to resin.When control centre 7 reached by the temperature inductor 8 perception resin temperature in resin temperature required after, control centre 7 controls semiconductor air conditioner 4 and runs the diffusion of additional heat with lower-wattage, with the temperature of stable work area domain resin.
When resin temperature is too high, whole system can greenhouse cooling to working region in the same way.
In whole print procedure, the temperature of print area resin can be passed through the work of semiconductor air conditioner 4 and maintain a constant working temperatures automatically.
Of the present utility model ultimate principle and principal character and of the present utility model advantage have more than been shown and described.Skilled person will appreciate that of the industry; this utility model is not restricted to the described embodiments; described in above-described embodiment and description is that principle of the present utility model is described; under the premise without departing from this utility model spirit and scope; this utility model also has various changes and modifications, and these changes and improvements both fall within the scope of claimed this utility model.This utility model claims scope and is defined by appending claims and equivalent thereof.

Claims (2)

1. one kind is applied on SLA printer the energy saver of heated resin, it is characterized in that, including print area (1), switch board (2), resin storage tank (3), semiconductor air conditioner (4), air inlet (5), gas outlet (6), control centre (7) and temperature sensor (8), print area (1) side is provided with switch board (2), print area (1) contacts with resin storage tank (3) upper surface, semiconductor air conditioner (4) is arranged in switch board (2), air inlet (5) on semiconductor air conditioner (4), gas outlet (6) is connected with print area (1), resin storage tank (3) place is provided with temperature sensor (8), temperature sensor (8) is connected with semiconductor air conditioner (4) and control centre (7) respectively;It it is the space of relative closure in described print area (1);Described print area (1), switch board (2) relatively independent setting.
2. according to claim 1 a kind of it is applied on SLA printer the energy saver of heated resin, it is characterised in that the thermal source of the described heated resin in resin storage tank (3) adopts cabinet air conditioner.
CN201620160895.XU 2016-03-03 2016-03-03 Use economizer of heating resin on SLA printer Active CN205395181U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201620160895.XU CN205395181U (en) 2016-03-03 2016-03-03 Use economizer of heating resin on SLA printer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201620160895.XU CN205395181U (en) 2016-03-03 2016-03-03 Use economizer of heating resin on SLA printer

Publications (1)

Publication Number Publication Date
CN205395181U true CN205395181U (en) 2016-07-27

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201620160895.XU Active CN205395181U (en) 2016-03-03 2016-03-03 Use economizer of heating resin on SLA printer

Country Status (1)

Country Link
CN (1) CN205395181U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107505959A (en) * 2017-09-14 2017-12-22 广州迈普再生医学科技有限公司 The temperature and cleanliness factor control system of a kind of 3D printer closing space and biological 3D printer

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107505959A (en) * 2017-09-14 2017-12-22 广州迈普再生医学科技有限公司 The temperature and cleanliness factor control system of a kind of 3D printer closing space and biological 3D printer

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Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
C56 Change in the name or address of the patentee
CP03 Change of name, title or address

Address after: Pudong New Area town Shanghai City Hunan Road 201399 Lane 8666 No. 11 floor two layer

Patentee after: Shanghai digital electromechanical Polytron Technologies Inc

Address before: Shanghai Road Pudong New Area town Shanghai city 201204 No. 9628 Building 1 room 908

Patentee before: SHANGHAI SHUZAO ELECTROMECHANICAL TECHNOLOGY CO., LTD.